JP3815911B2 - Film carrier tape - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is made of polyimide, for example, a polyimide made mainly of biphenyltetracarboxylic dianhydride or a derivative thereof and phenylenediamine, and adheres to at least one surface of an aromatic polyimide film having a large tear propagation resistance (Elmendorf). The present invention relates to a film carrier tape having an agent layer and a protective film layer thereon.
[0002]
[Prior art]
Aromatic polyimide films are widely used in various fields because they have excellent characteristics in heat resistance, cold resistance, chemical resistance, electrical insulation, mechanical strength, and the like. Among them, it is known that an aromatic polyimide film composed of a biphenyltetracarboxylic acid component and a phenylenediamine component has particularly high heat resistance and high elastic modulus. Therefore, this type of aromatic polyimide film is particularly suitable for the manufacture of tape carrier tapes for tape-automated bonding (TAB), especially when focusing on its excellent heat resistance and elastic modulus. It can be said that it is suitable as a support to be used.
[0003]
However, in the field where this polyimide film is used, the running stability of a laminate in which a conductor (usually copper foil) and a polyimide film are laminated with an adhesive from the demand for higher accuracy and higher productivity ( For example, the problem of tearing) and the buckling of the film during punching are problems.
And it has been pointed out that these are due in part to the small elongation of the polyimide film.
In addition, it is known that the polyimide film has a property in which the elastic modulus and the elongation are opposite to each other, and the film having a large elastic modulus has a small elongation and the film having a large elongation has a small elastic modulus.
[0004]
For this reason, various improvements have been made on the polyimide film. For example, JP-A-61-264027 describes a method for producing a dimensionally stable polyimide film by re-treating a polyimide film obtained from biphenyltetracarboxylic dianhydride and p-phenylenediamine under low tension. Has been. Japanese Examined Patent Publication No. 4-6213 discloses a polyimide film having a linear expansion coefficient ratio (feed direction / perpendicular direction) and a linear expansion coefficient in the feed direction within a specific range and excellent in dimensional stability. Furthermore, Japanese Patent Publication No. 62-60416, Japanese Patent Publication No. 63-5421, Japanese Patent Publication No. 63-5422 discloses a method for improving the peelability of an aromatic polyamic acid film during film formation by the casting method. Are listed. Japanese Patent Publication No. 3-20130 discloses a 3-4 component polyimide film of biphenyltetracarboxylic acids and pyromellitic acids, phenylenediamine and diaminodiphenyl ether, and Japanese Patent Application Laid-Open No. 4-198229. Kaihei 4-339835 discloses a production method in which a substituted or unsubstituted nitrogen-containing heterocyclic compound is added.
However, with these known techniques, the resulting aromatic polyimide film has improved thermal properties such as linear expansion coefficient and dimensional stability and tensile elastic modulus, but has insufficient elongation and tear propagation resistance (Elmendorf). Conversely, heat resistance and tensile elastic modulus are reduced.
[0005]
Therefore, pyromellitic dianhydride and benzophenonetetracarboxylic dianhydride or biphenyltetracarboxylic dianhydride are combined as a tetracarboxylic acid component, and linear diamine (for example, phenylenediamine) and flexible diamine are combined as a diamine component. (For example, a tape for TAB using a film made of polyimide combined with diaminodiphenyl ether), a polyimide film with improved bending resistance made of polyimide containing an organophosphorus compound, or edge cracking A film excellent in punchability made of a polyimide film having a resistance of 50-70 kgf / 20 mm has been proposed.
That is, the first TAB tape is disclosed in JP-A-5-263049, the second polyimide film with improved bending resistance is disclosed in JP-A-2-28257, and the third punching property is excellent. The films are described in JP-A-6-334110.
However, these known polyimide films have insufficient elongation and tear propagation resistance (Elmendorf), low tensile strength and tensile modulus, insufficient bending resistance, and insufficient adhesion. Neither is satisfactory.
[0006]
Therefore, according to the prior art, it has not been possible to obtain an aromatic polyimide film that satisfies the tensile modulus, elongation, and tear propagation resistance (Elmendorf).
[0007]
[Problems to be solved by the invention]
An object of the present invention is to provide a film having good handling and punching properties by using an aromatic polyimide film having high dimensional accuracy and satisfying both tensile modulus, elongation and tear propagation resistance (Elmendorf) as a substrate film. It is to provide a carrier tape.
[0008]
[Means for Solving the Problems]
The present invention comprises a polyimide produced using biphenyltetracarboxylic dianhydride or a derivative thereof and phenylenediamine as main components, and has a thickness of 45-125μm with a tensile modulus of 550-1300 kg / mm²And the growth is60A film carrier tape having an adhesive layer on at least one side of an aromatic polyimide film having a tear propagation resistance (Elmendorf) of 550 to 1500 g / mm and a protective film layer on the adhesive film. It is.
[0009]
  Moreover, this invention has a thickness of 45−.125μm with a tensile modulus of 550-1300 kg / mm²And the growth is60-90% and linear expansion coefficient (50-200 ° C.) is 5 × 10^-6-25x10^-6A film carrier tape having an adhesive layer on at least one surface of an aromatic polyimide film having a cm / cm / ° C. and tear propagation resistance (Elmendorf) of 550-1500 g / mm, and having a protective film layer thereon. It is about.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The preferred embodiments of the present invention are listed below.
1) The film carrier tape described above, wherein the aromatic polyimide film has a heat shrinkage of 0.002 to 0.4% and a specific end resistance of 14 to 25 kg / 20 mm / 10 μm.
2) The film carrier tape as described above, wherein the aromatic polyimide film contains 0.1-5% by weight of inorganic filler.
3) The film carrier tape as described above, wherein the surface of the film in contact with the adhesive is subjected to at least one surface treatment of corona discharge treatment, vacuum or atmospheric pressure plasma treatment.
4) The film carrier tape as described above, wherein the adhesive is a thermoplastic adhesive or a thermosetting adhesive.
[0011]
  In this inventionThe aromatic polyimide film used is, for example, a polyimide precursor solution obtained by adding an imidization catalyst to a polyamic acid mainly composed of a biphenyltetracarboxylic acid component and phenylenediamine, and is a long film by a solution casting method. Can be manufactured.
AboveExamples of the biphenyltetracarboxylic acid component include 2,3,3 ′, 4′-biphenyltetracarboxylic acid, 3,3 ′, 4,4′-biphenyltetracarboxylic acid, halides thereof, dianhydrides thereof, or Those esters can be used, and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride is preferably used among them. Examples of the aromatic tetracarboxylic acid component that can be used in combination with the biphenyltetracarboxylic acid component include pyromellitic dianhydride. When pyromellitic dianhydride is used in combination, it is preferably 50 mol% or less in the tetracarboxylic acid component.
[0012]
You may use another aromatic tetracarboxylic-acid component in the range which does not impair the effect of this invention. Such aromatic tetracarboxylic acid components include 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 2,2 ′, 3,3′-benzophenone tetracarboxylic dianhydride, 2, 2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether Anhydride, bis (2,3-dicarboxyphenyl) ether dianhydride, 2,3,6,7-naphthalene tetracarboxylic dianhydride, 1,4,5,8-naphthalene tetracarboxylic dianhydride 2,2-bis (3,4-dicarboxyphenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) 1,1,1,3,3 Etc. can be mentioned 3-hexafluoropropane dianhydride.
[0013]
AboveThe phenylenediamine may be any of o-phenylenediamine, m-phenylenediamine, and p-phenylenediamine. You may use another aromatic diamine in the range which does not impair the effect of this invention. Such aromatic diamine components include diaminodiphenyl ether, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenylethane, 4,4′-diaminodiphenylmethane, bis [4- (4-amino Phenoxy) phenyl] propane, 2,2′-bis [4- (aminophenoxy) phenyl] 1,1,1,3,3,3-hexafluoropropane, bis [4- (4-aminophenoxy) phenyl] -Tells can be mentioned.
[0014]
In the present invention, the aromatic polyimide film has a thickness of 45 to 125 μm, preferably about 50 to 75 μm.
When the thickness of the aromatic polyimide film is smaller than this lower limit, the self-supporting property is low, and when it is larger than the upper limit, it is not preferable as a film carrier tape requiring high accuracy.
Further, if the values of the tensile modulus, elongation and tear propagation resistance (Elmendorf) of the aromatic polyimide film are out of the above ranges, the object of the present invention cannot be achieved.
In addition, when the heat shrinkage rate and specific end resistance value of the aromatic polyimide film are within the above ranges, the dimensional stability and handling in various environments are good.
[0015]
  AboveBiphenyltetracarboxylic acids and phenylenediamine, preferably paraphenylenediamine, are preferably used in an organic polar solvent usually used for the production of polyimides such as N, N-dimethylacetamide and N-methyl-2-pyrrolidone. Polymerization is carried out at 80 ° C. for 1 to 30 hours, and the polymer has a logarithmic viscosity (measurement temperature: 30 ° C., concentration: 0.5 g / 100 ml solvent, solvent: N-methyl-2-pyrrolidone) of 0.1-5, polymer. -A polyamic acid (imidation rate: 5% or less) solution having a concentration of 15 to 25% by weight and a rotational viscosity (30 ° C) of 500 to 4500 poises is obtained.
[0016]
Subsequently, for example, 1,2-dimethylimidazole is preferably added to the polyamic acid solution obtained as described above, particularly 0.005-2 times equivalent, preferably with respect to the amic acid unit of the polyamic acid. Is contained in an amount of about 0.005-0.8 times equivalent, particularly about 0.02-0.8 times equivalent. A portion of 1,2-dimethylimidazole is converted to imidazole, benzimidazole, N-methylimidazole, N-benzyl-2-methylimidazole, 2-methylimidazole, 2-ethyl. -4-methylimidazole, 5-methylbenzimidazole, isoquinoline, 3,5-dimethylpyridine, 3,4-dimethylpyridine, 2,5-dimethylpyridine, 2,4-dimethylpyridine, 4-n- It may be replaced with propylpyridine.
[0017]
In the above polyamic acid solution, a phosphorus compound is preferably added in an amount of 0.01-5 parts by weight, particularly 0.01-3 parts by weight, particularly 0.01-1 part by weight, based on 100 parts by weight of the polyamic acid. An organic phosphorus compound, preferably a (poly) phosphate ester, an amine salt of a phosphate ester or an inorganic phosphorus compound is added in a proportion, and more preferably, an inorganic filler is added in an amount of 0.005 parts per 100 parts by weight of polyamic acid. 1-3 parts by weight of colloidal silica, silicon nitride, talc, titanium oxide, calcium phosphate (preferably an average particle size of 0.005-5 μm, especially 0.005-2 μm) is added to obtain a polyimide precursor solution composition. obtain.
[0018]
The polyimide precursor solution composition is continuously cast on a glass or metal support surface having a smooth surface to form a thin film of the solution, and the drying conditions are adjusted when the thin film is dried. The temperature: 100-200 ° C., time: 1-30 minutes, the solidified film has a volatile content of about 30-50% by weight and an imidation rate of 5-80. % Of a long solidified film is formed, and the solidified film is peeled off from the support surface.
You may add the drying process which adjusts drying conditions further for the said solidified film, and temperature: room temperature (25 degreeC) -250 degreeC, time: about 0.5-30 minutes.
You may extend a little in the width direction (TD) and both directions (MD, TD) by hold | maintaining the stretched state by hold | gripping the both ends edge of the solidified film in the width direction in at least one part of these drying processes.
[0019]
The aromatic polyimide film in this invention can then be obtained by heating the solidified film to a high temperature, preferably in a curing furnace, to complete drying and imidization.
That is, the solidified film obtained as described above is further dried if necessary, and in the state where both edges of the width direction of the dry film are gripped, the maximum heating temperature in the curing furnace: about 400-500 ° C., In particular, the dried film is heated and dried and imidized under the condition that the temperature of about 475 to 500 ° C. is 0.5 to 30 minutes, and the imidization is completed with a residual volatile content of about 0.4% by weight or less. Thus, a long aromatic polyimide film can be suitably produced.
[0020]
The aromatic polyimide film obtained as described above is preferably heated at a temperature of about 200 to 400 ° C. under low tension or no tension, and subjected to stress relaxation treatment and then wound.
[0021]
By the above methodThe tensile modulus, elongation, and tear propagation resistance (Elmendorf) can take the values specified in this invention.
Further, by the above method, the tensile modulus, elongation, linear expansion coefficient and tear propagation resistance (Elmendorf) can take the values specified in the present invention.
[0022]
The aromatic polyimide film in the present invention is preferably subjected to corona discharge treatment, low temperature or atmospheric pressure plasma discharge treatment, particularly plasma discharge treatment, on at least one side.
The plasma discharge treatment may be performed without treating the film surface or after treating with an organic solvent such as acetone, isopropyl alcohol, ethyl alcohol or the like.
[0023]
The pressure of the atmosphere in which the plasma discharge treatment is performed is not particularly limited, but a range of 0.1-100 Torr is preferable.
The gas composition of the atmosphere in which the plasma treatment is performed is not particularly limited, but preferably contains oxygen. Or you may contain the rare gas at least 20 mol%. Examples of the rare gas include He, Ne, Ar, and Xe, and Ar is preferable. A rare gas such as CO2, N2, H2, or H2O may be mixed and used.
The plasma irradiation time for performing the plasma treatment is preferably about 1 second to 10 minutes.
[0024]
The adhesive in the present invention may be thermosetting or thermoplastic. For example, an epoxy resin, an NBR-phenol resin, a phenol-butyral resin, an epoxy-NBR resin, an epoxy-phenol. Resin, epoxy-nylon resin, epoxy-polyester resin, epoxy-acrylic resin, acrylic resin, polyamide-epoxy-phenolic resin, polyimide resin, polyimide-epoxy resin, polyimidesiloxane-epoxy resin, etc. Or a thermoplastic adhesive such as a polyamide resin, a polyester resin, a polyimide adhesive, or a polyimide siloxane adhesive. In particular, a polyimide adhesive, a polyimide-epoxy resin adhesive, a polyimide siloxane-epoxy resin adhesive, and an epoxy resin adhesive are preferably used.
[0025]
In the film carrier tape having the protective film layer of the present invention, for example, the adhesive solution is applied onto the surface of the aromatic polyimide film, and the applied layer is applied at a temperature of about 80 to 200 ° C. for 20 seconds. -A thin film of adhesive (dried with a thickness of about 1 to 200 μm) that has been substantially removed to a solvent content of 1 wt% or less, preferably 0.5 wt% or less by drying for 100 minutes. Film or sheet), and a commercially available resin film such as aromatic polyimide film, aromatic polyester, polyethylene, polypropylene, polybutene-1, etc. is heated to a temperature of 20 to 200 ° C. It can be obtained by laminating through the gaps.
Alternatively, a laminated sheet in which a thin film layer of an adhesive is formed on the heat-resistant film or thermoplastic film and the aromatic polyimide film of the present invention for transfer destination are superposed to each other at about 20-200 ° C. By passing between a pair of rolls (lamine rolls) heated to a temperature, the thin film layer of the adhesive is transferred to the aromatic polyimide film for transfer destination, and a film carrier having a protective film layer is transferred. -You can also get
[0026]
The film carrier tape having the protective film layer of the present invention has flexibility, and can be wound around a paper tube or punched by a punching method.
[0027]
In order to form a laminated sheet (sheet) with a metal foil such as a copper foil using the film carrier tape of the present invention, for example, through the thin film adhesive formed as described above. Laminate (laminate) the aromatic polyimide film and the metal foil under pressure (0.2-8 kg / cm 2) at a temperature of 80-200 ° C., particularly 100-180 ° C. Can be easily and continuously produced.
[0028]
【Example】
Examples of the present invention will be described below.
In each of the following examples, the physical properties of the polyimide film were measured by the following method. The following measured values are measured values at 25 ° C. unless otherwise specified.
[0029]
Elongation: Measured according to ASTM D882-83 (MD)
Tensile modulus: measured according to ASTM D882-83 (MD)
Tear propagation resistance (Elmendorf): measured in accordance with ASTM D1922-67 (MD)
[0030]
Tensile strength: measured according to ASTM D882-83 (MD)
Heat shrinkage: measured according to JIS C2318 (200 ° C)
Dielectric breakdown voltage: measured according to JIS C2318
[0031]
End crack resistance value: measured in accordance with JIS C2318 (MD)
The end tear resistance value (or specific end tear resistance value) means an average value of end tear resistance values (or specific end tear resistance values) of samples (five pieces) measured according to JIS C2318. Specifically, the center line of the V-shaped cut plate test fixture with an upper thickness of 1.00 ± 0.05 mm of the constant speed tension type tensile tester is made to coincide with the center line of the upper grip, and the top of the cut and the lower grip A handle is attached so that the interval is about 30 mm. A test piece with a width of about 20 mm and a length of about 200 mm is passed through a hole in the metal fitting, folded in half, and clamped at the bottom of the tester, pulled at a speed of about 200 mm per minute, and the force when torn Is called resistance to end tearing. Five test pieces are taken over the entire width from the vertical direction and the horizontal direction, respectively, and the average value of the end crack resistance is obtained and shown as the end crack resistance value. The specific end resistance value indicates the end resistance value per film thickness (in terms of 10 μm).
[0032]
Linear expansion coefficient (50-200 ° C.) measurement: A sample subjected to stress relaxation by heating at 300 ° C. for 30 minutes was measured with a TMA apparatus (tensile mode, 2 g load, sample length 10 mm, 20 ° C./min).
[0033]
Tear strength: A cut of 5 cm in length was made on one side of the film cut into a 7.5 cm × 7.5 cm square using a razor blade. The load when the both sides of the notch were pulled at a speed of 200 mm / min was measured with a tensile tester, and the load when tearing occurred was defined as the tear strength (g).
Bending resistance (MIT): measured according to ASTM D2176 (MD)
Punching property: A film having no problem without buckling, deformation or cutting of the film at the time of punching was judged good.
Adhesive strength: 180 ° peel strength was measured at a tensile speed of 50 mm / min.
[0034]
Reference example 1
To a reaction vessel, 5.897 parts by weight of p-phenylenediamine and 16.019 parts by weight of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride were added to 100 parts by weight of N, N-dimethylacetamide. The polymer was stirred at 40 ° C. for 3 hours under a nitrogen stream and polymerized to give a polymer concentration of 18% by weight, the logarithmic viscosity of the polymer (measurement temperature: 30 ° C., concentration: 0.5 g / 100 ml solvent, solvent: N, N -Dimethylacetamide) was 1.3, and a polyamic acid solution having a solution viscosity of 1800 poise (30 ° C., rotational viscometer) was obtained. In this polyamic acid solution, an average particle diameter of 0 in terms of 0.1 parts by weight of monostearyl phosphate ester triethanolamine salt and 0.5 parts by weight (based on solid content) with respect to 100 parts by weight of polyamic acid. 0.08 μm colloidal silica was added and mixed uniformly to obtain a polyamic acid solution composition.
Furthermore, 2.39 kg of 1,2-dimethylimidazole (0.1 times equivalent to the polyamic acid unit) was added to this polyamic acid solution composition with respect to 100 parts by weight of the polyamic acid, and 2 at 40 ° C. The mixture was stirred for a time to obtain a polyimide precursor solution composition.
[0035]
This polyimide precursor solution composition was continuously extruded from a slit of a T die to form a thin film on a smooth metal support. The thin film was heated at 140 ° C. for 20 minutes and then peeled off from the support to form a self-supporting film. The film was continuously passed through a heating furnace with both ends of the film being restrained. At this time, the residence time in the heating furnace was 13 minutes, and the maximum heating temperature in the heating furnace was 480 ° C.
Thus, an aromatic polyimide film having a long shape and a thickness of 50 μm was obtained.
The obtained polyimide film is subjected to plasma treatment under the conditions of a plasma irradiation time of 1 minute, a microwave oscillation output of 1 kW, a plasma generation vacuum of 0.8 Torr, and a plasma treatment gas of oxygen, and a modified polyimide film is obtained. Obtained.
[0036]
The physical properties of this modified polyimide film are as follows.
Tensile modulus (MD): 890 kg / mm 2
Elongation (MD): 60%
Tear propagation resistance (Elmendorf) (MD): 710 g / mm
Tensile strength (MD): 56kg / mm2
Heat shrinkage (200 ° C): 0.05%
Dielectric breakdown voltage: 11.1 kv
Edge resistance (MD): 82kg / 20mm
Linear expansion coefficient (50 to 200 ° C.): 1.7 × 10 −5 cm / cm / ° C.
Tear strength (MD): 21g
Bending resistance (× 10 4 times):> 10
[0037]
Reference example 2
2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride and 2,2′-bis (4-aminophenoxy) propane (60 mol%) using N-methyl-2-pyrrolidone as a solvent in the reaction vessel ) And diaminopolysiloxane (40 mol%, Mw = 950) to obtain polyimidesiloxane.
This polyimidesiloxane had a tensile modulus of 57 kg / mm @ 2 as a film and a Tg of 190.degree.
55 parts of this polyimidesiloxane, 30 parts of bisphenol F type epoxy resin (manufactured by Yuka Shell, EP807) as an epoxy resin, and 18 parts of phenol novolak type curing agent (manufactured by Meiwa Kasei Co., Ltd., H-1) as a curing agent 0.1 part of 2-phenylimidazole was charged in 200 parts of THF (tetrahydrofuran) and stirred at 30 ° C. for about 2 hours to obtain a uniform adhesive solution.
[0038]
Example 1
The adhesive solution obtained in Reference Example 2 was applied onto a polyethylene terephthalate film (PET) with a doctor blade to a thickness of 125 μm, and then the applied layer was heated at 80 ° C. for 10 minutes to dry, A polyethylene terephthalate sheet (25 μm) is laminated thereon at 90 ° C. and slit to a width of 29.6 mm, and an adhesive layer having a thickness of about 20 μm and a protective film layer are formed on the PET film. An adhesive tape was obtained.
The adhesive tape from which one protective film layer of this adhesive tape was peeled off was laminated at 130 ° C. on the tape obtained by slitting the modified polyimide film obtained in Reference Example 1 into a width of 35 mm. Thus, a film carrier tape having a protective layer was obtained.
This film carrier tape exhibited bending resistance equivalent to that of the modified polyimide film.
Sprocket holes and device holes are made in the film carrier tape having this protective layer, the protective layer is peeled off, and a 31 mm wide copper foil (35 μm) is overlaid between the laminar rolls heated to 130 ° C. The adhesive is cured by passing the pressure-bonded laminate by applying pressure and heat-treating the pressure-bonded laminate at 100 ° C. for 1 hour, 120 ° C. for 1 hour, and 180 ° C. for 5 hours in a nitrogen stream. A laminate was produced.
The adhesive strength of the obtained laminate and the punching characteristics when producing the laminate are shown below.
Adhesive strength: 1.6 kg / cm
Punchability: Good
[0039]
Reference example 3
A modified aromatic polyimide film having a thickness of 75 μm was obtained in the same manner as in Reference Example 1 except that the conditions for extrusion through the slit of the T die were changed.
The physical properties of this aromatic polyimide film are summarized below.
Tensile modulus (MD): 840 kg / mm @ 2
Elongation (MD): 68%
Tear propagation resistance (Elmendorf) (MD): 820 g / mm
Tensile strength (MD): 48kg / mm2
Heat shrinkage (200 ° C): 0.05%
Dielectric breakdown voltage: 10.9kv
End crack resistance value (MD): 110 kg / 20 mm
Linear expansion coefficient (50 to 200 ° C.): 1.8 × 10 −5 cm / cm / ° C.
Tear strength (MD): 42g
Bending resistance (× 10 4 times):> 10
[0040]
Example 2
A film carrier tape having a protective layer was obtained in the same manner as in Example 1 except that the aromatic polyimide film was changed to the one having a thickness of 75 μm obtained in Reference Example 3.
This film carrier tape exhibited bending resistance equivalent to that of the modified polyimide film.
A sprocket hole and a device hole were made in the film carrier tape having this protective layer, the protective layer was peeled off, and a laminate was produced in the same manner as in Example 1.
The adhesive strength of the obtained laminate and the punchability at the time of producing the laminate are shown below.
Adhesive strength: 1.7 kg / cm
Punchability: Good
[0041]
Comparative Reference Example 1
A modified aromatic polyimide film having a thickness of 50 μm was obtained in the same manner as in Reference Example 1 except that 1,2-dimethylimidazole was not added.
The physical properties of this aromatic polyimide film are summarized below.
Tensile modulus (MD): 850 kg / mm 2
Elongation (MD): 43%
Tear propagation resistance (Elmendorf) (MD): 510 g / mm
Tensile strength (MD): 48kg / mm2
Heat shrinkage (200 ° C): 0.07%
Dielectric breakdown voltage: 10.9kv
End crack resistance value (MD): 66 kg / 20 mm
Linear expansion coefficient (50 to 200 ° C.): 1.4 × 10 −5 cm / cm / ° C.
Tearing strength (MD): 16g
Bending resistance (× 10 4 times): 5.6
[0042]
Comparative Example 1
A film carrier tape having a protective layer was obtained in the same manner as in Example 1 except that the aromatic polyimide film obtained in Comparative Reference Example 1 was used.
A sprocket hole and a device hole were made in the film carrier tape having this protective layer, the protective layer was peeled off, and a laminate was produced in the same manner as in Example 1.
The adhesive strength of the obtained laminate and the punchability at the time of producing the laminate are shown below.
Adhesive strength: 1.5 kg / cm
Punchability: Slightly unfavorable
[0043]
【The invention's effect】
Since the present invention is configured as described above, the following effects can be obtained.
The film carrier tape of the present invention has good punchability and maintains adhesiveness, and can be processed with high accuracy.

Claims (5)

A polyamic acid solution obtained by polymerizing biphenyltetracarboxylic dianhydride or a derivative thereof and phenylenediamine in an organic polar solvent contains 1,2-dimethylimidazole and a phosphorus compound to obtain a polyimide precursor solution composition. Obtained from a polyimide obtained from a polyimide precursor solution composition ,
Continuously manufactured by the solution casting method and having a thickness of 45-75 μm, a tensile modulus (MD) of 550-1300 kg / mm ² and an elongation (MD) of 60-90% , Aromatic having a linear expansion coefficient (50-200 ° C.) of 17 × 10 ⁻⁶ −25 × 10 ⁻⁶ cm / cm / ° C. and a tear propagation resistance (Elmendorf) (MD) of 550-1500 g / mm A film carrier tape in which an adhesive layer is provided on at least one side of a polyimide film and a protective film layer is provided thereon.   The film carrier tape according to claim 1, wherein the aromatic polyimide film has a heat shrinkage of 0.002 to 0.4% and a specific end resistance value of 14 to 25 kg / 20 mm / 10 µm.   2. The film carrier tape according to claim 1, wherein the aromatic polyimide film contains 0.1-5% by weight of an inorganic filler.   2. The film carrier tape according to claim 1, wherein the surface of the film in contact with the adhesive is subjected to at least one surface treatment of corona discharge treatment, vacuum or atmospheric pressure plasma treatment.   2. The film carrier tape according to claim 1, wherein the adhesive is a thermoplastic adhesive or a thermosetting adhesive.