JPH07162208A - Dielectric resonator device - Google Patents

Abstract

PURPOSE:To improve the flatness of a base substrate by preventing the base substrate from warping or curving even when plural through holes are bored. CONSTITUTION:Plural through holes 33 of the base substrate 22 through which earth currents from dielectric coaxial resonators 1-7 are made to flow are formed not linearly, but nonlinearly and alternately at front and rear positions. Therefore, even when many through holes 33 matching the number of dielectric coaxial resonators are bored in the base substrate 22, the base substrate 22 neither warping nor curving about a through hole 33. Consequently, the flatness of the base substrate 22 can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, a car telephone,
The present invention relates to a dielectric resonator device used as a dielectric filter used in mobile communication devices such as mobile phones.

[0002]

2. Description of the Related Art FIG. 7 is an exploded perspective view of a conventional dielectric filter of this type, which is a so-called antenna duplexer composed of a band elimination filter and a bandpass filter. Is. In FIG. 7, input / output terminals 23 to 25 connected to the antenna side, the transmission section side, and the reception section side are formed on the upper and lower surfaces of the base substrate 22 made of a dielectric material such as resin in the form of electrode films.

A ground electrode 26 in the form of an electrode film is formed on substantially the entire upper and lower surfaces except the input / output terminals 23 to 25. The input / output terminals 23 to 25 and the ground electrode 26 on the upper and lower surfaces are electrically connected to each other through the electrode film on the inner surface of the semicircular cutout formed at the end of the base substrate 22.

In this example, seven dielectric coaxial resonators 1 to 7 are mounted on the upper surface of the ground electrode 26 of the base substrate 22 by soldering or the like. Further, the connection terminal 9 is press-fitted into the holes of the dielectric coaxial resonators 1 to 7.
Although detailed description will be given in the embodiments, the coupling substrates 13 and 18, the spacer 21 and the like, the capacitor substrate, the inductor and the like are also mounted in addition to the dielectric coaxial resonators 1 to 7. There is. The metal cover 27 and the base substrate 22 form a casing (outer shell) of the dielectric filter.

A plurality of through holes 33 are linearly formed in the base substrate 22, and the through holes 33 are formed.
Conduction is achieved with the ground electrode 26 formed on the upper and lower surfaces of the base substrate 22 via.

By the way, in a dielectric filter of the type in which the dielectric coaxial resonators 1 to 7 are mounted on the base substrate 22, the ground current flowing from the dielectric coaxial resonators 1 to 7 is
As shown by the arrow in FIG. 8, some flow from the cover 27 and some flow through the through hole 33 of the base substrate 22. Reference numeral 41 shown in FIG. 8 is a wiring board for mounting the dielectric filter on the user side. Also,
Reference numeral 42 denotes solder in which the dielectric coaxial resonators 1 to 7 and the cover 27 are soldered.

[0007]

When the earth currents flowing from the dielectric coaxial resonators 1 to 7 are passed through the through holes 33 of the base substrate 22 to the ground electrode 26 on the lower surface of the base substrate 22 and the wiring substrate 41. In addition, conventionally, as shown in FIG. 7, a large number of through holes 33 are formed in a straight line. However, when the number of stages of the dielectric coaxial resonators 1 to 7 increases, the number of through holes 33 for the resonator ground current also increases.

Then, as shown in FIG. 9, there arises a problem that the base substrate 22 is bent or warped around the through-holes 33 arranged in a straight line. When the base substrate 22 is warped, the flatness of the base substrate 22 is deteriorated, and a problem may occur when the user performs reflow soldering.

The present invention has been provided in view of the above points, and prevents the base substrate from being bent or warped even when a plurality of through holes are formed, and improves the flatness of the base substrate. The present invention provides a dielectric resonator device for the purpose.

[0010]

The present invention comprises dielectric coaxial resonators 1 to 7 and a base substrate 22 on which the dielectric coaxial resonators 1 to 7 are mounted on one surface of an earth electrode 26. In the dielectric resonator device, the ground currents from the dielectric coaxial resonators 1 to 7 are caused to flow through a plurality of through holes 33 formed between the ground electrodes 26 formed on both surfaces of the base substrate 22. It is characterized in that a plurality of through holes 33 are formed in the base substrate 22 in a non-linear manner.

[0011]

According to the present invention, the through hole 33 for flowing the ground current from the dielectric coaxial resonators 1 to 7 is formed in the base substrate 22.
Since a plurality of holes are formed in a non-linear manner, unlike the conventional case in which a plurality of through holes 33 are formed in a straight line, it is possible to prevent the base substrate 22 from being bent or warped.
Therefore, the flatness of the base substrate 22 can be improved, and the reflow soldering by the user becomes easy.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. First, the overall configuration of the dielectric filter to which the dielectric resonator device of the present invention is applied will be described. FIG. 1 shows an exploded perspective view of a dielectric filter, and FIG. 2 shows a perspective view of a state in which various parts are mounted. The dielectric filters shown in FIGS. 1 and 2 are used in mobile communication devices such as car phones and mobile phones, and are so-called antenna duplexers used in the microwave band.

The dielectric filter has a band elimination filter on the transmitting side and a band pass filter on the receiving side. First, the overall structure of this surface mount type dielectric filter is shown in FIGS.
Will be described. Band elimination filter is 3
It has a multi-stage resonator configuration and has three quarter-wave dielectric coaxial resonators 1 to 3, and the bandpass filter has four-stage resonator configuration and four quarter-wave resonators. It has dielectric coaxial resonators 4 to 7.

The dielectric coaxial resonators 1 to 7 are electrode film-shaped inner conductors formed on the inner peripheral surface of the dielectric hole 8 formed in a rectangular parallelepiped shape, and electrodes formed on the side surfaces of the dielectrics. A film-shaped outer conductor and a short-circuit conductor that connects the electrode-film-shaped inner conductor and the outer conductor, which is not shown in the figure, is formed on one of the end faces where the hole 8 is open, It resonates at the frequency. Into the holes 8 of the dielectric coaxial resonators 1 to 7, metal connection terminals 9 whose one end side is formed in a substantially cylindrical shape are press-fitted from the open end sides of the dielectric coaxial resonators 1 to 7, respectively. Conductivity is obtained by contacting the inner conductor inside. The other end of the connection terminal 9 is formed in a tongue shape, and is connected to electrode films 14 to 17 formed on the upper surfaces of the capacitor substrates 10 to 12 and the coupling substrate 13, which will be described later, by soldering or the like. It is like this.

The capacitor substrates 10 to 12 are made of a dielectric material, and electrode films are formed on the upper and lower surfaces thereof to form capacitors. Further, a plurality of electrode films 14 to 17 are arranged in parallel on the upper surface of the coupling substrate 13 made of a dielectric material, and the electrode films 14 to 16 are formed in a comb-tooth shape at the opposing portions in order to increase the coupling capacitance. ing. Furthermore, electrode films are formed on both sides of the lower surface of the combined substrate 13. In addition, coil-shaped inductors L _{1 to} L ₃ are connected between the capacitor substrates 10 to 12. The inductors L _{1 to} L
Electrode films 19 and 20 are formed on the upper surface of a combined substrate 18 made of a dielectric material for mounting ₃ , and an electrode film serving as a ground electrode is formed on the entire lower surface of the combined substrate 18.

Base board 2 on which the above-mentioned members are mounted
Reference numeral 2 denotes an electrode film-shaped input / output terminal 23 connected to the antenna side and an electrode film-shaped input / output terminal 2 connected to the transmitter side.
4 and an input / output terminal 25 in the form of an electrode film to which the receiver side is connected
And are formed respectively. Further, an electrode film-shaped ground electrode 26 is formed on substantially the entire upper surface and lower surface of the base substrate 22. The base substrate 22 is made of a dielectric material such as resin or an insulator. The coupling substrate 13 mounted on the upper surface of the base substrate 22 is mounted via the two spacers 21, and the other spacer 21 is mounted on the upper surface of the input / output terminal 24 of the base substrate 22. It The three spacers 21 are made of a conductive material such as metal.

Further, ground electrodes 26 are formed on the entire surface of the upper and lower surfaces of the base substrate 22 except for the portions of the input / output terminals 23 to 25, and the ground electrodes 26 on the upper and lower surfaces are formed in a laterally non-linear shape. Conduction is obtained by the plurality of through holes 33. Further, the ground electrodes 26 on the upper and lower surfaces are also electrically connected through the electrode film formed on the end surface of the semicircular cutout 34 formed around the base substrate 22. Further, the input / output terminals 23 to 25 are also electrically connected to the upper and lower surfaces of the base substrate 22 via the electrode films formed on the end surfaces.

The cover 27 for covering the base substrate 22 is made of metal, and the top plate of the cover 27 is used for soldering the outer conductors of the upper surfaces of the dielectric coaxial resonators 1 to 7 and the cover 27. And an elongated hole 28 and a hole 29 for inserting a jig for adjusting the characteristics of the dielectric coaxial resonators 1 to 7 are formed. Further, the front and back portions of the lower edge of the cover 27 (not shown)
A plurality of ground terminals 30 connected to the upper surface ground electrode 26 of the base substrate 22 are formed. Notches 31 for exposing the input / output terminals 23 to 25 of the base substrate 22 are formed on the side plates of the cover 27, respectively.
Further, as shown in FIG. 2, a label 32 is attached to the upper surface of the cover 27 to cover the holes 28 and 29.

In the above case, the case where the cover 27 is used has been described, but the dielectric filter may be formed without using the cover 27. The label 32 is formed of a resin called Kapton (trade name) having high heat resistance. When the label 32 is made of resin, it does not serve as a shield, but when it has the function of a shield, it is made of metal.

Next, the arrangement of each member will be described. As shown in FIGS. 1 and 2, one spacer 21 is provided on the side of the band elimination filter as the base substrate 2.
2 is mounted on the input / output terminal 24 and the combined substrate 1
8 is mounted on the ground electrode 26 between the input / output terminals 24 and 23 of the base substrate 22 and soldered. Furthermore,
The spacers 21 are mounted on the upper surfaces of the input / output terminals 23 and 25, and the combined substrate 13 is bridged and soldered on the upper surfaces of the two spacers 21 so that the electrode films on the lower surfaces are in contact with each other.

As shown by 42, one end of the inductor L ₁ is mounted on the upper surface of the spacer 21, the capacitor substrate 10 is mounted thereon, and the dielectric coaxial resonator 1 is mounted on the electrode film on the upper surface of the capacitor substrate 10. The connection terminal 9 of is connected. The other end of the inductor L ₁ is mounted on the electrode film 19 of the combined substrate 18, and the inductor L ₂ is connected to the combined substrate 1
8 is mounted between the electrode films 19 and 20. Then, the capacitor substrate 11 is placed on the connecting portion between the inductors L ₁ and L _2.
Is mounted, and the connection terminal 9 from the dielectric coaxial resonator 2 is connected to the electrode film on the upper surface of the capacitor substrate 11. One end of the inductor L ₃ is mounted on the electrode film 20 of the coupling substrate 18, and the other end is mounted on the input / output terminal 23. Also,
Capacitor board 1 above the connection between inductors L ₂ and L _3.
2 is mounted, and the connection terminal 9 from the dielectric coaxial resonator 3 is connected to the electrode film on the upper surface of the capacitor substrate 12.

The connection terminals 9 from the dielectric coaxial resonators 4 to 7 are connected to the electrode films 14 to 17 on the upper surface of the coupling substrate 13 mounted on the two spacers 21, respectively. There is.

FIG. 3 shows an equivalent circuit diagram of the dielectric filter constructed as described above. Capacitors C _{1 to} C ₃ on the band elimination filter side are upper and lower electrode films of the capacitor substrates 10 to 12. The capacitor C ₄ is formed between the input / output terminal 24 and the ground electrode on the lower surface. The capacitors C ₅ and C ₆ are formed by the electrode films 19 and 20 on the upper surface and the electrode film on the lower surface of the combined substrate 18. Further, the capacitor C ₇ is connected to the input / output terminal 23.
And the ground electrode on the lower surface.

Further, the capacitor C ₈ bandpass filter side is formed between the electrode film 14 and the lower surface of the electrode film of the bonded substrate 13, the capacitor C ₉ -C _{1 0} is a bond substrate 1
3 between the electrode films 14 to 16. The capacitor C _{1 1} is formed on the upper surface of the electrode film 16 and the lower surface of the electrode film of the bonded substrate 13 (not shown). The electrode film on the lower surface is electrically connected to the spacer 21 at the right end in the figure. Furthermore, the electrode film 1 on the upper surface of the capacitor C _{1 2} is bonded substrate 13
7 and the electrode film on the lower surface. Incidentally, constitute a trap circuit of the series resonant circuit with the dielectric coaxial resonator 7 and the capacitor C _{1 2.}

Next, the gist of the present invention will be described in detail. As shown in FIG. 1, according to the present invention, unlike the conventional case, the base substrate 22 for flowing the ground current from the dielectric coaxial resonators 1 to 7 is used.
In this embodiment, the plurality of through holes 33 are formed in a non-linear shape instead of a straight shape, and alternately in the front and rear. Therefore, even when a large number of through holes 33 are formed in the base substrate 22 according to the number of dielectric coaxial resonators, the base substrate 22 does not bend or warp about the through holes 33.

(Embodiment 2) FIG. 4 shows Embodiment 2 in which the dielectric coaxial resonator has six stages. The broken line in the figure indicates the position where the dielectric coaxial resonator is mounted.
In the present embodiment, the case of a filter composed of two input / output terminals 43 and 44 is shown, and the positions of the through holes 33 formed in the base substrate 22 are alternated in the front and rear as in the case of the previous embodiment. Is perforated.

(Embodiment 3) Embodiment 3 is shown in FIG. In this embodiment, the dielectric coaxial resonator has five stages, the left and right through holes 33 are formed in the front side of the base substrate 22, and the inner through hole 33 is formed in the rear side.

(Fourth Embodiment) FIG. 6 shows a fourth embodiment. Also in the case of this embodiment, the dielectric coaxial resonators are arranged in five stages, and the positions of the through holes 33 are formed in the base substrate 22 in a zigzag shape.

The positions of the plurality of through holes 33 of the base substrate 22 are not limited to the positions shown in the above-mentioned respective embodiments, but may be formed in a non-linear form instead of being formed in a straight line. However, any arrangement may be used. Further, the number of stages of the dielectric coaxial resonator is not limited to the number shown in the embodiment, and the present invention can be applied to any number of stages.

By the way, in the above embodiment, the case where the dielectric filter is constructed by using the individual dielectric coaxial resonators 1 to 7 has been described. However, a plurality of holes are perforated in one dielectric coaxial resonator. Alternatively, a multi-stage dielectric filter may be configured. Further, although the case where the holes 8 of the dielectric coaxial resonators 1 to 7 are penetrated to both end sides has been described, the present invention can be applied to the case of the dielectric coaxial resonator having the short-circuit surface side closed.

In the embodiment, as a filter configuration,
An example of an antenna duplexer in which a bandpass filter and a band elimination filter are combined is shown, but the present invention is also applicable to a single configuration of these, another highpass filter, a single configuration of each lowpass filter, or a combination of each filter. It is applicable. Further, the number of stages of the resonator is not limited.

Further, in the above-described embodiment, the case where the present invention is applied to the dielectric filter using the base substrate on which the dielectric coaxial resonator is mounted has been described, but the present invention is not limited to the dielectric filter, and the VCO using the base substrate and It can also be applied to various electronic circuits such as FM front-end circuits.

[0033]

According to the present invention, since a plurality of through-holes for flowing the ground current from the dielectric coaxial resonator are formed non-linearly in the base substrate, a plurality of through-holes are linearly formed. Unlike the conventional method, it is possible to prevent the base substrate from being bent or warped. Therefore, the flatness of the base substrate can be improved, and the reflow soldering by the user becomes easy.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an entire dielectric filter according to an embodiment of the present invention.

FIG. 2 is a perspective view of a dielectric filter showing a mounted state of an embodiment of the present invention.

FIG. 3 is an equivalent circuit diagram of a dielectric filter according to an embodiment of the present invention.

FIG. 4 is a plan view of a base substrate according to a second embodiment of the present invention.

FIG. 5 is a plan view of a base substrate according to a third embodiment of the present invention.

FIG. 6 is a plan view of a base substrate according to a fourth embodiment of the present invention.

FIG. 7 is an exploded perspective view of a conventional dielectric filter.

FIG. 8 is a cross-sectional view of a main part of a conventional example.

FIG. 9 is an explanatory diagram showing a problem of the conventional base substrate.

[Explanation of symbols] 1 to 7 dielectric coaxial resonator 22 base substrate 26 ground electrode 33 through hole

Claims (1)

[Claims] 1. A dielectric coaxial resonator (1)-(7), and a base substrate (22) for mounting the dielectric coaxial resonator (1)-(7) on one surface of a ground electrode (26). And a ground electrode (2) formed on both surfaces of the base substrate (22).
6) In the dielectric resonator device in which the ground currents from the dielectric coaxial resonators (1) to (7) are caused to flow through a plurality of through holes (33) provided between the through holes (33). 33) A dielectric resonator device having a plurality of non-linear holes 33) formed in the base substrate (22).