JP3425986B2 - Phenolic resin high flow molding and molding method thereof - Google Patents

Phenolic resin high flow molding and molding method thereof

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Publication number
JP3425986B2
JP3425986B2 JP02067593A JP2067593A JP3425986B2 JP 3425986 B2 JP3425986 B2 JP 3425986B2 JP 02067593 A JP02067593 A JP 02067593A JP 2067593 A JP2067593 A JP 2067593A JP 3425986 B2 JP3425986 B2 JP 3425986B2
Authority
JP
Japan
Prior art keywords
molding
phenol resin
resin
weight
surface tension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP02067593A
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Japanese (ja)
Other versions
JPH06206234A (en
Inventor
新吾 佐佐木
陸矩 山尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
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Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP02067593A priority Critical patent/JP3425986B2/en
Publication of JPH06206234A publication Critical patent/JPH06206234A/en
Application granted granted Critical
Publication of JP3425986B2 publication Critical patent/JP3425986B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Magnetic Record Carriers (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、フェノール樹脂高流動
成形体及びその成形法に関し、詳しくは、安価で高精密
な光学部品用フェノール樹脂高流動成形体及び高純度の
成形材料等の二次加工品に好適に仕上げることができる
フェノール樹脂高流動成形体及びその成形法に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin high-fluidity molded article and a molding method thereof, and more particularly, to an inexpensive and highly precise phenolic resin high-fluidity molded article for optical parts The present invention relates to a phenolic resin high-fluidity molded product that can be suitably finished into a processed product and a molding method thereof.

【0002】[0002]

【従来の技術】フェノール樹脂は安価で耐熱性、剛性
率、硬度、電気絶縁性、耐薬品性等の諸特性が優れた樹
脂として、古来、電気材料等の各種製品に多用されてい
るが、大部分の製品は、液状の原料を用い、これに紙、
布、ガラス繊維、無機フィラー等の補強材、充填材を配
合して成形した複合熱硬化性樹脂成形体であった。この
成形体は、安価ではあるが、未反応のフェノールを多く
含み、気泡の混入が避けられず、したがって特性的にも
高度なものは望めないので、高性能製品には利用され得
なかった。それに対して最近、高純度の常温にて固体
(粉粒体)の熱流動性を有する成形材料(以後、熱流動
性粒状成形材料と略称する。)が登場し、各種高性能部
品の素材として広く普及しつつある。
2. Description of the Related Art Phenolic resin is inexpensive and has been widely used for various products such as electric materials since ancient times as a resin excellent in various properties such as heat resistance, rigidity, hardness, electric insulation and chemical resistance. Most of the products use liquid raw materials and paper,
It was a composite thermosetting resin molded product formed by blending cloth, glass fiber, a reinforcing material such as an inorganic filler, and a filler. Although this molded product is inexpensive, it contains a large amount of unreacted phenol, and the inclusion of bubbles is unavoidable. Therefore, it cannot be expected that the molded product has a high level of properties, so it could not be used as a high-performance product. On the other hand, recently, a molding material having a high purity and a solid (powder granule) heat fluidity at room temperature (hereinafter, abbreviated as a heat fluid granular molding material) has appeared, and as a raw material for various high performance parts. It is becoming widespread.

【0003】本材料は、フェノール樹脂の成形法として
最も一般的に用いられてきた圧縮成形法以外にトランス
ファー成形法、射出成形法あるいは押出成形法(以後、
単に高流動成形法と略称する。また、「トランスファー
成形、射出成形あるいは押出成形」又は「トランスファ
ー成形体、射出成形体あるいは押出成形体」について
も、同様に高流動成形、又は高流動成形体と略称す
る。)のような高流動状態で成形する、したがって高精
度で生産性の高い成形法にも適用できる成形用樹脂であ
って、従来の積層板ような比較的単純な形状のものから
精密電気・機械部品のような複雑な高寸法精度を要求さ
れる成形製品にまで、多様な製品を成形できる素材であ
る。
In addition to the compression molding method which has been most commonly used as a molding method for phenolic resins, this material has a transfer molding method, an injection molding method or an extrusion molding method (hereinafter referred to as "molding method").
It is simply referred to as a high flow molding method. Further, “transfer molding, injection molding or extrusion molding” or “transfer molding, injection molding or extrusion molding” is also abbreviated as high flow molding or high flow molding. ) Is a molding resin that can be molded in a highly fluid state such as the above, and therefore can be applied to a molding method with high accuracy and high productivity. It is a material that can be used to form a wide variety of products, including molded products that require complex high dimensional accuracy such as parts.

【0004】ところで、従来のフェノール樹脂成形材料
は、このような高流動成形可能な熱流動性粒状成形材料
でも、通常、特公平1−38816号公報に記載のよう
に、ガラス繊維ような繊維補強材やステアリン酸亜鉛の
ような金属含有有機滑剤を含むものでないと満足な成形
ができない現状にある。すなわち、かかる成形材料から
ガラス繊維や金属含有有機滑剤を除いたフェノール樹脂
成形材料を高流動成形すると成形機のシリンダー内で、
成形材料のスムーズな流動性が損なわれ、安定してかつ
高精度に成形することが困難となる。
By the way, the conventional phenol resin molding material, even such a heat-fluidable granular molding material capable of high flow molding, is usually fiber-reinforced such as glass fiber as described in Japanese Patent Publication No. 1-38816. In the present situation, satisfactory molding cannot be achieved unless a material or an organic lubricant containing metal such as zinc stearate is included. That is, in a cylinder of a molding machine when high flow molding of a phenol resin molding material from which a glass fiber or a metal-containing organic lubricant is removed from such a molding material,
The smooth fluidity of the molding material is impaired, making it difficult to mold stably and with high precision.

【0005】一方、ポリメタクリル樹脂、ポリカーボネ
ート樹脂のような透明樹脂を用いた透明成形品に相当す
るような透明なフェノール樹脂成形品が成形できれば上
記フェノール樹脂の特性を有し、しかも透明なので、上
記した従来品に比較して一段と高性能で安価な光学部
品、容器、ウインドー材等の製品として多様な用途展開
が期待されるが、現状では圧縮成形(熱プレス成形)に
て板状体のような比較的単純な形状の製品が得られるの
みで、しかもサイクルタイムが長くかかるため高価なも
のしか生産できない状況にある。ちなみに、高流動成形
法にてこれを成形しようとすると、上記した繊維補強材
や金属含有有機滑剤を配合した成形品は透明性が失われ
るため、未だにこのような高流動成形体製品は開発され
ていない。
On the other hand, if a transparent phenol resin molded product corresponding to a transparent molded product using a transparent resin such as a polymethacrylic resin or a polycarbonate resin can be molded, it has the characteristics of the above-mentioned phenol resin and is transparent. It is expected that it will be used in various applications as products such as optical parts, containers, window materials, etc. that have higher performance and are more inexpensive than the conventional products, but at present, it is like a plate-shaped body by compression molding (hot press molding). However, only a relatively simple product can be obtained, and since the cycle time is long, only expensive products can be produced. By the way, if it is attempted to mold it by the high flow molding method, the molded product containing the above-mentioned fiber reinforcement and metal-containing organic lubricant loses its transparency, so such a high flow molded product has not yet been developed. Not not.

【0006】透明なフェノール樹脂成形品は、上記した
透明樹脂製品以外に、これを真空中または不活性ガス雰
囲気中で高温焼成することにより、高純度のアモルファ
スカーボン(グラッシーカーボン)、グラファイト等の
ような炭素材料として磁気ディスク基盤、坩堝容器等の
多様な用途に用いることができる。例えば、磁気ディス
ク基盤の場合、板状成形体の板表面の平滑性が高度に優
れたものを要求され、そのために成形品表面を精密研磨
して仕上げる方法がとられているが、この際、気泡、不
純物、局在金属の存在が研磨面の欠陥となって顕れるの
で、従来品では低グレードのものしか得られていなかっ
た。フェノール樹脂は、上記したような焼成処理により
容易に炭素化し得る炭素材料調製用の原料として最もよ
く用いられているものの一つであるが、従来のフェノー
ル樹脂素材の場合は、重合工程及び成形工程上にて、必
然的に上記欠陥要因の夾雑が避けられず、高性能の炭素
材料用には用いられなかったものである。
In addition to the above-mentioned transparent resin products, transparent phenol resin molded products can be obtained by burning them at high temperature in a vacuum or in an inert gas atmosphere to obtain high-purity amorphous carbon (glassy carbon), graphite, etc. As a carbon material, it can be used in various applications such as magnetic disk substrates and crucible containers. For example, in the case of a magnetic disk substrate, it is required that the flatness of the plate surface of the plate-shaped molded article is extremely high, and therefore a method of precision polishing the surface of the molded product to finish it is used. Since the presence of bubbles, impurities, and localized metals appear as defects on the polished surface, only low-grade products have been obtained in the conventional products. Phenol resin is one of the most used as a raw material for preparing a carbon material that can be easily carbonized by the above-mentioned firing treatment, but in the case of a conventional phenol resin material, a polymerization process and a molding process are performed. Above all, the contamination of the above-mentioned defect factors is unavoidable, and it has not been used for high-performance carbon materials.

【0007】[0007]

【発明が解決しようとする課題】かかる状況に鑑み、本
発明は、磁気ディスク炭素基盤等の二次加工品にも好適
に仕上げることができるフェノール樹脂高流動成形体及
びその成形法を提供することを目的とするものである。
In view of the above situation, the present invention provides a phenol resin high flow molded article and a molding method thereof, which can be suitably finished to a secondary processed product such as a magnetic disk carbon substrate. The purpose is.

【0008】[0008]

【課題を解決するための手段】本発明者らは、本課題を
解決すべく鋭意研究を行った結果、透明性に優れ、気泡
及び金属を殆ど含まぬフェノール樹脂高流動成形体によ
り本課題が解決されることを見出し、本発明に到達した
ものである。
Means for Solving the Problems As a result of intensive studies to solve the problems, the present inventors have found that the problems can be solved by a phenol resin high-fluidity molded article having excellent transparency and containing almost no bubbles or metal. The present invention has been found to be solved and has reached the present invention.

【0009】すなわち、本発明は、波長800nm の可視光
線の光路1mm当りの光透過率80%以上、1cm3 当り孔径
100 μm 以上、好ましくは20μm 以上の気孔が1個未
満、金属含有率が200 重量ppm 以下であることを特徴と
するフェノール樹脂高流動成形体を要旨とするものであ
る。また、本発明は、水分含有量が1重量%以下、粒径
が50μm 以上で、ディスクキュアー法で測定した熱流動
性が60〜160mm である粒状フェノール樹脂の表層に、融
点が30〜160 ℃の低表面張力物質が対フェノール樹脂組
成比0.2 〜5 重量%量被覆されてなるフェノール樹脂成
形材料をトランスファー成形、射出成形あるいは押出成
形することを特徴とする上記フェノール樹脂高流動成形
体の成形法を要旨とするものである。
That is, the present invention has a light transmittance of 80% or more per 1 mm of the optical path of visible light having a wavelength of 800 nm and a pore diameter per 1 cm 3.
A gist of a phenol resin high-fluidity molded article characterized by having less than 1 pore having a size of 100 μm or more, preferably 20 μm or more and a metal content of 200 ppm by weight or less. The present invention also has a melting point of 30 to 160 ° C. on the surface layer of a granular phenol resin having a water content of 1% by weight or less, a particle size of 50 μm or more and a thermal fluidity of 60 to 160 mm as measured by the disc cure method. The method for molding a high flow molding of a phenol resin, characterized in that the phenol resin molding material coated with the low surface tension substance of 0.2 to 5% by weight relative to the phenol resin is subjected to transfer molding, injection molding or extrusion molding. Is the gist.

【0010】以下、本発明について詳細に説明する。光
透過率は波長800nm の可視光線の試料厚さ1mm当りの入
射光と出射光の強度比を百分率で表した値(以後単に光
透過率と称する)であり、物質の透明性を定量表示する
と共に物質の純度を表す尺度でもある。フェノール樹脂
の光透過率は、それが完全に高純度のものでもキノイド
系副反応生成物等の分子性光吸収物の存在によって95%
以上にはならないが、95%未満の場合は、その差がフェ
ノール樹脂以外の微小な夾雑不純物や微細気孔、ボイド
等による光の吸収、散乱等の損失を表しており、この値
が80%未満の場合は炭素材料にしたとき研磨面の表面平
滑性に有意なる欠陥が顕れる。
The present invention will be described in detail below. The light transmittance is a value that expresses the intensity ratio of incident light and emitted light per 1 mm of sample thickness of visible light of wavelength 800 nm as a percentage (hereinafter simply referred to as light transmittance), and quantitatively displays the transparency of a substance. It is also a measure of the purity of a substance. The light transmittance of phenol resin is 95% due to the presence of molecular light absorbers such as quinoid side reaction products, even if it is completely pure.
If it is less than 95%, the difference indicates the loss of light absorption and scattering by minute contaminant impurities other than phenol resin, fine pores, voids, etc., and this value is less than 80%. In the case of, when the carbon material is used, a significant defect appears in the surface smoothness of the polished surface.

【0011】また気孔の存在も上記と同様に欠陥とな
り、特に孔径100 μm 以上の気孔は重欠陥となる。ただ
し、もとの成形体にて1cm3 当り孔径100 μm 以上の気
孔が1個未満の場合は、ほとんど同上平滑性に影響が顕
れない。
The existence of pores also becomes a defect as described above, and especially pores having a pore diameter of 100 μm or more become serious defects. However, if the number of pores having a pore size of 100 μm or more per 1 cm 3 is less than 1 in the original molded body, there is almost no effect on the smoothness.

【0012】また、金属の混入は、それが単体金属、あ
るいは金属酸化物、金属炭化物、金属硫化物、金属炭酸
化物、金属硫酸化物等の金属化合物、又は有機酸塩類、
錯塩類、キレート類等の有機金属化合物等いずれの形で
存在する場合でも、炭素材料に仕上げた時に炭素素材中
に夾雑する微小な単体金属、金属酸化物、金属炭化物、
等の局在金属となり、その近傍の炭素を異質化して欠陥
となる。ただしもとの成形体の金属含有率が200 重量pp
m 以下である場合には研磨面の表面平滑度に殆ど影響が
顕れない。
[0012] The mixing of the metal may be a simple metal, a metal compound such as a metal oxide, a metal carbide, a metal sulfide, a metal carbonate or a metal sulfate, or an organic acid salt.
Even if it exists in any form such as complex salts and organometallic compounds such as chelates, minute single metals, metal oxides, metal carbides that are contaminated in the carbon material when finished into a carbon material,
It becomes a localized metal such as, and the carbon in the vicinity becomes heterogeneous, resulting in a defect. However, the metal content of the original compact is 200 weight pp
When it is less than m, the surface smoothness of the polished surface is hardly affected.

【0013】しかも、本発明のフェノール樹脂成形体は
高流動成形体であるので、圧縮成形体等の従来の成形体
に比較して、組織が均一で、重合度、架橋度、分岐度等
の化学構造、ラテラルオーダー、ボイド、粒界等の微細
組織及び局部歪み等の微視的物性等の構造・物性におい
て斑が殆どない。本発明の成形体のこのような均質度の
良さは、透明体の光学特性において重要な利点をもたら
すのみならず、これを炭素材料に仕上げたときにも、大
きな優位性を発揮する。すなわち、本発明の成形体より
なる炭素材料は、成形体表面研磨面の平滑度が優れ、し
かも厚みの薄いシートでも歪みとか撓み等の変形が殆ど
顕れない。
Moreover, since the phenol resin molded product of the present invention is a high-flow molded product, it has a more uniform structure and has a higher degree of polymerization, crosslinking degree, branching degree, etc. than conventional molded products such as compression molded products. There are almost no irregularities in the structure / physical properties such as chemical structure, lateral order, voids, grain boundaries and other microstructures, and local strain and other microscopic physical properties. Such good homogeneity of the molded body of the present invention not only brings important advantages in the optical properties of the transparent body, but also exerts a great advantage when it is finished into a carbon material. That is, the carbon material comprising the molded body of the present invention has excellent smoothness on the polished surface of the molded body, and even if the sheet is thin, deformation such as distortion or bending hardly appears.

【0014】次に、本発明のフェノール樹脂高流動成形
体の成形法について詳述する。本発明の成形法は、水分
含有量が1重量%以下、粒径が50μm 以上で、ディスク
キュアー法で測定した熱流動性が60〜160mm である粒状
フェノール樹脂の表層に、融点が30〜160 ℃の低表面張
力物質が対フェノール樹脂組成比0.2 〜5 重量%量被覆
されてなるフェノール樹脂成形材料をトランスファー成
形、射出成形あるいは押出成形する方法を要旨とする。
Next, the molding method of the phenol resin high flow molding of the present invention will be described in detail. According to the molding method of the present invention, the melting point is 30 to 160 on the surface layer of granular phenol resin having a water content of 1% by weight or less, a particle size of 50 μm or more and a thermal fluidity of 60 to 160 mm as measured by the disc cure method. The gist is a method of transfer molding, injection molding or extrusion molding of a phenol resin molding material, which is coated with a low surface tension substance at a temperature of 0.degree.

【0015】粒状フェノール樹脂としては、粒径が50μ
m 以上、好ましくは100 μm 以上で、ディスクキュアー
法で測定した熱流動性が60〜160mm であるフェノール樹
脂が好適に使用することができる。ここで、粒径とは、
粒体の平均最大径(外接球直径)を表す。粒径が50μm
未満の場合は、成形機への供給が安定して行えない。粒
径の上限には特に制限はない。例えば、実用的な粒径と
しては100 〜4000μm が適当である。粒体形状は球形、
円筒形、立方体形等いずれでも良いが粒径が小さい場合
は球形の方が成形中の輸送性が優れている。
The granular phenol resin has a particle size of 50 μm.
Phenolic resins having a m or more, preferably 100 μm or more and a thermal fluidity of 60 to 160 mm as measured by the disc cure method can be preferably used. Here, the particle size is
Shows the average maximum diameter (circumscribed sphere diameter) of the granules. Particle size is 50 μm
If it is less than the above, the supply to the molding machine cannot be performed stably. There is no particular upper limit on the particle size. For example, a practical particle size of 100 to 4000 μm is suitable. The grain shape is spherical,
Either a cylindrical shape or a cubic shape may be used, but if the particle size is small, the spherical shape is superior in transportability during molding.

【0016】本発明における熱流動性とは常温にては固
体であるが、加熱状態にて負荷をかけたときに流動性を
示す特性をいうが、ただし、通常の熱可塑性の樹脂の場
合と異なって自己硬化性を有するので、ある程度以上長
時間流動性を示す温度にて加熱を続けると分子内及び/
又は分子間での縮合が始まって架橋が形成され硬化する
性質をもっている。この熱流動性を表す尺度として、後
記するJIS規格(ディスクキュアー法)で測定した16
0 ℃における所定荷重下の試料樹脂円板の流れ(直径の
伸び;mm)で表す。この熱流動性が60mm未満の樹脂は成
形性が悪くなり、他方、160mm を越える樹脂は、硬化反
応に必要な時間が長くなるため生産性が悪く、しかも、
硬化反応によって生成する水分等が成形品内へ閉じ込め
られるため、欠陥製品となる恐れがある。
The term "thermofluidity" as used in the present invention means a characteristic that it is solid at room temperature but shows fluidity when a load is applied in a heated state, except that it is the case of a usual thermoplastic resin. Since they have different self-hardening properties, if they are heated at a temperature at which they have fluidity for a certain period of time or longer
Alternatively, it has the property that intermolecular condensation begins to form crosslinks and cure. As a measure of this heat fluidity, it was measured by the JIS standard (disc cure method) described later.
It is expressed as the flow (diameter extension; mm) of a sample resin disk under a predetermined load at 0 ° C. A resin having a heat fluidity of less than 60 mm has poor moldability, while a resin having a heat fluidity of more than 160 mm has a poor productivity due to the long time required for the curing reaction, and
Moisture and the like generated by the curing reaction are trapped in the molded product, which may result in a defective product.

【0017】粒状フェノール樹脂の製造法としては、例
えば特開平4−159320号公報記載の方法のよう
に、ノボラック樹脂をヘキサメチレンテトラミンのよう
なアルカリ触媒兼メチレン架橋剤及び懸濁安定剤の存在
下、水媒体中で懸濁重合を行う方法(自己硬化型変性ノ
ボラック樹脂法)、フェノール及びホルムアルデヒドを
塩基性触媒及び懸濁安定剤の存在下、水性媒体中にて懸
濁重合を行う方法等の重合法(固形レゾール樹脂法)が
好適に採用することができる。これらの方法にては、極
めて高純度で真球状に近い球状微粒体が得られる。粒径
の大きな成形原料を得るには、上記微粒体を造粒して所
定の粒度の原料を調製する方法が有効である。
As a method for producing a granular phenol resin, for example, as in the method described in JP-A-4-159320, a novolak resin is prepared in the presence of an alkali catalyst such as hexamethylenetetramine and a methylene crosslinking agent and a suspension stabilizer. , A method of carrying out suspension polymerization in an aqueous medium (self-curing modified novolac resin method), a method of carrying out suspension polymerization of phenol and formaldehyde in an aqueous medium in the presence of a basic catalyst and a suspension stabilizer. A polymerization method (solid resole resin method) can be preferably adopted. By these methods, spherical fine particles having an extremely high purity and a nearly spherical shape can be obtained. In order to obtain a forming raw material having a large particle size, it is effective to granulate the above-mentioned fine particles to prepare a raw material having a predetermined particle size.

【0018】低表面張力物質は、融点が30℃〜160 ℃の
常温にて固体状の低融点化合物で、かつ潤滑性、離型
性、非付着性等の低表面張力物質(例えば常温[ 25℃]
で臨界表面張力が約35ダイン/cm以下の物質)に特有の
特性を有する化合物であって、特に金属塩類のような金
属元素を含まないものが好ましい。
The low surface tension substance is a low melting point compound which is solid at room temperature and has a melting point of 30 ° C. to 160 ° C., and has a low surface tension substance such as lubricity, releasability and non-adhesiveness (for example, at room temperature [25 ℃]
And a compound having a critical surface tension of about 35 dynes / cm or less), which is a compound having a characteristic peculiar to the compound and does not contain a metal element such as a metal salt is preferable.

【0019】代表的な例としては、ラウリン酸、パルミ
チン酸、ステアリン酸等の高級脂肪酸;ラウリン酸モノ
グリセライド、エチルステアレート、ステアリン酸モノ
グリセライド、ソルビタンモノパルミテート、ソルビタ
ンモノステアレート等の高級脂肪酸エステル;トリラウ
リン、トリステアリン、硬化ひまし油等の固形油脂類;
ステアリン酸アマイド、エチレンビスステアリン酸アマ
イド等の高級脂肪酸アマイド;セチルアルコール、ステ
アリルアルコール等の高級脂肪族アルコール;ステアリ
ルメタクリレート、ステアリルアクリレート等の高級脂
肪族(メタ)アクリレート;パラフィンワックス等のワ
ックス状炭化水素;パーフルオロオクタン酸、9H−ヘ
キサデカフルオロノナノン酸等の含多価フッ素高級脂肪
酸;N−エチルパーフルオロオクチルスルホンアミド等
の含多価フッ素高級脂肪族スルホンアミド;2−(パー
フルオロオクチル)沃化エチル、2−(パーフルオロデ
シル)沃化エチル等の含多価フッ素高級脂肪族沃化物;
1H,1H,9H−ヘキサデカフルオロノナノール、2−
(パーフルオロオクチル)エタノール、2−(パーフル
オロデシル)エタノール等の含多価フッ素高級脂肪族ア
ルコール;2−(パーフルオロデシル)メチルメタクリ
レート、1H,1H,11H−アイコサフルオロウンデシル
アクリレート等の含多価フッ素高級脂肪族(メタ)アク
リレート;パーフルオロドデカン等の含多価フッ素高級
脂肪族炭化水素;2−(P −オキシ安息香酸メチル・ヘ
キサフルオロプロペン3量体付加物等の含多価フッ素脂
肪族芳香族化合物、ペンタフルオロベンズアミド等の含
多価フッ素芳香族炭化水素;TFEワックス(テトラフ
ルオロエチレンテロマー)、CTFEテロマー(クロロ
トリフルオロエチレンテロマー)等の含多価フッ素オリ
ゴマー化合物等、あるいはこれらの誘導体、これらの一
種以上よりなる混合物並びにこれらに重合触媒等の添加
物を配合した組成物等の低表面張力物質が挙げられる。
Typical examples are higher fatty acids such as lauric acid, palmitic acid and stearic acid; higher fatty acid esters such as lauric acid monoglyceride, ethyl stearate, stearic acid monoglyceride, sorbitan monopalmitate and sorbitan monostearate; Solid fats and oils such as trilaurin, tristearin and hydrogenated castor oil;
Higher fatty acid amides such as stearic acid amide and ethylenebisstearic acid amide; higher aliphatic alcohols such as cetyl alcohol and stearyl alcohol; higher aliphatic (meth) acrylates such as stearyl methacrylate and stearyl acrylate; waxy hydrocarbons such as paraffin wax Polyvalent fluorine-containing higher fatty acids such as perfluorooctanoic acid and 9H-hexadecafluorononanoic acid; polyvalent fluorine-containing higher aliphatic sulfonamides such as N-ethylperfluorooctylsulfonamide; 2- (perfluorooctyl) Polyvalent fluorine-containing higher aliphatic iodide such as ethyl iodide and 2- (perfluorodecyl) ethyl iodide;
1H, 1H, 9H-hexadecafluorononanol, 2-
(Perfluorooctyl) ethanol, 2- (perfluorodecyl) ethanol and other polyvalent fluorine higher aliphatic alcohols; 2- (perfluorodecyl) methyl methacrylate, 1H, 1H, 11H-eicosafluoroundecyl acrylate, etc. Polyvalent fluorine-containing higher aliphatic (meth) acrylate; Polyvalent fluorine-containing higher aliphatic hydrocarbon such as perfluorododecane; Multi-valued containing 2- (P-hydroxybenzoic acid methyl hexafluoropropene trimer adduct) Fluorine aliphatic aromatic compounds, polyvalent fluorine aromatic hydrocarbons such as pentafluorobenzamide; polyvalent fluorine oligomer compounds such as TFE wax (tetrafluoroethylene telomer), CTFE telomer (chlorotrifluoroethylene telomer), etc., or These derivatives, a mixture of one or more of these And low surface tension materials, such composition containing an additive such as these polymerization catalysts.

【0020】フェノール樹脂成形材料は、上記粒状フェ
ノール樹脂の粒体表面に上記低表面張力物質が対フェノ
ール樹脂組成比0.2 〜5 重量%好ましくは0.3 〜3重量
%被覆されてなる複合粒状組成物であって、従来、使用
されていた圧縮成形のみならず、トランスファー成形、
射出成形、あるいは押出成形等の高流動成形にても使用
できる成形材料である。
The phenol resin molding material is a composite granular composition in which the surface of the granular phenol resin particles is coated with the low surface tension substance in a proportion of 0.2 to 5% by weight, preferably 0.3 to 3% by weight, relative to the composition ratio of phenol resin. So, not only the compression molding that has been used in the past, but also transfer molding,
It is a molding material that can be used for high-flow molding such as injection molding or extrusion molding.

【0021】低表面張力物質が0.2 重量%未満では、成
形の際に、成形機のシリンダー内で閉塞が起こり連続し
て成形を行うことが困難になることがあり、他方、5重
量%を越えると成形性の向上効果が頭打ちとなり、また
透明な成形品が得にくい傾向がある。
When the content of the low surface tension substance is less than 0.2% by weight, it may be difficult to continuously perform molding due to blockage in the cylinder of the molding machine during molding, while it exceeds 5% by weight. Therefore, the effect of improving the moldability reaches a ceiling, and it tends to be difficult to obtain a transparent molded product.

【0022】粒状フェノール樹脂に対する低表面張力物
質の被覆は、各粒子間にてできるだけ均一に分布し、し
かも膜厚が均等であるように施されているものが好まし
い。
The coating of the low surface tension substance on the granular phenol resin is preferably carried out so that it is distributed as uniformly as possible among the particles and the film thickness is even.

【0023】被覆法としては、所定組成の粒状フェノー
ル樹脂と低表面張力物質を、加熱装置付ブレンダーに
て、低表面張力物質の融点以上粒状フェノール樹脂の軟
化点以下の温度域内の所定温度にて加熱しつつ混和・攪
拌する方法、両原料を上記温度下に流動床攪拌する方
法、粒状フェノール樹脂に対して溶解性を示さず低表面
張力物質に対して良溶解性を示す溶媒によって低表面張
力物質を溶解し、この溶液に粒状フェノール樹脂を混和
しつ溶媒を留去・乾燥する方法等が推奨される。
As a coating method, a granular phenol resin having a predetermined composition and a low surface tension substance are mixed in a blender with a heating device at a predetermined temperature within a temperature range from the melting point of the low surface tension substance to the softening point of the granular phenol resin. Method of mixing and stirring while heating, method of stirring both raw materials in the fluidized bed at the above temperature, low surface tension due to a solvent showing no solubility for granular phenol resin and good solubility for low surface tension substances A method of dissolving the substance, mixing the granular phenol resin with this solution, and distilling off the solvent and drying is recommended.

【0024】この際、後記するように、本フェノール樹
脂成形材料は、少なくとも成形時には水分含有量が1重
量%以下に制御されていることを必須の要件とするが、
通常、重合後の原料フェノール樹脂は、数重量%以上の
水分を含有するので、使用に先立っては、上記限度内に
水分が低減するように乾燥しておき、上記被覆を施すの
が有効な方法である。この際の乾燥法としては、粒状フ
ェノール樹脂を真空中又は乾燥空気循環下に60〜120 ℃
の温度に加熱して行う方法が推奨される。本方法におい
て、低表面張力物質によるフェノール樹脂の被覆とフェ
ノール樹脂の乾燥とを併せて行うのも効率的である。
At this time, as will be described later, it is an essential requirement that the present phenol resin molding material has a water content controlled to 1% by weight or less at least at the time of molding.
Usually, the raw material phenol resin after polymerization contains several% by weight or more of water, so it is effective to dry it so as to reduce the water content within the above limits and to apply the above coating before use. Is the way. As the drying method at this time, the granular phenol resin is used in vacuum or under circulating dry air at 60 to 120 ° C.
It is recommended that the method be performed by heating to the temperature. In this method, it is also efficient to coat the phenol resin with a low surface tension substance and dry the phenol resin together.

【0025】この方法で調製された成形材料は被覆膜が
撥水性低透湿性の低表面張力物質よりなるため、そのま
までも長期間設定水分含有量以下に維持することができ
るが、工業的には品質管理上、成形直前まで密封容器あ
るいは密封包装に収納して保管するのが好ましい。
Since the coating material of the molding material prepared by this method is made of a water-repellent, low-moisture-permeable, low surface tension substance, it can be kept at a set water content or less for a long time as it is, but industrially From the viewpoint of quality control, it is preferable to store in a sealed container or a sealed package until just before molding.

【0026】もちろん、上記のように粒状フェノール樹
脂を乾燥せずそのまま被覆処理したフェノール樹脂成形
材料であっても、成形直前に乾燥を充分に行い、吸湿し
ない条件下に成形すれば、上記と同様の本発明の成形体
となすことができる。
Of course, even with a phenol resin molding material obtained by directly coating the granular phenol resin without drying as described above, if it is sufficiently dried immediately before molding and molded under a condition that does not absorb moisture, the same as above. The molded article of the present invention can be formed.

【0027】フェノール樹脂成形材料を用いて、通常の
成形条件にて、トランスファー成形、射出成形あるいは
押出成形等の高流動成形を行うと、透明で気泡を殆ど含
まない本発明のフェノール樹脂高流動成形体が得られ
る。この際、前記したように、フェノール樹脂成形材料
として水分含有量が1重量%以下、好ましくは0.2 重量
%以下のものを用いることが推奨される。水分含有量が
1重量%を越えると、成形の際に、成形品中に気孔が残
り、また成形条件によっては加水分解等の劣化現象が派
生することもある。本発明の成形体は、そのままでも多
様な用途に使用できるが、成形後140 〜240 ℃の温度域
内の所定温度でキュアリングすると、架橋がさらに進行
し、硬化度の高い各種製品が得られる。
When high flow molding such as transfer molding, injection molding or extrusion molding is carried out under normal molding conditions using a phenol resin molding material, the phenol resin high flow molding of the present invention is transparent and contains almost no bubbles. The body is obtained. At this time, as described above, it is recommended to use a phenol resin molding material having a water content of 1% by weight or less, preferably 0.2% by weight or less. If the water content exceeds 1% by weight, pores remain in the molded product during molding, and depending on the molding conditions, deterioration phenomena such as hydrolysis may occur. The molded product of the present invention can be used for various purposes as it is, but if it is cured at a predetermined temperature within a temperature range of 140 to 240 ° C. after molding, crosslinking further progresses and various products having a high degree of curing can be obtained.

【0028】[0028]

【作用】従来のフェノール樹脂熱流動性粒状成形材料の
高流動成形においては、前記したようにガラス繊維補強
材を用い、しかも金属含有有機滑剤を併用して成形して
いたが、本発明の成形体についての上記設定要件からこ
の両配合剤を排除して成形しようとすると、加熱ゾーン
以降で閉塞を起こし、全く成形ができない。
In the conventional high-flow molding of the phenol resin heat-fluidic granular molding material, the glass fiber reinforcing material was used as described above, and the metal-containing organic lubricant was also used in combination. If these compounding agents are excluded from the above setting requirements for the body and molding is attempted, blockage occurs after the heating zone and molding cannot be performed at all.

【0029】これに対して、本発明のフェノール樹脂成
形材料は、各粉粒体が潤滑性の高い低表面張力物質によ
って均一に被覆されているため、固体輸送部はもとよ
り、加熱ゾーンの圧縮輸送部までの全輸送区間において
も均一輸送(プラッグフロー)が達成され、しかも、加
熱ゾーンの樹脂が溶融する直前の圧縮輸送区間において
も粒状フェノール樹脂と低表面張力物質が分離すること
なく流動性を維持し、しかも溶融された低表面張力物質
によって粒状フェノール樹脂が被覆された状態にて液状
潤滑しつつ移動する。次いで同加熱ゾーンにて低表面張
力物質によってに被覆されたフェノール樹脂が溶融し凝
集・混練を開始すると同時に液状の低表面張力物質とフ
ェノール樹脂が二層に分離して、均一なフェノール樹脂
層の表面に低表面張力物質の液状被覆が形成される。か
くして低表面張力物質の液状被覆はシリンダー壁面にお
ける流体の流動抵抗を低減せしめて、均質かつ高流動性
の成形流体を形成し、トランスファー成形あるいは射出
成形の場合は金型内に、押出成形の場合はダイズ(ノズ
ル)より外系に、射出あるいは押出す。低表面張力物質
は成形品表面に被膜を形成して、金型より成形体を離型
する際、離型性を向上せしめる。
On the other hand, in the phenol resin molding material of the present invention, since each powder and granular material is uniformly coated with the low surface tension substance having high lubricity, not only the solid transportation part but also the compressed transportation in the heating zone. Uniform transport (Plug flow) is achieved even in the entire transport section up to the part, and the granular phenolic resin and low surface tension substances are not separated and maintain fluidity even in the compressed transport section immediately before the resin in the heating zone is melted. Moreover, it moves while being lubricated in a liquid state in a state where the granular phenol resin is coated with the melted low surface tension substance. Then, in the same heating zone, the phenol resin coated with the low surface tension substance melts and starts aggregation and kneading, and at the same time, the liquid low surface tension substance and the phenol resin are separated into two layers to form a uniform phenol resin layer. A liquid coating of low surface tension material is formed on the surface. Thus, the liquid coating of the low surface tension substance reduces the flow resistance of the fluid on the wall surface of the cylinder to form a homogeneous and highly fluid molding fluid, and in the case of transfer molding or injection molding, in the mold, in the case of extrusion molding. Is injected or extruded from soybean (nozzle) to the external system. The low surface tension substance forms a film on the surface of the molded product and improves the releasability when the molded product is released from the mold.

【0030】上記したように、本発明の成形は加熱ゾー
ンの圧縮輸送区間から樹脂溶融/混練区間にかけて樹脂
溶融・混練と低表面張力物質分散が極めてスムーズに進
行するため、成形体は均質で樹脂中に気孔の混入が殆ど
起こらない。
As described above, in the molding of the present invention, since the resin melting / kneading and the low surface tension substance dispersion proceed extremely smoothly from the compression transport section of the heating zone to the resin melting / kneading section, the molded body is homogeneous and the resin Almost no mixing of pores occurs inside.

【0031】低表面張力物質は、従来の滑剤とは異なっ
て、滑剤、流動性改良剤、非付着剤、離型剤と多様な機
能を発揮する成形助剤の役割を果たす物質である。な
お、低表面張力物質は成形品を炭素材料に焼成する際
に、そのまま蒸散するか、あるいは分解蒸散して炭素材
料にはその痕跡を殆ど残さない。
Unlike the conventional lubricants, the low surface tension substance is a substance which plays a role of a lubricant, a fluidity improver, a non-adhesive agent, a release agent, and a molding aid which exhibits various functions. The low surface tension substance evaporates as it is when the molded product is fired into a carbon material, or decomposes and evaporates to leave almost no trace on the carbon material.

【0032】フェノール樹脂成形材料は従来のフェノー
ル樹脂成形の主流である圧縮成形でも成形できるが、従
来成形の困難であったトランスファー成形、射出成形あ
るいは押出成形等の高流動成形において好適に成形でき
るので、一段と進歩した成形材料である。
The phenol resin molding material can be molded by compression molding, which is the mainstream of conventional phenol resin molding, but can be suitably molded in high flow molding such as transfer molding, injection molding or extrusion molding, which has been difficult to mold by conventional molding. It is a molding material that has advanced further.

【0033】これを成形製品面から観ると、圧縮成形体
の場合は原料の粒状フェノール樹脂を混練等の均質化処
理をせずに、焼結成形のように各粉粒体を溶融すると共
にそのまま融着して一体化した成形体であるのに対し
て、高流動成形体の場合は原料の粒状フェノール樹脂を
一旦完全に溶融し、高速流動(トランスファー成形)あ
るいは混練(射出成形又は押出成形)して流体を均質化
し成形した成形体であるので均質で、化学構造的にも一
様である。しかも、高流動成形体は複雑な形状の成形品
が得られるだけでなく生産性が優れている。
From the viewpoint of the molded product, in the case of the compression molded product, the granular phenol resin as a raw material is not subjected to homogenizing treatment such as kneading, but each powder or granular material is melted as it is by sintering molding, and is directly used. In the case of a high-fluidity molded body, the granular phenolic resin as a raw material is once completely melted and then melted at high speed (transfer molding) or kneading (injection molding or extrusion molding) Since it is a molded product obtained by homogenizing and molding a fluid, it is homogeneous and has a uniform chemical structure. Moreover, the high-fluidity molded product not only provides a molded product having a complicated shape, but also has excellent productivity.

【0034】また高流動成形法は、低粘性成形流体を高
圧高速充填する成形法で、射出圧が高度に制御されてい
るので、成形体は製品形状的にも高精度で再現性が優れ
ている。
The high-flow molding method is a molding method in which a low-viscosity molding fluid is filled at a high pressure and a high speed, and the injection pressure is highly controlled, so that the molded product is highly accurate and reproducible in terms of product shape. There is.

【0035】[0035]

【実施例】次に本発明を実施例によって具体的に説明す
る。 参考例1 ノボラック樹脂(三井東圧化学(株)製#600)150
重量部を160 ℃で溶融して、完全けん化ポリビニルアル
コール(重合度約2000)1重量部を溶解した90℃の熱水
(220 重量部)中へ攪拌しながら投入して分散し懸濁系
を形成し、続いてヘキサミン24重量部を40重量部の温水
に溶解して添加し、さらに同温度にて20分間攪拌を続け
て懸濁重合を行い、反応を終了、懸濁体を固液分離し、
自然乾燥して粒状フェノール樹脂を得た。このフェノー
ル樹脂の特性を表1に示す。ただし、表1に示すフェノ
ール樹脂の特性は以下の方法で測定した。熱流動性(以
後、HPFと略称する。)は、JIS−K−6911
19795.3.2[成形材料(円板式)]の方法に基づ
き、試料2gを160 ℃で1分間1145Kgの荷重下で熱プレ
スし、形成される円板の直径(最長径と最短径の平均
値)から求めた。平均粒径は、試料をガラスプレート上
に展開して顕微鏡写真を撮り、任意に選んだ100 個の粒
径を測定して、その平均値で示した。水分は、赤外線ヒ
ーターを用い、試料10g を80℃で30分間加熱しその重量
減少から求めた。
EXAMPLES Next, the present invention will be specifically described by way of examples. Reference example 1 Novolak resin (# 600 manufactured by Mitsui Toatsu Chemicals, Inc.) 150
1 part by weight of completely saponified polyvinyl alcohol (polymerization degree of about 2000) is melted at 160 ° C., and then poured into hot water (220 parts by weight) at 90 ° C. with stirring to disperse the suspension system. After formation, 24 parts by weight of hexamine are dissolved in 40 parts by weight of warm water and added, and the suspension is polymerized by continuing stirring at the same temperature for 20 minutes to complete the reaction, and the suspension is solid-liquid separated. Then
It was naturally dried to obtain a granular phenol resin. The characteristics of this phenol resin are shown in Table 1. However, the characteristics of the phenol resin shown in Table 1 were measured by the following methods. The heat fluidity (hereinafter, abbreviated as HPF) is JIS-K-6911.
1979 Based on the method of 5.3.2 [Molding material (disk type)], 2 g of the sample was hot pressed at 160 ° C for 1 minute under a load of 1145 kg, and the diameter of the disk (longest diameter and shortest diameter) It was calculated from the average value). The average particle size was obtained by developing the sample on a glass plate, taking a micrograph, measuring 100 arbitrarily selected particle sizes, and showing the average value. The water content was determined by heating 10 g of the sample at 80 ° C. for 30 minutes using an infrared heater and reducing the weight.

【0036】[0036]

【表1】 [Table 1]

【0037】参考例2 参考例1と同様に、ただし、完全けん化ポリビニルアル
コールの量を1.5 重量部に増やして、HPF145mm 、平
均粒径138 μm 、水分2.3 重量%のフェノール樹脂を調
製し、目開き50μm 、100 μm 、150 μm のフルイを用
いて分級し、50μm アンダー(実験No. 9)、50〜100
μm (実験No. 10)、100 〜150 μm(実験No. 1
1)及び150 μm以上(実験No. 12)分画物を得た。
また、実験No. 9分画物の樹脂を造粒して、直径2mm、
長さ3mmの円筒状ペレット(実験No. 13)を調製し
た。これらの上記特性を表2に示す。
Reference Example 2 As in Reference Example 1, except that the amount of completely saponified polyvinyl alcohol was increased to 1.5 parts by weight to prepare a phenol resin having HPF of 145 mm, an average particle size of 138 μm and a water content of 2.3% by weight. Classify using 50μm, 100μm, 150μm sieve, 50μm under (Experiment No. 9), 50 ~ 100
μm (Experiment No. 10), 100-150 μm (Experiment No. 1)
1) and 150 μm or more (Experiment No. 12) fractions were obtained.
In addition, the resin of Experiment No. 9 fraction was granulated to give a diameter of 2 mm,
A 3 mm long cylindrical pellet (Experiment No. 13) was prepared. These above characteristics are shown in Table 2.

【0038】[0038]

【表2】 [Table 2]

【0039】実験No. 1〜13の各粒状フェノール樹脂
について、加熱ジャケット付ブレンダーを用いて、下記
表3に示す条件にて100 ℃にて加熱しつつ混合して、低
表面張力物質を被覆し、70℃で相対湿度2%以下の空気
を用いて乾燥し、フェノール樹脂成形材料を調製した。
Each of the granular phenolic resins of Experiment Nos. 1 to 13 was mixed with a blender equipped with a heating jacket while heating at 100 ° C. under the conditions shown in Table 3 below to coat the low surface tension substance. A phenol resin molding material was prepared by drying at 70 ° C. with air having a relative humidity of 2% or less.

【0040】実施例及び比較例 松田製作所製EM35−25KS−10型射出成形機を
用いて、シリンダー温度120 ℃、金型温度170 ℃、射出
圧力70〜150Kg /cm2 の射出条件で、直径100mm 、厚さ
2mm、目付20g の円板を成形し、この成形品について以
下に示した評価基準及び測定法にて、成形性、光透過
率、気孔数、金属含有量を評価した。この結果を表3に
示す。
Examples and Comparative Examples Using an EM35-25KS-10 type injection molding machine manufactured by Matsuda Seisakusho, a cylinder temperature of 120 ° C., a mold temperature of 170 ° C., an injection pressure of 70 to 150 kg / cm 2 , and a diameter of 100 mm. A circular plate having a thickness of 2 mm and a basis weight of 20 g was molded, and the molded product was evaluated for moldability, light transmittance, number of pores, and metal content by the following evaluation criteria and measurement methods. The results are shown in Table 3.

【0041】[0041]

【表3】 [Table 3]

【0042】成形性(評価基準) ○:連続して所定サイクル(90秒)で射出成形が可能で
ある。 △:射出成形は可能であるが、前述条件では連続して所
定サイクルで成形できない。 ×:フェノール樹脂成形材料の食い込み不良、シリンダ
ーでの閉塞等により射出成形できない。
Moldability (Evaluation Criteria) Good: Injection molding is possible in a predetermined cycle (90 seconds) continuously. Δ: Injection molding is possible, but molding cannot be continuously performed in a predetermined cycle under the above conditions. X: Injection molding cannot be performed due to poor biting of the phenol resin molding material, blockage in the cylinder, and the like.

【0043】光透過率(測定法) 日立U−3400型自記分光光度計を用い25℃で円板試
料について前記定義の光透過率を測定した。1 試料当り
10点の測定値の平均値を求めた。 気孔数(測定法) 倍率300 倍のオリンパス社実体顕微鏡を用い、同上試料
の視野下における10cm2 当りの孔径20μm 以上の気孔の
数を数え、体積換算して1cm3 当りの同左気孔数を求め
た。 繰返し点数 10点 金属含有量(測定法) 日本ジャーレルアッシュ社発光分光分析装置I.C.A.P −
575を用い、発光分光分析を測定した。なお、測定さ
れた金属含有量は凡ての試料とも100ppm以下であったの
で、表3には表記しなかった。
Light Transmittance (Measurement Method) The light transmittance as defined above was measured for a disk sample at 25 ° C. using a Hitachi U-3400 type self-recording spectrophotometer. Per sample
The average value of 10 measured values was obtained. Number of pores (measurement method) Using an Olympus stereomicroscope with a magnification of 300 times, count the number of pores with a diameter of 20 μm or more per 10 cm 2 under the visual field of the same sample, and calculate the number of pores on the left per 1 cm 3 by volume conversion. It was Number of repetitions: 10 points Metal content (Measurement method) Japan Jarrell Ash Co., Ltd. Optical emission spectrometer ICAP-
575 was used to measure emission spectroscopy. The measured metal content was 100 ppm or less in all the samples, and therefore it is not shown in Table 3.

【0044】同表3において各低表面張力物質の略号
は、下記の化合物(融点)を表す。 SMG:ステアリン酸モノグリセライド(60℃) SE :ステアリン酸エチル(34℃) SAL:ステアリルアルコール(56℃) SMP:ソルビタンモノパルミテート(46℃) SAC:ステアリン酸(66℃) M :マンニトール(166 ℃) SAM:ステアリン酸アマイド(100 ℃)
In Table 3, the abbreviations of the low surface tension substances represent the following compounds (melting points). SMG: monoglyceride stearate (60 ° C) SE: ethyl stearate (34 ° C) SAL: stearyl alcohol (56 ° C) SMP: sorbitan monopalmitate (46 ° C) SAC: stearic acid (66 ° C) M: mannitol (166 ° C) ) SAM: Amide stearate (100 ℃)

【0045】表3において、No. 1、No. 8、No. 9、
No. 14、No. 18、No. 20及びNo. 25の各試料
は、比較例に相当するものであって、それぞれ下記の問
題点の存在が明らかとなった。試料No. 1は、フェノー
ル樹脂成形材料を構成するフェノール樹脂のHPFが45
mmと低いため、射出成形機のシリンダー内での流動性が
悪く閉塞して、射出成形できなかった。試料No. 8は、
同上HPFが160mmwを越えているので、射出成形はうま
くいったが、金型内で成形品の表層が硬化した後も内部
で縮合が進み、成形品内部に多数の気孔が形成された。
試料No. 9は、フェノール樹脂成形材料の粒径が50μm
未満の微粒体であり、食い込み不良により、連続して安
定な射出成形ができなかった。試料No. 14は、低表面
張力物質が0.2 重量%未満なのでシリンダー内閉塞によ
り、射出成形ができなかった。試料No. 18は、低表面
張力物質が5重量%を越えて多量に存在するので、成形
品の透明性が損なわれ、成形材料の気泡欠陥評価が困難
であった。試料No. 20は、フェノール樹脂成形材料の
水分が1重量%を越えて多量に存在するので、成形品内
部に無数の気孔が形成された。試料No. 25は、低表面
張力物質の融点が160 ℃以上なのでフェノール樹脂の乾
燥時、均一な被覆ができず、かつ射出成形の際溶融しに
くいため、充分な成形性が得られなかった。
In Table 3, No. 1, No. 8, No. 9,
The samples of No. 14, No. 18, No. 20 and No. 25 correspond to the comparative examples, and the existence of the following problems became clear. Sample No. 1 has a phenolic resin HPF composing the phenolic resin molding material of 45.
Since it was as low as mm, the fluidity in the cylinder of the injection molding machine was poor and it was blocked, and injection molding could not be performed. Sample No. 8 is
Since the HPF exceeds 160 mmw, the injection molding was successful, but even after the surface layer of the molded product was hardened in the mold, condensation proceeded inside and numerous pores were formed inside the molded product.
Sample No. 9 has a phenolic resin molding material particle size of 50 μm
It was a fine particle of less than, and continuous injection molding could not be performed due to poor bite. Sample No. 14 could not be injection-molded because the low surface tension substance was less than 0.2% by weight because of clogging in the cylinder. In sample No. 18, since the low surface tension substance was present in a large amount exceeding 5% by weight, the transparency of the molded product was impaired, and it was difficult to evaluate bubble defects in the molding material. In sample No. 20, the water content of the phenolic resin molding material was more than 1% by weight, and a large number of pores were formed inside the molded product. In Sample No. 25, the melting point of the low surface tension substance was 160 ° C. or higher, so that it was not possible to obtain a uniform coating when the phenol resin was dried, and it was difficult to melt during injection molding, so sufficient moldability was not obtained.

【0046】本発明のフェノール樹脂成形材料は表3の
実施例(すなわち、上記各比較例試料以外の試料)から
明らかなように、繊維補強材及び金属含有有機滑剤を全
く含まないにもかかわらず、安定して射出成形が可能で
あり、透明でかつ孔径100 μm 以上の気孔(以後、大気
孔と称する)及び含有金属の殆どない成形品が得られ
た。また、本実施例の成形品は、いずれも不活性ガス中
で、1200℃で焼成して、高純度のアモルファスカーボン
材料となることを確認することができた。
As is clear from the examples of Table 3 (that is, the samples other than the samples of the above-mentioned comparative examples), the phenolic resin molding material of the present invention contains no fiber reinforcing material and metal-containing organic lubricant at all. A stable injection-molded product was obtained, which was transparent and had almost no pores with a diameter of 100 μm or more (hereinafter referred to as atmospheric pores) and containing metal. Further, it was confirmed that all the molded articles of this example were fired at 1200 ° C. in an inert gas to become a high-purity amorphous carbon material.

【0047】[0047]

【発明の効果】本発明のフェノール樹脂高流動成形体は
透明で大気孔を殆ど含まないとともに金属含有量が極め
て少なく、真空または不活性雰囲気中で高温焼成するこ
とにより、高純度の炭素材料として磁気ディスク基盤、
坩堝容器等の多様な用途に用いることができる。また、
本発明のフェノール樹脂高流動成形体は、安価で耐熱
性、剛性率、硬度、電気絶縁性、耐薬品性等の諸特性が
優れた光学部品、容器、ウインドー材等の製品として多
様な用途に好適に使用することができる。さらに本発明
の成形法は、フェノール樹脂成形材料を、低水分含有量
下に、トランスファー成形法、射出成形法あるいは押出
成形法等の従来広く普及している成形法を用いて成形す
る簡易な方法であり、生産性が高く、高品質な製品を安
価に生産することのできる方法である。
EFFECT OF THE INVENTION The phenol resin high flow molding of the present invention is transparent, has almost no air holes, has a very small metal content, and is fired at a high temperature in a vacuum or an inert atmosphere to obtain a high purity carbon material. Magnetic disk base,
It can be used for various purposes such as crucible containers. Also,
INDUSTRIAL APPLICABILITY The phenol resin high-fluidity molded product of the present invention is inexpensive and has various properties such as heat resistance, rigidity, hardness, electric insulation, chemical resistance, and various other products such as containers and window materials. It can be used preferably. Furthermore, the molding method of the present invention is a simple method of molding a phenol resin molding material under a low water content by using a conventionally widely used molding method such as a transfer molding method, an injection molding method or an extrusion molding method. It is a method capable of producing high-quality products at high cost with high productivity.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G02B 1/04 G11B 5/82 B29C 45/00 B29C 47/00 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) G02B 1/04 G11B 5/82 B29C 45/00 B29C 47/00

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 波長800nm の可視光線の光路1mm当りの
光透過率が80%以上、1cm3 当り孔径100 μm 以上の気
孔が1個未満、金属含有量が200 重量ppm 以下であるこ
とを特徴とするフェノール樹脂高流動成形体。
1. A light transmittance of 80% or more per 1 mm optical path of visible light of wavelength 800 nm is less than 1 pore with a pore diameter of 100 μm or more per 1 cm 3 , and a metal content is 200 ppm by weight or less. High flow molding of phenolic resin.
【請求項2】 水分含有量が1重量%以下、粒径が50μ
m 以上で、ディスクキュアー法で測定した熱流動性が60
〜160mm である粒状フェノール樹脂の表層に、融点が30
〜160 ℃の低表面張力物質が対フェノール樹脂組成比0.
2 〜5 重量%量被覆されてなるフェノール樹脂成形材料
をトランスファー成形、射出成形あるいは押出成形する
ことを特徴とする請求項1記載のフェノール樹脂高流動
成形体の成形法
2. A water content of 1% by weight or less and a particle size of 50 μm.
Above 60 m, the thermal fluidity measured by the disk cure method is 60
The melting point is 30 on the surface of granular phenolic resin, which is ~ 160 mm.
Composition ratio of low surface tension substance to phenol resin at ~ 160 ° C is 0.
2. A method for molding a phenol resin high flow molding according to claim 1, wherein the phenol resin molding material coated with 2 to 5% by weight is subjected to transfer molding, injection molding or extrusion molding.
JP02067593A 1993-01-12 1993-01-12 Phenolic resin high flow molding and molding method thereof Expired - Fee Related JP3425986B2 (en)

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JP3425986B2 true JP3425986B2 (en) 2003-07-14

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JP3249257B2 (en) * 1993-08-11 2002-01-21 ユニチカ株式会社 Amorphous carbon molded body and method for producing the same
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