JPH10258322A - Colliding positioning method of back gage device, back gage device using this colliding positioning method and die - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a colliding positioning method of a back gage device, back gage device using this colliding positioning method and die, in which machining accuracy is improved by increasing the accuracy of a distance between an upper die and colliding part. SOLUTION: An actual distance is determined by measuring the distance to the punch P with a sensor 33 which is provided in the prescribed position of the colliding part 31 of the back gage device 13 just before a metal plate W is held between the punch P of the upper die and the die D of a lower die by bringing them relatively close to each other. The determined actual distance is compared with the target value and error is determined with a comparison operating part 43 and, when this error is larger than the allowance, the position of the colliding part 31 is corrected by the amount of the error by colliding part moving means 19 in a correction instructing part 45. With the sensor 33, the distance to the measuring surface 35 for measuring which is provided at the rear where is the side of the back gage device which is provided in the vicinity of the tip of the punch P is measured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for positioning a back gauge device, and a back gauge device and a die using the method.

[0002]

2. Description of the Related Art Referring to FIG. 4, a sheet material W is conventionally bent when a sheet material W is bent by cooperation of a punch P and a die D.
Back gauge device 101 for positioning
A ball screw 105 rotatably supported by the lower table 103 is rotationally driven by a motor 107, and a base 111 on which a ball nut 109 screwed to the ball screw 105 is mounted is placed on a supporter 113 in the front-rear direction (the left-right direction Move and position to). Note that the supporter 113
Is cantilevered to the lower table 103.

A post 115 is erected on the base 111, and a stretch 11 is provided in front of the post 115.
Since the abutment 119 is provided through the base 7, when the position of the base 111 is determined, the position of the tip (left end in FIG. 4) of the abutment 119 is determined. The position of the abutment 119 at this time is determined by detecting the rotation of the motor 107 by the encoder 121 provided in the motor 107 and controlling the rotation to position the base 111.

Accordingly, the position of the plate W can be controlled by abutting the plate W against the tip of the abutment 119.

[0005]

However, in such a conventional technique, the distance A from the bending position to the abutment position has an error due to deformation such as bending of the stretch 117 and an accuracy error of the ball screw 105. Therefore, the accuracy of the bending position is deteriorated.

Further, even when the distance A from the bending position to the abutment position is accurate, the supporter 113 for guiding the base 111 for moving the abutment 119 is provided with the lower table 10.
3, when the lower table 103 falls down due to the weight of the back gauge device 101, the distance A from the bending position to the abutment position is shifted,
Alternatively, referring to FIG. 5, an error d may occur due to the bending of the supporter 113 itself.

Further, when the operator presses the plate material W against the abutment 119, the stretch 117 or the like is deformed, and an error occurs in the distance A from the bending position to the abutment position due to a variation in the pressing force.

Further, when the punch P is replaced, the tip position of the punch P is slightly shifted, so that there is a problem that the distance A from the bending position to the abutting position is shifted.

SUMMARY OF THE INVENTION An object of the present invention is to pay attention to the above-described prior art, and to improve the processing accuracy by increasing the accuracy of the distance between the tip of the punch and the tip of the abutment. It is an object of the present invention to provide a method of positioning a back gauge device and a back gauge device and a mold using the method.

[0010]

In order to achieve the above-mentioned object, a method for abutting and positioning a back gauge device according to the present invention according to a first aspect of the present invention provides a method of processing a plate material by cooperating an upper die and a lower die. In a processing machine, the upper mold and the lower mold are relatively approached to each other, and the distance to the upper mold is measured by a sensor provided at the abutment of the back gauge device immediately before sandwiching the plate material. The actual distance between the tip of the abutment and the tip of the upper die is calculated from the above, and the error between the calculated distance and the target value is calculated. The contact position is corrected.

Therefore, immediately before processing the plate material by cooperation of the upper die and the lower die, the distance between the abutment of the back gauge device for positioning the plate material and the processing position of the tip of the upper die is measured by a sensor. If the error is larger than a predetermined value by comparing the actual distance obtained from the measured distance with the target value by directly measuring the length, processing is performed after correcting the error.

According to a second aspect of the present invention, there is provided a back gauge apparatus, wherein a plate is abutted against a butt moved and positioned by a butt moving means to position the plate, and the positioning is performed by cooperation of an upper die and a lower die. A plate material processing machine that performs processing on a plate material, wherein the sensor measures the distance between the tip of the upper die and the tip of the abutment, and a comparison operation that compares the distance measured by the sensor with a target value. And a correction instruction unit for controlling the abutting movement means to correct the error when the error between the measured distance and the target value is equal to or greater than a predetermined value. Things.

Therefore, immediately before the upper mold and the lower mold are relatively approached to sandwich the plate material, the distance to the upper mold is measured by a sensor provided at the abutment of the back gauge device. The distance between the tip of the butting and the tip of the upper die is compared with a target value to determine an error. If the error is greater than an allowable value, the correction instruction unit determines the amount of the error by the butting moving means. Correct the butting position only.

According to a third aspect of the present invention, there is provided a back gauge device, wherein the sensor according to the second aspect is provided on the butting.

Therefore, the distance to the rear surface of the upper mold is measured by a sensor provided at a predetermined position of the abutment.
The distance between the tip of the punch and the tip of the abutment, which is the actual bending position, is determined by the calculation of the comparison calculation unit.

According to a fourth aspect of the present invention, there is provided a mold which is positioned by abutting a plate material against a butt which is moved and positioned back and forth.
A plate material processing machine that performs processing on the positioned plate material by cooperation of an upper mold and a lower mold, wherein a distance from the tip is known on a back surface near the tip of the upper mold for length measurement. A flat part is provided.

Accordingly, the sensor measures the distance to a length measuring flat portion provided on the back surface near the tip of the upper die on the back gauge device side.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 3 shows, for example, an entire press brake 1 as a plate processing machine. In the press brake 1, side plates 3 are provided upright on both left and right sides, and a lower table 5 is fixed to a lower front surface between the side plates 3. A pair of cylinders 7 are provided on the upper front surface between the side plates 3.

At the upper end of the lower table 5, a die D as a lower die is detachably mounted. A vertically movable ram 9 is mounted on the cylinder 7, and a punch P as an upper die is detachably mounted on a lower end of the ram 9 so as to face the die D. An NC device 11 as a control device is provided adjacent to the press brake 1.

Accordingly, the plate material W is located between the die D and the punch P.
The cylinder 7 is driven under the control of the NC device 11 to move the ram 9 up and down, and the plate material W is bent in cooperation with the die D and the punch P.

Referring also to FIG. 1, the lower table 5
A back gauge device 13 according to the present invention is shown on the upper rear side (right side in FIG. 1). That is, a supporter 15 is horizontally attached to the upper rear surface (the right side surface in FIG. 1) of the lower table 5, and a ball screw 17 is rotatably provided along the supporter 15. The ball screw 17 is driven to rotate by a motor 19 serving as an abutting moving means provided on the supporter 15, and the rotation position is detected by an encoder 21 mounted on the motor 19.

A ball nut 23 screwed into the ball screw 17 is provided, and a base 25 which is reciprocally movable along the supporter 15 is provided. A post 27 is erected on the base 25 upward. . This post 27
Is provided with a strut 31 via a stretch 29 at the front end (left end in FIG. 1).
For example, a laser length measuring device 33 as a sensor is provided on the upper surface.

On the other hand, on the back surface (right side in FIG. 1) of the leading end of the punch P, a measuring surface 35 which is a plane portion for length measurement is located at a position at a known distance B from the bending position which is the leading end of the punch P. The distance S is measured by the laser length measuring device 33. The distance B from the bending position to the measurement surface 35 is approximately 1 /
Can be manufactured with an accuracy of 100 mm.

The laser length measuring device 33 is set so as to have a height corresponding to the measuring surface 35 of the punch P immediately before the plate material W is sandwiched between the punch P and the die D.
At this time, the distance S to the measurement surface 35 is measured.

Referring to FIG. 1, the NC unit 11 includes a CPU 37 serving as a central processing unit and an input / output unit 39,
The memory 41, the comparison operation unit 43, the correction instruction unit 45, and the like are connected.

The input / output means 39 inputs various data and outputs data to an output screen (not shown). The memory 41 stores a target value of the width of the plate material W to be processed, various data, a processing program, and the like. Comparison operation unit 4
At 3, the distance S lengthened by the laser length measuring device 33 is shown.
The actual distance L from the processing position to the tip of the abutment 31 is calculated based on the above, and the actual distance L is compared with a target value. The correction instruction section 45 controls the motor 19 to correct the position of the butting 31.

Next, a method of abutting and positioning the back gauge device 13 will be described with reference to FIG.

When started (step SS), the NC device 11 first contacts the encoder 21 with the bumper 3 as before.
While detecting the position 1, the motor 19 is controlled to move the abutment 31 to the target position (step S1).

Next, the cylinder 7 is operated to lower the ram 9 until the plate W is sandwiched by the cooperation of the punch P and the die D (step S2).
The distance S to the measurement surface 35 is measured (step S
3).

The comparison operation unit 43 calculates an actual distance L from the tip of the punch P, which is a processing position, to the tip of the abutment 31 based on the measured distance S, and calculates the actual distance L and a target value. Are compared (step S4), and when the error is smaller than a predetermined value, bending is performed by the cylinder 7 (step S6).

If the error is larger than the predetermined value, the correction instructing section 45 controls the motor 19 while measuring by the encoder 21, and the motor 19 causes the motor 31 to abut against the motor 31 by the error.
Is moved and corrected (step S5), bending is performed (step S6), and the processing is ended (step S5).
E).

From the above results, the actual distance between the tip of the punch P, which determines the positional relationship between the plate W and the processing position, and the tip of the abutment 31 immediately before the processing of the plate W is directly measured. The abutting position can always be controlled with high accuracy without being affected by variations or deformation of the processing machine itself.

At this time, since the flat measuring surface 35 whose distance from the tip of the punch P, which is the processing position, is provided on the back surface of the tip of the punch P, the distance can be measured accurately.

The present invention is not limited to the above-described embodiment, but can be embodied in other modes by making appropriate changes. That is, in the press brake 1 according to the above-described embodiment, the punch P is lowered by the cylinder 7 to perform the bending work on the die D provided on the fixed lower table 5. The bending process may be performed by raising the die D. Moreover, you may use the shearing as a board processing machine. In this case, the upper die is the upper blade,
The lower die serves as a lower blade, and the plate material W is subjected to shearing.

[0036]

As described above, in the butting method of the back gauge device according to the first aspect of the present invention, the plate material is positioned immediately before processing the plate material by cooperation of the upper die and the lower die. The distance between the butting of the back gauge device and the processing position of the upper die tip is directly measured by a sensor,
The actual distance is determined from the measured distance, and if the actual distance is compared with the target value and the error is larger than a predetermined value, machining is performed after correcting the error. The distance to the butting can be set accurately. This enables high-precision processing.

In the back gauge device according to the second aspect of the present invention, the distance to the upper die is measured by a sensor provided at the abutment of the back gauge device immediately before the upper die and the lower die are relatively approached to sandwich the plate. The comparison operation unit compares the measured distance between the tip of the butting and the tip of the upper die with a target value to determine an error. If the error is larger than an allowable value, the correction instruction unit determines Since the abutment position is corrected by the abutment moving means by the error, the distance between the upper die and the abutment immediately before machining can be accurately set. This enables high-precision processing.

In the back gauge device according to the third aspect of the present invention, the distance to the rear surface of the upper mold is measured by a sensor provided at a predetermined position of the abutment. The distance from the abutting tip can be accurately obtained by the operation of the comparison operation unit.

In the mold according to the fourth aspect of the present invention, since the sensor measures the distance to the length measuring flat portion provided on the back surface near the tip of the upper mold on the back gauge device side, the measurement is performed. The surface is constant, and the exact distance between the upper die and the abutment can be measured.

[Brief description of the drawings]

FIG. 1 is a block diagram and the like showing the configuration of a back gauge device according to the present invention.

FIG. 2 is a flowchart showing a method for positioning the back gauge device according to the present invention;

FIG. 3 is a cross-sectional view showing a butting method of a back gauge device according to the present invention, a back gauge device using the butting method, and a press brake to which a mold for the back gauge device is applied.

FIG. 4 is a cross-sectional view showing a conventional back gauge device.

FIG. 5 is an explanatory diagram showing one of problems in a conventional back gauge device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 press brake (plate processing machine) 13 back gauge device 19 motor (butting moving means) 31 butting 33 laser length measuring device (sensor) 35 measurement surface (flat portion) 43 comparison operation unit 45 correction instruction unit W plate material P punch (Mold) D die

Claims (4)

[Claims] 1. A plate material processing machine for processing a plate material by cooperation of an upper die and a lower die, wherein a back gauge device abuts immediately before the upper die and the lower die are relatively approached to sandwich the plate material. The distance to the upper mold is measured by the sensor provided in the above, the actual distance between the tip of the abutment and the tip of the upper mold is calculated from the measured distance, and the calculated distance and the target value are calculated. An abutting position of the back gauge device, wherein an error is determined, and if the error is larger than an allowable value, the abutting position is corrected by the amount of the error. 2. A plate material processing machine for abutting and positioning a plate material on a butt moved / positioned forward and backward by a butt moving means, and processing the positioned plate material by cooperation of an upper die and a lower die. A sensor that measures the distance between the tip of the upper die and the tip of the abutment, a comparison operation unit that compares the distance measured by the sensor with a target value, and the measured distance A back-gauge device, comprising: a correction instructing unit for controlling the abutting movement unit to correct the error when an error between the error and the target value is equal to or greater than a predetermined value. 3. The back gauge device according to claim 2, wherein the sensor is provided on the butting. 4. A plate material processing machine for positioning a plate material by abutting against a butt moved and positioned back and forth, and processing the positioned plate material by cooperation of an upper die and a lower die. A mold having a flat part for length measurement provided at a position on the back surface near the tip of the upper die where the distance from the tip is known.