JPH10296463A - Laser beam trimming device, measuring probe and laser beam trimming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To illuminate trimming starting position without restriction by illumination for observation, to improve the workability of positioning for trimming, to raise the degree of freedom in the arrangement of chip parts and to contrive high integration of composite elements by providing the wiring part which is electrically connected with the chip parts on the side face of a substrate to which the chip parts of materials to be workedare attached and making the measuring probes touchable to and separable from the side face of the substrate. SOLUTION: The composite element substrate 1 on which plural chip parts 10 are attached is placed on an X-Y table. At that time, the measuring probes 5, 6 are situated in a side position away from the substrate 1. Next, an illumination for observation irradiates to the trimming starting position, the trimming starting position is determined by moving the X-Y table and the tip parts 5a, 5b of the measuring probes 5 are brought into contact with the wiring part 13 on the side face of the substrate 1 by horizontally moving probe holder 3 to the side of the substrate 1. After that, voltage is impressed on the chip parts 10 and, while measuring the characteristic value, trimming is executed by a laser beam L.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a laser trimming device, a measuring probe and a laser trimming method, and more particularly to a laser trimming device, a measuring probe and a laser trimming method used for laser trimming of a composite element component.

[0002]

2. Description of the Related Art Generally, a laser trimming device cuts and removes a workpiece or a part of an electronic component on the workpiece by using a laser beam emitted from a laser oscillator.
It measures and adjusts the characteristics and circuit constants of the workpiece through a measuring probe.

Conventional laser trimming apparatuses and laser trimming methods are disclosed, for example, in Japanese Patent Application Laid-Open Nos. 3-234001, 58-75864 and 62-1.
No. 8670 and the like. FIG. 4 is a perspective view schematically showing a conventional laser trimming apparatus.

[0004] As shown in FIG. 4, a conventional laser trimming apparatus is disposed above a substrate 40 horizontally set on an XY table (not shown), and is moved by an elevator (not shown) or the like. It has a probe card 41 that can move up and down. At the center of the probe card 41, a transmission window 42 for transmitting the laser light L and the illumination light for observation is provided.
3 is attached.

A plurality of chip components 44, a surface wiring portion 45 electrically connected to the chip components 44, and a measurement electrode portion 46 that comes into contact with the measurement probe 43 are provided on a surface 40 a of the substrate 40. As shown in FIG. 5, a back surface electrode portion 12 for soldering is provided on the back surface of the substrate 40.
On the side surface of the substrate 40, a side wiring portion 13 for connecting the front surface wiring portion 45 and the back surface wiring portion 12 is provided.

In the case of laser trimming of the chip component 44 by a conventional laser trimming device, first, an observation illumination unit (not shown) irradiates an observation illumination light to a laser trimming start position, and the XY table is adjusted. By driving, the start position of laser trimming is positioned.

Next, the probe card 41 is lowered,
The measurement probe 43 is brought into contact with the measurement electrode section 46 of the substrate 40.

Next, while applying a voltage to the chip component 44 and measuring characteristic values such as a resistance value and a circuit constant of the chip component 44, the chip component 44 is irradiated with a laser beam L through a window of the probe card 41. Trim.

The laser light L is deflected in a one-dimensional direction in the X direction or the Y direction, or in a two-dimensional direction in the X direction and the Y direction, and the chip component 1 is laser-trimmed. When the characteristic value of the chip component 1 reaches a predetermined target value, the laser trimming is stopped.

When the laser trimming is completed, the probe card 41 is raised, the trimmed substrate 40 is taken out, replaced with a new substrate, and the above steps are repeated.

[0011]

In the conventional laser trimming apparatus, the observation illumination light illuminates the laser trimming start position, thereby positioning the laser trimming.

However, since the probe and the probe card are present above the substrate, the probe and the probe card block the illumination light for observation, and the illumination light for observation depends on the position of the mounted chip component. In some cases, it was not possible to illuminate the trimming start position.

For this reason, the chip component must be arranged at a position where the illumination light for observation can illuminate the start position of the laser trimming, and the position of the chip component is restricted. As a result, there has been an inconvenience that it is not possible to realize a high integration of a composite element component for which high-density mounting is required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can illuminate the starting position of laser trimming without restriction by observation illumination light, and can mount a workpiece such as a chip component at a high density. It is an object of the present invention to provide a laser trimming device, a measuring probe, and a laser trimming method that can perform laser trimming.

[0015]

SUMMARY OF THE INVENTION A laser trimming apparatus according to the present invention comprises a mounting surface on which a workpiece to be laser-trimmed is mounted, and a side surface on which a side wiring portion electrically connected to the workpiece is provided. A substrate supporting means for supporting the substrate having, a measurement probe that comes into contact with the side surface wiring portion of the substrate, and supporting the measurement probe, disposed on the side surface of the substrate, and the measurement probe with respect to the side surface wiring portion of the substrate. And a probe holder movable so as to make contact and detachment.

The laser trimming device of the present invention also includes a surface on which a workpiece to be laser trimmed is mounted;
A table on which a substrate having a side surface on which a side wiring portion electrically connected to a workpiece is provided, a measurement probe in contact with the side wiring portion of the substrate, and a side surface of the substrate for supporting the measurement probe And a probe holder moving means for moving the probe holder in a substantially horizontal direction so that the measurement probe contacts and separates from the side surface wiring portion of the substrate. Things.

The measurement probe may be mounted on a side surface of the probe holder on the substrate side.

Further, the side surface wiring portion of the substrate is electrically connected to a front surface wiring portion provided on the front surface for electrically connecting a plurality of workpieces to each other and a back surface electrode portion for soldering provided on the back surface. It may be connected.

The measuring probe of the present invention is used for the above-mentioned laser trimming device.

According to the laser trimming method of the present invention, (1)
A step of supporting a substrate having a mounting surface on which a workpiece to be laser-trimmed is mounted, and a side surface on which a side wiring portion electrically connected to the workpiece is provided; Contacting the measurement probe,
(3) a step of performing laser trimming while measuring the workpiece; and (4) a step of detaching the measurement probe from the side wiring portion of the substrate after the laser trimming is completed. It is characterized in that it is performed in the order of 4).

According to the present invention, there is no light-shielding material such as a measuring probe or a probe card on the mounting surface side of the substrate on which the workpiece to be laser-trimmed is mounted. The position can be illuminated without restriction.

Further, it is not necessary to provide a measurement electrode portion which comes into contact with the measurement probe on the mounting surface of the substrate.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view schematically showing a laser trimming apparatus of the present invention. FIG. 2 is a side view showing the laser trimming apparatus of the present invention in a state where a measurement probe is detached from a side wiring portion of a substrate. FIG. 3 is a side view showing the laser trimming device of the present invention in a state where the measurement probe is in contact with the side wiring portion of the substrate.

As shown in FIGS. 1 to 3, the laser trimming apparatus of the present invention comprises an XY table 2 on which a composite element substrate 1 is mounted in a horizontal state, and a probe holder 3 arranged on both side surfaces of the substrate 1. , 4, two measurement probes 5, 6 attached to side surfaces of the probe holders 3, 4 on the substrate 1 side, and probe holder moving units 7, 8 for moving the probe holders 3, 4 in the horizontal direction. And

On the front surface 1a of the substrate 1, there are provided a plurality of chip components 10 such as resistance elements which are workpieces, and a surface wiring portion 11 for electrically connecting the chip components 10 to each other.
The back surface of the substrate 1 has a back surface electrode portion 12 for soldering the chip component 10 (see FIG. 5). On the side of the substrate 1,
It has a side surface wiring portion 13 for connecting the front surface wiring portion 11 and the back surface electrode portion 12. Although three chip parts 10 are shown in the drawings for simplicity, the number of chip parts 10 to be mounted may vary depending on the purpose, function, operation, and the like required for the composite element part. I do.

The measuring probes 5 and 6 are electrically connected to a measuring device (not shown), and come into contact with the side wiring portion 13 of the substrate 1 to apply a voltage to the chip component 10 for resistance and circuit constants. The characteristic value of is measured. The tips 5a, 6a of the measurement probes 5, 6 are flat, curved,
A shape suitable for measurement such as a cone or a needle is used. The measurement probes 5 and 6 are attached at positions corresponding to the side surface wiring portions 13 of the substrate 1.

The driving sources of the probe holder moving units 7 and 8 are as follows:
Appropriate means such as motor drive, electromagnetic drive, air drive, hydraulic drive, and manual are selected.

The laser trimming apparatus according to the present invention also illuminates the start position of laser trimming, and provides observation illumination for facilitating observation of a reference point (not shown) provided on the surface 1a of the substrate 1. It has a unit (not shown) and a laser oscillator (not shown) for emitting laser light L.

Next, the operation of the laser trimming device of the present invention will be described. First, the substrate 1 on which the plurality of chip components 10 are mounted is placed on the XY table 2. The measurement probes 5 and 6 are located at positions away from the substrate 1 as shown in FIG.

Next, the observation illumination unit irradiates the observation illumination light to the laser trimming start position,
By moving the Y table 2, the start position of the laser trimming is determined. At this time, since there are no measurement probes 5, 6 or a probe card above the substrate 1, the observation illumination light can illuminate the laser trimming start position without restriction, and positioning can be performed easily.

Next, as shown in FIG. 3, the probe holders 3 and 4 are moved in the horizontal direction toward the substrate 1 (arrows 3a and 4a in FIG. 1), and the tip portions 5a and 6 of the measuring probes 5 and 6 are moved.
a is brought into contact with the side wiring portion 13 of the substrate 1.

Next, the measurement probe 5
6, a voltage is applied to the chip component 10 via the chip 6 and characteristic values such as a resistance value and a circuit constant of the chip component 10 are measured.
The chip component 10 is laser-trimmed by the laser light L.

The laser light L is emitted from a laser oscillator and deflected by a laser beam scanner (not shown) in a one-dimensional direction in the X direction or the Y direction, or in a two-dimensional direction in the X and Y directions. 10 is laser trimmed. Laser trimming is stopped when the characteristic value of the chip component 10 reaches a predetermined target value.

When the laser trimming is completed, the probe holders 3 and 4 are moved in the horizontal direction to the side opposite to the substrate 1, and the tips of the measuring probes 5 and 6 are separated from the side wiring portion 13 of the substrate 1. Then, the trimmed substrate 1 is taken out, replaced with a new substrate, and the above steps are repeated.

It should be noted that the back electrode portion 12 is
Is used for soldering the back electrode part 1
When the measurement is performed using No. 2, the back electrode portion 12 is damaged,
Since the reliability of soldering is impaired, it is not used as a measuring electrode for laser trimming.

According to the present invention, since there is no light-shielding material such as the measuring probes 5 and 6 and the probe card on the surface 1a side of the substrate 1 on which the workpiece to be laser-trimmed is mounted, the laser is irradiated by the observation illumination light. The starting position of trimming can be illuminated without restriction. As a result, the workability of positioning the trimming start position is improved.

Further, since it is not necessary to provide a measurement electrode portion in contact with the measurement probe on the surface 1a of the substrate 1, the degree of freedom in mounting the chip component 10 on the substrate 1 is increased, and the mounting density is improved. I do. As a result, further miniaturization and high integration of the composite element component can be achieved.

Furthermore, since the characteristic value is measured using the side wiring portion 13, the yield of soldering is improved without damaging the back electrode portion 12 for soldering, and the reliability of the product is improved. .

The present invention is not limited to the above embodiment, and various changes can be made within the scope of the technical matters described in the claims.

For example, although the side surface wiring portion 13 of the substrate 1 is formed on two side surfaces in the above embodiment, if it is formed on one side surface, three side surfaces, or four side surfaces, it may be adjusted accordingly. Then, a probe holder to which the measurement probe is attached is arranged.

Although the measuring probes 5 and 6 are mounted on the side surfaces of the probe holders 3 and 4 in the above embodiment, they may be mounted on an appropriate position such as the upper surface or the lower surface of the probe holder. .

Further, the number and shape of the measurement probes are appropriately changed depending on the measurement location.

[0043]

According to the present invention, the following excellent effects can be obtained. (1) There is no light-blocking material such as a measurement probe or a probe card on the mounting surface side of the substrate on which the workpiece to be laser-trimmed is mounted, and the start position of laser trimming can be illuminated by the observation illumination light without restriction. As a result, the workability of positioning the trimming start position is improved. (2) Since there is no need to provide a measurement electrode portion in contact with the measurement probe on the mounting surface of the board, the degree of freedom in mounting chip components on the board is increased, and the mounting density is improved. As a result, further miniaturization of composite element parts,
High integration can be achieved. (3) In order to measure the characteristic value using the side wiring portion,
The yield of soldering is improved without damaging the back electrode portion for soldering, and the reliability of the product is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a laser trimming device of the present invention.

FIG. 2 is a side view showing the laser trimming device of the present invention in a state where the measurement probe is detached from the side wiring portion of the substrate.

FIG. 3 is a side view showing the laser trimming device of the present invention in a state where a measurement probe is in contact with a side wiring portion of a substrate.

FIG. 4 is a perspective view schematically showing a conventional laser trimming device.

FIG. 5 is a perspective view showing a state in which the substrate is viewed from the back surface side.

[Explanation of symbols]

L: Laser light 1: Composite device substrate 1a: Surface (mounting surface) of substrate 2: XY table 3, 4: Probe holder 5, 6: Measurement probe 7, 8: Probe holder moving section (probe holder moving means) 10) Chip component (workpiece) 11: Front surface wiring portion 12: Back surface electrode portion 13: Side surface wiring portion

Claims (6)

[Claims] 1. A substrate supporting means for supporting a substrate having a mounting surface on which a workpiece to be laser-trimmed is mounted, and a side surface on which a side wiring portion electrically connected to the workpiece is provided; A measurement probe that comes into contact with the side surface wiring portion of the substrate; and a measurement probe that supports the measurement probe and is arranged on the side surface of the substrate, and moves so that the measurement probe contacts and separates from the side surface wiring portion of the substrate. A laser trimming device, comprising: a probe holder that can be used; 2. A table on which a substrate having a surface on which a workpiece to be laser-trimmed is mounted and a side surface on which a side wiring portion electrically connected to the workpiece is provided, and a side wiring portion of the substrate A probe for contacting the probe, a probe holder for supporting the probe for measurement, and a probe holder disposed on the side surface of the substrate; and a probe holder for contacting and detaching the probe for measurement from and to a side surface wiring portion of the substrate. And a probe holder moving means for moving the laser in a substantially horizontal direction. 3. The laser trimming device according to claim 1, wherein the measurement probe is attached to a side surface of the probe holder on the substrate side. 4. A side wiring portion of the substrate comprises a front wiring portion provided on a front surface for electrically connecting a plurality of workpieces to each other, and a back electrode portion for soldering provided on a back surface. The laser trimming device according to any one of claims 1 to 3, wherein the laser trimming device is connected to the laser trimming device. 5. A measuring probe used in the laser trimming device according to claim 1. 6. A step of supporting a substrate having a mounting surface on which a workpiece to be laser-trimmed is mounted, and a side face on which a side wiring portion electrically connected to the workpiece is provided. (2) a step of bringing a measurement probe into contact with a side wiring portion of the substrate; (3) a step of performing laser trimming while measuring the workpiece; and (4) a step of performing the measurement probe after the laser trimming is completed. Separating from the side wiring portion of the substrate, and performing the steps in the order of (1) to (4).