JPH10247657A - Method for packaging electronic part - Google Patents
Method for packaging electronic partInfo
- Publication number
- JPH10247657A JPH10247657A JP6732397A JP6732397A JPH10247657A JP H10247657 A JPH10247657 A JP H10247657A JP 6732397 A JP6732397 A JP 6732397A JP 6732397 A JP6732397 A JP 6732397A JP H10247657 A JPH10247657 A JP H10247657A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring board
- electronic component
- gap
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器の製造分
野、特に電子部品の配線基板への実装方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of manufacturing electronic equipment, and more particularly to a method for mounting electronic components on a wiring board.
【０００２】[0002]
【従来の技術】従来より、電子機器の製造分野において
は、半導体チップ等の電子部品を配線基板上の接続電極
に直付けする実装方法が実施されている。この実装方法
では、電子部品と配線基板との間を樹脂封止する必要が
あり、特公平２−１３８１７号公報に記載の従来技術で
は、電子部品を配線基板上に載置した後、その上から樹
脂を滴下することにより樹脂封止を行っている。また、
特公平２−７１８０号公報に記載の従来技術では、図６
（ａ）に示すように配線基板１１上に樹脂１２を塗布し
た後、その上から図６（ｂ）に示すように電子部品１３
を圧着する方法を採っている。また、特開平１−２２６
１６１号公報に記載の従来技術では、図７（ａ）に示す
ように配線基板１４上に電子部品１５を載置し、配線基
板１４上の電子部品１５の近傍に樹脂１６を塗布した
後、図７（ｂ）に示すように配線基板１４を傾けること
によって電子部品１５と配線基板１４との間に樹脂１６
を充填する方法を採っている。2. Description of the Related Art Conventionally, in the field of manufacturing electronic equipment, a mounting method of directly attaching an electronic component such as a semiconductor chip to a connection electrode on a wiring board has been implemented. In this mounting method, it is necessary to seal a resin between the electronic component and the wiring board. In the conventional technique described in Japanese Patent Publication No. 2-13817, after mounting the electronic component on the wiring board, Resin sealing is performed by dropping the resin from the substrate. Also,
In the prior art described in Japanese Patent Publication No. 2-7180, FIG.
After applying the resin 12 on the wiring board 11 as shown in FIG. 6A, the electronic component 13 is applied from above onto the wiring board 11 as shown in FIG.
The method of crimping is adopted. In addition, Japanese Patent Application Laid-Open No. Hei.
In the related art disclosed in Japanese Patent No. 161, after the electronic component 15 is placed on the wiring board 14 as shown in FIG. 7A and the resin 16 is applied to the vicinity of the electronic component 15 on the wiring board 14, By tilting the wiring board 14 as shown in FIG. 7B, the resin 16 is placed between the electronic component 15 and the wiring board 14.
The method of filling is adopted.
【０００３】[0003]
【発明が解決しようとする課題】しかし、特公平２−１
３８１７号公報に記載の従来技術のように電子部品の上
から樹脂を滴下する方法では、電子部品が樹脂で覆われ
た状態になるため、電子部品実装部の高さがばらついた
り、樹脂が所望の塗布領域からはみ出したりする。ま
た、この方法では、電子部品と配線基板との間の微少な
ギャップに樹脂を完全に充填することは不可能であり、
空気の巻き込みなどの発生によりボイドの形で未充填部
分ができてしまい、製品の品質が低下するという問題が
あった。また、特公平２−７１８０号公報に記載の従来
技術では、電子部品１３を配線基板１１上に載置する前
に樹脂１２を塗布するため、樹脂１２の塗布量を適切に
制御することが困難であり、樹脂１２の塗布量が多すぎ
ると電子部品１３を載置した際に電子部品１３と配線基
板１１との間から樹脂１２がはみ出し、反対に樹脂１２
の塗布量が少な過ぎると電子部品１３と配線基板１１と
の間の封止が不完全になってしまうという問題があっ
た。また、電子部品１３の接続端子１６と配線基板１１
上の配線端子１７との接合部に樹脂が介在し、接合部に
おける電気的接続の信頼性が低下するという問題もあっ
た。また、特開平１−２２６１６１号公報に記載の従来
技術では、樹脂封止の際に配線基板１４を傾けるための
機構が必要であり、また、樹脂１６が電子部品１５と配
線基板１４との間にから流れ出さないように適当なタイ
ミングで配線基板１４を水平姿勢に戻すなどの制御を行
う必要があるため、設備が複雑化しコストが高くなると
いう問題があった。そこで、本発明の解決すべき課題
は、設備を複雑化することなく、電子部品と配線基板と
の間の微少なギャップを樹脂によって完全に封止でき、
しかも、その際の樹脂量のばらつきを小さくして常に高
品質の電子部品実装体を得ることができる電子部品の実
装方法を提供することにある。[Problems to be solved by the invention]
In the method of dropping a resin from above an electronic component as in the prior art described in Japanese Patent No. 3817, since the electronic component is covered with the resin, the height of the electronic component mounting portion varies or the resin is not desired. Out of the application area. Also, with this method, it is impossible to completely fill the minute gap between the electronic component and the wiring board with the resin,
There is a problem that unfilled portions are formed in the form of voids due to the entrainment of air and the like, and the quality of the product is reduced. Further, in the prior art described in Japanese Patent Publication No. 2-7180, since the resin 12 is applied before the electronic component 13 is mounted on the wiring board 11, it is difficult to appropriately control the application amount of the resin 12. If the applied amount of the resin 12 is too large, the resin 12 protrudes from between the electronic component 13 and the wiring board 11 when the electronic component 13 is placed, and conversely, the resin 12
If the amount of the coating is too small, there is a problem that the sealing between the electronic component 13 and the wiring board 11 becomes incomplete. The connection terminals 16 of the electronic component 13 and the wiring board 11
There is also a problem that the resin is interposed at the joint with the upper wiring terminal 17 and the reliability of the electrical connection at the joint is reduced. Further, in the prior art described in Japanese Patent Application Laid-Open No. 1-226161, a mechanism for tilting the wiring board 14 at the time of resin sealing is required, and the resin 16 is disposed between the electronic component 15 and the wiring board 14. Since it is necessary to perform control such as returning the wiring board 14 to the horizontal position at an appropriate timing so as not to flow out of the apparatus, there is a problem that the equipment becomes complicated and the cost increases. Therefore, the problem to be solved by the present invention is that the minute gap between the electronic component and the wiring board can be completely sealed with resin without complicating the equipment,
In addition, it is an object of the present invention to provide a method of mounting an electronic component capable of reducing variation in the amount of resin at that time and always obtaining a high-quality electronic component mounted body.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
に、本発明は、配線基板の所定位置に電子部品を載置
し、当該電子部品と当該配線基板との間のギャップに樹
脂を充填した後、当該樹脂を硬化させるようにした電子
部品の実装方法において、前記ギャップに前記樹脂を充
填する際、前記樹脂がその自重により吐出するように構
成したノズルを使用して、前記電子部品の一端側から前
記ギャップ内に前記樹脂を流入させ、当該ノズルからの
樹脂の吐出力と毛細管現象によるギャップ内への進入力
とを利用して他端側まで充填するようにしたことを特徴
としている。上記方法によれば、樹脂自体の重さによる
ノズルからの吐出力と毛細管現象によるギャップ内への
進入力とを利用して、電子部品と配線基板との間に一端
側から他端側まで樹脂を流入させて充填することができ
るので、空気の巻き込みが発生しないためボイドによる
未充填部分が生じることがなく、電子部品と配線基板と
の間に樹脂を流入させるために配線基板を傾けたり、シ
リンダ等の強制注入手段を使用する必要が無いため設備
を簡略化できる。また、電子部品を配線基板に載置した
後で樹脂封入を行うため、樹脂量の制御が容易であり、
電子部品の接続端子と配線基板の配線端子との電気的接
続部の信頼性を損なうことなく樹脂封止できる。According to the present invention, an electronic component is mounted at a predetermined position on a wiring board, and a gap between the electronic component and the wiring board is filled with a resin. Then, in the mounting method of the electronic component in which the resin is cured, when the resin is filled in the gap, using a nozzle configured to discharge the resin by its own weight, using a nozzle configured to discharge the electronic component. The resin is caused to flow into the gap from one end side, and is filled to the other end side by utilizing the discharge force of the resin from the nozzle and the advance input into the gap due to capillary action. . According to the above method, the resin is used between the electronic component and the wiring board from one end to the other end by using the ejection force from the nozzle due to the weight of the resin itself and the advance input into the gap due to the capillary phenomenon. Can be filled by flowing air, so that no entrainment of air occurs, so that no unfilled portion due to voids occurs, and the wiring board is inclined to flow resin between the electronic component and the wiring board, Since there is no need to use a forced injection means such as a cylinder, the equipment can be simplified. In addition, since the resin is sealed after the electronic component is mounted on the wiring board, it is easy to control the amount of the resin,
Resin sealing can be performed without impairing the reliability of the electrical connection between the connection terminal of the electronic component and the wiring terminal of the wiring board.
【０００５】[0005]
【発明の実施の形態】次に、本発明の実施の形態を添付
図面に基づいて詳細に説明する。図１（ａ）は本発明に
係る電子部品の実装方法を示す概略側面図、図１（ｂ）
は概略平面図である。図中、１は電子部品である半導体
チップであり、半導体チップ１の下面の四隅部には接続
電極２が設けられている。３は配線基板であり、配線基
板３上には配線パターン端子４が設けられている。５は
絶縁樹脂７を半導体チップ１と配線基板３との間の微少
なギャップ８内に注入するためのノズル（ディスペン
サ）である。ギャップ８の大きさは、数１０μｍ〜数１
００μｍ程度である。ノズル５は、漏斗状の樹脂貯留部
５ａと、この脂貯留部５ａの下端部から配線基板３の上
面近傍に延びる樹脂案内部（本来のノズル部）５ｂとか
らなる。樹脂貯留部５ａの容積は樹脂案内部５ｂの容積
よりも遥かに大きい。樹脂案内部５ｂは、図１（ａ）に
示すように、基端部５ｃから先端部（下端部）５ｄにか
けて徐々に薄く（細く）なっており、樹脂封止時に半導
体チップ１と干渉することなく、半導体チップ１と配線
基板３との間の微少なギャップ８内に絶縁樹脂７を注入
できるように、鉛直軸に対して所定の角度θだけ傾いて
いる。また、樹脂案内部５ｂは、図１（ｂ）に示すよう
に扁平な構造になっており、半導体チップ１の一片１ａ
に沿って延びるスリット状の吐出口５ｅを有している。
吐出口５ｅの長さＬ1 は半導体チップ１の上記一片１ａ
の長さＬ2 よりも若干例えば０．５ｍｍ〜１．５ｍｍ程
度小さく設計されている。また、樹脂案内部５ｂの吐出
口５ｅ近傍には図視しない開閉弁が設けられている。絶
縁樹脂７の硬化前の粘度は、１．０ｃｐｓ程度と非常に
低い。そのため、樹脂貯留部５ａに貯留された樹脂７は
その自重で樹脂案内部５ｂに流入し、樹脂案内部５ｂ内
の絶縁樹脂７はその自重及び樹脂貯留部５ａ内の絶縁樹
脂７の重さによって吐出口５ｅから自然に吐出される。
また、絶縁樹脂７は、半導体チップ１及び配線基板３と
の濡れ性が高く、表面張力も大きく、半導体チップ１と
配線基板３との間のギャップ８のような微少なギャップ
内へは毛細管現象により自然に進入する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1A is a schematic side view showing a method for mounting an electronic component according to the present invention, and FIG.
Is a schematic plan view. In the figure, reference numeral 1 denotes a semiconductor chip as an electronic component, and connection electrodes 2 are provided at four corners on the lower surface of the semiconductor chip 1. Reference numeral 3 denotes a wiring board, on which wiring pattern terminals 4 are provided. Reference numeral 5 denotes a nozzle (dispenser) for injecting the insulating resin 7 into the minute gap 8 between the semiconductor chip 1 and the wiring board 3. The size of the gap 8 ranges from several tens μm to several tens
It is about 00 μm. The nozzle 5 includes a funnel-shaped resin storage part 5a and a resin guide part (original nozzle part) 5b extending from the lower end of the fat storage part 5a to the vicinity of the upper surface of the wiring board 3. The capacity of the resin storage part 5a is much larger than the capacity of the resin guide part 5b. As shown in FIG. 1A, the resin guide portion 5b is gradually thinner (smaller) from the base end portion 5c to the tip end portion (lower end portion) 5d, and may interfere with the semiconductor chip 1 during resin sealing. However, the insulating resin 7 is inclined by a predetermined angle θ with respect to the vertical axis so that the insulating resin 7 can be injected into the minute gap 8 between the semiconductor chip 1 and the wiring board 3. Further, the resin guide portion 5b has a flat structure as shown in FIG.
And has a slit-shaped discharge port 5e extending along.
The length L1 of the discharge port 5e is equal to the one piece 1a of the semiconductor chip 1.
It is designed slightly, for example, about 0.5mm~1.5mm smaller than the length L 2 of the. An on-off valve (not shown) is provided near the discharge port 5e of the resin guide 5b. The viscosity of the insulating resin 7 before curing is as low as about 1.0 cps. Therefore, the resin 7 stored in the resin storage portion 5a flows into the resin guide portion 5b by its own weight, and the insulating resin 7 in the resin guide portion 5b depends on its own weight and the weight of the insulating resin 7 in the resin storage portion 5a. The liquid is spontaneously discharged from the discharge port 5e.
Further, the insulating resin 7 has high wettability with the semiconductor chip 1 and the wiring board 3 and a large surface tension, and causes a capillary phenomenon into a minute gap such as the gap 8 between the semiconductor chip 1 and the wiring board 3. To enter naturally.
【０００６】図２（ａ）〜（ｃ）は、本実施の形態にお
ける電子部品の実装方法を工程順に示したものであり、
図２（ａ）に示すように、半導体チップ１を配線基板３
上に載置して、半導体チップ１の接続電極２と配線基板
３の配線パターン端子４とを接続した後、ノズル５の開
閉弁を開き、ギャップ８内に一端側（図示左端側）から
絶縁樹脂７の流入を開始させる。すると、絶縁樹脂７
は、樹脂自体の重さによるノズル５からの吐出力と毛細
管現象によるギャップ８内への進入力とにより、図２
（ｂ）に示すように、他端側（図示右端側）へ流入して
いく。そして、最後には、図２（ｃ）に示すように、ギ
ャップ８内全体に充填される。図２（ｃ）の状態になっ
たら、ノズル５の開閉弁を閉じて絶縁樹脂７の供給を停
止した後、加熱処理或いは露光処理により絶縁樹脂７を
硬化させる。以上の工程により、半導体チップ１の配線
基板３への実装が完了する。FIGS. 2A to 2C show a method of mounting an electronic component according to the present embodiment in the order of steps.
As shown in FIG. 2A, the semiconductor chip 1 is
After mounting on the connection electrode 2 of the semiconductor chip 1 and the wiring pattern terminal 4 of the wiring board 3, the opening / closing valve of the nozzle 5 is opened, and the gap 8 is insulated from one end side (left end side in the figure). The flow of the resin 7 is started. Then, the insulating resin 7
FIG. 2 shows that the ejection force from the nozzle 5 due to the weight of the resin itself and the advance input into the gap 8 due to the capillary phenomenon.
As shown in (b), it flows into the other end (the right end in the figure). Finally, as shown in FIG. 2C, the entire gap 8 is filled. When the state shown in FIG. 2C is reached, the supply of the insulating resin 7 is stopped by closing the on-off valve of the nozzle 5 and then the insulating resin 7 is cured by a heating process or an exposure process. Through the above steps, the mounting of the semiconductor chip 1 on the wiring board 3 is completed.
【０００７】本実施の形態の実装方法によれば、樹脂自
体の重さによるノズル５からの吐出力と毛細管現象によ
るギャップ内への進入力とを利用して、電子部品である
半導体チップ１と配線基板３との間のギャップ８内に一
端側から他端側まで絶縁樹脂７を流入させて充填するこ
とができるので、空気の巻き込みが発生しないためボイ
ドによる未充填部分が生じることがない。また、半導体
チップ１と配線基板３との間に絶縁樹脂７を流入させる
ために配線基板３を傾けたり、シリンダ等の強制注入手
段を使用する必要が無いため設備を簡略化できる。シリ
ンダ等を使用して絶縁樹脂７の強制注入を行うと、圧力
（通常、流路断面の中心部に圧力が集中する）により樹
脂液面が乱れ、ギャップ８内への絶縁樹脂７の流入量の
一様性がなくなるが、本実施の形態の場合、絶縁樹脂７
自体の特性により自然にギャップ８内へ絶縁樹脂７が進
入していくため、このような問題は生じない。また、半
導体チップ１を配線基板３に載置した後で樹脂封入を行
うため、樹脂量の制御が容易であり、半導体チップ１の
接続端子２と配線基板３の配線端子４との電気的接続部
の信頼性を損なうことがない。なお、本発明は上記実施
の形態に限定されるものではない。上記実施の形態のノ
ズル５はスリット状の一つの吐出口５ｅを有している
が、例えば、図３に示すように、小径の吐出口５ｆを複
数設けてもよい。また、例えば、図４に示すように、ノ
ズル５の先端部を５ｄを末広状にして吐出口５ｅを拡大
してもよい。また、例えば、図５に示すように、ノズル
５の先端部を５ｄを更に薄くして吐出口５ｅの上下の幅
を小さくしてもよい。According to the mounting method of the present embodiment, the semiconductor chip 1 as an electronic component is connected to the semiconductor chip 1 by utilizing the ejection force from the nozzle 5 due to the weight of the resin itself and the advance input into the gap due to the capillary phenomenon. Since the insulating resin 7 can flow from one end to the other end and fill the gap 8 between the wiring board 3 and the other end, no unfilled portion due to voids is generated because air is not involved. Further, since it is not necessary to tilt the wiring board 3 to allow the insulating resin 7 to flow between the semiconductor chip 1 and the wiring board 3 or to use a forced injection means such as a cylinder, the facility can be simplified. When the insulating resin 7 is forcibly injected by using a cylinder or the like, the resin liquid level is disturbed by pressure (normally, pressure is concentrated at the center of the cross section of the flow path), and the amount of the insulating resin 7 flowing into the gap 8 However, in the case of this embodiment, the insulating resin 7
Such a problem does not occur because the insulating resin 7 naturally enters the gap 8 by its own characteristics. In addition, since the resin is sealed after the semiconductor chip 1 is mounted on the wiring board 3, the amount of resin is easily controlled, and the electrical connection between the connection terminals 2 of the semiconductor chip 1 and the wiring terminals 4 of the wiring board 3 is performed. It does not impair the reliability of the unit. Note that the present invention is not limited to the above embodiment. Although the nozzle 5 in the above embodiment has one slit-shaped discharge port 5e, for example, as shown in FIG. 3, a plurality of small-diameter discharge ports 5f may be provided. In addition, for example, as shown in FIG. 4, the tip of the nozzle 5 may have a divergent 5d shape to enlarge the discharge port 5e. Further, for example, as shown in FIG. 5, the tip of the nozzle 5 may be made thinner at 5d to reduce the vertical width of the discharge port 5e.
【０００８】[0008]
【発明の効果】以上要するに、本発明の電子部品の実装
方法によれば、電子部品と配線基板との間のギャップに
樹脂を充填する際、樹脂がその自重により吐出するよう
に構成したノズルを使用して、前記電子部品の一端側か
ら前記ギャップ内に樹脂を流入させ、前記ノズルからの
樹脂の吐出力と毛細管現象によるギャップ内への進入力
とを利用して他端側まで充填するようにしたので、設備
を複雑化することなく、電子部品と配線基板との間の微
少なギャップを樹脂によって完全に封止でき、しかも、
その際の樹脂量のばらつきを小さくして常に高品質の電
子部品実装体を得ることができる。In summary, according to the electronic component mounting method of the present invention, when filling the gap between the electronic component and the wiring board with the resin, the nozzle configured to discharge the resin by its own weight is provided. By using the electronic component, the resin flows into the gap from one end side of the electronic component, and is filled to the other end side by utilizing the ejection force of the resin from the nozzle and the advance input into the gap by capillary action. As a result, the minute gap between the electronic component and the wiring board can be completely sealed with resin without complicating the equipment.
The variation in the amount of resin at that time can be reduced, and a high-quality electronic component mounted body can always be obtained.
【図１】（ａ）は本発明に係る電子部品の実装方法の実
施の形態を示す概略側面図、（ｂ）は概略平面図であ
る。FIG. 1A is a schematic side view showing an embodiment of an electronic component mounting method according to the present invention, and FIG. 1B is a schematic plan view.
【図２】（ａ）〜（ｃ）は本発明に係る電子部品の実装
方法の実施の形態を示す工程説明図である。FIGS. 2A to 2C are process explanatory views showing an embodiment of a method for mounting an electronic component according to the present invention.
【図３】本発明に係る電子部品の実装方法の実施に使用
するノズルの別の形態例を示す要部正面図である。FIG. 3 is a main part front view showing another embodiment of a nozzle used for carrying out the electronic component mounting method according to the present invention.
【図４】本発明に係る電子部品の実装方法の実施に使用
するノズルの別の形態例を示す要部断面図である。FIG. 4 is a cross-sectional view of a main part showing another embodiment of a nozzle used for implementing the electronic component mounting method according to the present invention.
【図５】本発明に係る電子部品の実装方法の実施に使用
するノズルの別の形態例を示す要部断面図である。FIG. 5 is a cross-sectional view of a main part showing another embodiment of a nozzle used for implementing the electronic component mounting method according to the present invention.
【図６】（ａ）、（ｂ）は従来の電子部品の実装方法の
一例を示す工程説明図である。FIGS. 6A and 6B are process explanatory views showing an example of a conventional electronic component mounting method.
【図７】（ａ）、（ｂ）は従来の電子部品の実装方法の
別の例を示す工程説明図である。FIGS. 7A and 7B are process explanatory views showing another example of a conventional method for mounting an electronic component.
１ 半導体チップ（電子部品）、２ 接続電極、３ 配
線基板、４ 配線パターン端子、５ ノズル、５ｅ 吐
出口、５ｆ 吐出口、７ 絶縁樹脂、８ ギャップ、５
ａ 樹脂貯留部、５ｂ 樹脂案内部。Reference Signs List 1 semiconductor chip (electronic component), 2 connection electrode, 3 wiring board, 4 wiring pattern terminal, 5 nozzle, 5e discharge port, 5f discharge port, 7 insulating resin, 8 gap, 5
a Resin storage part, 5b Resin guide part.
Claims (1)
し、当該電子部品と当該配線基板との間のギャップに樹
脂を充填した後、当該樹脂を硬化させるようにした電子
部品の実装方法において、 前記ギャップに前記樹脂を充填する際、前記樹脂がその
自重により吐出するように構成したノズルを使用して、
前記電子部品の一端側から前記ギャップ内に前記樹脂を
流入させ、当該ノズルからの樹脂の吐出力と毛細管現象
による前記ギャップ内への進入力とを利用して他端側ま
で充填するようにしたことを特徴とする電子部品の実装
方法。An electronic component is mounted at a predetermined position on a wiring board, and after a resin is filled in a gap between the electronic component and the wiring board, the resin is cured. In the method, when filling the gap with the resin, using a nozzle configured to discharge the resin by its own weight,
The resin is caused to flow into the gap from one end of the electronic component, and is filled to the other end using the discharge force of the resin from the nozzle and the advance input into the gap by capillary action. A method for mounting an electronic component, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6732397A JPH10247657A (en) | 1997-03-05 | 1997-03-05 | Method for packaging electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6732397A JPH10247657A (en) | 1997-03-05 | 1997-03-05 | Method for packaging electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10247657A true JPH10247657A (en) | 1998-09-14 |
Family
ID=13341707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6732397A Pending JPH10247657A (en) | 1997-03-05 | 1997-03-05 | Method for packaging electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10247657A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237397A (en) * | 2005-02-25 | 2006-09-07 | Kyocera Kinseki Corp | Nozzle |
-
1997
- 1997-03-05 JP JP6732397A patent/JPH10247657A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237397A (en) * | 2005-02-25 | 2006-09-07 | Kyocera Kinseki Corp | Nozzle |
| JP4499584B2 (en) * | 2005-02-25 | 2010-07-07 | 京セラキンセキ株式会社 | nozzle |
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