JPH10278079A - Manufacture of phenol resin high-flow molded body - Google Patents

Manufacture of phenol resin high-flow molded body

Info

Publication number
JPH10278079A
JPH10278079A JP9048397A JP9048397A JPH10278079A JP H10278079 A JPH10278079 A JP H10278079A JP 9048397 A JP9048397 A JP 9048397A JP 9048397 A JP9048397 A JP 9048397A JP H10278079 A JPH10278079 A JP H10278079A
Authority
JP
Japan
Prior art keywords
phenol resin
molding
resin
injection molding
phenolic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9048397A
Other languages
Japanese (ja)
Inventor
Tomozo Sakaguchi
知三 坂口
Takeyoshi Murakami
武義 村上
Nobuo Nagata
信夫 永田
Mutsunori Yamao
睦矩 山尾
Hiroshi Ibuki
洋 伊吹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP9048397A priority Critical patent/JPH10278079A/en
Publication of JPH10278079A publication Critical patent/JPH10278079A/en
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide the manufacturing method of phenol resin high-flow molded body, which is capable of obtaining the uniform phenol resin high-flow molded body, uniform in the degree of curing and reduced in the generation of bubbles or the like, by injection molding. SOLUTION: Upon the injection molding of granular phenol resin molding material, whose grain size is 50 μm or more and whose thermal fluidity, measured through disc cure method, is 60-180 mm while whose surface layer is coated by a low surface tension substance having the melting point of 30-160 deg.C in the composite ratio to phenol resin of 0.1-5 wt %, the molten resin is charged into a mold with the filling speed of 5-30 cm<3> /sec or less and the injection molding is effected under the mold clamping pressure of 70-90 kgf/cm<2> .

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、フェノール樹脂高
流動成形体の製造方法に関するものであり、さらに詳し
くは、射出成形によるフェノール樹脂高流動成形体の製
造方法に関するものであある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a phenol resin high-flow molded article, and more particularly to a method for producing a phenol resin high-flow molded article by injection molding.

【0002】[0002]

【従来の技術】フェノール樹脂は安価で耐熱性、剛性
率、硬度、電気絶縁性、耐薬品性等の諸特性が優れた樹
脂として、従来、電気材料等の各種製品に多用されてい
るが、大部分の製品は、液状の原料を用い、これに紙、
布、ガラス繊維、無機フィラー等の補強材、充填材を配
合して成形した複合熱硬化性樹脂成形体であった。この
成形体は、安価ではあるが、未反応のフェノールを多く
含み、気泡の混入が避けられず、したがって特性的にも
高度なものは望めないので、高性能製品には利用され得
なかった。
2. Description of the Related Art Phenol resins are inexpensive and have excellent properties such as heat resistance, rigidity, hardness, electrical insulation and chemical resistance. They have been widely used in various products such as electric materials. Most products use liquid raw materials, which are
The composite thermosetting resin molded article was formed by blending a reinforcing material such as cloth, glass fiber, and inorganic filler, and a filler. Although this molded product is inexpensive, it contains a large amount of unreacted phenol, and inevitably contains air bubbles, and therefore cannot be expected to have a high degree of characteristics, and thus cannot be used for high-performance products.

【0003】常温にて固体(粉粒体)の熱流動性を有す
る高純度フェノール樹脂成形材料(熱流動性粒状成形材
料)を用いると、フェノール樹脂の成形法として最も一
般的に用いられてきた圧縮成形法以外にもトランスファ
ー成形法、射出成形法あるいは押出成形法にて成形可能
である。ここで、熱流動性粒状成形材料を用いてトラン
スファー成形法、射出成形法あるいは押出成形法にて成
形する方法を高流動成形といい、得られる成形体を高流
動成形体という。
When a high-purity phenol resin molding material (thermofluid granular molding material) having a solid (powder or granular) thermofluidity at room temperature is used, it has been most commonly used as a phenol resin molding method. In addition to the compression molding method, it can be molded by a transfer molding method, an injection molding method or an extrusion molding method. Here, a method of molding by a transfer molding method, an injection molding method or an extrusion molding method using a thermofluid granular molding material is called high-fluid molding, and the obtained molded body is called a high-fluid molded body.

【0004】このような高流動成形可能な熱流動性粒状
成形材料であっても、通常、特公平1−38816号公
報に記載のように、ガラス繊維のような補強材及びステ
アリン酸亜鉛のような金属含有有機滑剤を含むものでな
いと満足な成形ができない現状にあり、すなわち、かか
る成形材料からガラス繊維や金属含有有機滑剤を除いた
フェノール樹脂成形材料を高流動成形すると成形機のシ
リンダー内で、成形材料のスムーズな流動性が損なわ
れ、安定してかつ高精度に成形することが困難であっ
た。
[0004] Even such a heat-fluidized granular molding material capable of high-fluidity molding is usually used as disclosed in Japanese Patent Publication No. 1-38816, such as a reinforcing material such as glass fiber and a zinc stearate. At present, satisfactory molding cannot be performed unless the composition contains a metal-containing organic lubricant.In other words, when a phenolic resin molding material obtained by removing glass fiber or a metal-containing organic lubricant from such a molding material is subjected to high flow molding, the molding is performed in a cylinder of a molding machine. In addition, the smooth fluidity of the molding material was impaired, and it was difficult to form the material stably and with high precision.

【0005】また、フェノール樹脂成形体を磁気ディス
ク基板等として用いる場合には上記のような補強材等を
含まず、不純物ができるだけ少ないフェノール樹脂成形
体が要求される。そこで、本発明者らは先に特願平8−
264031号においてガラス繊維や金属含有有機滑剤
を含まないフェノール樹脂成形材料を用い、フェノール
樹脂高流動成形体を生産性良く得ることができる方法を
提案した。しかし、この方法では欠陥となる気泡の発生
率が高く、その気泡のサイズも大きいものであった。
When a phenolic resin molded article is used as a magnetic disk substrate or the like, a phenolic resin molded article that does not include the above-mentioned reinforcing material and has as few impurities as possible is required. Therefore, the present inventors have previously described in Japanese Patent Application No. Hei.
No. 264031 proposed a method of using a phenolic resin molding material that does not contain glass fibers or a metal-containing organic lubricant to obtain a phenolic resin high-flow molded body with high productivity. However, this method has a high generation rate of bubbles serving as defects, and the size of the bubbles is large.

【0006】[0006]

【発明が解決しようとする課題】かかる状況に鑑み、本
発明の課題は、射出成形によって硬化度が均一でしかも
気泡等が少ない均一なフェノール樹脂高流動成形体を生
産性良く得ることができるフェノール樹脂高流動成形体
の製造方法を提供することにある。
SUMMARY OF THE INVENTION In view of the foregoing, an object of the present invention is to provide a phenol resin high-fluidity molded article having a uniform degree of curing and having a small number of air bubbles and the like with good productivity by injection molding. An object of the present invention is to provide a method for producing a resin high-flow molded article.

【0007】[0007]

【課題を解決するための手段】本発明者らは、上記課題
を解決すべく鋭意研究を行った結果、特定のフェノール
樹脂の表層を低表面張力物質で被覆したフェノール樹脂
成形材料を後述する特定の条件で射出成形すると、上記
課題が解決されることを見出し、本発明に到達した。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, a phenol resin molding material in which the surface layer of a specific phenol resin is coated with a low surface tension substance will be described later. It has been found that the above-mentioned problems can be solved by injection molding under the conditions described above, and the present invention has been achieved.

【0008】すなわち、本発明の要旨は、粒径が50μ
m以上で、ディスクキュアー法で測定した熱流動性が6
0〜180mmである粒状フェノール樹脂の表層に、融
点が30〜160℃の低表面張力物質が対フェノール樹
脂組成比0.1〜5重量%被覆されてなるフェノール樹
脂成形材料を射出成形するに際し、溶融樹脂の金型内へ
の充填速度を5〜30cm3 /sec、型締め圧力を7
0〜90kgf/cm2 にして射出成形することを特徴
とするフェノール樹脂高流動成形体の製造方法である。
That is, the gist of the present invention is that the particle size is 50 μm.
m or more, the thermal fluidity measured by the disc cure method is 6
When injection molding a phenolic resin molding material comprising a surface layer of a granular phenolic resin having a particle diameter of 0 to 180 mm and a low surface tension substance having a melting point of 30 to 160 ° C coated with a phenolic resin composition ratio of 0.1 to 5% by weight, The filling rate of the molten resin into the mold is 5 to 30 cm 3 / sec, and the mold clamping pressure is 7
This is a method for producing a phenolic resin high-flow molded article, which is injection-molded at a pressure of 0 to 90 kgf / cm 2 .

【0009】[0009]

【発明の実施の形態】以下、本発明を詳細に説明する。
本発明においては、後述する粒状フェノール樹脂の表層
を低表面張力物質を被覆してなるフェノール樹脂成形材
料を用いる。粒状フェノール樹脂としては、粒径が50
μm以上、好ましくは100μm以上で、ディスクキュ
アー法で測定した熱流動性が60〜180mm、好まし
くは90〜160mmであるフェノール樹脂を用いる。
ここで、粒径とは、粒体の平均最大径(外接球直径)を
表す。粒径が50μm未満の場合は、成形機への供給が
安定して行えないことがある。粒径の上限には特に制限
はないが、実用的な粒径としては100〜4000μm
が適当である。粒体形状は球形、円筒形、立方体形等い
ずれでも良く、粒径が小さい場合は球形の方が成形中の
輸送性に優れている。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
In the present invention, a phenol resin molding material obtained by coating a surface layer of a granular phenol resin described below with a low surface tension substance is used. As a granular phenol resin, the particle size is 50
A phenol resin having a thermal fluidity of 60 to 180 mm, preferably 90 to 160 mm measured by a disc cure method is used.
Here, the particle diameter represents the average maximum diameter (circumscribed sphere diameter) of the granular material. When the particle size is less than 50 μm, supply to a molding machine may not be performed stably. The upper limit of the particle size is not particularly limited, but a practical particle size is 100 to 4000 μm.
Is appropriate. The particle shape may be any of a spherical shape, a cylindrical shape, a cubic shape, and the like. When the particle size is small, the spherical shape is more excellent in transportability during molding.

【0010】本発明における熱流動性とは常温にては固
体であるが、加熱状態にて負荷をかけたときに流動性を
示す特性をいう。しかし、フェノール樹脂は通常の熱可
塑性の樹脂の場合とは異なって自己硬化性を有するの
で、ある程度以上の時間流動性を示す温度にて加熱を続
けると分子内及び/又は分子間での縮合が始まって架橋
して硬化する性質をもっている。そこで、熱流動性を表
す尺度として、後記するJIS規格(ディスクキュアー
法)で測定した160℃における所定荷重下の試料樹脂
円板の流れ(直径の伸び;mm)で表す。この熱流動性
が60mm未満の樹脂は成形性が低下する傾向があり、
他方、180mmを越える樹脂は硬化反応に必要な時間
が長くなるため生産性が低下し、しかも、硬化反応によ
って生成する水分等が成形品内へ閉じ込められるため、
欠陥製品となるおそれがある。
In the present invention, the term "thermofluidity" refers to the property of being solid at normal temperature but showing fluidity when a load is applied in a heated state. However, phenolic resins have self-curing properties differently from ordinary thermoplastic resins, so if heating is continued at a temperature that indicates fluidity for a certain period of time or more, condensation within molecules and / or between molecules will occur. It has the property of starting and crosslinking and curing. Therefore, as a scale representing the heat fluidity, the flow (elongation of diameter; mm) of a sample resin disk under a predetermined load at 160 ° C. measured by JIS standard (disc cure method) described later. The resin having a heat fluidity of less than 60 mm tends to have low moldability,
On the other hand, if the resin exceeds 180 mm, the time required for the curing reaction becomes longer, thereby lowering the productivity. In addition, since water and the like generated by the curing reaction are trapped in the molded product,
There is a risk of defective products.

【0011】粒状フェノール樹脂の製造法はなんら限定
されないが、例えば特開平4−159320号公報に記
載されている方法のように、ノボラック樹脂をヘキサメ
チレンテトラミンのようなアルカリ触媒兼メチレン架橋
剤及び懸濁安定剤の存在下、水媒体中で懸濁重合を行う
方法(自己硬化型変性ノボラック樹脂法)、フェノール
及びホルムアルデヒドを塩基性触媒及び懸濁安定剤の存
在下、水性媒体中にて懸濁重合を行う方法等の重合法
(固形レゾール樹脂法)が好適に採用することができ
る。これらの方法によれば、極めて高純度で真球状に近
い球状微粒体が得られる。粒径の大きな成形原料を得る
には、上記微粒体を造粒して所定の粒度の原料を調製す
る方法が有効である。
The method for producing the particulate phenol resin is not limited at all. For example, as described in Japanese Patent Application Laid-Open No. 4-159320, a novolak resin is prepared by adding an alkali catalyst / methylene crosslinking agent such as hexamethylenetetramine and a methylene crosslinking agent. A method of performing suspension polymerization in an aqueous medium in the presence of a turbidity stabilizer (self-curing modified novolak resin method), suspending phenol and formaldehyde in an aqueous medium in the presence of a basic catalyst and a suspension stabilizer A polymerization method (solid resol resin method) such as a method of performing polymerization can be suitably employed. According to these methods, spherical particles having a very high purity and a shape close to a true sphere can be obtained. In order to obtain a molding raw material having a large particle size, a method of granulating the above fine particles to prepare a raw material having a predetermined particle size is effective.

【0012】低表面張力物質は、融点が30℃〜160
℃、好ましくは40℃〜80℃で、常温にて固体状の低
融点化合物で、かつ潤滑性、離型性、非付着性等の低表
面張力物質(例えば常温〔25℃〕で臨界表面張力が約
35ダイン/cm以下の物質)に特有の特性を有する化
合物であって、特に金属塩類のような金属元素を含まな
いものを用いる。融点が30℃未満では成形時に計量不
良が起こる傾向にあり、160℃を超えると成形機のシ
リンダー内で潤滑性が乏しく、安定した成形性が得られ
ない傾向にある。
[0012] The low surface tension substance has a melting point of 30 ° C to 160 ° C.
C., preferably 40 ° C. to 80 ° C., a low melting point compound which is solid at room temperature at room temperature, and has a low surface tension substance such as lubricity, mold release and non-adhesiveness (for example, critical surface tension at room temperature [25 ° C.] Is a substance having a characteristic characteristic of about 35 dynes / cm or less), particularly a compound containing no metal element such as metal salts. If the melting point is less than 30 ° C., poor measurement tends to occur during molding, and if it exceeds 160 ° C., lubricity in the cylinder of the molding machine is poor, and stable moldability tends not to be obtained.

【0013】代表的な例としては、ラウリン酸、パルミ
チン酸、ステアリン酸等の高級脂肪酸;ラウリン酸モノ
グリセライド、エチルステアレート、ステアリン酸モノ
グリセライド、ソルビタンモノパルミテート、ソルビタ
ンモノステアレート等の高級脂肪酸エステル;トリラウ
リン、トリステアリン、硬化ひまし油等の固形油脂類;
ステアリン酸アマイド、エチレンビスステアリン酸アマ
イド等の高級脂肪酸アマイド;セチルアルコール、ステ
アリルアルコール等の高級脂肪族アルコール;ステアリ
ルメタクリレート、ステアリルアクリレート等の高級脂
肪族(メタ)アクリレート;パラフィンワックス等のワ
ックス状炭化水素;パーフルオロオクタン酸、9H−ヘ
キサデカフルオロノナノン酸等の含多価フッ素高級脂肪
酸;N−エチルパーフルオロオクチルスルホンアミド等
の含多価フッ素高級脂肪族スルホンアミド;2−(パー
フルオロオクチル)沃化エチル、2−(パーフルオロデ
シル)沃化エチル等の含多価フッ素高級脂肪族沃化物;
1H,1H,9H−ヘキサデカフルオロノナノール、2
−(パーフルオロオクチル)エタノール、2−(パーフ
ルオロデシル)エタノール等の含多価フッ素高級脂肪族
アルコール;2−(パーフルオロデシル)メチルメタク
リレート、1H,1H,11H−アイコサフルオロウン
デシルアクリレート等の含多価フッ素高級脂肪族(メ
タ)アクリレート;パーフルオロドデカン等の含多価フ
ッ素高級脂肪族炭化水素;2−(P−オキシ安息香酸メ
チル・ヘキサフルオロプロペン3量体付加物等の含多価
フッ素脂肪族芳香族化合物、ペンタフルオロベンズアミ
ド等の含多価フッ素芳香族炭化水素;TFEワックス
(テトラフルオロエチレンテロマー)、CTFEテロマ
ー(クロロトリフルオロエチレンテロマー)等の含多価
フッ素オリゴマー化合物等、あるいはこれらの誘導体、
これらの一種以上よりなる混合物並びにこれらに重合触
媒等の添加物を配合した組成物等の低表面張力物質が挙
げられる。
Typical examples are higher fatty acids such as lauric acid, palmitic acid and stearic acid; higher fatty acid esters such as lauric acid monoglyceride, ethyl stearate, stearic acid monoglyceride, sorbitan monopalmitate and sorbitan monostearate; Solid fats and oils such as trilaurin, tristearin, hardened castor oil;
Higher fatty acid amides such as stearic acid amide and ethylenebisstearic acid amide; higher aliphatic alcohols such as cetyl alcohol and stearyl alcohol; higher aliphatic (meth) acrylates such as stearyl methacrylate and stearyl acrylate; waxy hydrocarbons such as paraffin wax A polyvalent fluorine-containing higher fatty acid such as perfluorooctanoic acid and 9H-hexadecafluorononanoic acid; a polyvalent fluorine-containing higher aliphatic sulfonamide such as N-ethylperfluorooctylsulfonamide; 2- (perfluorooctyl) Polyvalent fluorine-containing higher aliphatic iodides such as ethyl iodide and 2- (perfluorodecyl) ethyl iodide;
1H, 1H, 9H-hexadecafluorononanol, 2
Poly (fluorinated higher aliphatic alcohols such as-(perfluorooctyl) ethanol and 2- (perfluorodecyl) ethanol; 2- (perfluorodecyl) methyl methacrylate, 1H, 1H, 11H-icosafluoroundecyl acrylate, etc. Poly (fluorine-containing higher aliphatic (meth) acrylates); polyfluoro-containing higher aliphatic hydrocarbons such as perfluorododecane; poly (methyl-oxybenzoate) hexafluoropropene trimer adducts; Polyvalent fluorine-containing aromatic hydrocarbons such as fluorinated aliphatic aromatic compounds and pentafluorobenzamide; polyvalent fluorine-containing oligomer compounds such as TFE wax (tetrafluoroethylene telomer) and CTFE telomer (chlorotrifluoroethylene telomer); Or derivatives thereof,
Low surface tension substances such as a mixture of one or more of these, and a composition in which additives such as a polymerization catalyst are blended with them are exemplified.

【0014】上記粒状フェノール樹脂の粒体表面に上記
低表面張力物質をフェノール樹脂に対して0.1〜5重
量%、好ましくは0.2〜3重量%配合する。低表面張
力物質の配合量がフェノール樹脂に対して0.1重量%
未満では、成形の際に、成形機のシリンダー内で閉塞が
起こり連続して成形を行うことが困難になることがあ
り、他方、5重量%を越えると成形性の向上効果が頭打
ちとなり、また透明な成形品が得にくいことがある。
The low surface tension substance is added to the surface of the granular phenolic resin particles in an amount of 0.1 to 5% by weight, preferably 0.2 to 3% by weight, based on the phenolic resin. 0.1% by weight of low surface tension substance based on phenol resin
If the amount is less than 5%, the molding may be blocked in the cylinder of the molding machine at the time of molding, and it may be difficult to continuously perform molding. It may be difficult to obtain a transparent molded product.

【0015】粒状フェノール樹脂に対する低表面張力物
質の被覆は、各粒子間にてできるだけ均一に分布し、し
かも膜厚が均等であるように施されているものが好まし
い。被覆法としては、前記粒状フェノール樹脂と低表面
張力物質を、加熱装置付ブレンダーにて、低表面張力物
質の融点以上粒状フェノール樹脂の軟化点以下の温度域
内の所定温度にて加熱しつつ混和・攪拌する方法、両原
料を上記温度下に流動床攪拌する方法、粒状フェノール
樹脂に対して溶解性を示さず低表面張力物質に対して良
溶解性を示す溶媒によって低表面張力物質を溶解し、こ
の溶液に粒状フェノール樹脂を混和しつ溶媒を留去・乾
燥する方法等が推奨される。
The coating of the particulate phenolic resin with the low surface tension substance is preferably such that it is distributed as evenly as possible between the particles and the film thickness is uniform. As the coating method, the granular phenolic resin and the low surface tension substance are mixed and mixed at a predetermined temperature within a temperature range from the melting point of the low surface tension substance to the softening point of the granular phenolic resin in a blender with a heating device. A method of stirring, a method of fluid-bed stirring both raw materials at the above temperature, dissolving the low surface tension substance by a solvent showing no solubility in the granular phenolic resin and showing good solubility in the low surface tension substance, A method in which a granular phenol resin is mixed with this solution, and the solvent is distilled off and dried is recommended.

【0016】この際、後記するように、フェノール樹脂
成形材料は、少なくとも成形時には水分含有量が1重量
%以下に制御されていることが好ましい。通常、重合後
の原料フェノール樹脂は、数重量%以上の水分を含有す
るので、使用に先立っては、上記限度内に水分が低減す
るように乾燥しておき、上記被覆を施すのが有効であ
る。この際の乾燥法としては、粒状フェノール樹脂を真
空中又は乾燥空気循環下に60〜120℃の温度に加熱
して行う方法が推奨される。本方法において、低表面張
力物質によるフェノール樹脂の被覆とフェノール樹脂の
乾燥とを併せて行うのも効率的である。
At this time, as described later, it is preferable that the phenol resin molding material is controlled to have a water content of 1% by weight or less at least at the time of molding. Usually, the raw phenolic resin after polymerization contains water of several weight% or more. Therefore, it is effective to dry the phenolic resin before use to reduce the water content within the above-mentioned limits and apply the above coating. is there. As a drying method at this time, a method of heating the granular phenol resin to a temperature of 60 to 120 ° C. in a vacuum or under a circulation of dry air is recommended. In the present method, it is also effective to combine the coating of the phenol resin with the low surface tension substance and the drying of the phenol resin.

【0017】このように調製されたフェノール樹脂成形
材料は被覆膜が撥水性で低透湿性の低表面張力物質より
なるため、そのままでも長期間設定水分含有量以下に維
持することができるが、工業的には品質管理上、成形直
前まで密封容器あるいは密封包装に収納して保管するの
が好ましい。もちろん、上記のように粒状フェノール樹
脂を乾燥せずそのまま被覆処理したフェノール樹脂成形
材料であっても、成形直前に乾燥を充分に行い、吸湿し
ない条件下に成形すれば、上記と同様の成形体となすこ
とができる。
In the phenolic resin molding material thus prepared, the coating film is made of a water repellent, low moisture permeable, low surface tension substance. From an industrial viewpoint, it is preferable to store and store in a sealed container or sealed package until immediately before molding in terms of quality control. Of course, even if it is a phenolic resin molding material obtained by coating the granular phenolic resin without drying it as described above, if it is sufficiently dried immediately before molding and molded under conditions that do not absorb moisture, the same molded article as described above can be obtained. Can be made.

【0018】この際、前記したようにフェノール樹脂成
形材料として水分含有量が1重量%以下にすることが好
ましく、0.5重量%以下にすることがより好ましい。
水分含有量が1重量%を越えると、成形の際に成形体中
に気孔が残り、また成形条件によっては加水分解等の劣
化現象が派生することもある。
At this time, as described above, the phenol resin molding material preferably has a water content of 1% by weight or less, more preferably 0.5% by weight or less.
If the water content exceeds 1% by weight, pores remain in the molded body during molding, and depending on the molding conditions, degradation phenomena such as hydrolysis may occur.

【0019】フェノール樹脂成形材料には、同一種類の
樹脂の硬化物を含むことができる。この樹脂硬化物を含
む成形材料は、焼成により均一な炭素材料を与える。さ
らに、フェノール樹脂成形材料を用いて、後述の成形条
件にて射出成形を行うと、気泡及び過硬化物を殆ど含ま
ないフェノール樹脂成形体が得られる。
The phenolic resin molding material may contain a cured product of the same type of resin. The molding material containing the cured resin gives a uniform carbon material by firing. Further, when injection molding is performed using the phenolic resin molding material under the molding conditions described below, a phenolic resin molded article substantially free of bubbles and overcured products is obtained.

【0020】射出成形するに当たって、溶融樹脂の金型
内への充填速度を5〜30cm3 /sec、型締め圧力
を70〜90kgf/cm2 にして成形する。
In injection molding, the molten resin is molded at a filling rate of 5 to 30 cm 3 / sec and a mold clamping pressure of 70 to 90 kgf / cm 2 .

【0021】溶融樹脂の金型内への充填速度が5cm3
/sec未満の場合には、金型内での樹脂の流れが遅い
ため、外周部に気泡が生じやすい。30cm3 /sec
より速い場合には、溶融樹脂がノズル部での摩擦熱によ
り発泡したり、あるいは、空気を樹脂板内に巻き込むこ
とにより気泡が発生することがある。充填速度のより好
ましい範囲は15〜25cm3 /secである。
The filling speed of the molten resin into the mold is 5 cm 3
If it is less than / sec, the flow of the resin in the mold is slow, so that bubbles are likely to be generated on the outer peripheral portion. 30cm 3 / sec
If the speed is higher, the molten resin may foam due to frictional heat at the nozzle portion, or air bubbles may be generated by entraining air into the resin plate. A more preferable range of the filling rate is 15 to 25 cm 3 / sec.

【0022】型締め圧力が70kgf/cm2 未満の場
合には、型締め圧力不足で気泡が発生することがある。
90kgf/cm2 より高い場合には、高い充填圧力が
必要となり溶融樹脂がシリンダー内を逆流することによ
り気泡が発生することがある。また、寸法不良及び製品
の応力歪みが大きい等の問題も生ずるおそれがある。型
締め圧力のより好ましい範囲は75〜85kgf/cm
2 である。
When the mold clamping pressure is less than 70 kgf / cm 2 , bubbles may be generated due to insufficient mold clamping pressure.
If the pressure is higher than 90 kgf / cm 2 , a high filling pressure is required, and bubbles may be generated by the molten resin flowing backward in the cylinder. In addition, problems such as dimensional defects and large stress distortion of the product may also occur. A more preferable range of the mold clamping pressure is 75 to 85 kgf / cm.
2

【0023】本発明によって得られる成形体は、そのま
までも多様な用途に使用できるが、成形後120〜24
0℃の温度域内の所定温度でキュアリングすると、架橋
がさらに進行し、硬化度の高い各種製品が得られる。
The molded article obtained by the present invention can be used for various purposes as it is,
When curing is performed at a predetermined temperature within a temperature range of 0 ° C., crosslinking proceeds further, and various products having a high degree of curing can be obtained.

【0024】しかし、本発明においては、フェノール樹
脂高流動成形材料を用い、溶融樹脂の金型内への充填速
度を5〜30cm3 /sec、型締め圧力を70〜90
kgf/cm2 にして射出成形することにより、均一で
欠陥の少ないフェノール樹脂高流動成形体を大量生産す
ることが可能となる。また、本発明によって得られた成
形体を所定温度でキュアリングすることにより、硬化度
の高い各種製品が得られ、さらに、補強材及び金属含有
有機滑剤を含んでいないため、真空中又は不活性ガス雰
囲気中で高温焼成することにより、高純度のアモルファ
スカーボン(グラッシーカーボン)、高純度グラファイ
ト等の炭素材料となり、磁気ディスク基板、るつぼ容器
等の多様な用途に用いることができる。
However, in the present invention, a phenol resin high-flow molding material is used, the filling rate of the molten resin into the mold is 5 to 30 cm 3 / sec, and the mold clamping pressure is 70 to 90.
By performing injection molding at kgf / cm 2 , it becomes possible to mass-produce a uniform phenolic resin high-flow molded body with few defects. Further, by curing the molded body obtained by the present invention at a predetermined temperature, various products having a high degree of curing can be obtained. By baking at high temperature in a gas atmosphere, it becomes a carbon material such as high-purity amorphous carbon (glassy carbon) and high-purity graphite, and can be used for various uses such as a magnetic disk substrate and a crucible container.

【0025】[0025]

【実施例】次に本発明を実施例によって具体的に説明す
るが、本発明はこれら実施例により限定されない。
EXAMPLES Next, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples.

【0026】参考例 ノボラック樹脂(三井東圧化学(株)製#600)15
0重量部を160℃で溶融して、完全けん化ポリビニル
アルコール(重合度約2000)1重量部を溶解した9
0℃の熱水(220重量部)中へ攪拌しながら投入して
分散し懸濁系を形成し、続いてヘキサミン24重量部を
40重量部の温水に溶解して添加し、さらに同温度にて
20分間攪拌を続けて懸濁重合を行い、反応を終了、懸
濁体を固液分離し、乾燥して粒状フェノール樹脂成形材
料を得た。このフェノール樹脂成形材料の特性を表1に
示す。
Reference Example Novolak resin (# 600 manufactured by Mitsui Toatsu Chemicals, Inc.) 15
0 parts by weight were melted at 160 ° C. to dissolve 1 part by weight of completely saponified polyvinyl alcohol (degree of polymerization: about 2000).
The mixture was poured into hot water (220 parts by weight) at 0 ° C. with stirring to disperse and form a suspension, and then 24 parts by weight of hexamine was dissolved in 40 parts by weight of warm water and added. The suspension was stirred for 20 minutes to carry out suspension polymerization to terminate the reaction. The suspension was separated into solid and liquid and dried to obtain a granular phenolic resin molding material. Table 1 shows the properties of the phenolic resin molding material.

【0027】ただし、表1に示すこれらの特性は次の方
法で測定した。熱流動性(HPF)は、JIS−K−6
911(1979)5.3.2〔成形材料(円板式)〕
の方法に基づき、試料2gを160℃で1分間1145
kgの荷重下で熱プレスし、形成される円板の直径(最
長径と最短径の平均値)から求めた。平均粒径は、試料
をガラスプレート上に展開して顕微鏡写真を撮り、任意
に選んだ100個の粒径を測定して、その平均値で示し
た。水分は、赤外線ヒーターを用い、試料10gを80
℃で30分間加熱しその重量減少から求めた。
However, these characteristics shown in Table 1 were measured by the following methods. Thermal fluidity (HPF) is JIS-K-6
911 (1979) 5.3.2 [Molding material (disc type)]
2 g of a sample at 1150 ° C. for 1 minute
It was hot pressed under a load of kg and determined from the diameter (average value of the longest diameter and the shortest diameter) of the formed disk. The average particle size was obtained by developing a sample on a glass plate, taking a micrograph, measuring 100 randomly selected particle sizes, and indicating the average value. The moisture was measured using an infrared heater,
C. for 30 minutes and the weight loss was determined.

【0028】[0028]

【表1】 [Table 1]

【0029】実施例1〜12 参考例で製造した表1に示す特性を有するフェノール樹
脂成形材料を用い、M150BL−TS型射出成形機
(株式会社名機製作所製)を用いて、表2に示す条件
で、直径260mm、厚さ5.2mm、目付350gの
円板を成形し、この成形品について、次に述べる方法で
気泡発生率を計算した結果を表2に示す。 気泡発生率:(直径100μm以上の気泡が発生した成
形品の数÷ショット数)×100
Examples 1 to 12 Using the phenolic resin molding materials having the properties shown in Table 1 produced in Reference Examples, and using an M150BL-TS injection molding machine (manufactured by Meiki Seisakusho), the results are shown in Table 2. A disk having a diameter of 260 mm, a thickness of 5.2 mm, and a basis weight of 350 g was formed under the conditions, and the bubble generation rate of the formed product was calculated by the method described below. Bubble generation rate: (the number of molded articles in which bubbles with a diameter of 100 μm or more were generated / the number of shots) × 100

【0030】[0030]

【表2】 [Table 2]

【0031】比較例1〜9 参考例で製造した表1に示す特性を有するフェノール樹
脂成形材料を用い、M150BL−TS型射出成形機
(株式会社名機製作所製)を用いて、表3に示す条件
で、直径260mm、厚さ5.2mm、目付350gの
円板を成形し、この成形品について、前記のようにして
気泡発生率を計算した結果を表3に示す。
Comparative Examples 1 to 9 Using phenolic resin molding materials having the properties shown in Table 1 produced in Reference Examples, and using an M150BL-TS type injection molding machine (manufactured by Meiki Seisakusho), the results are shown in Table 3. A disk having a diameter of 260 mm, a thickness of 5.2 mm, and a basis weight of 350 g was molded under the conditions, and the bubble generation rate of this molded product was calculated as described above, and the results are shown in Table 3.

【0032】[0032]

【表3】 [Table 3]

【0033】本実施例で得られた成形体は、いずれも不
活性ガス中で1600℃で焼成すると、高純度のアモル
ファスカーボン材料となることが確認された。
It was confirmed that all of the compacts obtained in the present example became high-purity amorphous carbon materials when fired at 1600 ° C. in an inert gas.

【0034】[0034]

【発明の効果】本発明によれば、過硬化物等の欠陥を殆
ど含まず、硬化度が均一であって、しかも気泡等を含む
ことなく均一なフェノール樹脂高流動成形体を生産性良
く得ることができ、大量生産が可能である。また、本発
明の方法によって得られるフェノール樹脂高流動成形体
は、気泡発生率が低く、安価で耐熱性、剛性率、硬度、
電気絶縁性、耐薬品性等の諸特性が優れ、光学部品、容
器、ウインドー材等の製品として多様な用途に好適に使
用することができる。さらに、本発明の方法によって得
られるフェノール樹脂高流動成形体は、真空または不活
性雰囲気中で高温焼成することにより高純度の炭素材料
とすることができ、この炭素材料は磁気ディスク基板、
坩堝容器等の多様な用途に用いることができる。
According to the present invention, it is possible to obtain a high-flowability molded article of a phenolic resin which has almost no defects such as overcured products, has a uniform curing degree, and has no air bubbles. And mass production is possible. In addition, the phenolic resin high-flow molded article obtained by the method of the present invention has a low bubble generation rate, is inexpensive and has heat resistance, rigidity, hardness,
It has excellent properties such as electrical insulation and chemical resistance, and can be suitably used for various applications as products such as optical parts, containers, and window materials. Further, the phenolic resin high-fluidity molded product obtained by the method of the present invention can be made into a high-purity carbon material by firing at a high temperature in a vacuum or an inert atmosphere.
It can be used for various applications such as crucible containers.

フロントページの続き (72)発明者 山尾 睦矩 京都府宇治市宇治小桜23番地 ユニチカ株 式会社中央研究所内 (72)発明者 伊吹 洋 京都府宇治市宇治小桜23番地 ユニチカ株 式会社中央研究所内Continued on the front page (72) Inventor, Mutsunori Yamao 23 Uji Kozakura, Uji-city, Kyoto, Japan Unitika Central Research Laboratories (72) Inventor Hiroshi Ibuki 23 Uji Kozakura, Uji-city, Kyoto, Japan Unitika Central Research Laboratories

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 粒径が50μm以上で、ディスクキュア
ー法で測定した熱流動性が60〜180mmである粒状
フェノール樹脂の表層に、融点が30〜160℃の低表
面張力物質が対フェノール樹脂組成比0.1〜5重量%
被覆されてなるフェノール樹脂成形材料を射出成形する
に際し、溶融樹脂の金型内への充填速度を5〜30cm
3 /sec、型締め圧力を70〜90kgf/cm2
して射出成形することを特徴とするフェノール樹脂高流
動成形体の製造方法。
1. A low surface tension substance having a melting point of 30 to 160 ° C. on a surface layer of a granular phenol resin having a particle diameter of 50 μm or more and a heat fluidity of 60 to 180 mm measured by a disc cure method, based on the phenol resin composition. 0.1-5% by weight
When injection molding the coated phenolic resin molding material, the filling speed of the molten resin into the mold is 5 to 30 cm.
A method for producing a phenolic resin high flow molded article, wherein injection molding is performed at a pressure of 70/90 kgf / cm 2 at 3 / sec.
JP9048397A 1997-04-09 1997-04-09 Manufacture of phenol resin high-flow molded body Pending JPH10278079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9048397A JPH10278079A (en) 1997-04-09 1997-04-09 Manufacture of phenol resin high-flow molded body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9048397A JPH10278079A (en) 1997-04-09 1997-04-09 Manufacture of phenol resin high-flow molded body

Publications (1)

Publication Number Publication Date
JPH10278079A true JPH10278079A (en) 1998-10-20

Family

ID=13999816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9048397A Pending JPH10278079A (en) 1997-04-09 1997-04-09 Manufacture of phenol resin high-flow molded body

Country Status (1)

Country Link
JP (1) JPH10278079A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003026900A (en) * 2001-07-17 2003-01-29 Unitika Ltd Method for producing resin material for injection molding
JP2014190618A (en) * 2013-03-27 2014-10-06 Asahi- Seiki Manufacturing Co Ltd Method for manufacturing frangible bullet
JP2019069522A (en) * 2017-10-05 2019-05-09 住友ベークライト株式会社 Method for producing molded product of thermosetting resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003026900A (en) * 2001-07-17 2003-01-29 Unitika Ltd Method for producing resin material for injection molding
JP2014190618A (en) * 2013-03-27 2014-10-06 Asahi- Seiki Manufacturing Co Ltd Method for manufacturing frangible bullet
JP2019069522A (en) * 2017-10-05 2019-05-09 住友ベークライト株式会社 Method for producing molded product of thermosetting resin composition

Similar Documents

Publication Publication Date Title
JPH045693B2 (en)
CN1393504A (en) Liquid crystal polyester resin mixture
JPS61258829A (en) Polyamide coated particle and its production
JP4084446B2 (en) Phenolic resin molding material
JPH10278079A (en) Manufacture of phenol resin high-flow molded body
JP3249257B2 (en) Amorphous carbon molded body and method for producing the same
JPH06207084A (en) Thermoplastic molding composition for producing inorganic sintered molding and production of the sintered molding
JP3425986B2 (en) Phenolic resin high flow molding and molding method thereof
US2753314A (en) Composition comprising a gelling agent and a dispersion of a vinyl resin in a plasticizer
JPH06184349A (en) Interconnected porous body and its production
JPH06206957A (en) Phenolic resin molding material
JP2001089239A (en) High heat conductivity amorphous carbon composite
JPS61233026A (en) Production of porous film
JPS5966440A (en) Vinyl chloride resin composition for powder molding
JPH11342518A (en) Injection molding of phenol resin
JPH09316266A (en) Tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer composition
JP2794753B2 (en) Polyester molding material
JPH0153697B2 (en)
BE1004037A5 (en) Compositions based rigid vinyl chloride having aliphatic polyol as an buck viscosity and use thereof for finishing rigid articles by injection molding.
JPS63190779A (en) Manufacture of silicon carbide porous body
JPH0881272A (en) Preparation of binder for ceramic material,thermally processable material and inorganic sintered molding
JP3809895B2 (en) Method for producing acrylic resin plastisol molded product
JPH06279099A (en) Binder for refractory and preparation of refractory granule using the binder
JP2002103369A (en) Method for manufacturing injection molding
JPS5974146A (en) Vinyl chloride resin composition