JPH10287073A - Non-contact ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a non-contact IC card with high reliability by integrally forming an IC chip and an antenna coil with a center core film, and sandwiching the chip, coil and film between an underlay and an overlay. SOLUTION: An IC chip 3 is mounted in a mounting hole of a center core film 4, and lead terminals 9 of both ends of the coil 2 are bonded to the chip 3. Resin 10 is charged to integrate the coil 2 with the chip 3, and thermally press bonded by an underlay film 6 and an overlay film 7. To manufacture such a non-contact IC card 1, a core body 5 made of the chip 3 and coil 2 is formed on a continued sheet of the film 6, resin 10 is charged on the sheet, a lengthy overlay film 7 is laminated, press-bonded, and punched in a predetermined size by a die.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card which is used for an ID card, an entry / exit management card, a prepaid card, etc., and is capable of non-contact data communication with the outside, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Compared to magnetic cards, etc., it is more convenient,
In addition, a non-contact IC card with high security includes an antenna coil for transmitting and receiving data to and from the outside, and an IC chip including various circuits for storing data and controlling the entire system.・ Generally manufactured by a method of separately mounting in a mounting hole provided in a base material such as styrene or polyethylene terephthalate, laminating them by a resin sheet, and enclosing them inside a card having a thickness of about 0.8 mm. Have been.

However, in the conventional method, since the antenna coil is connected to the IC chip in a suspended state in a bare state, the antenna coil may be deformed or broken during transportation, so that it is very difficult to handle the antenna coil. There was a problem that was difficult. In addition, when reinforcing around the IC chip with a center core film or the like, there is a problem that precise positioning is difficult and the positional relationship between the antenna coil and the IC chip is not constant. Further, the above-mentioned problem has been a factor that hinders labor saving of the manufacturing process by the automated equipment.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a high positioning accuracy for an IC chip or the like.
An object of the present invention is to provide a non-contact IC card which is inexpensive because it can be automated, is easy to handle, has high reliability, and a method for manufacturing the same.

[0005]

The present invention provides a non-contact IC card comprising an IC chip and an antenna coil.
Non-contact IC wherein the IC chip and the antenna coil are integrally formed on a center core film, and the IC chip, the antenna coil and the center core film are sandwiched by an underlay film and an overlay film. Card.

The present invention relates to a method for manufacturing a non-contact IC card comprising an IC chip and an antenna coil, wherein a center core film is provided on an underlay film.
A non-contact IC, comprising: mounting an antenna coil on the outer periphery of the center core film; bonding lead wires at both ends of the antenna coil to the IC chip; and laminating an overlay film.
This is a method for manufacturing a C card.

The present invention provides a center core film, wherein at least one of the underlay film and the overlay film has a length corresponding to a plurality of IC cards, and a center core film formed integrally with the IC chip and the antenna coil. The method for producing a non-contact IC card according to the above-mentioned, further comprising punching a predetermined size after laminating the underlay film and the overlay film narrowly.

According to the present invention, since the IC chip and the antenna coil are integrally formed on the center core film, the workability is good and the productivity is high, so that the cost is low and the reliability is high. A non-contact IC card can be manufactured.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A center core film is mounted on a continuous sheet as an underlay film, an IC chip is mounted in a mounting hole thereof, an antenna coil is formed around the center core film, and its lead terminals are connected to an IC. After connecting to the chip, it is filled with resin, an overlay film is laminated, and pressure bonded. The laminated sheet is punched out with a mold to obtain the non-contact IC card of the present invention.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view of a non-contact IC card according to one embodiment of the present invention, FIG. 1 (a) is a plan view, and FIG.
Is a sectional view.

As shown in FIGS. 1A and 1B, in a non-contact IC card 1 of the present invention, an IC chip 3 is mounted in a mounting hole of a center core film 4, and an antenna coil 2 is mounted on a center core film. It is wound on the film 4.

Lead terminals 9 at both ends of antenna coil 2
Are bonded to the IC chip 3. The antenna coil 2 and the IC chip 3 are integrated, filled with a resin 10, and heat-pressed with an underlay film 6 and an overlay film 7.

The center core film 4 is composed of the IC chip 3
It is a hard film such as glass epoxy to protect Its thickness is about 200 μm.

The thickness of the IC chip 3 is 150 μm. The copper wire of the antenna coil 2 has a diameter of about 50 μm, is formed in two layers, and has a thickness of about 100 μm. When the antenna coil 2 is formed by a printed coil, the inner peripheral portion of the printed coil is formed by the center core film 4.
It is configured to carry the outer peripheral portion. Similarly, the thickness of the printed coil is about 100 μm.

The underlay film 6 and the overlay film 7 are made of polyethylene terephthalate (PET),
It is made of polyvinyl chloride (PVC) or polycarbonate, and has a thickness of about 100 μm. Further, the thickness of the entire non-contact IC card is 450 μm or less.

Next, a method for manufacturing a non-contact IC card according to the present invention will be described. FIG. 2 is an explanatory view showing the first half of steps in the method for manufacturing a non-contact IC card of the present invention.
2A is a plan view, and FIG. 2B is a cross-sectional view. FIG.
FIGS. 3A and 3B are explanatory diagrams showing the latter half of the steps of the method for manufacturing a non-contact IC card according to the present invention. FIG. 3A is a plan view, and FIG.

As shown in FIGS. 2A and 2B, a center core film 4 is mounted on a continuous sheet 8 of a long underlay film having a length corresponding to a plurality of cards, and an IC is mounted. Chip 3 was mounted. Then, the antenna coil 2 was wound around the center core film 4, and the lead terminals 9 were bonded to the IC chip 3. Thus, the core body 5 including the IC chip 3 and the antenna coil 2 was formed on the sheet 8.

Next, FIG. 3A, FIG.
As shown in (b), a resin 10 was filled, and a long overlay film 7 having a length corresponding to a plurality of cards was laminated and pressed. A laminated sheet filled with resin between the overlay film 7 and the underlay film 6 and having the molded core body 5 interposed therebetween was punched into a predetermined size by a mold 11 to obtain a non-contact IC card.

The present invention is not limited to the above embodiment. In this embodiment, a long sheet having a length corresponding to a plurality of cards is used for both the underlay film and the overlay film, but either one may be used.

Further, a long sheet having a length corresponding to a plurality of cards is used, and is finally punched into a predetermined size by a mold. First, a film is punched into a predetermined card size. You may.

[0021]

According to the present invention, the positioning accuracy of an IC chip or the like is high and automation is possible.
In addition, a non-contact IC card which is easy to handle and has high reliability and a method for manufacturing the same can be provided.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a non-contact IC card according to an embodiment of the present invention. FIG. 1A is a plan view. FIG. 1B is a sectional view.

FIG. 2 is an explanatory view showing the first half of steps in the method for manufacturing a non-contact IC card according to the present invention. FIG. 2A is a plan view. FIG.
(B) is sectional drawing.

FIG. 3 is an explanatory view showing the latter half of the steps of the method for manufacturing a non-contact IC card according to the present invention. FIG. 3A is a plan view. FIG.
(B) is sectional drawing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Non-contact IC card 2 Antenna coil 3 IC chip 4 Center core film 5 Core body 6 Underlay film 7 Overlay film 8 Sheet 9 Lead terminal 10 Resin 11 Mold

Claims (3)

[Claims] 1. A non-contact IC card comprising an IC chip and an antenna coil, wherein the IC chip and the antenna coil are integrally formed on a center core film, and the IC chip, the antenna coil, and the center core film are formed by A non-contact IC card sandwiched between an underlay film and an overlay film. 2. A method for manufacturing a non-contact IC card comprising an IC chip and an antenna coil, wherein a center core film is mounted on an underlay film together with the IC chip, and an antenna coil is mounted on an outer periphery of the center core film. A method for manufacturing a non-contact IC card, comprising: forming, bonding the lead wires at both ends of the antenna coil to the IC chip, and laminating an overlay film. 3. At least one of the underlay film and the overlay film has a length corresponding to a plurality of IC cards, and a center core film formed integrally with the IC chip and the antenna coil is provided on the underlay film. 3. The method for manufacturing a non-contact IC card according to claim 1 or 2, wherein after narrowly laminating the film and the overlay film, a predetermined size is punched.