JPH1028004A - Electronic parts for high frequency - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the input-output terminals of electronic parts to be able to be led out longitudinally or laterally in as desired by a user. SOLUTION: The electrode films of an input-output terminal 24 connected to a transmitting section side and an input-output terminal 25 connected to a receiving section side are extended toward an input-output terminal 23 connected to an antenna side and formed to the end section of a base substrate 22. Therefore, the upper end sections of the terminals 24 and 25 in the Fig. are aligned in the same direction (longitudinal direction) as that of the terminal 23 and the terminals 23-25 can be led out in the longitudinal direction. The lower end sections of the terminals 24 and 25 in the figure become lateral and can be led out in the lateral direction, because the terminals 24 and 25 are formed to both end sections of the substrate 22. Therefore, the same input-output terminals 24 and 25 can be led out in both the longitudinal and lateral directions as desired by a user by using only one kind of base substrate 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention
The present invention relates to a high-frequency electronic component such as a dielectric filter used for a mobile communication device such as a mobile phone.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view of a conventional dielectric filter, which is used for mobile communication equipment such as an automobile telephone and a portable telephone, and is used as an antenna duplexer. This dielectric filter is composed of a base substrate 51 made of a dielectric on which an electronic component element such as a dielectric coaxial resonator is mounted on the upper surface, and a metal cover 52 covered on the upper surface of the base substrate 51. ing.

At the center end of the base substrate 51, an input / output terminal 53 in the form of an electrode film connected to the antenna side is formed. As shown in FIG. On one end, an input / output terminal 54 in the form of an electrode film connected to the transmitter is formed. On the other end of the base substrate 51, an input / output terminal 55 in the form of an electrode film connected to the receiver is formed. That is, each input / output terminal 5
3 to 55 are formed on the upper and lower surfaces of the base substrate 51,
The input / output terminals 53 to 55 on the upper and lower surfaces are electrically connected via the electrode films formed on the end surfaces of the base substrate 51.

The input / output terminals 53 to
A ground electrode 56 is provided over substantially the entire upper and lower surfaces except 55.
Is formed. The ground electrodes 56 on the upper and lower surfaces are also electrically connected to each other via the through holes and the electrode films formed on the end surfaces of the main portions of the base substrate 51.

Such a dielectric filter is of a type that is surface-mounted on a wiring board on the user side, and includes a pattern of the wiring board and input / output terminals 53 on the lower surface side of the base substrate 51.
55, the wiring board ground pattern and the base board 5
1 and a ground electrode 56 on the lower surface side are soldered, and the dielectric filter is mounted on the wiring board.

[0006]

In the conventional example shown in FIGS. 6 and 7, the base substrate 5 of the dielectric filter is used.
The directions of the input / output terminals 53 to 55 formed in 1 are horizontal and vertical. That is, as shown in FIG.
The input / output terminals 53 formed on the lower surface of the base substrate 51 are in the vertical direction (upward in the drawing), the input / output terminals 54 are in the horizontal direction (leftward in the drawing), and
5 is formed in the horizontal direction (right direction in the drawing).

Since the directions of the input / output terminals 53 to 55 are two directions, that is, a horizontal direction and a vertical direction, it is desired that all the three input / output terminals 53 to 55 be output in the same direction (vertical or horizontal). One type of base substrate 51 cannot meet user's request. In order to meet the demand, it is necessary to newly form the patterns of the input / output terminals 53 to 55 of the base substrate 51 in the horizontal direction and the vertical direction, and there is a problem that it is wasteful in terms of time and cost. Was.

FIGS. 8 and 9 show another conventional example of a dielectric filter. This dielectric filter is formed in a substantially Z shape from an input / output electrode in the form of an electrode film formed on a base substrate (not shown). The metal input / output terminals 57 to 58 are of a type protruding outside. 8 and 9, 6
Reference numeral 1 denotes a pattern formed on the wiring board 60 on the user side, and the input / output terminals 57 to 59 of the dielectric filter are connected to this pattern 61 by soldering. A wiring board 60 is provided below the side plate of the cover 52.
A ground pattern (not shown) and a ground terminal 62 to be soldered are integrally formed.

Here, the input / output terminals 57 to 59 of the dielectric filter shown in FIG. 8 are provided in the same direction, and have a so-called vertical type configuration. Further, the dielectric filter shown in FIG. 9 has a so-called lateral projection type configuration in which the input / output terminals 58 and 59 on both sides are laterally extended. As described above, when the input / output terminals are provided in the vertical direction or the horizontal direction, it is necessary to prepare two types of input / output terminals in advance. Further, in a high frequency band in which a dielectric filter is used, interference between components may have an adverse effect depending on the arrangement direction of the dielectric filter.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide a high-frequency electronic component capable of responding to the user's request for vertical or horizontal extension of input / output terminals. Is what you do.

[0011]

According to the present invention, a high frequency electronic component element is mounted on an upper surface, and input / output terminals are formed on a base substrate at least at an end of a lower surface, and the base substrate is mounted on a wiring substrate. In a high-frequency electronic component which is soldered and mounted via a writing output terminal, an input / output terminal formed on the base substrate is formed so as to extend to lateral and vertical ends of the base substrate. .

[0012]

According to the present invention, it is possible to cope with any user's request for vertically extending or horizontally extending input / output terminals. In other words, only one type of design is required, and there is no need to prepare high-frequency electronic components using two types of base substrates as in the related art, and component management becomes easy. In addition, the degree of freedom in pattern wiring on the user side is increased, and the commercial value can be increased. Furthermore, the arrangement of the high-frequency electronic components can be prevented from interfering between the components, and the reliability can be further improved.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. First, the overall configuration of a dielectric filter to which the present invention is applied will be described. FIG. 2 is an exploded perspective view of the dielectric filter, and FIG. 3 is a perspective view of a state where various components are mounted. The dielectric filter shown in FIG. 2 and FIG.
For example, it is used for mobile communication devices such as a mobile phone and a mobile phone, and is used in a microwave band and is called a so-called antenna duplexer.

The dielectric filter has a transmission side composed of a band elimination filter and a reception side composed of a band-pass filter. First, FIG. 2 and FIG. 3 show the overall structure of this dielectric filter of the surface mount type.
This will be described below. Band elimination filter is 3
The resonator has a three-stage resonator configuration, and has three quarter-wavelength dielectric coaxial resonators 1 to 3. The band-pass filter has a four-stage resonator configuration and four quarter-wavelength resonators. It has dielectric coaxial resonators 4 to 7.

The dielectric coaxial resonators 1 to 7 are composed of an electrode film-shaped inner conductor formed on the inner peripheral surface of a dielectric hole 8 formed in a rectangular parallelepiped shape, and an electrode formed on a side surface of the dielectric. It is composed of a film-like outer conductor and a short-circuit conductor (not shown) formed on one of the end faces where holes 8 are opened to short-circuit the inner conductor and the outer conductor, and resonates at a predetermined frequency. It has become. Metal connection terminals 9 each having one end formed in a substantially cylindrical shape are press-fitted into the holes 8 of the dielectric coaxial resonators 1 to 7 from the open ends of the dielectric coaxial resonators 1 to 7, respectively.
It is in contact with the inner conductor inside to obtain conduction. The connection terminal 9
Is formed in a tongue shape, and is connected to electrode films 14 to 17 formed on the upper surfaces of the capacitor substrates 10 to 12 and the coupling substrate 13 to be described later by soldering or the like, respectively. I have.

The capacitor substrates 10 to 12 are made of a dielectric material, and electrode films are respectively formed on upper and lower surfaces thereof to form capacitors. A plurality of electrode films 14 to 17 are provided in parallel on the upper surface of the coupling substrate 13 made of a dielectric, and the electrode films 14 to 16 have opposing portions formed in a comb shape in order to increase the coupling capacitance. ing. Further, electrode films are formed on both sides of the lower surface of the coupling substrate 13. Further, coil-shaped inductors L _{1 to} L ₃ are connected between the capacitor substrates 10 to 12. The inductor L ₁ ~L
Electrode films 19 and 20 are formed on the upper surface of a coupling substrate 18 made of a dielectric on which ₃ is mounted. The lower surface of the coupling substrate 18 is provided with an electrode film serving as a ground electrode over the entire surface.

A base substrate 2 on which the above members are mounted on the upper surface
2, an electrode film-shaped input / output terminal 23 connected to the antenna side and an electrode film-shaped input / output terminal 2 connected to the transmission unit side.
4 and an input / output terminal 25 in the form of an electrode film to which the receiver is connected.
Are formed respectively. On the upper and lower surfaces of the base substrate 22, an earth electrode 26 in the form of an electrode film is formed over substantially the entire surface. The base substrate 22 is formed of a dielectric or an insulator. The coupling substrate 13 mounted on the upper surface of the base substrate 22 includes two spacers 2
1, and another spacer 21 is mounted on the upper surface of the input / output terminal 24 of the base substrate 22. These three spacers 21 use conductive members such as metal.

FIG. 1A shows a front view of the base substrate 22, and FIG. 1B shows a lower surface of the base substrate 22. As shown, ground electrodes 26 are formed over the entire surface of the base substrate 22 except for the input / output terminals 23 to 25 on the upper and lower surfaces.
Is a plurality of through holes 33 formed in a straight line in the horizontal direction.
Is obtained. The ground electrodes 26 on the upper and lower surfaces are electrically connected to each other through electrode films formed on the end surfaces of the plurality of semicircular cutouts 34 formed around the base substrate 22. Further, the upper and lower surfaces of the base substrate 22 are also electrically connected to the input / output terminals 23 to 25 via the electrode films formed on the end surfaces.

The cover 27 for covering the base substrate 22 is made of metal. The top plate of the cover 27 is used for soldering the outer conductors on the upper surfaces of the dielectric coaxial resonators 1 to 7 to the cover 27 and the like. And a hole 29 for inserting a jig for adjusting characteristics of the dielectric coaxial resonators 1 to 7 are formed. In addition, a plurality of ground terminals 30 connected to the upper surface ground electrode 26 of the base substrate 22 are formed from the lower edge front and back portions (not shown) of the cover 27. Cutouts 31 for exposing the input / output terminals 23 to 25 of the base substrate 22 are formed in the side plates of the cover 27, respectively. Also, as shown in FIG.
2 is attached to cover the holes 28 and 29.

In the above case, the case where the cover 27 is used has been described. However, the dielectric filter may be constructed without using the cover 27. The label 32 is made of a resin called Kapton (trade name). The label 32 does not have a role of a shield when formed of a resin, but is made of a metal material when it has a function of a shield.

Next, the arrangement of each member will be described. As shown in FIGS. 2 and 3, one spacer 21 is provided on the base substrate 2 on the band elimination filter side.
2 are mounted on the input / output terminals 24 of the
8 is mounted on the ground electrode 26 between the input / output terminals 24 and 23 of the base substrate 22 and soldered. Furthermore,
Spacers 21 are mounted on the upper surfaces of the input / output terminals 23 and 25, respectively, and the coupling substrate 13 is cross-linked and soldered so that the electrode films on the lower surfaces are in contact with the upper surfaces of the two spacers 21.

As shown in FIG. 3, one end of the inductor L ₁ is mounted on the upper surface of the spacer 21, the capacitor substrate 10 is mounted thereon, the dielectric coaxial resonator 1 to the electrode film on the upper surface of the capacitor substrate 10 Is connected. The other end of the inductor L ₁ is mounted on the electrode film 19 of the bonded substrate 18, the inductor L ₂ is bonded substrate 1
8 is mounted between the electrode films 19 and 20. The capacitor substrate 11 on the connecting portion of the inductor L ₁ and L ₂
Is mounted, and the connection terminal 9 from the dielectric coaxial resonator 2 is connected to the electrode film on the upper surface of the capacitor substrate 11. One end of the inductor L ₃ is mounted on the electrode film 20 of the coupling substrate 18, and the other end is mounted on the input / output terminal 23. Also,
Capacitor substrate on the connection of the inductor L ₂ and L ₃ 1
2 is mounted, and the connection terminal 9 from the dielectric coaxial resonator 3 is connected to the electrode film on the upper surface of the capacitor substrate 12.

The connection terminals 9 from the dielectric coaxial resonators 4 to 7 are respectively connected to the respective electrode films 14 to 17 on the upper surface of the coupling substrate 13 mounted on the two spacers 21. I have.

FIG. 4 is an equivalent circuit diagram of the dielectric filter configured as described above. The capacitors C _{1 to} C ₃ on the band elimination filter side are upper and lower electrode films of the capacitor substrates 10 to 12. is formed, the capacitor C ₄ is intended to be formed between the input-output terminal 24 and the lower surface of the earth electrode. The capacitors C ₅ and C ₆ are formed by the electrode films 19 and 20 on the upper surface of the coupling substrate 18 and the electrode films on the lower surface. The capacitor C ₇ is connected to the input / output terminal 23.
And the ground electrode on the lower surface.

The capacitor C ₈ on the bandpass filter side is formed between the electrode film 14 of the coupling substrate 13 and the electrode film on the lower surface, and the capacitors C _{9 to} C ₁₀ are connected to the coupling substrate 1.
3 are formed between the electrode films 14 to 16. The capacitor C ₁₁ is formed by the electrode film 16 on the upper surface of the coupling substrate 13 and an electrode film (not shown) on the lower surface. The electrode film on the lower surface is electrically connected to the spacer 21 shown in FIG. Further, the capacitor C ₁₂ is formed by the electrode film 17 on the upper surface of the coupling substrate 13 and the electrode film on the lower surface. Incidentally, constitute a trap circuit of the series resonant circuit with the dielectric coaxial resonator 7 and the capacitor C _{1 2.}

Next, the gist of the present invention will be described in detail. The gist of the present invention is that the input / output terminals 2 formed on the base substrate 22 are provided.
3 to 25. In particular, the base substrate 22 is connected to the pattern of the wiring board on the user side by soldering.
Are the shapes of the input / output terminals 23 to 25 on the lower surface of FIG. That is, as shown in FIG. 1, the electrode films of the input / output terminal 24 connected to the transmitting unit and the input / output terminal 25 connected to the receiving unit are connected in the direction of the input / output terminal 23 connected to the antenna. And an electrode film is formed up to the end of the base substrate 22.

Therefore, the upper ends of the input / output terminals 24 and 25 in the drawing are in the same direction (vertical direction) as the input / output terminals 23.
, And the input / output terminals 23 to 25 can each be of a vertical type. In addition, the lower ends of the input / output terminals 24 and 25 in the drawing are horizontal since the lower ends of the input / output terminals 24 and 25 are formed up to both ends of the base substrate 22.
5 can be of a horizontal type. Accordingly, one type of base substrate 22 can support both vertical and horizontal projection from the same input / output terminals 24 and 25 according to a user's request.

FIG. 5 shows the lower surface of the base substrate 22 when the structure of the dielectric filter is a band-pass filter. In the case of the present embodiment, because of the configuration of the band-pass filter, two input / output terminals 24 and 25 of the input side terminal and the output side terminal are formed on both sides of the base substrate 22. Also in the case of this embodiment, both input / output terminals 2
Since they are formed up to the upper portions of the base substrates 22 and 4, 25, they can be adapted to the vertical and horizontal directions.

In the above embodiment, examples of the filter configuration include an antenna duplexer in which a band-pass filter and a band elimination filter are combined, and an example of a band-pass filter. The present invention can also be applied to a configuration, a single configuration of each of other high-pass filters and low-pass filters, or a combination of each filter. Further, the number of stages of the resonator is not limited.

Further, in the above-described embodiment, the case where the dielectric coaxial resonator is applied to the dielectric filter using the base substrate having the electrode has been described. The present invention can be applied to various electronic circuits such as a VCO or FM front-end circuit using a substrate.

[0031]

According to the present invention, a high frequency electronic component element is mounted on the upper surface, and an input / output terminal is formed on the base substrate at least at an end of the lower surface. In a high-frequency electronic component that is soldered and mounted via terminals, since the input / output terminals formed on the base substrate are formed to extend to the lateral and vertical ends of the base substrate, Vertical I / O terminal,
Either way, it is possible to respond to the request of a lateral user. In other words, only one type of design is required, and there is no need to prepare high-frequency electronic components using two types of base substrates as in the related art, and component management becomes easy. In addition, the degree of freedom in pattern wiring on the user side is increased, and this has the effect of increasing the commercial value. Further, the arrangement of the high-frequency electronic components can be prevented from interfering with each other, and the reliability can be further improved.

[Brief description of the drawings]

FIG. 1A is a front view of a base substrate according to an embodiment of the present invention. (B) is a rear view of the base substrate of the example of the present invention.

FIG. 2 is an exploded perspective view of the entire dielectric filter using the base substrate according to the embodiment of the present invention.

FIG. 3 is a perspective view showing the mounting of the dielectric filter according to the embodiment of the present invention.

FIG. 4 is an equivalent circuit diagram of the dielectric filter according to the embodiment of the present invention.

FIG. 5 is a rear view of the base substrate in the case of the bandpass filter according to the embodiment of the present invention.

FIG. 6 is a perspective view of a conventional dielectric filter.

FIG. 7 is a rear view of a base substrate of the conventional dielectric filter shown in FIG. 6;

FIG. 8 is a perspective view of another conventional vertical type dielectric filter.

FIG. 9 is a perspective view of another conventional horizontal type dielectric filter.

[Explanation of symbols]

 22 base board 23 input / output terminal 24 input / output terminal 25 input / output terminal

Claims (1)

[Claims] A high frequency electronic component element is mounted on an upper surface, and an input / output terminal is formed on a base substrate at least at an end of a lower surface, and the base substrate is soldered to a wiring substrate via the input / output terminal. In a high frequency electronic component to be mounted, an input / output terminal formed on the base substrate is formed so as to extend to lateral and vertical ends of the base substrate.