JP2003318218A - Curved chip substrate and its manufacturing method, and bump formation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely mount a chip on a curved substrate. <P>SOLUTION: A curved chip surface has a curved substrate of a curved shape having a substrate electrode, a chip with a chip electrode following the curved shape of the curved substrate, a first bump electrically connecting corresponding substrate electrode and chip electrode, and a second bump physically jointing the curved substrate and the chip in a non-conduction state. The curved chip substrate uses a curved substrate having a bump at a first position on the substrate electrode and a second position which is different from a position on the electrode, respectively, and a chip having a bump in a third position on the chip electrode and a fourth position which is different from a position on the electrode. At first, the chip is deformed following the curved shape of the curved substrate, the bump at the first position and the bump at the third position are electrically connected, and the bump at the second position and the bump at the fourth position are physically jointed in a non-conduction state. In the process, the chip is jointed following the curved shape of the curved substrate. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a technique for mounting a chip on a curved substrate.

[0002]

2. Description of the Related Art FIG. 6 shows two chips 2 on a flat substrate 25.
It is sectional drawing of the chip substrate mounted above. Chip 2
For example, it is a so-called flip-chip arranged semiconductor chip which is arranged upside down and mounted on the flat substrate 25. The solder bumps 3 electrically and physically connect the chip 2 and the flat substrate 25. Both the chip 2 and the flat substrate 25 before mounting have solder bumps on electrodes (pads). During mounting, the solder bumps on each electrode are heated and melted to form integrated solder bumps 3. The underfill resin 4 seals the gap between the chip and the substrate.

The procedure for mounting the chip 2 on the flat substrate 25 will be specifically described. First, the solder bumps on the chip 2 side and the solder bumps on the flat substrate 25 side are pressed and heated. As a result, both solder bumps are melted and the chip 2 and the flat substrate 25 are electrically and physically connected. At this time, the portions other than the solder bumps 3 between the chip 2 and the flat substrate 25 remain as hollow regions, that is, gaps. Then, the underfill resin 4 is injected into the gap and cured to seal the gap. Through the above steps, the chip substrate shown in FIG. 6 is completed.

In FIG. 6, an example of the chip substrate in which the planar chip 2 and the planar substrate 25 are joined has been described. In recent years, various devices tend to be smaller and thinner. Therefore, in the future, it would be very useful if the chip could be mounted on a substrate having a shape other than a plane (non-planar shape) such as a curved shape. For example, Japanese Patent Laid-Open No. 9-148374 discloses a technique of joining a curved semiconductor film and a curved semiconductor chip with an anisotropic conductive adhesive.

Subsequently, FIG. 7A is a schematic view showing the structure of a conventional solder bump forming apparatus. The solder bump forming apparatus discharges solder onto the electrodes 8 of the chip 2 or the electrodes of the substrate to form solder bumps. The procedure for forming solder bumps on the electrodes 8 of the chip 2 is as follows. The solder bump forming apparatus uses the solder 1 in the solder tank 11.
4 is heated by the heater 10 and melted. The molten solder 14 is filled from the solder tank 11 to the pressure chamber 9. Then, the solder bump forming apparatus ejects the solder 14 from the nozzle 22 toward the electrode 8 on the chip 2. Specifically, a predetermined voltage is applied to the piezoelectric element 13 to displace it, and the diaphragm 19 is deformed. As a result, the pressure in the pressure chamber 9 rises, and the solder 14 is ejected from the nozzle 22. The ejected solder 16 is cooled when ejected,
Harden. Until the discharge amount becomes appropriate, use multiple solders 16
Is discharged. Further, when the solder 14 is desired to be ejected onto the plurality of electrodes 8, the respective electrodes 8 may be arranged below the nozzle 22 in order and ejected. The N ₂ pipe 15 emits nitrogen N ₂ to form an N ₂ atmosphere, and prevents the solder 14 and the discharged solder 16 from being oxidized.

When the solder bumps 16 are formed on the electrodes 8 of the chip 2, the heater 18 heats the chip 2. After a lapse of a predetermined time from the start of heating, the plurality of solder bumps 16 are melted and integrated, and the solder bumps 17 having a desired volume are formed. FIG. 7B shows the chip 2 having the solder bumps 17 melted by the heat of the heater.

[0007]

The first problem is to mount the chip on a curved board as described above.
When the technique of Japanese Patent No. 374 is used, an anisotropic conductive adhesive (resin material) is newly required. further,
New equipment is also needed to utilize the resin material.
In other words, new investment in equipment and materials will be required. Therefore, it is difficult to mount the chip on substrates of various shapes, not limited to the curved surface.

The second problem is that in the solder bump forming apparatus, when the diameter of the nozzle 22 is increased in order to increase the discharge amount of the solder 14, the static pressure of the solder applied to the nozzle 22 (ρ ·
g · H) causes the solder to drip from the nozzle 22. Therefore, the required amount of solder cannot be secured on the electrode 8 by one discharge, and as a result, a process such as increasing the number of discharges is required. This increases the processing time until the desired amount of solder can be secured. Specifically, the surface tension is σ, the solder density is ρ, the gravitational acceleration is g,
When the height from the nozzle to the liquid surface of the solder 14 is H, the maximum nozzle diameter D can be expressed as D = 4σ / (ρ · g · H). Now, σ = 470 × 10 ⁻³ (N / m), ρ =
9.7 × 10 ³ (kg / m ³ ), g = 9.8 m / s ² , H =
If it is 0.1 m, then D = 198 μm. According to the experiment, the diameter of the solder discharged at one time is about 200 μm in terms of the spherical diameter, with respect to the nozzle diameter of about 200 μm.

A third problem is that in the conventional solder bump forming apparatus, since the solder formed on the chip 2 or the substrate is melted by using the heater 18, the chip 2 having low heat resistance,
It cannot be applied to substrates and the like.

A first object of the present invention is to reliably mount a chip on a curved board. The second purpose is to discharge a desired amount of solder in a short time. A third object is to enable melting of solder even with a chip, a substrate or the like having low heat resistance.

[0011]

A curved chip substrate of the present invention includes a curved curved substrate having a substrate electrode, and a chip having a chip electrode that follows the curved shape of the curved substrate. It is provided with a first bump that electrically connects the substrate electrode and the chip electrode, and a second bump that physically joins the curved substrate and the chip in a non-conductive state. This achieves the above object.

A resin may be further provided to seal between the curved substrate and the chip.

A method of manufacturing a curved chip substrate according to the present invention is a curved curved substrate having a substrate electrode,
A step of providing a curved substrate having bumps at a first position on the substrate electrode and at a second position different from the position on the substrate electrode; Providing a chip having bumps at a third position and a fourth position different from the position on the chip electrode, and deforming the chip by following the curved shape of the curved substrate. Electrically connecting the bump at the first position on the curved substrate and the bump at the third position on the chip;
A step of physically joining the bump at the second position on the curved substrate and the bump at the fourth position on the chip in a non-conducting state, wherein the chip is formed into a curved shape of the curved substrate. And a step of joining while imitating. Thereby, the above object can be achieved.

The method may further include the step of sealing between the curved substrate and the chip with a resin.

A curved chip substrate according to the present invention includes a curved curved substrate having a substrate electrode, a chip having a chip electrode that follows the curved shape of the curved substrate, and the corresponding substrate electrode and the chip electrode. And a resin that seals between the curved substrate and the chip. This achieves the above object.

A bump forming apparatus for ejecting a conductive material onto an electrode to form a bump according to the present invention is provided in a pressure chamber for pressurizing the conductive material and a wall surface of the pressure chamber,
A plurality of nozzles for discharging the conductive material by pressurization are provided. This achieves the above object.

The interval between the plurality of nozzles may be smaller than the width of the electrodes.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings.

(First Embodiment) FIG. 1 is a sectional view of a chip substrate in which two chips 2 are mounted on a curved substrate 1 according to the first embodiment. The chip 2 is, for example, a thin semiconductor chip in a so-called flip chip arrangement, which is arranged upside down and mounted on the curved substrate 1. The curved substrate 1 is
A substrate in which all or part of the substrate has a non-planar shape. The curved substrate 1 and the chip 2 each include a substrate electrode and a chip electrode. In addition, the chip 2 before mounting
At least one of the curved substrate 1 has a solder bump on the electrode (on the pad). During mounting, the solder bumps on each electrode are heated and melted to form integrated solder bumps 3. The solder bumps 3 electrically and physically connect the corresponding electrodes of the curved substrate 1 and the chip 2 to each other. As a result, a signal is supplied to the chip 2 via the curved substrate 1, and the chip 2 can execute a predetermined process. The processing result of the chip 2 is transmitted to the curved substrate 1 via the solder bump 3 and further processed by another component not shown. The underfill resin 4 is injected into the gap for the purpose of protecting the connection between the chip 2 and the curved substrate.

The main features of the invention according to the first embodiment are:
The chip 2 is bent according to the curvature of the curved substrate 1,
That is, the solder bumps 3 (dummy bumps) are bonded to the curved substrate 1 and further provided at positions where no electrodes are present (for example, the central portion of the chip 2). For more details,
For example, the curvature of the chip 2 is almost equal to the curvature of the curved substrate 1. In order to realize this structure, a sufficiently thin chip 2 is used. For example, the thickness of the chip 2 is about 50 μm. This is because if the thickness is in this range, the chip 2 is deformed like a leaf spring. The dummy bump 3 is
Reference numeral 3 is a solder bump actually attached. The dummy bump 3 functions only to physically and firmly bond the curved substrate 1 and the chip 2 in a non-conductive state. Therefore, the dummy bump 3 is formed on the curved substrate 1 and the chip 2.
Is provided at a position that does not hinder the necessary electrical connection of the device and that does not cause unnecessary electrical connection.

The manufacturing procedure of such a chip substrate (FIG. 1) will be described below with reference to FIG. 2 (a)-
(G) is a figure explaining a manufacturing process of a curved surface chip substrate. In this example, both the curved substrate 1 and the chip 2 are
It is assumed that bumps are provided on the electrodes (pads).

First, FIG. 2A is a view showing the thin chip 2 in a planar state. It is understood that the chip bump 3a is provided on the electrode 2a of the chip 2. For simplification of description, only one electrode 2a portion is shown in detail in the drawing. FIG. 2B shows the curved substrate 1 with respect to
It is a figure which shows the chip | tip 2 bent by substantially the same curvature. The deformation of the chip 2 is performed by using the overheat cooling head 5. The superheat cooling head 5 has an adsorption hole 6 for adsorbing the chip 2, and the chip 2 can be deformed into a desired shape by adsorbing the chip 2 at an appropriate position and with a required strength. By this deformation, the chip 2 follows the shape of a curved surface that is substantially the same as the curved surface of the substrate. Electrodes on curved substrate 1 (not shown)
The substrate bump 3b is also provided on the top. The overheat cooling head 5 moves together with the chip 2 so that the corresponding chip bump 3a on the chip 2 is located above the substrate bump 3b. It should be noted here that among these bumps, there is a bump that does not bear the electrical connection between the curved substrate 1 and the chip 2 but bears only the physical connection, that is, a dummy bump. When dummy bumps are provided on both the curved substrate 1 and the chip 2, the chip 2 is moved to a position corresponding to these dummy bumps.

The superheat cooling head 5 lowers the chip 2 to bring the bumps of the curved substrate 1 and the bumps of the corresponding curved surface 1 into contact with each other. Then, the heating / cooling head 5 descends to bring the chip bumps 3a and the substrate bumps 3b into contact with each other. Further, the bumps are heated and melted to be integrated. Figure 2
(C) is a diagram showing a curved chip substrate in which the curved substrate 1 and the chip 2 are connected. Integrated chip bump 3
The a and the substrate bump 3b are shown as the solder bump 3. The solder bumps 3 that are heated and melted and integrated are cooled and solidified.

FIG. 2D is a view showing the curved chip substrate after the superheat cooling head 5 releases the adsorption. Then, when the heating / cooling head 5 is raised, the curved chip substrate in which the chip 2 deformed according to the curved surface of the curved substrate 1 and the curved substrate 1 are fixed by the solder bumps 3 is obtained. FIG. 2E is a diagram showing a curved chip substrate fixed by the solder bumps 3. Finally, liquid underfill resin 4 is placed in the gap between the curved substrate 1 and the chip 2.
Inject. The underfill resin 4 is heated and hardened by a heating means (not shown) such as a heater. FIG. 2F is a diagram showing a curved chip substrate in which the gap between the curved substrate 1 and the chip 2 is sealed. Here, the solder bumps 3 near the center of the chip 2 to which reference numerals are actually attached are the above-mentioned dummy bumps, and strengthen the physical bonding between the curved substrate 1 and the chip 2. By providing the dummy bumps, the chip 2 can more easily and reliably follow the curved surface of the curved substrate 1. Further, when a stress is generated between the curved substrate 1 and the chip 2 due to a positional displacement between the curved substrate 1 and the chip 2, expansion due to heat, etc., the solder bump 3 for electrically connecting the electrodes is formed. Concentration of stress can be avoided. A curved chip substrate can be obtained by the above steps.

2E is a diagram showing a chip 2 in which two chip bumps 3a are formed on one electrode. Such a chip 2 can be used instead of the chip 2 shown in FIG. A process of forming the chip 2 will be described later with reference to FIG. The curved chip substrate described with reference to FIG. 2 has a downward convex shape. But,
Depending on the overheat cooling head 5, it is also possible to manufacture an upward convex curved surface chip substrate formed of the chip 2 and the curved surface substrate 1 on the right side of FIG. It should be noted that it is effective to provide the above-mentioned dummy bumps when mounting chips on substrates of various shapes.

Further, the electrical connection between the curved substrate 1 and the chip 2 can be secured without using the solder bump 3. FIG. 3 is a view showing a curved chip substrate using the wire 30. Steps (b) to (e) of FIG. 2 are performed in the state where the solder bumps 3 are not present. Then wire 30
Thus, the corresponding electrodes of the curved substrate 1 and the corresponding electrodes of the chip 2 are electrically connected. Although two wires 30 are shown in the figure, this number can be increased or decreased as needed. On the other hand, the physical bond between the curved substrate 1 and the chip 2 is secured by the adhesive 31. To protect the wire 30, resin 32
Are provided on the curved substrate 1 so as to cover the chip 2 and the wires 30. The resin 32 also firmly bonds the curved substrate 1 and the chip 2 together. The solder bumps 3 may be used at some places and the wires 30 may be used at other places. As described above, when the wire 30 is used, the conventional manufacturing equipment can be used, so that the equipment investment can be suppressed.

In this embodiment, an example of forming bumps using solder bumps has been described. However, the material of the bump is not limited to solder, and gold may be used. Also in this case,
The same effect as the above effect can be obtained.

(Second Embodiment) In the second embodiment, solder bump formation for obtaining the chip 2 and the curved substrate 1 in FIGS. 1 and 2A to 2F described in the first embodiment. The device will be described. This solder bump forming apparatus is configured to discharge a desired amount of solder in a short time.

FIG. 4A is a schematic view showing the structure of the solder bump forming apparatus according to the second embodiment. The main feature of this solder bump forming apparatus is that it has a plurality of nozzles through which solder is ejected. This nozzle is a multi-nozzle 1
Referred to as 2. By providing the multi-nozzle 12 and discharging solder at the same time, the work can be speeded up. The required amount of solder can be adjusted by the total amount of solder ejected from each nozzle.

The structure of the solder bump forming apparatus will be described below. The solder bump forming apparatus includes a discharge head 7 and a pressure chamber 9
, Heater 10, solder tank 11, multi-nozzle 1
2, a piezoelectric element 13, an N ₂ pipe 15, a diaphragm 19, and a heater 18. Discharge head 7
Is a housing containing the ejection mechanism in the solder bump forming apparatus. The pressure chamber 9 is a section that applies a pressure required for discharging the solder 14 to the solder 14. Solder tank 11
Is a tank for holding the solder 14. Multi nozzle 12
Has a plurality of nozzles for ejecting the solder 14 on the lower wall surface of the pressure chamber 9. In the figure, two nozzles are shown, and the ejected solder is shown as the solder 16. The nozzle spacing can be smaller than the width of the electrodes. Thereby, a plurality of solder bumps can be formed on a single electrode. The piezoelectric element 13 is an element that causes mechanical strain by applying a voltage. N ₂ pipe 1
5 emits nitrogen N ₂ to form an N ₂ atmosphere, and solder 14
It also prevents the discharged solder 16 from being oxidized. The diaphragm 19 is a plate or a film that deforms according to the displacement of the piezoelectric element 13 to which a voltage is applied. The heater 18 is a heat stage that heats the chip 2.

Next, the operation of the solder bump forming apparatus will be described. Here, a case where solder bumps are formed on the electrodes 8 of the chip 2 will be described as an example. In addition to the curved substrate 1 ((b) to (f) in FIGS. 1 and 2), the flat substrate 25 (FIG. 6).
The same applies to the above, but the description thereof is omitted because it is similar to the following description.

First, the solder bump forming apparatus melts the solder 14 in the solder tank 11 by heating it with the heater 10. The molten solder 14 is transferred from the solder tank 11 to the pressure chamber 9
Is filled up. Next, a predetermined voltage is applied to the piezoelectric element 13 to generate strain (displacement). Due to this displacement, the diaphragm 19 is deformed. More specifically, the piezoelectric element 13 extends toward the pressure chamber 9 by applying a predetermined voltage. As a result, the diaphragm 19 also deforms toward the pressure chamber 9 side. As a result, the pressure in the pressure chamber 9 rises, and the solder 14
Are ejected from the multi-nozzle 12. When the ejection is stopped, the application of the voltage may be stopped to restore the displacement of the piezoelectric element 13 and the deformation of the diaphragm 19.

Since the multi-nozzle 12 has a plurality of nozzles, solder is ejected at the same time. Solder 16
Falls on the electrode 8 of the chip 2 below and is cooled and hardened. The ejection amount is the total volume of the solder ejected from each hole of the multi-nozzle 12. Number of nozzles, and 1
By adjusting the discharge amount from each nozzle per time, a required amount of solder can be discharged onto the electrode 8. When a large amount is required, the ejection may be performed a plurality of times, but it is preferable to eject the required amount of solder once. This is because the work can be speeded up. When it is desired to eject the solder onto the plurality of electrodes 8, the electrodes 8 may be sequentially arranged under the nozzle 22 and ejected. Note that N
_{The two} pipes 15 emit nitrogen N ₂ to form an N ₂ atmosphere, and prevent the solder 14 and the discharged solder 16 from being oxidized.

When the solder bumps 16 are formed on the electrodes 8 of the chip 2, the heater 18 heats the chip 2. After a lapse of a predetermined time from the start of heating, the plurality of solder bumps 16 are melted and integrated, and the solder bumps 17 having a desired volume are formed. FIG. 4B shows the chip 2 having the solder bumps 17 melted by the heat of the heater.

Here, as shown in FIG.
There are a plurality of ejection solders 16 on one electrode 8. This can be grasped as the chip bump 3a shown in FIG. That is, according to the solder bump forming apparatus of the second embodiment, a plurality of chip bumps can be formed by one ejection. At this time, it is not necessary to heat with the heater 18.

As described above, the solder bump forming apparatus is
Eject solder from one or more nozzle holes,
Two chip bumps 3a are simultaneously formed on the single electrode 2a ((g) of FIG. 2). Further, since the plurality of chip bumps 3a can be melted to form the solder bumps 17 having a desired volume, the work speed can be increased even when a solder material having a relatively large density that cannot increase the nozzle diameter is used. it can. Since such a solder bump forming apparatus can be used without selecting the type of the semiconductor chip, it is highly versatile.

The chip 2 having the solder bumps 17 formed on the electrodes 8 can be used as, for example, the chip 2 shown in FIGS. 1 and 2A to 2G in the first embodiment. It can also be used when forming a chip substrate (FIG. 6) by connecting the conventional flat substrate 1 and chip 2.

(Third Embodiment) In the third embodiment, the solder can be melted even for a substrate and a chip having low heat resistance. Specifically, the bumps ejected from the solder bump forming apparatus (FIG. 4) are irradiated with a laser beam to locally heat only the bumps. This can eliminate the need for heating the entire substrate and chip.

FIG. 5 is a diagram showing a state in which the galvano mirror 20 is used to irradiate only the plurality of bumps 17 with the laser light 21. The laser light 21 is a laser light source (not shown)
And is used as a heat source for melting the solder bumps 17 on the chip 2. The galvanometer mirror 20 reflects and scans the laser light 21. Galvanometer mirror 20 rotates about two orthogonal axes, as shown.
The laser light 21 can be reflected at a desired position by controlling each of the rotation angles.

According to the structure using the galvano mirror 20 and the laser beam 21 shown in FIG. 5, it is not necessary to heat the entire chip 2 using the heater 18 in FIGS. 4 (a) and 4 (b). That is, since the laser can be irradiated only to the ejected bumps, only the ejected solder can be melted to form the solder bumps 17, and therefore, the chip 2 having low heat resistance can be applied.

[0041]

EFFECTS OF THE INVENTION In a chip substrate in which a chip is mounted on a curved substrate, bumps for physically joining the curved substrate and the chip in a non-conductive state are provided. This allows the chip to more easily and reliably follow the curved surface of the curved substrate. Further, it is possible to prevent the stress between the curved substrate and the chip from concentrating on the solder bumps that electrically connect the electrodes.

The space between the curved substrate and the chip is sealed with resin. This can strengthen the physical bonding between the curved substrate and the chip.

Since the curved substrate is connected by the wire, the conventional manufacturing equipment can be used, and the equipment investment can be suppressed.

The bump forming apparatus has a plurality of nozzles for discharging a conductive material. Thereby, a plurality of bumps can be formed at the same time.

Further, since the nozzle interval is smaller than the electrode width, a plurality of bumps can be formed on a single electrode.

[Brief description of drawings]

FIG. 1 is a sectional view of a chip substrate in which two chips 2 are mounted on a curved substrate according to the first embodiment.

FIG. 2A to FIG. 2G are diagrams for explaining a manufacturing process of a curved chip substrate.

FIG. 3 is a diagram showing a curved chip substrate using wires.

FIG. 4A is a schematic diagram showing a structure of a solder bump forming apparatus according to a second embodiment. (B) is a diagram showing a chip 2 having solder bumps melted by the heat of the heater.

FIG. 5 is a diagram showing how a galvanometer mirror is used to irradiate only a plurality of bumps with laser light.

FIG. 6 is a cross-sectional view of a chip substrate in which two chips are mounted on a flat substrate.

FIG. 7A is a schematic view showing a structure of a conventional solder bump forming apparatus. (B) is a diagram showing a chip having solder bumps melted by the heat of the heater.

[Explanation of symbols]

1 curved substrate, 2 chips, 3 solder bumps / dummy bumps, 4 underfill resin, 7 ejection head, 8 electrodes, 9 pressure chamber, 10 heater, 1
DESCRIPTION OF SYMBOLS 1 solder tank, 12 multi-nozzle, 13 piezoelectric element, 14 solder, 15 N ₂ pipe, 16 discharge solder, 17 solder bump, 19 diaphragm

Continued front page    (72) Inventor Ryuichiro Mori             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. F term (reference) 5F044 KK01 KK17 LL01 PP16 PP19                 5F061 AA01 BA03 CA05

Claims (7)

[Claims] 1. A curved surface substrate having a substrate electrode, a chip having a chip electrode following the curved surface shape of the curved substrate, and the corresponding substrate electrode and the chip electrode are electrically connected. A curved chip substrate including a first bump and a second bump that physically joins the curved substrate and the chip in a non-conducting state. 2. The curved chip substrate according to claim 1, further comprising a resin that seals between the curved substrate and the chip. 3. A curved surface substrate having a substrate electrode, the curved substrate having bumps at a first position on the substrate electrode and at a second position different from the position on the substrate electrode, respectively. Providing a tip having a tip electrode, the tip having a third location on the tip electrode and a fourth location different from the location on the tip electrode.
Providing a chip having bumps at respective positions, deforming the chip according to the curved shape of the curved substrate, bumps at a first position on the curved substrate, and the bump on the chip. Electrically connecting the bump at the third position, and physically connecting the bump at the second position on the curved substrate and the bump at the fourth position on the chip in a non-conductive state And a step of joining the chips while following the curved shape of the curved substrate. 4. The method for manufacturing a curved chip substrate according to claim 2, further comprising a step of sealing between the curved substrate and the chip with a resin. 5. A curved curved surface substrate having a substrate electrode, a chip having a chip electrode following the curved surface shape of the curved substrate, and electrically connecting the corresponding substrate electrode and the chip electrode. Surface of the curved substrate and a resin that seals between the curved substrate and the chip. 6. A bump forming apparatus for ejecting a conductive material onto an electrode to form a bump, comprising: a pressure chamber for pressurizing the conductive material; A bump forming apparatus having a plurality of nozzles for ejecting a conductive material. 7. The bump forming apparatus according to claim 6, wherein the interval between the plurality of nozzles is smaller than the width of the electrode.