JPH1151999A - Inspection device for printed wiring board, plate-like inspection jig, and inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To conduct sure inspection by guiding an inspection probe to an inspecting contact point with high precision, and to extremely easily and inexpensively inspect a multi-preparation substrate. SOLUTION: This device is provided with a plate-like inspection jig 34 having a substrate holding region for holding integrally a printed wiring board 41 and a substrate positioning region arranged in a periphery of the holding region, and a positioning means 38 arranged in an inspection table or the positioning region to position the inspection jig 34 in a prescribed position on the inspection table, and is constituted to position the printed wiring board 41 in a prescribed inspecting position of the inspection table via the plate-like inspection jig 34.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board inspection apparatus, a plate-shaped inspection jig, and an inspection method. More specifically, a printed wiring board inspection apparatus capable of positioning a printed wiring board at a predetermined inspection position, guiding an inspection probe to an inspection contact of the printed wiring board with high accuracy, and performing inspection work with high accuracy and speed.
The present invention relates to a plate-shaped inspection jig and an inspection method.

[0002]

2. Description of the Related Art A printed wiring board employed in various electronic devices is formed by forming a circuit pattern on or inside an insulating substrate, and electronic components such as semiconductors are connected to connection terminals provided on the surface. The electronic device is configured by mounting.

In recent years, with the progress of miniaturization of products,
2. Description of the Related Art High-density packaging technology for electronic components has had a great influence on product development. That is, by using an MCM (multi-chip module) or the like in which bare chips are directly connected on a multilayer wiring board, the mounting density of electronic components mounted on the printed wiring board is increased, and the connection terminal interval of each electronic component is reduced. The distance between the conductor patterns formed on the substrate has been reduced accordingly.

[0004] In order to inspect a connection failure of a conductive pattern or the like on such a printed wiring board, for example, an inspection apparatus as described in JP-A-4-95881 is used. This inspection device is configured so that the inspection probe with a spring is brought into contact with the connection terminal or through hole of the printed wiring board to electrically detect the connection state of the conductive pattern. It is provided with an inspection head in which inspection probes are arranged with high accuracy.

In the above-described inspection apparatus for a printed wiring board, an inspection probe must accurately contact an inspection contact on the board. For this reason, in the inspection apparatus described in the above publication, various methods for improving the positioning accuracy of the printed wiring board to be inspected and the positioning accuracy of the inspection head are adopted.

[0006]

In a conventional inspection apparatus, a positioning hole is formed directly on a printed wiring board, a positioning pin is provided at a predetermined position on an inspection table, and the positioning pin is engaged with the positioning hole. As a result, the printed wiring board is positioned on the inspection table to perform the inspection.

However, depending on the conductive pattern, it may not be possible to provide a positioning hole for engaging a positioning pin on the printed wiring board. In particular, in order to reduce the manufacturing cost, it is necessary to form a conductive pattern without any gaps up to the edge of the substrate to effectively use the substrate, and to provide a positioning hole for inspection at a convenient position on the substrate. Often not.

In such a case, the edge of the printed wiring board is often used for positioning on the table.
The external accuracy of the printed wiring board is not always high. In addition, it becomes necessary to provide a positioning device corresponding to each printed wiring board, which increases the cost of the inspection device.

In addition, as the mounting density of electronic parts has increased, the number of terminals with which contact probes have come into contact has increased dramatically.
Accordingly, a large number of contact probes must be provided at extremely small intervals. However, the accuracy of implanting a large number of contact probes in the inspection head is also limited. Further, if one of the many contact probes is slightly bent for some reason, the inspection cannot be performed.

In recent years, the life cycle of a product in which a printed wiring board is incorporated has been shortened, and it has been necessary to cope with high-mix low-volume production. On the other hand, the inspection device described in the above publication aims to automatically transport a large number of printed wiring boards to the inspection device and perform inspection, and the accuracy of the inspection device itself such as a lifting device is secured. It is assumed that For this reason, the inspection apparatus itself becomes expensive, and it is not cost-effective to inspect a small variety of printed wiring boards with the above-described inspection apparatus.

Further, in order to cope with high-mix low-volume production and to increase the production efficiency, a so-called multi-cavity printed wiring board, in which conductive patterns corresponding to a plurality of electronic devices are formed on one substrate, is sometimes manufactured. More.
On such a multi-cavity substrate, conductive patterns corresponding to several to several tens of electronic devices are formed. To perform inspection at a time, an inspection head of an inspection device corresponds to these conductive patterns. A very large number of contact probes must be implanted. For this reason, a large number of contact probes must be arranged with high accuracy, and the inspection apparatus becomes extremely expensive. As a result, it is not possible to cope with a printed wiring board whose production quantity is small.

The present invention has been conceived in view of the above-mentioned circumstances, and solves the above-mentioned conventional problems. The present invention can lead a test probe to a test contact with high accuracy to perform a reliable test. It is an object of the present invention to provide a printed wiring board inspection apparatus, a plate-shaped inspection jig, and an inspection method that can perform inspection of a take-out board extremely easily and at low cost.

[0013]

Means for Solving the Problems To solve the above problems, the present invention takes the following technical means.

The invention described in claim 1 of the present application comprises an inspection table capable of positioning and holding a printed wiring board at a predetermined inspection position, and an inspection head for holding an inspection probe so as to be able to contact and separate from the printed wiring board. An inspection device for a printed wiring board, comprising: a plate-shaped inspection jig including a substrate holding area for integrally holding the printed wiring board and a substrate positioning area disposed around the substrate holding area; A positioning means provided in the table or the substrate positioning area and capable of positioning the plate-shaped inspection jig at a predetermined position on the inspection table; and positioning the printed wiring board on the inspection table via the plate-shaped inspection jig. Is characterized in that it is positioned at the inspection position.

The present invention is characterized in that the printed wiring board is positioned on an inspection table via a plate-shaped inspection jig for inspection.

Since the plate-shaped inspection jig can be formed by using a resin plate or a metal plate made of polycarbonate or the like, it can be manufactured at extremely low cost.

Further, the plate-shaped inspection jig according to the present invention holds the printed wiring board integrally,
Positioning means for positioning the printed wiring board at a predetermined position on the inspection table is provided.

That is, the printed wiring board is placed on the inspection table while being held integrally with the board holding area, and is fixed to the plate-shaped inspection jig by the positioning means provided in the board positioning area. Positioned in position.

Various means can be employed as the positioning means. For example, as in the invention described in claim 5, it is also possible to provide a positioning pin having a conventionally employed configuration on an inspection table and to provide a positioning hole for engaging with the positioning pin in a substrate positioning area.

In addition, an optical positioning mark can be formed in the substrate positioning area, and the printed wiring board can be automatically positioned based on the positioning mark using an XY table or the like. Further, while positioning projections are provided on the plate-shaped inspection jig, positioning holes into which the positioning projections engage can be provided on the inspection table.

By providing the above-mentioned substrate positioning area, positioning holes and the like are provided at the most convenient positions for inspection without being affected by the size, shape, conductive pattern, etc. of the printed wiring board to be inspected. Can be provided. In addition, there are almost no restrictions on the size and shape of the positioning means. For this reason, it is possible to accurately position the printed wiring board at a predetermined inspection position.

Various means can be employed as means for integrally holding the printed wiring board on the plate-shaped inspection jig. For example, the printed wiring board can be configured to be held by laminating the printed wiring board. In this case, the printed wiring board can be held using the adhesive tape. Also, a double-sided adhesive tape can be used. Further, an adhesive may be applied to the substrate holding region in advance.

Also, as in the invention described in claim 2,
The plate-shaped inspection jig may be provided with an auxiliary plate that is arranged so as to sandwich the printed wiring board and that protects a wiring pattern and / or mounted electronic components. That is, the printed wiring board is configured to be held between the plate-like inspection jig and the auxiliary plate so as to be sandwiched therebetween.

The auxiliary plate can be attached to a printed wiring board in the same manner as the plate-like inspection jig. Further, the auxiliary plate and the plate-shaped inspection jig can be formed integrally.

In the inspection apparatus according to the present invention, the plate-like inspection jig and / or the auxiliary plate and the printed wiring board are integrally joined in advance before the inspection. These can be quickly and accurately joined using a conductive pattern or the like on a printed wiring board and using a microscope or the like. Further, since these joining operations can be performed at a place away from the inspection table, a large number of printed wiring boards can be inspected continuously by preparing a plurality of plate-shaped inspection jigs.

Further, the plate-shaped inspection jig can be configured to be laminated and attached to at least one surface of the printed wiring board to hold the printed wiring board. The plate-shaped inspection jig is integrated with the printed wiring board, transported together with the printed wiring board, and positioned at a predetermined inspection position on an inspection table.

By laminating and attaching the plate-like inspection jig and the auxiliary plate to the printed wiring board, an effect of protecting the printed wiring board and the conductive pattern on the surface can be expected when handling the board. Further, even when the conductive pattern is formed on the entire surface of the substrate, the finger does not touch the conductive pattern. Therefore, handling of the substrate becomes easy. In particular, a high effect can be expected on a flexible printed wiring board having flexibility and a ceramic substrate which is easily damaged.

The plate-like inspection jig may be provided on at least one side of the printed wiring board. This is because the printed circuit board may be positioned with high accuracy by the positioning means provided in the positioning area. If it is necessary to supplement the strength or the like of the plate-shaped inspection jig, plate-shaped inspection jigs can be provided on both sides of the printed wiring board.

Also, as in the invention described in claim 3,
A probe guide hole for guiding each test probe to a test contact of the printed wiring board can be formed in the board holding area. The probe guide hole is provided in the substrate holding area in accordance with the inspection contact of the printed wiring board, and is formed to have a shape and a size that allows each contact probe to be inserted and guided. For example,
A circular hole having a diameter slightly larger than the outer shape of the inspection probe can be formed. By ensuring the dimensional accuracy and the arrangement accuracy of the circular holes, the inspection probe can be accurately guided and guided to the inspection contact with high accuracy.

In addition, it is possible to prevent an inadvertent force from being applied to the inspection probe from the printed wiring board or the like during the inspection, and prevent the inspection probe from being bent, thereby performing a reliable inspection. Further, since the inspection probe can be protected from damage or the like, the life of the inspection device can be extended.

Further, since the tip of the inspection probe can be reliably guided to a predetermined inspection contact point of the printed wiring board by the probe guide hole, the arrangement accuracy of the inspection probe or the guidance accuracy of the inspection head is slightly reduced. Can also be inspected. Therefore, high accuracy is not required for the inspection device, and the manufacturing cost of the inspection device can be reduced.

According to a fourth aspect of the present invention, the plate-shaped inspection jig and / or the auxiliary plate are formed with a notch for preventing interference with an electronic component mounted on a printed wiring board. It corresponds to inspection of a semi-finished product in which some electronic components are mounted on a printed wiring board, or a finished product in which all electronic components are mounted. By forming the notch, the electronic component is not damaged during the inspection, the handling of the substrate is facilitated, and the yield of the product is improved. The shape of the notch is not particularly limited, and a recess or a hole that can accommodate a mounted component may be formed.

According to a fifth aspect of the present invention, the positioning means includes a positioning pin provided on the inspection table, and a positioning hole formed in the substrate positioning area and into which the positioning pin is engaged. It is composed.

The positioning hole is formed in a positioning area provided around the substrate holding area. For this reason, the positioning holes can be accurately formed at the optimum positions without being affected by the size, shape, conductive pattern, and the like of the printed wiring board.

In addition, since a sufficient space for forming the positioning holes can be secured, a plurality of positioning pins and positioning holes can be formed to accurately position the printed wiring board.

According to a sixth aspect of the present invention, there is provided a printed wiring board inspection apparatus for inspecting a printed wiring board having a plurality of inspection areas corresponding to a plurality of electronic devices, wherein the inspection head comprises one The inspection device includes an inspection probe corresponding to one inspection region, and the positioning unit is configured to perform the inspection by sequentially positioning the printed wiring board at a plurality of inspection positions where each of the inspection regions faces the inspection probe. Is what is being done.

The present invention corresponds to a so-called multi-cavity printed wiring board in which conductive patterns corresponding to a plurality of electronic devices are formed on one printed wiring board.

Conventionally, a multi-chip substrate corresponding to the plurality of electronic devices has been inspected at once by using an inspection head provided with inspection probes corresponding to all of the plurality of conductive patterns. For this reason, it was necessary to provide an extremely large number of inspection probes in the inspection head. Also, circuits and the like for judging pass / fail of each inspection area are required by the number of each inspection area. As a result, a high precision is required for the inspection head and the guide device, and the inspection device becomes extremely expensive, and cannot be applied to a printed wiring board for an electronic device which is manufactured in a small quantity.

According to the present invention, by using a plate-shaped inspection jig, an inspection area corresponding to each electronic device is sequentially positioned at an inspection position. It is configured so that a multi-piece substrate can be inspected.

In the inspection apparatus according to the present invention, positioning means for sequentially positioning the inspection areas corresponding to the plurality of electronic devices at predetermined inspection positions on the inspection table are provided in the positioning area of the plate-shaped inspection jig. That is, by this positioning means, the printed wiring board is
The inspection is performed at a plurality of positions on the inspection table.

The work of positioning the plate-shaped inspection jig can be performed directly by an operator using hands, or can be automatically performed using a stepping motor or the like.

With the above configuration, the cost of the inspection apparatus can be significantly reduced, and the inspection accuracy can be ensured. In addition, various printed wiring boards can be inspected only by changing the plate-shaped inspection jig, so that it is possible to cope with the inspection of printed wiring boards that are produced in various types and in small quantities.

As the positioning means for positioning the multi-cavity printed wiring board, the positioning means may include a positioning pin provided on the inspection table and the inspection area of the printed wiring board. And a plurality of sets of positioning holes provided in the substrate positioning area corresponding to the above, and by sequentially engaging the positioning pins with the positioning holes, the printed wiring board is connected via a plate-shaped inspection jig. Each inspection area can be configured to be sequentially positioned at a predetermined inspection position.

In the plate-shaped inspection jig according to the present invention, since there is almost no restriction on the area for forming the positioning holes, a problem may occur even if a large number of positioning holes corresponding to a plurality of inspection areas are formed. There is no.

The invention described in claim 8 of the present application is a printed wiring board inspection apparatus for inspecting a printed wiring board having inspection areas on both sides, wherein the printed wiring board positioned and held on an inspection table is sandwiched. It is provided with a pair of inspection heads to be arranged.

The present invention is compatible with a printed wiring board having inspection contacts on both sides, and can easily inspect a printed wiring board having electronic components mounted on both sides of the board.

According to a ninth aspect of the present invention, an inspection area identifying means for identifying an inspection area of a printed wiring board positioned at an inspection position is provided.

When inspecting a multi-piece printed wiring board, if the number of conductive patterns corresponding to the electronic device increases, it may be difficult to identify which inspection area is being inspected.

The present invention is adapted to such a case, and is configured so that a conductive pattern to be inspected can be easily recognized and a defective conductive pattern can be easily identified.

As the inspection area identification means, for example,
An identification hole corresponding to each of the inspection areas is formed in a part of a positioning area provided around the substrate holding area, and provided below the identification hole when the corresponding inspection area is positioned at the inspection position of the inspection table. The light source can emit light from the light source.

Also, an identification mark corresponding to each inspection area is provided in a positioning area or the like, and the identification mark is identified by an optical recognition device so as to constitute a system for displaying which inspection area is being inspected. You can also.

The invention according to claim 10 of the present application relates to a plate-like inspection jig for positioning a printed wiring board at a predetermined inspection position on an inspection table, wherein the printed wiring board is integrated. And a substrate positioning area disposed around the substrate holding area. The printed circuit board is positioned in the substrate positioning area in cooperation with positioning means provided on the inspection table. And a positioning means for positioning at the inspection position.

According to the invention described in claim 11 of the present application, the plate-shaped inspection jig is provided with an auxiliary plate which is arranged so as to sandwich the printed wiring board and protects the wiring pattern and / or the mounted electronic components. Things.

The auxiliary plate can be formed separately from the plate-shaped inspection jig, and can be configured to be laminated and integrated on a printed wiring board. Alternatively, the edge of the plate-shaped inspection jig and the edge of the auxiliary plate may be integrally formed by being rotatably joined to each other, and may be held so as to sandwich the printed wiring board.

According to a twelfth aspect of the present invention, a notch for avoiding interference with an electronic component mounted on a printed wiring board is provided in the substrate holding area and / or the auxiliary plate of the plate-like inspection jig. It is provided. By providing the above-mentioned notch, it is possible to perform an inspection in a state where some or all of the electronic components are mounted on the printed wiring board. Therefore, it is possible to inspect a semi-finished product or a completed electronic device.

When the notch is provided, it is desirable to form the plate-shaped inspection jig and the auxiliary plate from a plate-shaped material having a thickness at least equal to the height of the electronic component to be mounted.

The invention according to claim 13 of the present application relates to a plate-shaped inspection jig provided with a probe guide hole for guiding each inspection probe to guide it to an inspection contact of a printed wiring board.

According to a fourteenth aspect of the present invention, a positioning hole is formed as a positioning means formed in a substrate positioning area, the positioning hole engaging with a positioning pin provided on an inspection table.

According to a fifteenth aspect of the present invention, there is provided a plate-like inspection jig for positioning a printed wiring board having a plurality of inspection areas corresponding to a plurality of electronic devices, the positioning jig being formed in the positioning area. The means is configured to perform an inspection by sequentially positioning the printed wiring board at a plurality of inspection positions where each of the inspection areas faces the inspection probe in cooperation with positioning means provided on an inspection table. Is what it is.

According to a sixteenth aspect of the present invention, there is provided an inspection table for positioning and holding a printed wiring board at a predetermined inspection position, and an inspection head for holding an inspection probe so as to be able to contact and separate from the printed wiring board. An inspection method in an inspection device for a printed wiring board, comprising:
The printed wiring board is adhered to and held by a plate-shaped inspection jig provided with positioning means for performing positioning in cooperation with the positioning means provided on the inspection table, and the printed wiring board is passed through the plate-shaped inspection jig. Is positioned at a predetermined inspection position and the inspection is performed.

According to a seventeenth aspect of the present invention, a printed circuit board having a plurality of inspection regions corresponding to a plurality of electronic devices is inspected using an inspection device provided with an inspection probe corresponding to one electronic device. In the method of inspecting a printed wiring board, the printed wiring board is attached and held on a plate-shaped inspection jig provided with positioning means capable of positioning at a plurality of inspection positions, and via the plate-shaped inspection jig, The inspection is performed by sequentially positioning each inspection area of the printed wiring board at a predetermined inspection position facing the inspection probe.

The invention according to claim 18 of the present application guides an inspection probe to a contact point of the printed wiring board through a guide hole formed in the plate-shaped inspection jig corresponding to each inspection area. The present invention relates to a method of inspecting a printed wiring board to be brought into contact with the printed circuit board.

The invention described in claim 19 of the present application is a method for inspecting a printed wiring board on which some or all of the electronic components to be mounted are mounted, wherein the board holding area and / or The inspection is performed by accommodating an electronic component mounted on a printed wiring board in a notch formed in the auxiliary plate.

When inspecting a printed wiring board, an intermediate inspection may be performed with some electronic components mounted on the printed wiring board. In particular, if a defect in a printed wiring board can be found before mounting an expensive arithmetic unit or the like, the yield of products will be improved. In addition, it is necessary to inspect an electronic device completed by mounting all electronic components. The present invention corresponds to such a case.

The invention described in claim 20 of the present application performs an inspection under the same conditions as when an electronic component is mounted on a printed wiring board. That is, an electronic component not mounted on the printed wiring board is connected to a base end of an inspection probe that contacts a connection portion of the electronic component, and an inspection is performed.

In the invention according to claim 16,
There is a case where the operation of the printed wiring board itself or some of the electronic components mounted thereon is inspected in relation to the electronic components not mounted. The invention of the present application corresponds to such a case, and the inspection can be performed in a state where a standard electronic component having a certain performance is connected to the base end of the inspection probe. According to this method, it is possible to inspect whether or not the function as a finished product can be exhibited at an intermediate stage of the manufacturing process of the electronic device. Also,
According to the above-described inspection method, it is possible to inspect the characteristics of the printed wiring board in a state where the electronic component is mounted, and it is also possible to perform a multifaceted inspection of the printed wiring board.

[0067]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a front view of a printed wiring board inspection apparatus according to the present invention, and FIG. 2 is a side view thereof. As shown in these drawings, an inspection apparatus 1 according to the present embodiment includes a base plate 2 placed on a desk, a stand 3 fixed to the rear of the upper surface of the base plate 2 and standing upright, 3 and an upper inspection head 4
Lifting table 5 that holds the lower inspection head 6 and a test table device 7 that is provided at the front of the base plate 2 so as to face the lifting block 5 and that holds the lower inspection head 6. Lifting means 8 for lifting and lowering.

The elevating block 5 is moved toward and away from the inspection table device 7 along a guide surface 9 provided on the front surface of the stand 3. The elevating means 8 includes an operation arm 10 rotatably provided on a side surface of the stand 3 and a drive mechanism (not shown) provided inside the stand 3. The rotation operation is configured to be converted into a vertical movement of the lifting block 5. The drive mechanism can be configured using a well-known gear mechanism or the like, and is configured such that the elevation block 5 is lowered along the guide surface 9 by rotating the operation arm 10 toward the user. .

The inspection table device 7 is held on the base plate 2 via an XY positioning device 11, and a knob 1
The lower inspection head 6 held by the inspection table device is moved by rotating the second and the second inspection table 13 so that the lower inspection head 6 can be positioned at a position facing the upper inspection head 4.

FIG. 3 shows a cross section of the upper inspection head 4 and the inspection table device 7.

As shown in this figure, the upper inspection head 4
Is a cylindrical mounting block 15 fixed to a fixing device 14 provided on the lifting block 5, and a mounting plate integrally joined to the lower surface of the mounting block 15 and brought into contact with the lower surface of the lifting block 5. 16 and a head plate 18 facing the inspection table device 7
And the mounting plate 16 and the head plate 18
And a plurality of columns 19 for connecting them at a predetermined interval. Further, a probe holding plate 21 is provided on the head plate 18 via a plurality of columns 20, and the tip of the inspection probe 17 implanted on the probe holding plate 21 is provided on the head plate 18. It protrudes downward from the lower surface of the head plate 18 through the insertion hole.

The inspection probe 17 has a known structure, and although not shown, the probe holding plate 2
1 includes a cylindrical tube having a base end held therein, a probe needle slidably held within the cylindrical tube in a predetermined range, and a spring for elastically biasing the probe needle toward an open end. ing. The distal end of the probe needle is pressed against the inspection contact of the printed wiring board, and an inspection signal can be taken out via a lead wire 22 connected to the base end of the inspection probe.

The inspection table device 7 includes a positioning device 11
A base plate 23 fixed thereon, a table plate 25 supported on the base plate 23 via a plurality of columns 24, and a state in which the table plate 25 is elastically raised to a predetermined height on the upper surface of the table plate 25 in a natural state. And a lifting plate 26 that is held by the above. The lifting plate 26 shown in FIG. 3 shows a state in which the lifting plate 26 is in close contact with the table plate 25 for easy understanding of the drawing.

A lower inspection head 6 is provided below the center of the table plate 25. The lower inspection head 6 includes a mounting plate 27 mounted on the lower surface of the table plate 25, and a probe holding plate 29 supported on the mounting plate 27 via a plurality of columns 28. A base end portion of the inspection probe 30 is implanted in 28, and a tip end portion of the inspection probe 30 is projected upward from the table plate 25. Note that the structure and mounting structure of the inspection probe 30 are the same as those provided in the upper inspection head 4, and therefore description thereof is omitted.

The lift plate 26 is configured to be lifted to a predetermined height by a float 31 that is projected while being elastically urged from the table plate 25.

As shown in FIGS. 3, 7, and 8, the float 31 is provided with a holding hole 3 formed in the table plate 25.
2, while being elastically urged by a spring 33, it is held so as to be retractable from the surface of the table plate 25,
The lifting plate 26 is configured to lift up to a position where the tip of the inspection probe 30 relatively sinks from the upper surface of the lifting plate 26.

In the inspection apparatus 1 according to the present invention, the printed circuit board 41 to be inspected is positioned and mounted integrally with the plate-shaped inspection jig 34 on the inspection table apparatus 27, and the upper inspection head 4 The inspection is carried out by bringing the inspection probe 17 held by the sensor into contact with the inspection probe 30 held by the table plate 25 from above and below.

The plate-shaped inspection jig 34 according to the present embodiment is formed from a thin rectangular transparent plate made of polycarbonate having a thickness of about 0.5 mm. As shown in FIGS. 4 and 5, this plate-shaped inspection jig 34 includes:
A board holding area 35 for holding the printed wiring board 41 is provided at the center, and the board holding area 35
A positioning area 37 having a plurality of positioning holes 36a to 36i is provided on both side portions.

On the other hand, as shown in FIGS. 3, 7 and 8,
In the table plate 25, the positioning holes 36a to 36
Four positioning pins 38 that engage with i are protruded.

The positioning pin 38 is held in a holding hole 39 formed in the table plate 25 with its tip protruding from the surfaces of the table plate 25 and the lifting plate 26 while being elastically urged by a spring 40. I have.
Positioning holes 36a-36 of the plate-shaped inspection jig 34
When the positioning pins 38 are engaged with the i, the plate-shaped inspection jig 34 and the printed wiring board 41 held by the jig 34 are positioned at predetermined positions on the table 25.

The protrusion height of the positioning pin 38 is shown in FIG.
In the inspection state of the printed wiring board 41 shown in (1), the plate-like inspection jig 34 is set so as to be engaged with the positioning holes 36a to 36i deeply and immovably. On the other hand, in the positioning state shown in FIG. 7, the head of the positioning pin 38 engages with the positioning holes 36 a to 36 i so that the positioning holes can be positioned.
It is set so that it can be easily released against the elasticity of the vehicle. By lifting the plate-like inspection jig 34 and sliding the upper surface of the plate 26, the positioning pins 38 are moved.
Are sequentially engaged with the positioning holes 36a to 36i so that the plate-shaped inspection jig 34 can be sequentially positioned at a predetermined inspection position.

In this embodiment, using the positioning pins 38 and the plate-like inspection jig 34, the printed wiring board 41 having nine inspection areas 41a to 41i,
In other words, each of the inspection areas of the nine-cavity printed wiring board can be inspected by the upper and lower inspection heads 4 and 6 each having an inspection probe corresponding to one inspection area.

That is, as shown in FIG. 4, the plate-shaped inspection jig 34 according to the present embodiment is provided with positioning holes 36a at pitches corresponding to the above-described inspection areas 41a to 41i.
36i are formed on both sides, respectively, and positioning pins 38 provided at two positions on the left and right are sequentially engaged with the positioning holes 36a to 36i, respectively, so that each inspection area corresponding to the positioning holes 36a to 36i is formed. 41a
To 41i can be sequentially positioned at inspection positions facing the upper and lower inspection heads 4 and 6.

For example, with the upper inspection head 4 shown in FIG. 7 raised, four positioning pins 38 provided on the front, rear, left and right of the lower inspection head 6 are moved to the right and left 36e shown in FIG.
By engaging with the positioning holes indicated by, the inspection area 41e at the center can be positioned at the inspection position facing the inspection heads 4 and 6.

When the upper inspection head 4 is lowered by rotating the operation arm 10 in the above-mentioned positioning state, the tip of each inspection probe 17 projecting from the head plate 18 as shown in FIGS. Are inserted into the probe guide holes 42 of the plate-shaped inspection jig 34 and are brought into contact with the inspection contacts on the upper surface of the printed wiring board 41,
The lower surface of the head plate 18 presses the plate-shaped inspection jig 34 and the printed wiring board 41 downward. As a result, the lift plate 26 supported by the float 31 is displaced downward, and the lower inspection probe 30 projects upward from the upper surface of the lift plate 26 and
1 is brought into contact with the inspection contact on the lower surface. In this state, the inspection probes 17 and 30 are energized, and the printed wiring board 41 is inspected.

After the above inspection is completed, when the upper inspection head 4 is raised by rotating the operation arm 10, the upper inspection probe 17 comes out of the probe guide hole 42, and the floating member 31 urged elastically by the spring 33. The pressed lifting plate 26 rises from the table plate 25, the tip of the lower inspection probe 30 separates from the printed wiring board 41, and returns to the state shown in FIG.

In the state shown in FIG. 7, the plate-shaped inspection jig 34 and the printed wiring board 41 are temporarily fixed by the engagement between the positioning pins 38 and the positioning holes 36e. For this reason, the engagement between the positioning pin 38 and the positioning hole 36e is released against the elasticity of the positioning pin 38 or the like, so that the plate-like inspection jig 34 is imaginary in the direction indicated by the arrow in FIG. By moving to the position shown, the next inspection area can be positioned at the inspection position. In addition, the elasticity of the positioning pin 38 allows the plate to be locked at a desired position in a stepwise manner, so that the work of positioning the plate-shaped inspection jig 34 can be easily performed.

In the present embodiment, the inspection is performed by attaching and holding the printed wiring board 41 to the lower surface of the plate-shaped inspection jig 34. As shown in FIG. 4, the printed circuit board 41
A pair of rectangular openings 43 are formed for attaching and fixing the adhesive tape 44 to the plate-shaped inspection jig 34 and the printed wiring board 41 through the openings 43 as shown in FIG. The printed wiring board 41 is attached and held on the plate-shaped inspection jig 34 by being attached in a bridging manner. Thereby, as shown in FIG. 5, the printed wiring board 41 and the plate-shaped inspection jig 34 are integrally attached and bonded.

By using the adhesive tape 44, the work of attaching the printed wiring board 41 to the plate-shaped inspection jig 34 can be easily performed.

Further, as shown in FIGS. 7 to 9, the plate-shaped inspection jig 34 includes a printed wiring board 41.
The probe guide holes 42 corresponding to the test contacts are formed in portions that are in contact with the respective test areas 41a to 41i. This probe guide hole 42 is, as shown in FIG.
The test probe 17 is formed to have an inner diameter slightly larger than the outer diameter of the test probe 17, and even if the arrangement accuracy of the test probes is slightly reduced, each test probe 17 can be reliably guided to a predetermined test contact. Therefore, the inspection can be performed accurately and reliably.

Further, since the inspection probe 17 during the inspection can be protected by the probe guide hole, it is possible to prevent the inspection probe 17 from being bent or damaged during the inspection.

Further, by overlapping the probe guide hole 42 with the inspection contact on the printed wiring board 41, the printed wiring board 41 can be positioned and held with high precision on the plate-shaped inspection jig 34.

Further, in the present embodiment, a plate-shaped inspection jig 34 having a probe guide hole 42 is attached to the upper surface of the printed wiring board 41 in particular. This makes it possible to supplement the accuracy of the elevating means 8 and to provide an inexpensive inspection device.

FIGS. 10 and 11 show the inspection area identification means for identifying the inspection areas 41a to 41i of the printed wiring board 41 positioned at the inspection position when inspecting a multi-piece printed wiring board. An example is shown.

As shown in FIG. 10, each inspection area 4 of the printed wiring board 41 is
Identification holes 46a to 46i are formed in an arrangement and pitches A and B corresponding to 1a to 41i. On the other hand, as shown in FIG. 11, a light source device 47 is provided on the front lower surface of the inspection table device 7 so that light can be emitted upward through an irradiation hole 48 formed in the table device 7. It is configured.

The irradiation hole 48 is provided in the printed circuit board 41.
When the predetermined inspection area is located at the inspection position, it is formed so as to overlap with the identification hole formed corresponding to the inspection area. For example, when the inspection area 41e is positioned at the inspection position, the identification hole 46e is configured to correspond to the irradiation hole 48. Therefore, light is emitted from the identification hole corresponding to the inspection area positioned at the inspection position, and the inspection area to be inspected is a plate-shaped inspection jig 34.
Displayed above.

With the above configuration, the inspection work of the multi-piece board can be performed quickly, and the desired inspection area of the printed wiring board 41 can be easily positioned even when re-inspection is performed.

FIG. 12 shows an embodiment relating to an inspection apparatus capable of inspecting the printed wiring board 41 with electronic components mounted thereon.

FIG. 12 shows a cross section of a main part of an inspection apparatus for inspecting a printed wiring board 41 having electronic components 50, 51, 52 mounted on an upper surface and electronic components 53, 54, 55, 56 mounted on a lower surface. .

As shown in this figure, in the present embodiment, the auxiliary plate 57 is provided above the printed circuit board 41.
Are laminated and attached, while a plate-like inspection jig 58 is laminated and attached below.

The auxiliary plate 57 stuck on the upper side has
Electronic component 5 mounted on upper surface of printed wiring board 41
0, 51, and 52, respectively, to prevent interference between the head plate 18 and the printed wiring board.
60 and 61 are formed. In addition, the inspection probe 17
A probe guide hole 62 is formed to guide and guide the probe to the inspection contact of the printed wiring board 41.

On the other hand, the plate-shaped inspection jig 58 stuck on the lower side is formed with one notch hole 63 for accommodating the electronic components 53, 54, 55, 56 in a lump. In addition, a substrate positioning area 65 in which positioning holes 36 for engaging with the positioning pins 38 are formed on both sides of the substrate holding area 64.
Is provided in the same manner as in the above-described embodiment.

The auxiliary plate 57 and the plate-shaped inspection jig 58 are connected by a positioning spacer 66 provided at the edge of the substrate holding area 64. The positioning spacer 66 engages with engagement holes 67 and 68 formed in the auxiliary plate 57 and the plate-shaped inspection jig 58 to connect the auxiliary plate 57 and the plate-shaped inspection jig 58 to each other. 70 and the auxiliary plate 5
7 and the plate-shaped inspection jig 58
And a spacer portion 71 for holding in accordance with the thickness of the spacer.

The auxiliary plate 57 and the plate-like inspection jig 58 are joined with high precision via the positioning spacer 66, and hold the printed wiring board 41 on which electronic components are mounted in the middle.

The thickness of the auxiliary plate 57 and the plate-shaped inspection jig 58 is set to a thickness corresponding to the height of the electronic component mounted on the surface to be in contact with. Alternatively, it can be held without protruding from the surface of the plate-shaped inspection jig 58. For this reason, the printed wiring board is slid together with the plate-shaped inspection jig, and the inspection can be performed by sequentially positioning each inspection region at the inspection position. Thereby, the printed wiring board on which the electronic component is mounted can be inspected efficiently.

The other configuration of the inspection apparatus is the same as that shown in FIG. 7, and the description is omitted.

FIG. 13 is a sectional view of a main part of an inspection apparatus for performing an inspection by connecting an electronic component not mounted on a printed wiring board to a base end of an inspection probe that comes into contact with a connection portion of the electronic component. .

As shown in FIG.
Electronic components 72, 73, 74 are mounted on the lower surface of 1, and an auxiliary plate 80 is laminated and attached. On the other hand, no electronic components are mounted on the upper surface of the printed wiring board 41, and a plate-like inspection jig 81 is laminated and attached. The electronic component 75 to be mounted on the printed wiring board 41 is connected to the base end of a test probe 76 projecting from the upper surface of the upper test head 4.

The electronic component 75 is a standard electronic component whose performance has been confirmed in advance. By inspecting the printed wiring board 41 with this device, it is assumed that all the electronic components are mounted in an intermediate step. The inspection of the substrate 41 can be performed.

By performing the above inspection, it is possible to inspect the printed wiring board 41 on which the electronic devices 72, 73, 74 are mounted on one side, and to confirm the defect of the board and the like.
Repair or replacement of the board or the electronic component can be easily performed. In addition, since the quality of a printed circuit board or other electronic components can be checked before assembling expensive electronic components such as an arithmetic unit, the yield of products can be improved and the cost can be reduced.

The scope of the present invention is not limited to the above embodiment.

In the embodiment, the present invention is applied to a nine-piece printed circuit board. However, the present invention is applied to a single-piece printed circuit board or a multi-piece printed circuit board corresponding to ten or more electronic devices. Can be applied.

Further, the method of joining the printed wiring board and the plate-shaped inspection jig is not limited to the above-described embodiment. For example, the joining can be performed using a positioning hole or the like formed in the printed wiring board. .

In the embodiment, a plate-like inspection jig made of a transparent resin material is used.
Other plate-like materials such as a metal material can also be adopted.

[Brief description of the drawings]

FIG. 1 is a front view of an inspection device according to the present invention.

FIG. 2 is a side view of the inspection device according to the present invention.

FIG. 3 is an enlarged sectional view showing a main part of the inspection device.

FIG. 4 is a plan view in which a printed wiring board is held by a plate-shaped inspection jig.

FIG. 5 is a side view of the plate-shaped inspection jig shown in FIG.

FIG. 6 is a sectional view taken along the line VI-VI in FIG.

FIG. 7 is a sectional view of a main part of the inspection apparatus, showing a state where an upper inspection head is separated.

FIG. 8 is a cross-sectional view of a main part of the inspection apparatus, showing a state where the printed wiring board is being inspected.

FIG. 9 is an enlarged sectional view of a main part of FIG.

FIG. 10 is a plan view showing an example of an inspection area identification unit.

FIG. 11 is a sectional view taken along the line XI-XI in FIG. 10;

FIG. 12 is a sectional view of a main part of an inspection apparatus for inspecting a printed wiring board on which electronic components are mounted.

FIG. 13 is a cross-sectional view of a main part of an inspection apparatus that performs inspection by connecting some electronic components to an inspection probe.

[Explanation of symbols]

 Reference Signs List 1 inspection apparatus 4 upper inspection head 6 lower inspection head 7 inspection table 17 inspection probe 30 inspection probe 34 plate-shaped inspection jig 35 substrate holding area 36 positioning hole 37 substrate positioning area 38 positioning pin 41 printed wiring board 42 probe guide hole 57 auxiliary plate

Claims (20)

[Claims] An inspection apparatus for a printed wiring board, comprising: an inspection table capable of positioning and holding a printed wiring board at a predetermined inspection position; and an inspection head for holding an inspection probe so as to be able to contact and separate from the printed wiring board. A plate holding jig provided with a board holding area for integrally holding the printed wiring board, and a board positioning area disposed around the board holding area; and an inspection table or the board positioning area. Positioning means for positioning the plate-shaped inspection jig at a predetermined position on an inspection table, wherein the printed wiring board is positioned at a predetermined inspection position on the inspection table via the plate-shaped inspection jig. A printed wiring board inspection device, characterized in that: 2. The printed circuit board according to claim 1, wherein the plate-shaped inspection jig includes an auxiliary plate disposed so as to sandwich the printed circuit board and protecting a wiring pattern and / or a mounted electronic component. Inspection equipment. 3. The plate-shaped inspection jig and / or the auxiliary plate are provided with a probe guide hole for guiding each inspection probe to an inspection contact of a printed wiring board.
An inspection device for a printed wiring board according to claim 2. 4. The printed circuit board and / or the auxiliary plate according to claim 1, wherein a cutout portion is formed on the printed circuit board and / or the auxiliary plate to avoid interference with an electronic component mounted on the printed circuit board. A printed circuit board inspection apparatus as described in the above. 5. The positioning device according to claim 1, wherein the positioning means includes a positioning pin provided on the inspection table, and a positioning hole formed in the substrate positioning area and into which the positioning pin is engaged. Item 5. An inspection device for a printed wiring board according to any one of Items 4. 6. A printed wiring board inspection apparatus for inspecting a printed wiring board provided with a plurality of inspection areas corresponding to a plurality of electronic devices, wherein the inspection head includes an inspection probe corresponding to one inspection area. The positioning means is configured to perform an inspection by sequentially positioning the printed wiring board at a plurality of inspection positions where each of the inspection regions faces the inspection probe. Item 6. An apparatus for inspecting a printed wiring board according to any one of Items 5. 7. The positioning means includes: a positioning pin provided on the inspection table; and a plurality of sets of positioning holes provided in the board positioning area corresponding to the inspection areas of the printed wiring board. 7. The method according to claim 6, wherein each of the inspection areas of the printed wiring board can be sequentially positioned at a predetermined inspection position via a plate-like inspection jig by sequentially engaging the positioning pins with the positioning holes. A printed circuit board inspection apparatus as described in the above. 8. A printed wiring board inspection apparatus for inspecting a printed wiring board having an inspection area on both sides, comprising a pair of inspection heads arranged so as to sandwich a printed wiring board positioned and held on an inspection table. Was
An inspection apparatus for a printed wiring board according to claim 1. 9. An inspection area identification means for identifying an inspection area of a printed wiring board positioned at an inspection position,
An apparatus for inspecting a printed wiring board according to claim 6. 10. A printed wiring board inspection apparatus, comprising: an inspection table capable of positioning and holding a printed wiring board at a predetermined inspection position; and an inspection head for holding an inspection probe so as to be able to contact and separate from the printed wiring board. A plate-shaped inspection jig for positioning a printed wiring board at a predetermined inspection position on an inspection table, wherein the board holding area integrally holds the printed wiring board, and is disposed around the board holding area. And a positioning means for positioning the printed wiring board at a predetermined inspection position in cooperation with the positioning means provided on the inspection table in the substrate positioning area. , Plate inspection jig. 11. The plate-shaped inspection jig according to claim 10, wherein the plate-shaped inspection jig is provided so as to sandwich the printed wiring board and includes an auxiliary plate for protecting a wiring pattern and / or mounted electronic components. jig. 12. A notch for avoiding interference with an electronic component mounted on a printed wiring board is provided in a substrate holding area and / or an auxiliary plate of the plate-shaped inspection jig. The plate-shaped inspection jig according to claim 10 or 11. 13. The substrate holding area and / or the auxiliary plate of the plate-shaped inspection jig is provided with a probe guide hole for guiding each inspection probe and guiding the inspection probe to an inspection contact of a printed wiring board. Item 13. A plate-shaped inspection jig according to any one of Items 12. 14. The plate-like inspection jig according to claim 10, wherein the positioning means formed in the substrate positioning area is a positioning hole which engages with a positioning pin provided on the inspection table. . 15. A plate-like inspection jig for positioning a printed wiring board provided with a plurality of inspection areas corresponding to a plurality of electronic devices, wherein a positioning means formed in the board positioning area includes: 11. The inspection apparatus according to claim 10, wherein each of the inspection areas is sequentially positioned at a plurality of inspection positions facing the inspection probe in cooperation with a positioning means provided on an inspection table to perform the inspection. 15. The plate-shaped inspection jig according to any one of 14. 16. An inspection method for an inspection apparatus for a printed wiring board, comprising: an inspection table for positioning the printed wiring board at a predetermined inspection position; and an inspection head for holding an inspection probe so as to be able to contact and separate from the printed wiring board. The printed wiring board is stuck and held on a plate-shaped inspection jig provided with positioning means for performing positioning in cooperation with the positioning means provided on the inspection table, via the plate-shaped inspection jig, An inspection method for a printed wiring board, wherein the inspection is performed by positioning the printed wiring board at a predetermined inspection position. 17. A printed wiring board inspection method for inspecting a printed wiring board having a plurality of inspection regions corresponding to a plurality of electronic devices using an inspection device provided with an inspection probe corresponding to one electronic device. Attaching and holding the printed wiring board to a plate-shaped inspection jig provided with positioning means capable of positioning at a plurality of inspection positions, and using the plate-shaped inspection jig to inspect each inspection area of the printed wiring board And a method for inspecting a printed wiring board, wherein the inspection is performed by sequentially positioning the inspection circuit at a predetermined inspection position facing the inspection probe. 18. The inspection probe is brought into inductive contact with an inspection contact of the printed wiring board via a probe guide hole formed in the plate-shaped inspection jig corresponding to each inspection area. A method for inspecting a printed wiring board according to claim 17. 19. A method for inspecting a printed wiring board on which a part or all of electronic components to be mounted are mounted, wherein a notch formed in a substrate holding area of a plate-shaped inspection jig and / or an auxiliary plate. 19. The method for inspecting a printed wiring board according to claim 16, wherein the inspection is performed by housing an electronic component mounted on the printed wiring board. 20. A method of inspecting a printed wiring board for inspecting a printed wiring board on which some electronic components are mounted, wherein the electronic component not mounted on the printed wiring board is
The printed circuit board inspection method according to any one of claims 16 to 19, wherein the inspection is performed by connecting to a base end of an inspection probe that comes into contact with a connection portion of the electronic component.