JPH10298509A - Tape for loc - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a tape for lead on chip(LOC) having good punching property and dimensional stability and capable of precisely processing by slitting a sheet providing an adhesive layer on both sides of a specific aromatic polyimide film composed of a tetracarboxylic acid component and an aromatic diamine component. SOLUTION: A polyimide sheet having an adhesive, providing an adhesive layer on both sides of an aromatic polyimide film comprising a polyimide obtained by reaction of a tetracarboxylic acid component containing at least 15 mol.% biphenyltetracarboxylic acid or its dianhydride or ester with an aromatic diamine component containing at least 5 mol.% phenylene diamine and having 20-80 μm thickness, 11-22 kg/20 mm/10 μm specific shear resistance and <=0.4 wt.% residual volatile matter content is slit to provide the objective tape for LOC.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to at least 15
A polyimide produced by reacting a tetracarboxylic acid component containing at least 5 mol% of a biphenyltetracarboxylic acid with an aromatic diamine component containing at least 5 mol% of a phenylenediamine;
With an adhesive having an adhesive layer provided on both surfaces of an aromatic polyimide film having a specific end resistance of 1 to 22 kg / 20 mm / 10 μm and a good punching property with a residual volatile matter content of 0.4% by weight or less. The present invention relates to a tape for LOC formed by slitting a polyimide sheet.

[0002]

2. Description of the Related Art As the storage capacity of a semiconductor memory has increased, the package has been changed from a DIP (dual in-line package) to a LOC (lead-on-chip) system. In the LOC system, there is a lead frame on the IC chip, and the space between them is bonded with a LOC tape (adhesive / insulating tape / adhesive). This LO
The aromatic polyimide used for C is a polymer having excellent heat resistance and mechanical properties obtained by heating and dehydrating a polyamic acid produced from a tetracarboxylic acid component and an aromatic diamine component to a high temperature. -. However, the aromatic polyimide film used for the tape for LOC is required to have higher punchability in order to achieve higher precision and higher productivity.

Japanese Patent Application Laid-Open No. 6-334110 discloses that a polyimide film having an edge crack resistance of 50 to 70 kgf / 20 mm has excellent punching properties.
Further, it is stated that the polyimide film must have some% of a hygroscopic solvent remaining.

In consideration of the heat resistance and electrical insulation properties of electronic parts such as LOC tapes, as well as the high requirements for mechanical strength, especially tensile modulus, etc., the aromatic polyimide film is used as a tetracarboxylic acid component. Those containing a biphenyltetracarboxylic acid component and a phenylenediamine component as an aromatic diamine component are preferred. In order to form a LOC by bonding a lead frame and a tape for LOC, an aromatic polyimide film is formed by a known polyamide adhesive, polyimide adhesive, epoxy resin adhesive, acrylic resin, or the like. It is necessary to exhibit high adhesiveness to an adhesive such as a resin adhesive.

However, according to the study of the present inventors, the technique described in the above-mentioned Japanese Patent Application Laid-Open No. 6-334110 utilizes a component containing a biphenyltetracarboxylic acid component as a tetracarboxylic acid component, and uses an aromatic diamine component as a component. It has been found that it is not possible to impart satisfactory properties to an aromatic polyimide film produced using a material containing a phenylenediamine component.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a tape for LOC using an aromatic polyimide film which has good punching properties and maintains adhesiveness and dimensional stability as a substrate film. It is.

[0007]

SUMMARY OF THE INVENTION The present invention provides a tetracarboxylic acid component containing at least 15 mol% of biphenyltetracarboxylic acid or a dianhydride or an ester thereof, and an aromatic diamine component containing at least 5 mol% of phenylenediamine. Is an aromatic polyimide film having a thickness of 20 to 80 μm, which is made of polyimide produced by the reaction with
A slit polyimide sheet with an adhesive layer provided on both surfaces of an aromatic polyimide film having a specific crack resistance of about 22 kg / 20 mm / 10 μm and a residual volatile matter content of 0.4% by weight or less. The present invention relates to a tape for LOC.

[0008] In this specification, the crack resistance (or specific crack resistance) means the average value of the crack resistance (or specific crack resistance) of samples (5 pieces) measured according to JIS C2318. Specifically, the center line of the V-shaped notch plate test bracket having the upper thickness of 1.00 ± 0.05 mm of the constant-speed tension-type tensile tester was made to coincide with the center line of the upper grip, and the top of the cut and the lower grip were Attach the handle so that the interval is about 30 mm. A test piece with a width of about 20 mm and a length of about 200 mm is passed through the hole of the bracket, folded into two parts, clamped at the lower part of the tester, pulled at a speed of about 200 mm per minute, and pulled apart. Is called end tear resistance.
Five test pieces were taken from the longitudinal direction and the lateral direction over the entire width, respectively, and the average value of the end crack resistance was determined and shown as the end crack resistance value. The specific tear resistance is a tear resistance per film thickness (converted to 10 mm).

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be listed below. 1) The specific crack resistance of the aromatic polyimide film is 11 to 11
The above LO in the range of 15 kg / 20 mm / 10 μm
Tape for C. 2) The residual volatile matter content of the aromatic polyimide film is 0.35
The above-mentioned tape for LOC which is not more than weight%. 3) The above-mentioned tape for LOC, wherein the residual volatile matter content of the aromatic polyimide film is 0.3% by weight or less. 4) The above-mentioned tape for LOC, in which the residual volatile matter content of the aromatic polyimide film is 0.2% by weight or less. 5) The LOC tape described above, wherein the layer containing at least one surface of the aromatic polyimide film contains 0.02 to 6% by weight of the inorganic filler relative to the aromatic polyimide. 6) The above-mentioned LOC tape in which both surfaces of the aromatic polyimide film are subjected to any one or more of surface treatment agent treatment, corona discharge treatment, flame treatment, ultraviolet irradiation, glow discharge treatment, and plasma treatment. H. 7) The aromatic polyimide film has a water absorption of 1.8% or less, a tensile modulus of 450 kg / mm ² or more, and a coefficient of linear expansion (50 to 200 ° C.) of 2.5 × 10 ⁻⁵ cm / cm / cm.
The above LOC tape having a temperature of not more than ° C. 8) Dielectric breakdown voltage of aromatic polyimide film is 3KV
The volume resistivity (25 ° C.) is 1 × 10 ¹⁵ Ω ·
cm or more for LOC tape. 9) The above-mentioned LOC tape, wherein the adhesive is a thermoplastic adhesive or a thermosetting adhesive.

The biphenyltetracarboxylic acid component in the present invention includes 2,3,3 ', 4'-biphenyltetracarboxylic acid, 3,3', 4,4'-biphenyltetracarboxylic acid, dianhydrides thereof, Alternatively, esters thereof can be used, and among them, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride is preferably used.

The aromatic tetracarboxylic acid component which can be used in combination with the biphenyltetracarboxylic acid component in the present invention includes pyromellitic dianhydride, 3,3 ', 4,4'
-Benzophenonetetracarboxylic dianhydride, 2,
2 ', 3,3'-benzophenonetetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl)
Propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (2,3-dicarboxyphenyl) ) Ether dianhydride, 2,3,6
7-naphthalenetetracarboxylic dianhydride, 1,4
5,8-naphthalenetetracarboxylic dianhydride, 1,
2,5,6-naphthalenetetracarboxylic dianhydride,
2,2-bis (3,4-dicarboxyphenyl) -1,
1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis (2,3-dicarboxyphenyl)-
Examples thereof include 1,1,1,3,3,3-hexafluoropropane dianhydride.

The phenylenediamine in the present invention is
Although any of p-phenylenediamine, m-phenylenediamine and o-phenylenediamine may be used, p-phenylenediamine is particularly preferably used. Aromatic diamine components that can be used in combination with phenylenediamine include diaminodiphenyl ether, 4,4′-
Diaminodiphenylpropane, 4,4′-diaminodiphenylethane, 4,4′-diaminodiphenylmethane,
4,4'-diaminodiphenyl sulfide, bis [4-
(4-aminophenoxy) phenyl] methane, 2,2-
Bis [4- (4-aminophenoxy) phenyl] propane, 2,2'-bis [4- (aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, bis [4- (4-aminophenoxy) phenyl] ether and the like.

In the present invention, the aromatic polyimide film (or surface-treated film) has a thickness of 2
It is preferably from 0 to 80 μm, and particularly preferably from 25 to 55 μm. When the thickness of the aromatic polyimide film is smaller than the lower limit, the self-supporting property is low. Also,
When the amount of the remaining volatiles is more than 0.4% by weight, problems occur in the adhesiveness and dimensional stability. If the specific crack resistance of the aromatic polyimide film is outside the above range, the object of the present invention cannot be achieved.

When (1) the water absorption and (2) the coefficient of linear expansion (50 to 200 ° C.) are within the above ranges, the dimensional stability under various environments (high temperature, etching, etc.) is good. It is. Further, (3) when the tensile modulus is in the above range, the handling is good as a substrate film.

The aromatic polyimide film according to the present invention can be manufactured, for example, as follows.
Preferably first the tetracarboxylic dianhydride, preferably biphenyltetracarboxylic acids and phenylenediamine,
Preferably, paraphenylenediamine is polymerized in an organic polar solvent usually used for the production of a polyimide such as N, N-dimethylacetamide or N-methyl-2-pyrrolidone, preferably at 10 to 80 ° C. for 1 to 30 hours. And the polymer
Logarithmic viscosity (measuring temperature: 30 ° C., concentration: 0.5 g / 10
0 ml solvent, solvent: N-methyl-2-pyrrolidone) 0.1-5, polymer concentration 15-25% by weight, rotational viscosity (30 ° C.) 500-4500 poise polyamic acid (imidization) (Rate: 5% or less) to obtain a solution.

Next, preferably, the polyamic acid 10
0.01 to 1% by weight, based on 0 parts by weight, of a phosphorus compound, for example, an organic phosphorus compound or an inorganic phosphorus compound such as a (poly) phosphate ester and / or an amine salt of a phosphate ester, and preferably further a polyamic acid Acid 100
0.02 to 6 parts by weight of an inorganic filler such as colloidal silica, silicon nitride, talc, titanium oxide and calcium phosphate (preferably 0.005 to 5 parts by weight)
μm, particularly 0.005 to 2 μm) to prepare a polyamic acid solution composition. These phosphorus compounds and / or
Or, the inorganic filler is preferably present uniformly in the entire film layer, or when a film having a two- or three-layer structure is formed, the inorganic filler is preferably contained in the layer containing at least one surface in the above-described ratio. Fine projections are formed on one surface.

The polyamic acid solution composition is cast on a glass or metal support having a smooth surface to form a thin film of the solution, and when the thin film is dried,
Adjust the drying conditions (preferable temperature: 100 to 16
(0 ° C., time: 1 to 60 minutes) By drying, the solidified film has a volatile content of 30 to 50% by weight and an imidization rate of 10 to 60% in the solidified film. A solidified film is formed, and the solidified film is peeled from the support surface.

Next, after one or both surfaces of the solidified film are coated with a surface treating solution containing an aminosilane-based, epoxysilane-based or titanate-based surface treating agent, the film can be further dried. As the surface treatment agent, γ-
Aminopropyl-triethoxysilane, N-β- (aminoethyl) -γ-aminopropyl-triethoxysilane, N- (aminocarbonyl) -γ-aminopropyl-
Triethoxysilane, N- [β- (phenylamino)-
Ethyl] -γ-aminopropyl-triethoxysilane,
Aminosilanes such as N-phenyl-γ-aminopropyl-triethoxysilane, γ-phenylaminopropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) -ethyl-trimethoxysilane, γ-glycidyloxypropyl And heat-resistant surface treatment agents such as epoxysilanes such as trimethoxysilane and titanates such as isopropyl-tricumylphenyl-titanate and dicumylphenyl-oxyacetate-titanate. The surface treatment solution is prepared by adding the above surface treatment agent to 0.5 to 50.
It can be used as a solution of an organic polar solvent such as a lower alcohol or an amide-based solvent containing 1 wt%. The surface treatment liquid is preferably applied uniformly using a gravure coating method, a silk screen, a dipping method or the like to form a thin layer.

One example of the method for producing an aromatic polyimide film according to the present invention will be described below with reference to FIG. 1, which shows preferable heating conditions before curing in a curing furnace. That is, the solidified film obtained as described above is further dried if necessary, and preferably the volatile content of the dried film is adjusted to 10 to 45% by weight, and then the width of the dried film is adjusted. Fig. 1
Temperature (° C) (preferably 100 to 250 ° C) at the entrance of the curing furnace in the curing furnace shown in (1) x residence time (minutes)
After drying so that is within the range of the oblique line, the maximum heating temperature: 4
The dried film is heated and dried and imidized under the condition that the temperature is from 00 to 500 ° C. for 0.5 to 30 minutes. It can be suitably manufactured as a polyimide film. Further, after the curing step, one or both sides of the aromatic polyimide film are alkali-treated (for example, after immersion in an aqueous alkali solution such as sodium hydroxide, and then washed and dried), and then the surface treatment liquid is applied and dried. , The film surface can be similarly surface-treated.

The aromatic polyimide film obtained as described above is preferably used under low tension or no tension.
Heat at a temperature of about 00 to 400 ° C. to perform stress relaxation treatment,
Take up.

In the above-mentioned aromatic polyimide film, the heating conditions before curing in the curing furnace during the above-mentioned production are controlled within the range shown in FIG. 1 and the curing conditions are adjusted to the above-mentioned temperature and time. When the thickness is within the range, the thickness is 20 to 75 μm, and the amount of residual volatiles is 0.
The specific crack resistance can be set to a value specified in the present invention when the content is not more than 4% by weight.

The aromatic polyimide film according to the present invention preferably has 3,3 as a tetracarboxylic dianhydride.
It can be easily obtained by a method of polymerizing 3 ′, 4,4′-biphenyltetracarboxylic dianhydride and paraphenylenediamine as an aromatic diamine, but as a polyamic acid, it satisfies the physical properties of the film. Within the range, other components may be polymerized together with 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and paraphenylenediamine, and the type of bond may be random polymerization or block polymerization. Any of them may be used. Also,
If the total amount of each component in the finally obtained polyimide film is within the above range, polyamic acid containing 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and paraphenylenediamine are included. You may mix and use the polyamic acid component which consists of another component with polyamic acid. In either case, the polymer is cut and recombined at the time of heating at a high temperature, and the target aromatic polyimide film can be obtained in the same manner as described above. Further, the aromatic polyimide film in the present invention is not limited to the above-mentioned thermal imidization, and can be similarly performed by chemical imidization within the above-mentioned conditions.

The aromatic polyimide film in the present invention is preferably subjected to a surface treatment by a corona discharge treatment, a plasma treatment, an ultraviolet irradiation, a glow discharge treatment, and a flame treatment, as it is or when it is not treated with a surface treatment agent. Then, apply and dry a thermoplastic adhesive solution or a thermosetting adhesive solution on both sides of the aromatic polyimide film with improved adhesiveness, or laminate these adhesive sheets (uncured state) to adhere. An adhesive layer is provided, and the polyimide sheet with the adhesive is slit to obtain a tape for LOC. A LOC tape having both surfaces covered with a cover film can be obtained by laminating a cover film on the surface of the adhesive layer of a polyimide sheet with an adhesive and slitting the cover film.

Examples of the adhesive include a polyamide adhesive, a polyimide adhesive, an epoxy resin adhesive, and an acrylic resin adhesive. As these adhesives, those known as adhesives for electronic components can be applied. The thickness of the adhesive layer is usually preferably about 5 to 35 μm. The adhesive may contain an inorganic filler (preferably a fine inorganic filler). When an inorganic filler is contained, the peel strength tends to increase. When using an adhesive film, a heat-resistant film, for example, a thermoplastic film having both solvent resistance and a relatively high melting point, for example, a polyester film is used as a support film, and the adhesive solution is applied on the support film. After coating and drying to a predetermined width, both surfaces of the adhesive layer are laminated with a protective film (one is a support film), and the adhesive film is laminated with a polyimide film of a predetermined width while peeling off one protective film. Then, the polyimide sheet with the adhesive covered with the protective film is slit to obtain a tape for LOC.

The tape for LOC obtained by the above-mentioned slipping is punched into a strip shape by punching, and is sandwiched between an IC chip and a lead frame.
Press for 0.4 to 200 seconds at kg / cm ² to fix the lead frame on the IC chip. A semiconductor chip can be manufactured by connecting the fixed lead frame and the IC chip by wire bonding and packaging by transfer molding.

[0026]

Embodiments of the present invention will be described below. In each of the following examples, the physical properties of the polyimide film were measured by the following methods. Water absorption: measured according to ASTM D570-63 (23
° C × 24 hours) Tensile modulus: Measured according to ASTM D882-64T (MD) Coefficient of linear expansion (50 to 200 ° C): A sample that has been heated at 300 ° C for 30 minutes and stress-relaxed is subjected to a TMA apparatus (tensile module).
(2g load, sample length 10mm, 20 ° C / min)

Imidation ratio: Determined by FI-IR (ATR method) from the ratio of absorbance at 1780 cm ^-1 to 1510 cm ^-1 . The measurement was performed on the A side of the film. Residual volatile amount (solidified film): determined by the following equation. Residual volatile matter amount (solidified film) = [(AB) / A] x 1
00 A: Film weight before heating B: Film weight after heating at 420 ° C. for 20 minutes Remaining volatile matter (polyimide film): Determined by the following formula. Amount of residual volatile matter (polyimide film) = [(AB) /
A] × 100 A: Weight after drying at 150 ° C. × 10 minutes B: Weight after drying at 450 ° C. × 20 minutes (Measurement is usually performed in air, but may be performed in nitrogen.)

Dielectric breakdown voltage: ASTM D149-64
(25 ° C.) Volume resistivity: measured according to ASTM D257-61 (25 ° C.) Dielectric constant: measured according to ASTM D150-64T (2
Peel strength: Measure 90 ° peel strength

Example 1 54.6 kg of N, N-dimethylacetamide was added to a polymerization tank having an internal volume of 100 liters.
4,4'-biphenyltetracarboxylic dianhydride 8.8
26 kg and 3.243 kg of paraphenylenediamine are added and polymerized at 30 ° C. for 10 hours, and the logarithmic viscosity of the polymer (measuring temperature: 30 ° C., concentration: 0.5 g / 100 ml solvent, solvent: N, N-dimethyl) Acetamide)
Was 1.60, and a polyamic acid (imidization ratio: 5% or less) solution having a polymer concentration of 18% by weight was obtained. In this polyamic acid solution, monostearyl phosphate triethanolamine salt at a ratio of 0.1 part by weight to 100 parts by weight of the polyamic acid and an average particle diameter of 0 part by weight (based on solid content) of 0.5 part by weight. 0.08 μm of colloidal silica was added and uniformly mixed to obtain a polyamic acid solution composition. The rotational viscosity of this polyamic acid solution composition was 30.
It was 00 poise. This polyamic acid solution composition was continuously cast from a slit of a T-die mold.
The solution was extruded on a smooth support in a drying furnace to form a thin film of the solution, and dried at an average temperature of 141 ° C. to form a long solidified film. By peeling from the surface of the support, a long solidified film was obtained. Next, an aminosilane surface treatment solution of N, N-dimethylacetamide was uniformly applied to both surfaces of the long solidified film, and then dried to obtain a dried film having a surface treated. This dried film had a residual volatile content of 27% by weight consisting of the solvent and the produced water. Next, while holding the surface-treated dry film in the width direction, it is cured in a curing furnace (temperature at entrance × residence time = 2).
40 ° C × 2 minutes, maximum temperature × maximum temperature residence time = 480 ° C
× 1 minute), and a long aromatic polyimide film having a thickness of 25 μm, both surfaces of which were treated with a surface treating agent, was continuously produced. Table 1 shows the results of measurement and evaluation of this aromatic polyimide film.

A thermoplastic polyimide adhesive (siloxane-modified polyimide) is applied on one side of the obtained polyimide film.
Is applied so that the thickness after drying is 20 μm,
C., and the same thermoplastic adhesive was applied to the other surface and dried to obtain a polyimide sheet with an adhesive provided with an adhesive on both surfaces. This sheet was slit to a width of 20 μm to obtain a tape for LOC.

Example 2 An elongated solidified film was obtained in the same manner as in Example 1, except that the slit width of the T-die was changed. The dried film was obtained by heating and drying in the same manner as in Example 1 without applying the surface treatment liquid to both surfaces of the long solidified film. This film had a residual volatile matter content of 27% by weight. Then, while holding the dried film in the width direction, it is cured in a curing furnace (temperature at the entrance × residence time = 200 ° C. × 4 minutes, maximum temperature × maximum temperature residence time = 480 ° C. × 3 minutes), Thickness 50μm
Was continuously produced. Table 1 shows the results of measurement and evaluation of the aromatic polyimide film. After using this aromatic polyimide film by subjecting it to low-temperature plasma treatment by a conventional method, a tape for LOC was manufactured in the same manner as in Example 1.

Example 3 A long solidified film was produced in the same manner as in Example 2. Next, a dried film surface-treated in the same manner as in Example 1 was obtained. This film had a residual volatile content of 28% by weight. Next, while holding the dried film in the width direction, it is cured in a curing furnace (temperature at the inlet × residence time = 200 ° C. × 2.5 minutes, maximum temperature × maximum temperature residence time = 480 ° C. × 3 minutes) ), A long aromatic polyimide film having a thickness of 50 µm and having both surfaces treated with a surface treating agent was continuously produced. Table 1 shows the results of measurement and evaluation of the aromatic polyimide film. Using this aromatic polyimide film, a tape for LOC was manufactured in the same manner as in Example 1.

Example 4 An elongated solidified film was obtained in the same manner as in Example 2 except that the slit width of the T-die was changed. Next, a dried film without surface treatment was obtained in the same manner as in Example 2. This film had a residual volatile content of 30% by weight. Next, while holding the dried film in the width direction, it is cured in a curing furnace (temperature at the inlet × residence time = 140 ° C. × 5).
Min, maximum temperature x maximum temperature residence time = 480 ° C x 3 minutes),
A long aromatic polyimide film having a thickness of 75 μm was continuously manufactured. Both surfaces of the aromatic polyimide film are alkali-treated (immersed in a solution of potassium hydroxide / hydrazine hydrate / water for 3 minutes), washed with acid, washed with water and dried, and then coated with the same surface treating agent as in Example 1. Surface treatment was performed by heating, and a long aromatic polyimide film having a thickness of 75 μm, both surfaces of which were treated with a surface treating agent, was continuously produced. Table 1 shows the results of measurement and evaluation of the aromatic polyimide film. Using this aromatic polyimide film, a tape for LOC was manufactured in the same manner as in Example 1.

Example 5 An elongated solidified film was obtained in the same manner as in Example 2 except that the slit width of the T-die was changed. A dried film was obtained by heating and drying in the same manner as in Example 2 without applying the surface treatment liquid to both surfaces of the long solidified film. This film had a residual volatile matter content of 30% by weight. Then, while holding the dried film in the width direction, the film is cured in a curing furnace (temperature at the inlet × residence time = 105 ° C. × 9 minutes, maximum temperature × maximum temperature residence time = 450 ° C. × 15 minutes), Thickness 75μ
m long aromatic polyimide film was continuously produced. Table 1 shows the results of measurement and evaluation of the aromatic polyimide film. Using this aromatic polyimide film, a polyimide adhesive (siloxane-modified polyimide) is applied and dried, and then the LOC tape is similarly formed.
Got

Example 6 A cut section of the tape for LOC obtained in Examples 1 to 5 punched into a strip shape by punching was observed. The case where the linearity was maintained and generation of beards and debris was not observed is indicated by ○, and the case where linearity was poor and generation of beards and debris was observed is indicated by ×. A strip obtained by punching out this LOC tape and a lead frame (42 alloy) were placed at 220 ° C. for 10 minutes.
The laminate was obtained by laminating under a pressure of 2 kg / cm ² for 2 seconds to obtain a laminate. Next, the peel strength of the laminate was measured. Further, tapes for LOC were obtained in the same manner as in Examples 1 to 5, except that the aromatic polyimide film and an acrylyl-based adhesive (Pilalux manufactured by DuPont) were used. Using this, lamination was performed under heating and pressure bonding conditions of 220 ° C., 20 kg / cm ² and 40 minutes to obtain a laminate. From the observation of the cut surface during punching and the measurement of the peel strength, the same results as those of the polyimide adhesive were obtained. Further, the heat shrinkage of the aromatic polyimide film in Examples 1 to 5 (250 ° C., 2 hours, JIS
C2318) was 0.3% or less. The results are summarized in Table 1.

[0036]

[Table 1]

[0037]

Since the present invention is configured as described above, the following effects can be obtained. INDUSTRIAL APPLICABILITY The tape for LOC of the present invention has good punching properties and adhesiveness, and can be processed with high precision.

[Brief description of the drawings]

FIG. 1 shows a range of suitable heating conditions before curing in a curing furnace in an example of a method for producing an aromatic polyimide film according to the present invention. Vertical axis Temperature at the entrance of cure furnace (° C) × Residence time (minutes) Horizontal axis Film thickness (μm) Oblique line Preferred range

Claims (10)

[Claims] 1. A polyimide prepared by reacting a tetracarboxylic acid component containing at least 15 mol% of biphenyltetracarboxylic acid or a dianhydride or ester thereof with an aromatic diamine component containing at least 5 mol% of phenylenediamine. Consisting of a thickness of 20 to 80
With an adhesive having an adhesive layer provided on both surfaces of an aromatic polyimide film having a specific edge resistance of 11 to 22 kg / 20 mm / 10 μm and a residual volatile matter amount of 0.4% by weight or less. LOC tape formed by slitting a polyimide sheet. 2. The LOC tape according to claim 1, wherein the specific tear resistance of the aromatic polyimide film is in the range of 11 to 15 kg / 20 mm / 10 μm. 3. The tape for LOC according to claim 1, wherein the residual volatile matter content of the aromatic polyimide film is 0.35% by weight or less. 4. The L according to claim 1, wherein the amount of residual volatile matter in the aromatic polyimide film is 0.3% by weight or less.
Tape for OC. 5. The L according to claim 1, wherein the amount of residual volatile matter in the aromatic polyimide film is 0.2% by weight or less.
Tape for OC. 6. The method according to claim 1, wherein the layer containing at least one surface of the aromatic polyimide film contains 0.02 to 6% by weight of the inorganic filler relative to the aromatic polyimide. Of LOC described in the section
H. 7. Both surfaces of the aromatic polyimide film are treated with a surface treatment agent, corona discharge treatment, flame treatment, ultraviolet irradiation,
The LOC tape according to any one of claims 1 to 6, wherein at least one of a glow discharge treatment and a plasma treatment is subjected to a surface treatment. 8. The aromatic polyimide film has a water absorption of 1.8% or less, a tensile modulus of 450 kg / mm ² or more, and a coefficient of linear expansion (50 to 200 ° C.) of 0.5 × 10 ⁻⁵ or less.
The LOC tape according to any one of claims 1 to 7, wherein the tape is at 2.5 x 10 ^-5 cm / cm / ° C. 9. The aromatic polyimide film has a dielectric breakdown voltage of 3 KV or more and a volume resistivity (25 ° C.) of 1 ×.
10 ¹⁵ Ω · cm or more in which one of claims to Te for LOC according to one of claims 1 to 8 - flop. 10. The LOC tape according to claim 9, wherein the adhesive comprises a thermoplastic adhesive or a thermosetting adhesive.
H.