JPH0722815A - Electronic parts for high frequency - Google Patents

Abstract

PURPOSE:To supply a product having good characteristics and a high reliability. CONSTITUTION:A base substrate 22 is made of a glass thermosetting polyphenylene-oxide resin. Since the glass thermosetting polyphenylene-oxide resin is superior in heat resistance to a conventionally used glass epoxy resin and has a higher characteristic stability against temperature, the appearance and characteristics are less changed before and after reflow solder. Further, the product of good high frequency characteristics is produced because dielectric loss tangent tandelta of the glass thermosetting polyphenylene-oxide resin is good. Since this resin has proper dielectric constant epsilonr in comparison with Teflon glass, a pattern having a capacity is not made too large to miniaturize the product, and this resin is characterized by inexpensive materials. Consequently, the product which has good high frequency characteristics and has the solder heat resistance improved and has a high reliability is supplied without increasing the cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, a car telephone,
The present invention relates to a dielectric filter used in mobile communication devices such as mobile phones.

[0002]

2. Description of the Related Art FIG. 4 is an exploded perspective view of a conventional dielectric filter of this type, which is a so-called antenna duplexer composed of a band elimination filter and a bandpass filter. Is. In FIG. 4, the base substrate 22 made of a dielectric material such as glass epoxy or Teflon (trade name) glass has input / output terminals 23 to 25 connected to the antenna side, the transmitter side and the receiver side in the form of electrode films. Has been formed. These input / output terminals 23
Electrode film-like ground electrodes 26 are formed on the upper and lower surfaces other than the portions 25 to 25.

In this example, seven dielectric coaxial resonators 1 to 7 are mounted on the upper surface of the ground electrode 26 of the base substrate 22 by soldering or the like. Further, the connection terminal 9 is press-fitted into the holes of the dielectric coaxial resonators 1 to 7.
Although detailed description will be given in the embodiments, the coupling substrates 13 and 18, the spacer 21 and the like, the capacitor substrate, the inductor and the like are also mounted in addition to the dielectric coaxial resonators 1 to 7. There is. The metal cover 27 and the base substrate 22 form a casing (outer shell) of the dielectric filter.

[0004]

The material of the base substrate 22 used in the conventional dielectric filter shown in FIG. 4 is made of glass epoxy or Teflon (trade name) as described above.
Since the glass was used, it had the following problems.

That is, glass epoxy has the problems of low heat resistance, poor temperature coefficient TC, and poor dielectric loss tangent tan δ. In addition, Teflon (trade name) glass has problems that the permittivity εr is too low, the cost is high because surface treatment is required by through-hole processing, and the cost of the material itself is high.

The present invention has been made in view of the above points, and provides a high frequency electronic component intended to supply a product having excellent characteristics and high reliability.

[0007]

The present invention provides a base substrate 2
In a high-frequency electronic component in which a high-frequency electronic component element is mounted on one surface of the substrate 2 by soldering or the like, the material of the base substrate 22 is a glass thermosetting polyphenylene oxide resin.

[0008]

According to the present invention, since the base substrate 22 is made of glass thermosetting polyphenylene oxide resin, it has excellent heat resistance as compared with glass epoxy, and
Since the characteristic stability with temperature is good, there is little change in appearance and characteristics before and after reflow soldering. Furthermore, the dissipation factor tan δ
Since it is good, a product with good high frequency characteristics can be created. In addition, since it has an appropriate dielectric constant εr as compared with Teflon (trade name) glass, a pattern having a capacitance does not become too large, so that it can be downsized, and the material is inexpensive. . Therefore, it is possible to supply inexpensive and highly reliable products having good high frequency characteristics and improved solder heat resistance without increasing costs.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. First, the overall configuration of the dielectric filter to which the present invention is applied will be described. FIG. 1 shows an exploded perspective view of a dielectric filter, and FIG. 2 shows a perspective view of a state in which various parts are mounted. The dielectric filter shown in FIG. 1 and FIG.
For example, it is used for mobile communication devices such as car phones and mobile phones, and is called a so-called antenna duplexer used in the microwave band.

The dielectric filter has a band elimination filter on the transmitting side and a band pass filter on the receiving side. First, the overall structure of this surface mount type dielectric filter is shown in FIGS.
Will be described. Band elimination filter is 3
It has a multi-stage resonator configuration and has three quarter-wave dielectric coaxial resonators 1 to 3, and the bandpass filter has four-stage resonator configuration and four quarter-wave resonators. It has dielectric coaxial resonators 4 to 7.

In the dielectric coaxial resonators 1 to 7, the electrode film-shaped inner conductor formed on the inner peripheral surface of the dielectric hole 8 formed in a rectangular parallelepiped shape and the electrode formed on the side surface of the dielectric body. A film-shaped outer conductor and a short-circuit conductor that connects the electrode-film-shaped inner conductor and the outer conductor, which is not shown in the figure, is formed on one of the end faces where the hole 8 is open, It resonates at the frequency. Into the holes 8 of the dielectric coaxial resonators 1 to 7, metal connection terminals 9 whose one end side is formed in a substantially cylindrical shape are press-fitted from the open end sides of the dielectric coaxial resonators 1 to 7, respectively. Conductivity is obtained by contacting the inner conductor inside. The other end of the connection terminal 9 is formed in a tongue shape, and is connected to electrode films 14 to 17 formed on the upper surfaces of the capacitor substrates 10 to 12 and the coupling substrate 13, which will be described later, by soldering or the like. It is like this.

The capacitor substrates 10 to 12 are made of a dielectric material, and electrode films are formed on the upper and lower surfaces thereof to form a capacitor. Further, a plurality of electrode films 14 to 17 are arranged in parallel on the upper surface of the coupling substrate 13 made of a dielectric material, and the electrode films 14 to 16 are formed in a comb-tooth shape at the opposing portions in order to increase the coupling capacitance. ing. Furthermore, electrode films are formed on both sides of the lower surface of the combined substrate 13. In addition, coil-shaped inductors L _{1 to} L ₃ are connected between the capacitor substrates 10 to 12. The inductors L _{1 to} L
Electrode films 19 and 20 are formed on the upper surface of a combined substrate 18 made of a dielectric material for mounting ₃ , and an electrode film serving as a ground electrode is formed on the entire lower surface of the combined substrate 18.

A base substrate 2 on which the above members are mounted on the upper surface.
Reference numeral 2 denotes an electrode film-shaped input / output terminal 23 connected to the antenna side and an electrode film-shaped input / output terminal 2 connected to the transmitter side.
4 and an input / output terminal 25 in the form of an electrode film to which the receiver side is connected
And are formed respectively. Further, an electrode film-shaped ground electrode 26 is formed on substantially the entire upper surface and lower surface of the base substrate 22. The base substrate 22 is made of a dielectric material or an insulating material. The combined substrate 13 mounted on the upper surface of the base substrate 22 includes two spacers 2.
The other spacer 21 is mounted on the upper surface of the input / output terminal 24 of the base substrate 22. The three spacers 21 are made of a conductive material such as metal.

Ground electrodes 26 are formed on the entire upper and lower surfaces of the base substrate 22 except for the input / output terminals 23 to 25, and the ground electrodes 26 on the upper and lower surfaces are formed in a straight line in the horizontal direction. Conduction is obtained by a plurality of through holes 33. Further, the ground electrodes 26 on the upper and lower surfaces are also electrically connected through the electrode film formed on the end surface of the semicircular cutout 34 formed around the base substrate 22. Further, the input / output terminals 23 to 25 are also electrically connected to the upper and lower surfaces of the base substrate 22 via the electrode films formed on the end surfaces.

The cover 27 that covers the base substrate 22 is made of metal, and the top plate of the cover 27 is used for soldering the outer conductors of the upper surfaces of the dielectric coaxial resonators 1 to 7 and the cover 27. And an elongated hole 28 and a hole 29 for inserting a jig for adjusting the characteristics of the dielectric coaxial resonators 1 to 7 are formed. Further, the front and back portions of the lower edge of the cover 27 (not shown)
A plurality of ground terminals 30 connected to the upper surface ground electrode 26 of the base substrate 22 are formed. Notches 31 for exposing the input / output terminals 23 to 25 of the base substrate 22 are formed on the side plates of the cover 27, respectively.
Further, as shown in FIG. 2, a label 32 is attached to the upper surface of the cover 27 to cover the holes 28 and 29.

In the above case, the case where the cover 27 is used has been described. However, the dielectric filter may be formed without using the cover 27. The label 32 is formed of a resin called Kapton (trade name) having high heat resistance. When the label 32 is made of resin, it does not serve as a shield, but when it has the function of a shield, it is made of metal.

Next, the arrangement of each member will be described. As shown in FIGS. 1 and 2, one spacer 21 is provided on the side of the band elimination filter as the base substrate 2.
2 is mounted on the input / output terminal 24 and the combined substrate 1
8 is mounted on the ground electrode 26 between the input / output terminals 24 and 23 of the base substrate 22 and soldered. Furthermore,
The spacers 21 are mounted on the upper surfaces of the input / output terminals 23 and 25, and the combined substrate 13 is bridged and soldered on the upper surfaces of the two spacers 21 so that the electrode films on the lower surfaces are in contact with each other.

As shown in FIG. 2, one end of the inductor L ₁ is mounted on the upper surface of the spacer 21, the capacitor substrate 10 is mounted thereon, and the dielectric coaxial resonator 1 is mounted on the electrode film on the upper surface of the capacitor substrate 10. Is connected to the connection terminal 9. The other end of the inductor L ₁ is mounted on the electrode film 19 of the combined substrate 18, and the inductor L ₂ is connected to the combined substrate 1
8 is mounted between the electrode films 19 and 20. Then, the capacitor substrate 11 is placed on the connecting portion between the inductors L ₁ and L _2.
Is mounted, and the connection terminal 9 from the dielectric coaxial resonator 2 is connected to the electrode film on the upper surface of the capacitor substrate 11. One end of the inductor L ₃ is mounted on the electrode film 20 of the coupling substrate 18, and the other end is mounted on the input / output terminal 23. Also,
Capacitor board 1 above the connection between inductors L ₂ and L _3.
2 is mounted, and the connection terminal 9 from the dielectric coaxial resonator 3 is connected to the electrode film on the upper surface of the capacitor substrate 12.

The connection terminals 9 from the dielectric coaxial resonators 4 to 7 are connected to the electrode films 14 to 17 on the upper surface of the coupling substrate 13 mounted on the two spacers 21, respectively. There is.

FIG. 3 is an equivalent circuit diagram of the dielectric filter constructed as described above. Capacitors C _{1 to} C ₃ on the band elimination filter side are upper and lower electrode films of the capacitor substrates 10 to 12. The capacitor C ₄ is formed between the input / output terminal 24 and the ground electrode on the lower surface. The capacitors C ₅ and C ₆ are formed by the electrode films 19 and 20 on the upper surface and the electrode film on the lower surface of the combined substrate 18. Further, the capacitor C ₇ is connected to the input / output terminal 23.
And the ground electrode on the lower surface.

Further, the capacitor C ₈ on the bandpass filter side is formed between the electrode film 14 of the combined substrate 13 and the electrode film on the lower surface, and the capacitors C _{9 to} C ₁₀ are formed on the combined substrate 1.
3 between the electrode films 14 to 16. Further, the capacitor C ₁₁ is formed by the electrode film 16 on the upper surface and the electrode film (not shown) on the lower surface of the combined substrate 13. The electrode film on the lower surface is electrically connected to the spacer 21 at the right end in the figure. Further, the capacitor C ₁₂ is the electrode film 1 on the upper surface of the combined substrate 13.
7 and the electrode film on the lower surface. The dielectric coaxial resonator 7 and the capacitor C ₁₂ form a trap circuit of a series resonance circuit.

Next, the gist of the present invention will be described in detail. The present invention is characterized in that the base substrate 22 is made of glass thermosetting polyphenylene oxide resin.
This glass thermosetting polyphenylene oxide resin is a resin manufactured by Matsushita Electric Works, Ltd. That is, the glass thermosetting polyphenylene oxide resin is superior in heat resistance to the conventionally used glass epoxy and has good characteristic stability due to temperature, and therefore, changes in appearance and characteristics before and after reflow soldering are small. Furthermore, since the dielectric loss tangent tan δ is good, it has a feature that a product with good high frequency characteristics can be produced.

Further, the glass thermosetting polyphenylene oxide resin has an appropriate dielectric constant εr as compared with Teflon (trade name) glass, so that the pattern having a capacitance does not become too large, and the size can be reduced. In addition, it has the characteristic that the material is inexpensive. Therefore, by using the glass thermosetting polyphenylene oxide resin as the material of the base substrate 22, it is possible to supply a cheap and highly reliable product having good high frequency characteristics and improved solder heat resistance without increasing the cost.

Further, the glass thermosetting polyphenylene oxide resin is excellent in high frequency characteristics of 1 to 12 GHz, and can be processed in the same processing step as a normal glass epoxy printed wiring board, compared to a glass fluororesin copper clad laminate. It has various features such as cost reduction, excellent through-hole reliability, high thermal decomposition temperature, and excellent solder heat resistance. Further, by using the glass thermosetting polyphenylene oxide resin of high dielectric constant ε type, in addition to the above effects, the size of the high frequency circuit can be reduced. The base substrate 22 used in the dielectric filter of the present embodiment is made of the above glass thermosetting polyphenylene oxide resin, and is copper-clad on the upper and lower surfaces.

In the embodiment, as the filter configuration,
An example of an antenna duplexer in which a bandpass filter and a band elimination filter are combined is shown, but the present invention is also applicable to a single configuration of these, another highpass filter, a single configuration of each lowpass filter, or a combination of each filter. It is applicable. Further, the number of stages of the resonator is not limited.

Further, in the above-mentioned embodiment, the case where the invention is applied to the dielectric filter using the base substrate on which the dielectric coaxial resonator is mounted is explained, but the invention is not limited to the dielectric filter and is formed of bismaleimide-triazine resin. The present invention can be applied to various electronic circuits such as a VCO or FM front end circuit using the above base substrate.

[0027]

According to the present invention, in a high frequency electronic component in which a high frequency electronic component element is mounted on the entire surface of the base substrate by soldering or the like, the material of the base substrate is glass thermosetting polyphenylene oxide resin. Since it is composed of, the heat resistance is superior to that of glass epoxy, and the characteristic stability with temperature is good, so that there is little change in appearance and characteristics before and after reflow soldering. Furthermore, since the dielectric loss tangent tan δ is good, a product with good characteristics can be created. In addition, since it has an appropriate dielectric constant εr as compared with Teflon (trade name) glass, the pattern having a capacitance does not become too large, so that it can be downsized, and the material is inexpensive. . Therefore, it is possible to provide a cheap and highly reliable product having good high-frequency characteristics and improved solder heat resistance without increasing the cost.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an entire dielectric filter according to an embodiment of the present invention.

FIG. 2 is a perspective view of a dielectric filter showing a mounted state of an embodiment of the present invention.

FIG. 3 is an equivalent circuit diagram of a dielectric filter according to an embodiment of the present invention.

FIG. 4 is an exploded perspective view of a conventional dielectric filter.

[Explanation of symbols]

 22 Base substrate

Claims (1)

[Claims] 1. In a high frequency electronic component in which a high frequency electronic component element is mounted on one surface of a base substrate (22) by soldering or the like, the material of the base substrate (22) is glass thermosetting polyphenylene oxide. A high-frequency electronic component characterized by being made of resin.