JPH10305894A - Substrate storage case and semiconductor production process - Google Patents

Abstract

PROBLEM TO BE SOLVED: To apply a substrate storage case for storing a substrate such as reticle to other devices irrespective of the top and bottom of the case. SOLUTION: On the bottom of a frame 5, hold members 2 are provided for holding a substrate 1. A preload plate 12 attached to an upper lid 6 via compression springs 4 is provided with preload hold members 3 so that they are symmetrical with respect to the hold members 2 with the substrate between them. The parts 2a and 3a of the hold members 2 and the preload hold members 3, respectively, where they contact the substrate 1 are formed so as to taper. Cams 8 for moving the preload plate 12 upward according as an opening operation of a front lid 7 is attached to walls 5C and 5D. Thus, even if the case is inverted so that its bottom is above the top, the substrate 1 is surely held by the hold members 2 and the preload hold member 3, and it is released from the hold by opening the front lid 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate storage case for storing a glass substrate such as a reticle or a mask used in semiconductor manufacturing.

[0002]

2. Description of the Related Art For example, in a conventional reticle case shown in FIG. 10, a reticle 1 is held from below by a holding member 21, and a fixing pin 22 is held from above by pressing the reticle 1 downward. . FIG.
As shown in (1), the holding member 21 and the fixing pin 22 are configured to directly contact the polished glass surface of the reticle 1. The fixing pin 22 is urged in the direction of the reticle 1 by a pressing spring 25 or the like. When the front cover 23 is opened, the fixing pin 22 separates from the reticle 1 and the fixing of the reticle 1 is released. I have. When the operator manually puts the reticle 1 in and out of the reticle case,
This is performed by opening the top cover 24. On the other hand, in the reticle inspection machine, an automatic reticle transport device provided in the inspection machine automatically opens the front cover 23 of the reticle case, releases the fixing of the reticle by the fixing pin 22, and automatically moves the reticle 1 to the reticle. Put in and out of the case.

[0003]

In the reticle case as described above, a fixing pin 22 is provided on a top cover 24 via a spring 25, and the reticle 1 is held between the fixing pin 22 and the holding member 21 by a spring 25. Since the reticle is fixed in the case by being held by the urging force, the reticle 1 cannot be taken out with the reticle case upside down. Therefore,
A reduction projection exposure apparatus that uses the chrome surface of the reticle 1 facing downward, and an EB that uses the chrome surface facing upward.
It is impossible to use a common reticle case in an apparatus or an inspection apparatus, and it is necessary to prepare a dedicated reticle case for each apparatus.

In a conventional reticle case, a holding member 21 and a fixing pin 22 are provided on the polished glass surface of the reticle 1.
Are configured to make direct surface contact, dust generated at the contact portion easily adheres to the polished glass surface, and may adversely affect the pattern drawn very precisely on the reticle 1. Further, in the case described above, if the spring 25 swings right and left, the reticle 1 may move left and right inside the case, and this movement may cause the fixing pin 22 and the reticle 1 or the holding member 2 to move.
1 and the reticle 1 slide with each other, and dust is more likely to be generated.

FIG. 11 shows an example of a conventional semiconductor manufacturing process. As shown in FIG. 11, for example, E
In the B exposure drawing apparatus 201, a pallet 201 unique to the apparatus.
When the reticle 1 is placed on A and the operator manually sets the reticle 1, an automatic transport device (not shown) of the EB exposure apparatus 201 automatically transports the pallet 201A. In the etching / developing apparatus 202, when an operator stores the reticle 1 in a carrier 202A unique to the apparatus and then sets the carrier 202A, an automatic transport device (not shown) of the apparatus transports the reticle 1 to the etching / developing apparatus 202. Configuration.

Further, in the reticle inspection apparatus 203, when an operator sets a plurality of reticles 1 on a reticle stocker 203A unique to the apparatus, the reticle inspection apparatus 2
03 reticle stocker 2 (not shown)
The reticle 1 is transported to the reticle inspection device 203 from 03A. Further, the reduction projection exposure device 204
Then, the operator operates the reticle case 204A unique to the apparatus.
When the reticle 1 is stored in the reticle case 204A and the reticle case 204A is set, an automatic transfer device (not shown) takes out the reticle 1 from the reticle case 204A and removes the reticle 1 from the reticle case 204A.
It is configured to be transported to

In such a semiconductor manufacturing process, reticle 1 is placed on EB exposure apparatus 201 through pallet 201A.
→ Reticle drawing → Reticle 1 removal → Reticle 1 is stored in carrier 202A and set in etching / development device 202 → Etching / development → Reticle 1 removal → Reticle 1 is set in stocker 203A → Reticle inspection → Reticle 1 A series of complicated steps such as taking out → storing the reticle 1 in the reticle case 204A and setting it in the reduction exposure apparatus 204 → reducing projection exposure → taking out the reticle 1 are required, and the work of the operator becomes complicated, and dust and dirt are removed. The possibility of adhesion increases.
In an actual process, the number of steps is further increased, and the manufacturing process becomes more complicated.

An object of the present invention is to provide a substrate storage case that can be used even when the board is turned upside down. Another object of the present invention is to provide a semiconductor manufacturing process that is efficient and can reduce the adhesion of dust and dirt.

[0009]

FIG. 1 shows an embodiment of the present invention.
According to the first aspect of the present invention, a frame 5 having at least an upper portion opened, a lid 6 for opening and closing the opening of the frame 5, and a first holding member 2 disposed on the bottom surface of the frame 5 are provided. A second holding member 3 disposed on the lid 6, the first and second holding members 2, 3 sandwich the substrate 1 and are applied to a substrate storage case for storing the substrate 1.
On each of the first holding member 2 and the second holding member 3, a mounting portion 2 on which the substrate 1 can be mounted independently.
The above-mentioned object is achieved by providing a and 3a.

According to a second aspect of the present invention, the mounting portions 2a, 3a of the first holding member 2 and the second holding member 3 are tapered with a downward slope toward the center of the case. Contacts the edge of the substrate 1 and holds the substrate 1. The invention according to claim 3 further includes an urging mechanism 4 for urging at least one of the first holding member 2 and the second holding member 3 toward the other. In the invention of claim 4, the second holding member 3 is provided on the preload plate 12, and the urging mechanism 4 urges the preload plate 12.

The invention according to claim 5 further includes a regulating mechanism for regulating the preload plate 12 from moving in a direction orthogonal to the urging direction of the urging mechanism 4. The invention according to claim 6 further includes a release mechanism 8 for releasing the bias of the biasing mechanism 4. The invention according to claim 7 is a front cover 7 for opening and closing the front of the frame 5.
The release mechanism 8 releases the urging of the urging mechanisms 4 and 12 according to the opening operation of the front cover 7. In the invention according to claim 8, the release mechanism 8 is provided separately from the space in which the substrate 1 is stored.

According to a ninth aspect of the present invention, there is provided a semiconductor manufacturing process including a plurality of steps for processing or inspecting the substrate 1 when the substrate 1 is moved from one of the plurality of steps to the next step. The substrate 1 is stored in the substrate storage case 20 according to any one of claims 1 to 8. According to a tenth aspect of the present invention, there is provided the semiconductor manufacturing process according to the ninth aspect, wherein the substrate 1 is sequentially moved through three or more steps. It is something to do. According to an eleventh aspect of the present invention, in the semiconductor manufacturing process according to the tenth aspect, a common substrate storage case 2 is provided.
Automatic transfer devices 40 and 50 for taking out the substrate 1 from 0 and automatically transferring the substrate 1 to a predetermined position for processing or inspection are provided for each process.

According to the first aspect of the present invention, the first and the second
Since the mounting portions 2a and 3a of the holding members 2 and 3 respectively hold the substrate 1 independently, the substrate 1 is held in the same state in the case regardless of the top and bottom of the case. According to the second aspect of the present invention, the substrate 1 is held in a state where the edges thereof are in line contact with the tapered mounting portions 2a, 3a of the first and second holding members 2, 3. According to the invention of claim 3,
At least one of the first and second holding members 2 and 3 is
Since the substrate 1 is urged toward the other by the urging mechanism 4, the substrate 1 is securely held by the first and second holding members 2 and 3. According to the invention of claim 4, the preload plate 12 is urged by the urging mechanism 4, and the substrate 1 is urged by the second holding member 3 provided on the preload plate 12 toward the first holding member 2. Will be maintained.

According to the fifth aspect of the present invention, the preloading plate 12 is regulated by the regulating mechanisms 30 and 31 so as not to move in the direction orthogonal to the urging direction of the urging mechanism 4. According to the invention of claim 6, by releasing the urging of the urging mechanism 4 by the releasing mechanism 8, the substrate 1 is separated from the first and second holding members 2 and 2.
3 is released from holding. According to the invention of claim 7, the release mechanism 8 releases the urging of the urging mechanism 4 in response to the opening operation of the front cover 7, so that the substrate 1 can be easily taken out from the front of the frame 5. According to the invention of claim 8, since the release mechanism 8 is isolated from the space in which the substrate 1 is stored, dust generated by the operation of the release mechanism 8 does not adhere to the substrate 1.

In the section of the means for solving the above-mentioned problems, which explains the configuration of the present invention, the drawings of the embodiments of the present invention are used for easy understanding of the present invention. However, the present invention is not limited to this.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION

-Embodiment of substrate storage case according to the present invention- An embodiment of a substrate storage case according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a configuration of a reticle case according to the present embodiment, and FIG. 2A is a view of a reticle holding portion in a state where a front cover of the reticle case according to the present embodiment is closed and holds the reticle. FIG. 2B is a cross-sectional view of a reticle fixing portion holding the reticle, and FIG. 3A is a reticle holding portion of the reticle case according to the present embodiment with a front cover opened. FIG. 3B is a cross-sectional view of the reticle fixing portion with the front cover of the reticle case opened. FIGS. 4A and 4B show FIGS. 2A and 2B, respectively.
5 (a) and 5 (b) show a state where the top and bottom of FIGS. 3 (a) and 3 (b) are reversed.

As shown in FIG. 1, a reticle case according to the present embodiment comprises a box-shaped frame 5 having an open top and front, and a hinge (not shown) so as to open and close the top of the frame 5. Upper lid 6 rotatably provided
And a front cover 7 that can be opened and closed by a hinge (not shown) so as to open and close the front surface of the frame 5.

Four holding members 2 for holding the reticle 1 are attached to the lower surface of the frame 5 as described later. The contact portion 2a of the holding member 2 with the reticle 1 is formed in a tapered shape so as to become lower toward the center of the bottom surface of the frame 5. Therefore, reticle 1
When the reticle 1 is placed on the holding member 2, only the edge of the reticle 1 comes into line contact with the holding member 2. That is, the holding member 2 does not come into surface contact with any of the front surface (chrome surface), the back surface (glass surface), and the side surface of the reticle 1.

The lower surface of the frame 5 has a side wall 5
Wall portions 5C and 5D are formed substantially parallel to A and 5B,
Two cams 8 are provided on the walls 5C and 5D so as to be rotatable about a shaft 8B. The shape of the cam 8 will be described later. The two cams 8 provided on each of the wall portions 5C and 5D are connected by a connecting wire 9 connected to a pin 8A formed on the cam 8, whereby the two cams 8 are interlocked with each other. Rotate. The cam 8 on the side close to the front cover 7 is connected to the front cover 7 by a wire 10. Further, the cam 8 is urged by a tension spring 11 in the rear direction of the frame 5 (counterclockwise direction).
Therefore, the opening and closing of the front cover 7 and the rotation of the four cams 8 are linked, and the front cover 7 is constantly urged in the closing direction.

A preload plate 12 is attached to the upper lid 6 via four compression springs 4. As shown in FIGS. 6A and 6B, the guide pins 30 attached to the upper cover 6 are inserted into the cylindrical portion 31 attached to the preload plate 12, and thus the upper cover 12 is fitted to the upper cover 12. 6 can be moved only in the vertical direction. The guide pins 30
And the cylinder part 31 is provided in the compression spring 4. A preload holding member 3 having a tapered contact portion 3a is attached to the surface of the preload plate 12 similarly to the holding member 2 provided on the lower surface of the frame 5. The preload holding member 3 is disposed at a vertically symmetric position with respect to the holding member 2 of the frame 5 and the reticle 1. The upper lid 6 is the frame 5
Is locked by a lock device (not shown) when the upper surface of the is closed.

Here, when the upper lid 6 and the front lid 7 are closed by sandwiching the reticle 1 between the holding member 2 and the preload holding member 3, the cam surface 8 a contacts the preload plate 12. The cam surface 8a presses the preload holding member 3 upward when the front cover 7 is opened and rotated toward the front of the frame 5 without contact.

Next, the operation of this embodiment will be described. When the chrome surface of the reticle 1, that is, the surface on which the pellicle 1a is provided in FIG. 2A, is placed on the holding member 2 of the frame 5 and the upper lid 6 is closed, as shown in FIG. The reticle 1 is sandwiched between the holding member 2 and the preload holding member 3 from above and below. At this time, the reticle 1 is pressed from above by the action of the compression spring 4, whereby the reticle 1 is held from above and below. On the other hand, since the reticle 1 is held by the tapered contact portions 2a and 3a of the holding member 2 and the preload holding member 3, the movement in the two-dimensional direction with respect to the reticle surface is also restricted. Therefore, reticle 1 is held without moving within frame 5. At this time, the cam surface 8a of the cam 8 is
As shown in (b), the reticle 1 is reliably held by the preload holding member 3 because it is not in contact with the preload plate 12.

Next, the front cover 7 is moved to the position shown in FIGS. 2 (a) and 2 (b).
When the cam 8 is opened in the direction of arrow A, the cam 8 rotates in the direction of arrow C in FIG. 2B against the urging force of the spring 11 in conjunction with the opening movement of the front cover 7. Thereby, the cam 8
Rotates against the urging force of the compression spring 4, and the cam surface 8a starts contacting with the preload plate 12, and the cam surface 8a
Is gradually pushed up in the direction of arrow B. And the front cover 7
Is fully opened, as shown in FIGS. 3 (a) and 3 (b), the cam 8 completely pushes up the preload plate 12, so that the fixing of the reticle 1 is released. At this time, the reticle 1 is placed on the holding member 2, and in this state, the automatic transfer device of the semiconductor device automatically takes out the reticle 1 from the frame 5 and transfers it.

When the front cover 7 is closed again, the cam 8 rotates toward the rear surface of the frame 5 by the urging force of the spring 11, so that the preload plate 12 moves downward by the urging force of the compression spring 4, and in this state. Is held in.

On the other hand, when the reticle case is installed upside down, as shown in FIG. 4A, the reticle 1 has the holding member 2 and the preload holding member 3 as in the case shown in FIG. 2A. Sandwiched between. At this time, the reticle 1 is pressed upward from below by the action of the compression spring 4, and
Thereby, the reticle 1 is fixed up and down. On the other hand, since the reticle 1 is held by the tapered contact portions 2a and 3a of the holding member 2 and the preload holding member 3, the movement in the two-dimensional direction with respect to the reticle surface is also restricted. Therefore,
Even if the case is turned upside down, the reticle 1 is held in the frame 5 without moving. At this time, since the cam 8 is not in contact with the preload plate 12 as shown in FIG. 4B, the holding of the reticle 1 by the preload holding member 3 is assured.

Next, the front cover 7 is moved to the position shown in FIGS.
4B, the cam 8 rotates in the direction of arrow C in FIG. 4B against the urging force of the spring 11 in conjunction with the opening movement of the front cover 7. Thereby, the cam 8
Presses down the preload plate 12 gradually in the direction of arrow B against the urging force of the compression spring 4. When the front cover 7 is fully opened, as shown in FIGS. 5A and 5B, the cam 8 completely pushes down the preloading plate 12, so that the reticle 1 is unlocked. At this time, the reticle 1 is placed on the preload holding member 3, and in this state, the automatic transfer device of the semiconductor device automatically takes out the reticle 1 from the frame 5 and transfers it.

When the front cover 7 is closed again, the cam 8 rotates toward the rear surface of the frame 5 by the urging force of the spring 11, so that the preload plate 12 moves upward by the urging force of the compression spring 4, and in this state. Is held in.

As described above, in the present embodiment, the holding member 2 provided on the bottom surface of the frame 5 and the holding member 2
The reticle 1 is held by the preload holding member 3 provided on the preload plate 12 and the preload plate 12 is urged toward the bottom surface of the frame 5. The nipped reticle 1 is securely held in the reticle case even if the reticle case is turned upside down.
Therefore, it is not necessary to provide separate cases for a reduced projection exposure apparatus or the like that uses the chrome surface of the reticle 1 facing downward and an EB apparatus or an inspection device that uses the chrome surface facing upward.

Further, the reticle 1 is held in line contact with the holding member 2 and the preload holding member 3 only at its edges by the tapered contact portions 2a and 3a of the holding member 2 and the preload holding member 3, so that the reticle 1 The holding member 2 and the preload holding member 3 do not come into contact with the surface of the first member. Therefore, generation of dust due to surface contact between the holding member and the reticle 1 can be prevented, and it is possible to prevent the pattern drawn on the reticle 1 from being adversely affected.

Further, in the above embodiment, the space in the case where the cam 8 is attached and the reticle 1
Is separated from the space in which the reticle 1 is held by the walls 5C and 5D, so that dust generated by the rotation of the cam 8 is
Can be prevented from entering the space in which is held.

In the above embodiment, the case for storing the reticle 1 has been described. However, the present invention can be applied to a case for storing a wafer or a glass substrate.

In the above embodiment, the upper lid 6
Although the preload plate 12 is provided on the bottom of the frame 5 via a compression spring, a preload plate may be provided on the bottom of the frame 5 via a compression spring. A preload plate may be provided.

In the correspondence between the above embodiment and the claims, the holding member 2 is the first holding member, the preload holding member 3 is the second holding member, the contact portions 2a, 3a are the mounting portions, The compression spring 4 and the preload plate 12 constitute an urging mechanism, the cam 8 constitutes a release mechanism, and the guide pin 30 and the cylinder 31 constitute a regulating mechanism.

Embodiment of Semiconductor Manufacturing Process According to the Present Invention Hereinafter, an embodiment of a semiconductor manufacturing process according to the present invention will be described with reference to FIGS.

In FIG. 7, a reticle case 20 is a common storage case for storing the reticle 1 when moving between individual steps constituting a semiconductor manufacturing process. The reticle case 20 has substantially the same configuration as the above-described embodiment of the substrate storage case. However, the width of the front cover 7a is wider than that of the front cover 7 of the above-described embodiment, and both ends of the front cover 7a are
It is configured to protrude from B.

Reticle case 20 containing reticle 1
Is the reticle case library 10 of the EB exposure apparatus 101
When the reticle 1 is inserted into the EB exposure apparatus 101, the automatic transport apparatus (not shown) of the EB exposure apparatus 101 takes out the reticle 1 from the reticle case 20 and transports the reticle 1 into the EB exposure apparatus 101. After executing the EB depiction, the drawn reticle 1 is carried out of the EB exposure apparatus 101 by the automatic transport device, and is again stored in the reticle case 20 in the reticle case library 101A.

After the EB drawing process is completed, the reticle case 20 containing the reticle 1 is taken out of the reticle case library 101A, and is used for the next process.
Inserted into 2A. Next, the etching / developing device 102
The automatic transfer device (not shown) takes out the reticle 1 from the reticle case 20 and transfers it to the etching / developing device 102. The reticle 1 that has undergone the etching / developing process is stored again in the reticle case 20 in the reticle case library 102A by the automatic transport device.

After the completion of the etching / development process, the reticle case 20 is taken out of the reticle case library 102A and inserted into the reticle case library 103A of the reticle inspection apparatus 103. The reticle 1 is moved by a later-described automatic transfer device 40 (FIG. 8) into a reticle case 2.
And is carried into the reticle inspection apparatus 103. After the dimensions of the pattern formed on the reticle 1 are measured and the appearance of the pattern is inspected by the reticle inspection device 103, the reticle 1 is returned into the reticle case 20 by the automatic transfer device 40, and the reticle inspection process is completed.

Next, the reticle case 20 is taken out of the reticle case library 103A of the reticle inspection apparatus 103, and sent to the next process, the reduced projection exposure process. In the reduction projection exposure process, the reticle 1 must be set so that the pattern surface is on the lower side, and the reticle case 20 is turned upside down and inserted into the reticle case library 104A of the reduction projection exposure apparatus 104. The reticle 1 is transferred into the reduction projection exposure device 104 by an automatic transfer device 50 (FIG. 9) described later, and performs reduction projection on a wafer. After the reduction projection is completed, the reticle 1 is returned to the reticle case 20 by the automatic transfer device 50, and all the processes are completed.

Next, with reference to FIG. 8, the automatic transfer device 40 used in the above-described reticle inspection process will be described. As shown in FIG. 8, the automatic transport device 40 includes a base 41 having a moving part 41 a movable in a vertical direction, a first arm 42 rotatably attached to the moving part 41 a, and a tip of the first arm 42. A second arm 43 is rotatably attached to the unit, and a hand 44 is rotatably attached to the tip of the second arm 43. With such a configuration, the position, direction (R, θ) and vertical position (Z) of the hand 44 in the horizontal plane can be controlled.

On the other hand, as shown in FIG. 8, the reticle case library 103A of the reticle inspection device 103 has a claw 46 for opening the front cover 7a of the reticle case 20.
Are provided for each stage. The front cover 7a can be opened in the P direction by moving the claw 46 that contacts the end of the front cover 7a.

The reticle case 20 is the reticle inspection device 1
When the reticle 1 is inserted into the reticle case library 103A of No. 03, the front cover 7a is opened by the claw 46, whereby the fixing of the reticle 1 is released. Subsequently, the reticle 1 is placed on the hand 44 by raising the hand 44 inserted into the lower gap of the reticle 1. Next, by moving the hand 44, the arrows Q, R,
The reticle 1 passes through the S and T paths,
3 is mounted on the reticle stage 47. After the reticle inspection is completed, the reticle 1 is placed in the reticle case 20 with the front cover 7a opened via the paths of arrows U, V, W, and X. After the hand 44 is pulled out of the reticle case 20, the claws 46 are moved to close the front cover 7a in the Y direction. Thereby, reticle 1 is fixed in reticle case 20.

Next, with reference to FIG. 9, an automatic transport device 50 used in the above-described reduced projection exposure process will be described. The automatic transfer device 50 has the same configuration as the automatic transfer device 40. As shown in FIG. 9, the automatic transfer device 50 includes a base 51 having a moving portion 51 a movable in a vertical direction,
First arm 52 rotatably attached to moving part 51a
A second arm 53 rotatably attached to the distal end of the first arm 52; and a hand 54 rotatably attached to the distal end of the second arm 53. In the reticle case library 104A of the reduction projection exposure apparatus 104, claws 56 for opening the front cover 7a of the reticle case 20 are provided for each stage. Note that in FIG. 9, the top and bottom of the reticle case 2 are inverted from those in FIG.

The reticle case 20 is a reduction projection exposure apparatus 1
When inserted into the reticle case library 104A of No. 04, the front cover 7a is opened by the claw 56. Subsequently, the hand 54 inserted into the lower gap of the reticle 1 is lifted, and the reticle 1 is placed on the hand 54. Then, the reticle 1 is moved through the paths indicated by arrows Q, R, S, and T in FIG. It is mounted on a reticle stage 57 of the reduction projection exposure apparatus 104. After reticle inspection, reticle 1 is indicated by arrows U, V,
The front cover 7a is placed in the open reticle case 20 via the paths of W and X. After the hand 54 is pulled out of the reticle case 20, the front cover 7a is closed in the Y direction by the movement of the claw 56, whereby the reticle 1 is fixed in the reticle case 20.

In the semiconductor manufacturing process of this embodiment,
When moving between the respective steps, the reticle 1 is held in the reticle case 20.
And a reticle case library for accommodating the reticle case 20 for each apparatus in each process. For this reason, the reticle case 20 can be moved between the reticle case libraries while the reticle 1 is stored, so that the operator does not touch the reticle 1 during the manufacturing process, and dust in the air hardly adheres. Therefore, an extremely clean process can be realized. In addition, since the reticle case 2 can be used upside down, there is no need to replace the reticle 1 in a different case, and the efficiency and cost of the semiconductor manufacturing process can be reduced.

The movement of the reticle case 20 between the steps may be performed by an operator, or may be automated by using an unmanned transfer device or the like. According to the present embodiment, the case for storing reticle 1 is unified to reticle case 20, so that automation using an unmanned transfer device or the like is easy. In addition, by unifying the storage cases, it is possible to standardize the design of the automatic transport devices used for each process such as the automatic transport devices 40 and 50.

[0047]

As described above in detail, according to the first aspect of the present invention, the first and second mounting portions for mounting the substrate on both the bottom surface of the frame and the lid are provided. Because the holding member is provided, the substrate is held in the same state in the case regardless of the top and bottom of the case,
The case can be used regardless of whether the substrate is above or below the substrate, and it is not necessary to provide a separate case depending on the device using the substrate. According to the second aspect of the present invention, the substrate 1 is held with the edges thereof in contact with the tapered mounting portions of the first and second holding members 2 and 3. For this reason, the first and second holding members do not come into contact with the surface of the substrate, and the generation of dust due to the contact between the holding member and the substrate is prevented, thereby preventing the substrate from being adversely affected. it can.

According to the third aspect of the present invention, the first and the second
Since at least one of the holding mechanisms is biased toward the other, the substrate is reliably held with its position regulated by the first and second holding mechanisms. According to the fourth aspect of the present invention, the second holding member is provided on the preload plate, and the urging mechanism urges the preload plate. Therefore, the second holding member holds the substrate with a uniform holding force. Can be. According to the fifth aspect of the present invention, the preload plate is regulated by the regulating mechanism so as not to move in the direction orthogonal to the urging direction of the urging mechanism, so that the preload plate surely moves in the urging direction of the urging mechanism. Will be done. Therefore, the second holding member can surely hold the substrate with a uniform holding force.

According to the sixth aspect of the present invention, since the release mechanism for releasing the urging of the urging mechanism is provided, the substrate can be easily released from being held by the first and first holding members. According to the seventh aspect of the invention, the urging mechanism is released from the urging mechanism by the releasing mechanism in accordance with the opening operation of the front cover, so that the substrate can be easily taken out from the front surface of the frame. According to the invention of claim 8, since the release mechanism is isolated from the space in which the substrate is stored, dust generated by the operation of the release mechanism does not adhere to the substrate, thereby preventing adverse effects on the substrate. be able to.

According to the ninth aspect of the present invention, when the substrate 1 is moved between a plurality of processes for processing or inspecting the substrate 1, the substrate 1 is stored in the substrate storage case according to any one of the first to eighth aspects. Since it is accommodated in the substrate, it is possible to prevent dust and dirt from adhering to the substrate. According to the tenth aspect, a common substrate storage case is used for a plurality of movements between steps, so that the semiconductor manufacturing process can be made more efficient.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a reticle case according to the present embodiment.

FIG. 2A is a cross-sectional view of a reticle holding portion in a state where a front cover of a reticle case according to the present embodiment is closed to hold a reticle, and FIG. 2B is a state in which a reticle is held; Cross section of reticle fixing part

FIG. 3A is a cross-sectional view of a reticle holding portion of the reticle case according to the present embodiment with a front cover opened, and FIG. 3B is a view of a reticle fixing portion of the reticle case with a front cover opened. Sectional view

FIG. 4 is a diagram showing a state in which the top and bottom of FIGS. 2A and 2B are inverted;

FIG. 5 is a diagram showing a state in which the top and bottom of FIGS. 3A and 3B are inverted;

FIG. 6 is a diagram showing a configuration of a guide pin.

FIG. 7 is a diagram schematically showing a semiconductor manufacturing process of the present embodiment.

FIG. 8 is a view showing an automatic transfer device used in the reticle inspection process.

FIG. 9 is a diagram showing an automatic transport device used in the reduction projection exposure process.

FIG. 10 is a diagram showing a configuration of a conventional reticle case.

FIG. 11 is a diagram showing an example of a conventional semiconductor manufacturing process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Reticle 2 Holding member 3 Preload holding member 4 Compression spring 5 Frame 6 Upper lid 7 Front lid 8 Cam 9 Connecting wire 11 Tension spring 12 Preload plate 20 Reticle case 30 Guide pin 31 Tubular part 40 Automatic transport device 50 Automatic transport device

Claims (11)

[Claims] 1. A frame having at least an upper part opened, a lid for opening and closing the opening of the frame, a first holding member disposed on a bottom surface of the frame, and a first member disposed on the lid. A holding member for holding the substrate by holding the substrate between the first and second holding members, wherein each of the first holding member and the second holding member is provided. In
A substrate storage case, wherein a mounting portion on which the substrate can be mounted independently is provided. 2. The mounting portion of the first holding member and the second holding member is tapered with a downward slope toward the center of the case, and the mounting portion contacts an edge of the substrate. The substrate storage case according to claim 1, wherein the substrate is held by holding the substrate. 3. The substrate storage according to claim 1, further comprising an urging mechanism for urging at least one of the first holding member and the second holding member toward the other. Case. 4. The substrate storage case according to claim 3, wherein the second holding member is provided on a preload plate, and the urging mechanism urges the preload plate. 5. The substrate storage case according to claim 4, further comprising a regulating mechanism for regulating the preload plate so as not to move in a direction orthogonal to the urging direction of the urging mechanism. 6. The apparatus according to claim 3, further comprising a release mechanism for releasing the urging of said urging mechanism.
The board storage case described. 7. The apparatus according to claim 6, further comprising a front cover for opening and closing a front surface of the frame, wherein the release mechanism releases the bias of the biasing mechanism in response to an opening operation of the front cover. The board storage case described. 8. The substrate storage case according to claim 6, wherein the release mechanism is provided separately from a space in which the substrate is stored. 9. In a semiconductor manufacturing process including a plurality of steps of processing or inspecting the substrate, when the substrate is moved from one of the plurality of steps to the next step, Any one of claims 1 to 8
A semiconductor manufacturing process characterized in that the semiconductor device is housed in the substrate housing case described in (1). 10. The process according to claim 9, wherein said substrate is a process of sequentially moving three or more steps, and wherein said substrate is stored in a common substrate storage case during a plurality of movements. Semiconductor manufacturing process. 11. The apparatus according to claim 10, wherein an automatic transfer device for taking out the substrate from the common substrate storage case and automatically transferring the substrate to a predetermined position for processing or inspection is provided for each process. Semiconductor manufacturing process.