JP2002269521A - Manufacturing method of noncontact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve production efficiency in a manufacturing method of noncontact IC card by minimizing the deformation in the handling of a coil and to improve the radio characteristic by increasing the coil area to enable a close windings. SOLUTION: Windings of coil antenna 2 are wound on the side surface of a winding core 1, formed of a sheet-like resin to form a coil unit. The coil unit is arranged on a card base 5, so that the central axis of its winding coil 3 is vertical to the card flat surface, lidded with a card upper resin sheet 7, and is then integrated together through thermal pressing or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-contact IC card including an IC chip module and a coil coil of a coil antenna connected to the IC chip module.

[0002]

2. Description of the Related Art An IC card that performs communication using electromagnetic waves is called a non-contact IC card, and the input and output of information such as data and commands, the power and the like between the non-contact IC card and a reader / writer device. The supply of a clock signal or the like is performed in a non-contact state using electromagnetic waves or the like.

In general, a non-contact IC card is connected to a coil antenna for performing data communication with an external device by non-contact communication by electromagnetic induction, and a winding (antenna coil) of the coil antenna, and is connected to an external input. And an IC chip module including an IC (integrated circuit) that generates a signal in response.

Conventionally, the following method is known as a method for manufacturing a non-contact IC card.

(1) A method of forming a coil directly on a card substrate.

According to a method disclosed in Japanese Patent No. 2810547 (a method for manufacturing a chip card and a chip card),
A coil is drawn directly on the card board using a tool that moves while embedding one electric wire on the board of the card. Thereafter, the IC chip module and the electric wires are connected to form a core sheet of the card. A technology in which another sheet is placed on the wire side or both sides of the core sheet of the card and the card is formed by laminating or pressing.

(2) After forming the air-core coil off-line,
How to mount on card board.

The coil is formed by a winding machine such as a coil winder. In a winding machine, a coil is manufactured by rotating a winding tool (core) and winding an electric wire or the like around the outer periphery thereof. The completed coil is removed from the winding tool and stocked in a stocker. After that, the coil and the IC chip module are connected to form a transponder unit. The transponder unit may be embedded in the resin by resin injection molding. Next, a transponder unit is arranged and temporarily fixed on the card substrate to form a core sheet. A technology in which another sheet is placed on the wire side or both sides of the core sheet of the card, and the card is formed by laminating or pressing.

(3) A method in which a cored coil is formed off-line and then mounted on a card substrate.

The coil is formed by a winding machine such as a coil winder. In a winding machine, a coil is manufactured by rotating a coil core set in advance on a winding tool and winding an electric wire or the like around the outer periphery thereof. Remove the cored coil and stock it in the stocker. After that, the coil and the chip module are connected to form a transponder unit. Next, the transponder unit is arranged and temporarily fixed on the card substrate so that the center axis of the coil is parallel to the card surface to form a core sheet. A technology in which another sheet is placed on the wire side or both sides of the core sheet of the card, and the card is formed by laminating or pressing.

[0011]

However, the prior art has the following problems.

(1) In the case of the method in which the coil is formed directly on the card substrate, (i) it is difficult to match the feed of the electric wire with the drawing speed, and if the drawing speed is faster than the feed, the wire is cut. (ii) Since the electric wires are arranged two-dimensionally on the plane of the substrate sheet, the number of turns is limited by the card area. (iii) Since a predetermined clearance is required between the electric wires at the time of multiple windings and tight winding cannot be performed, there is a large variation in radio wave characteristics. (iv) The production speed is slow because the coil is formed while burying the electric wire in the card board.

(2) After forming the air-core coil off-line,
In the case of the method of mounting on a card substrate, (i) deformation defects often occur during winding handling. (ii) Since the windings are crushed together during lamination and pressing, there are many cutting defects. (iii) Extra cost is required when the transponder unit is injected and embedded.

(3) In the method of mounting the cored coil off-line and then mounting it on a card substrate, the coil is arranged so that the central axis is parallel to the card plane.
The outer diameter of the coil is limited by the thickness of the card, the coil area is small, and the radio wave characteristics are poor.

Therefore, an object of the present invention is to solve the above-mentioned problems, and to provide a method for manufacturing a non-contact IC card, wherein (i) deformation at the time of coil handling is reduced and production efficiency is improved, and (ii) ) To increase the coil area and enable dense winding to improve radio wave characteristics,
ii) to reduce disconnection defects during lamination and pressing;
(iv) To improve production speed by using a coil unit manufactured off-line.

[0016]

Means for Solving the Problems In order to achieve the above object, the present invention is configured as follows.

According to a first aspect of the present invention, there is provided a method for manufacturing a non-contact IC card having a built-in IC chip module and a coil coil of a coil antenna connected to the IC chip module. A coil unit is formed by winding a coil antenna on the side surface of the wire core, and the coil axis of the coil unit is arranged on the card substrate so that the center axis of the coil is perpendicular to the card plane. And then integrated by a hot press or the like.

Here, the concept of integration by a hot press or the like includes a method of heating and pressing from above and below by a hot press or a roll laminator, or a cold press or a roll using a solvent-based adhesive. It includes a method of bonding.

(2) According to a second aspect of the present invention, in a method of manufacturing a non-contact IC card including an IC chip module and a winding coil of a coil antenna connected to the IC chip module, a winding made of a sheet-like resin is provided. A coil unit is formed by winding the coil antenna on the side surface of the wire core, and the coil unit is inserted into a storage hole formed on the card substrate by a card outer frame disposed on the card substrate, and the central axis of the coil unit is adjusted. The card is housed so as to be perpendicular to the plane of the card, covered with a card upper resin sheet, and then integrated by a hot press or the like.

This specifies a mode in which a storage hole is provided by a card outer frame. Here, it is advantageous to form the winding core in a shape similar to the card board, because a coil having a large area can be obtained. However, it is not always necessary to make the shape similar to the card core. It may be formed as an oval or the like.

(3) The invention according to claim 3 is the invention according to claim 2
The method according to any one of the preceding claims, wherein the card substrate and the card outer frame are both integrally formed in advance by resin injection molding.

This specifies a form in which the entire lower part of the IC card (card substrate and card outer frame) is injection-molded.

(4) The invention according to claim 4 is the invention according to claim 1.
3. The method according to claim 2, wherein the winding core is formed by punching a sheet-like resin.

(5) The invention according to claim 5 is the invention according to claim 1.
3. The method according to claim 2, wherein the winding core is formed by injection molding of a resin.

(6) The invention described in claim 6 is the first invention.
6. The manufacturing method according to any one of claims 1 to 5, wherein a module housing portion is formed in the winding core, and a coil unit is formed by applying a coil antenna winding to a side surface of the winding core. A method for manufacturing a non-contact IC card, wherein an IC chip module is housed in a module housing part of the unit, and the two are connected to form a transponder unit, which is arranged on a card substrate.

(7) The invention according to claim 7 is the invention according to claim 1.
7. The manufacturing method according to any one of items 1 to 6, wherein the winding of the coil antenna applied to the side surface of the winding core is performed by aligning and tightly winding an electric wire on the side surface of the winding core. This is a method for manufacturing a contact IC card.

<The gist of the invention> The gist of the present invention is to use a coil unit in which a coil is wound on a side surface of a sheet-shaped winding core. By having the sheet-shaped winding core, the strength of the coil unit itself is increased, the coil deformation during handling can be reduced, and efficient production becomes possible.
In addition, since the electric wire is wound around the outer periphery of the sheet-shaped winding core, a tightly wound and wide area coil can be obtained.
By using such a card, it is possible to manufacture a good IC card with small variations in radio wave characteristics.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.

FIG. 1 shows an embodiment of the present invention.

First, a winding core 1 formed by punching a sheet-like resin is prepared. The winding core 1 is mounted on the card substrate 5 later, and is made of a similar sheet material having a smaller area than the card substrate 5. Therefore, when the winding core 1 is provided on the card substrate 5, a step portion which is a region not covered by the winding core 1 is formed in a peripheral region on the card substrate 5. . The winding core 1 is provided with a hole for accommodating the IC chip module 4 (module accommodation hole) in advance.

The winding core 1 having such dimensions and shapes is set on a coil winder, and the electric wires 2 are aligned and wound tightly around the core side surface of the winding core 1 to form the winding coil 3 of the coil antenna. FIG. 1A is an enlarged cross-sectional view of a part a of FIG. As a result, a coil unit in which the coil antenna is wound on the side surface of the sheet-shaped winding core 1 is obtained (FIG. 1A).

Although the sheet of the winding core 1 is made of PVC (polyvinyl chloride) resin, PET-G resin, PET
(Polyethylene terephthalate) resin, ABS resin (acrylonitrile-butadiene-styrene), PP resin,
PS resin or the like may be used. Card board 5 described later
Also, a sheet of the same material is used for the card outer frame 6 and the card upper resin sheet 7.

Next, the IC chip module 4 is set in the module storage hole of the winding core 1 and connected to the terminal of the winding coil 3 of the coil antenna to form the transponder unit 8.

On the other hand, a card outer frame 6 formed by punching a sheet-like resin is prepared separately from the transponder unit 8. The card outer frame 6 is formed of a frame-shaped resin sheet formed in a frame shape and disposed at a stepped portion which is a peripheral region on the card substrate 5 and is not covered with the winding core 1. That is, this frame-shaped card outer frame 6
Has a recess whose outer peripheral surface coincides with the outer peripheral surface of the IC card, that is, the outer peripheral surface of the card substrate 5, and whose inner peripheral surface accommodates the coil unit or the transponder unit 8 (storage hole 9 of the coil unit or the transponder unit). Has a shape that forms Accordingly, the inner diameter of the frame-shaped card outer frame 6 is slightly larger than the outer diameter of the coil 3 of the coil antenna existing on the outer periphery of the coil unit or the transponder unit 8.

The thus constructed card outer frame 6 is stamped and bonded to the card substrate 5 in advance. Next, this card outer frame 6
Then, the transponder unit 8 is stored in the storage hole 9 of the coil unit or the transponder unit formed on the card substrate 5 (FIG. 1 (1)). Therefore, the coil unit in which the antenna coil is wound on the side surface of the sheet-shaped winding core 1 is arranged on the card substrate 5 so that the central axis of the coil is perpendicular to the card plane.

Next, after being covered with the card upper resin sheet 7 (FIG. 1 (2)), each of the resin sheets 1, 5, and 6 is heat-sealed or the adhesive layer is formed by heating and pressing with a hot press. (FIG. 1 (3)).

A non-contact IC card was manufactured by the manufacturing process of the above procedure.

According to this manufacturing method, since the coil unit in which the coil is wound on the side surface of the sheet-shaped winding core 1 is handled, the deformation at the time of coil handling, which is a problem in the prior art, is reduced. In addition to improving the production efficiency, the coil unit is mounted on the card board 5 so that the center axis of the coil 3 is perpendicular to the card plane.
Since it is arranged on the upper side, it is possible to increase the coil area to enable dense winding, and to produce an IC card having a small variation in radio wave characteristics.

In the above-described embodiment, the winding core 1 is formed in a similar shape to the card substrate 5, but it is not always necessary to do so, and a non-similar rectangular, circular, elliptical, etc. It may be formed as. Although the winding core 1 is formed by punching a sheet-like resin, the winding core 1 can be formed by injection molding.

In the above embodiment, the card substrate 5 and the card outer frame 6 are prepared as separate members.
Alternatively, the substrate constituted by the card outer frame 6 may be collectively formed by injection molding of a resin. Further, the card outer frame 6 does not necessarily have to exist, and may be omitted depending on circumstances.

Furthermore, in the above embodiment, each resin sheet is heat-sealed or bonded by heating and pressing with a hot press. However, the present invention is not limited to this. A method using a roll laminator may be used. Alternatively, they may be bonded by a cold press or a roll using a solvent-based adhesive.

[0042]

As described above, according to the present invention, the following excellent effects can be obtained.

According to the manufacturing method of the present invention, the coil unit in which the coil is wound on the side surface of the sheet-shaped winding core is handled, and the strength of the coil unit itself is increased by having the sheet-shaped winding core. In addition, since coil deformation during handling can be reduced, efficient production becomes possible. In particular, disconnection failure during lamination or pressing can be reduced, and the production speed can be improved by using a coil unit manufactured off-line.

Further, in the manufacturing method of the present invention, since the electric wire is wound around the outer periphery of the side surface of the sheet-shaped winding core, a tightly wound and wide area coil is obtained, and the coil is used for the coil antenna of the IC card. It is possible to manufacture an IC card having small radio wave characteristics and good radio wave characteristics.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for manufacturing a non-contact IC card according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Winding core 2 Electric wire 3 Coil 4 IC chip module 5 Card board 6 Card outer frame 7 Card upper resin sheet 8 Transponder unit 9 Storage hole

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Naoki Sunaga 5-1-1, Hidaka-cho, Hitachi City, Ibaraki Prefecture Hitachi Cable, Ltd. F-term (Reference) 2C005 MA10 MA19 RA01 5B035 AA04 BB09 CA01

Claims (7)

[Claims] 1. A method of manufacturing a non-contact IC card having a built-in IC chip module and a coil coil of a coil antenna connected to the IC chip module, the method comprising: To form a coil unit, placed on the card board so that the center axis of the winding coil of this coil unit is perpendicular to the card plane, covered with a card upper resin sheet, and then heat pressed A method for manufacturing a non-contact IC card, which is integrated. 2. A method for manufacturing a non-contact IC card having a built-in IC chip module and a coil coil of a coil antenna connected to the IC chip module, the method comprising: To form a coil unit, and store the coil unit in a storage hole formed on the card substrate by a card outer frame disposed on the card substrate such that the center axis thereof is perpendicular to the card plane. A method for manufacturing a non-contact IC card, comprising: closing the cover with a resin sheet on the upper side of the card; 3. A method for manufacturing a non-contact IC card according to claim 2, wherein both the card substrate and the card outer frame are formed integrally by injection molding of a resin in advance. . 4. The method according to claim 1, wherein
A method for manufacturing a non-contact IC card, wherein the winding core is formed by punching a sheet-like resin. 5. The method according to claim 1, wherein
A method for manufacturing a non-contact IC card, wherein the winding core is formed by injection molding of a resin. 6. The manufacturing method according to claim 1, wherein a module housing portion is formed in the winding core, and a coil antenna is wound on a side surface of the winding core. A unit is formed, an IC chip module is housed in a module housing of the coil unit, and the two are connected to form a transponder unit.
A method for manufacturing a non-contact IC card, comprising disposing the IC card on a card substrate. 7. The manufacturing method according to claim 1, wherein the winding of the coil antenna applied to the side surface of the winding core is closely wound with the electric wire aligned with the side surface of the winding core. A method for manufacturing a non-contact IC card.