JPH11163049A - Structure and method of mounting electronic component with bump - Google Patents
Structure and method of mounting electronic component with bumpInfo
- Publication number
- JPH11163049A JPH11163049A JP9327759A JP32775997A JPH11163049A JP H11163049 A JPH11163049 A JP H11163049A JP 9327759 A JP9327759 A JP 9327759A JP 32775997 A JP32775997 A JP 32775997A JP H11163049 A JPH11163049 A JP H11163049A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- bumps
- substrate
- underfill resin
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フリップチップな
どのバンプ付電子部品を基板に実装するバンプ付電子部
品の実装構造および実装方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a mounting method for mounting a bumped electronic component such as a flip chip on a substrate.
【０００２】[0002]
【従来の技術】電子部品の種類として、フリップチップ
など半導体素子に突出電極であるバンプを設け、このバ
ンプを基板に接合することによって実装されるものが用
いられている。このバンプと基板との接合部を補強する
目的で電子部品と基板の間にアンダーフィル樹脂を注入
して封止することが行われる。このアンダーフィル樹脂
による封止は、エポキシ樹脂などで電子部品下面の隙間
を充填し、接合部を完全に包み込んで補強するととも
に、水分などの異物の侵入を防止するものである。2. Description of the Related Art As a type of electronic component, there is used a semiconductor device such as a flip chip which is provided with a bump which is a protruding electrode on a semiconductor element and which is bonded to a substrate by bonding the bump. In order to reinforce the joint between the bump and the substrate, an underfill resin is injected between the electronic component and the substrate for sealing. The sealing with the underfill resin fills a gap on the lower surface of the electronic component with an epoxy resin or the like, completely wraps and reinforces the joint, and prevents entry of foreign substances such as moisture.
【０００３】[0003]
【発明が解決しようとする課題】ところで、アンダーフ
ィル樹脂の注入にはディスペンサなどが用いられるが、
アンダーフィル樹脂がディスペンサにセットされ吐出さ
れて電子部品下面に注入されるまでの間に、アンダーフ
ィル樹脂内部には種々の混和物が入り込み、アンダーフ
ィル樹脂が注入されて硬化した後はそのままアンダーフ
ィル樹脂中に封入されたままとなっている。これらの混
和物には、空気などの他に水分や有機物などの気化性の
ものが含まれており、これらは、加熱されると気化して
体積が急膨張する。A dispenser or the like is used for injecting the underfill resin.
Before the underfill resin is set in the dispenser, discharged, and injected into the underside of the electronic component, various admixtures enter the underfill resin, and after the underfill resin is injected and cured, the underfill remains as it is. It remains encapsulated in the resin. These admixtures include vaporizable substances such as moisture and organic substances in addition to air and the like, and when heated, vaporize and rapidly expand in volume.
【０００４】そしてこの現象がバンプの接合部近辺で発
生すると接合部が剥離して電子部品の接続不良につなが
ることがある。特にこのような事態は製品として出荷さ
れた後の使用時に発生しやすいため、電子部品が使用さ
れる機器の信頼性を損なうこととなる。このように、従
来のバンプ付電子部品の実装構造では、アンダーフィル
樹脂中の気化性の混和物のため、実装後の接合部の信頼
性が確保されないという問題点があった。When this phenomenon occurs in the vicinity of the junction of the bumps, the junction may peel off, leading to poor connection of the electronic component. In particular, such a situation easily occurs at the time of use after being shipped as a product, which impairs the reliability of the device in which the electronic component is used. As described above, in the conventional mounting structure of the electronic component with bumps, there is a problem that the reliability of the bonded portion after mounting cannot be ensured due to the volatile compound in the underfill resin.
【０００５】そこで本発明は、上記問題点を解決し、実
装後の接合部の信頼性を確保することができるバンプ付
電子部品の実装構造および実装方法を提供することを目
的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a mounting structure and a mounting method of an electronic component with bumps which can solve the above-mentioned problems and can secure the reliability of a joint after mounting.
【０００６】[0006]
【課題を解決するための手段】請求項１記載のバンプ付
電子部品の実装構造は、基板上にバンプ付電子部品を実
装し、基板とバンプ付電子部品の間の隙間にアンダーフ
ィル樹脂を注入して成るバンプ付電子部品の実装構造で
あって、前記アンダーフィル樹脂中に空隙部とこの空隙
部から外部へ通じる開孔が形成されており、アンダーフ
ィル樹脂中の封入気体をこの開孔から脱気させるように
した。According to a first aspect of the present invention, there is provided a mounting structure of an electronic component with a bump, wherein the electronic component with a bump is mounted on a substrate, and an underfill resin is injected into a gap between the substrate and the electronic component with the bump. In the mounting structure of the electronic component with bumps, a void portion and an opening communicating with the outside from the void portion are formed in the underfill resin, and the gas filled in the underfill resin is discharged from the opening. I tried to degas.
【０００７】請求項２記載のバンプ付電子部品の実装方
法は、基板にバンプ付電子部品を搭載し、バンプ付電子
部品のバンプを基板と接合した後に、基板とバンプ付電
子部品の間の隙間にアンダーフィル樹脂を注入するバン
プ付電子部品の実装方法であって、前記アンダーフィル
樹脂の注入に際し、アンダーフィル樹脂を吐出する吐出
手段の吐出量および吐出位置を制御することにより、前
記アンダーフィル樹脂中に空隙部とこの空隙部から外部
へ通じる開孔を形成するようにした。According to a second aspect of the present invention, there is provided a method for mounting an electronic component with a bump, wherein the electronic component with a bump is mounted on a substrate, and the bump of the electronic component with a bump is bonded to the substrate. A method of mounting an electronic component with bumps by injecting an underfill resin into the underfill resin by controlling a discharge amount and a discharge position of a discharge unit that discharges the underfill resin during the injection of the underfill resin. A void portion and an opening communicating from the void portion to the outside are formed therein.
【０００８】本発明によれば、バンプ付電子部品と基板
の隙間に注入されるアンダーフィル樹脂に空隙部とこの
空隙部から外部へ通じる開孔を形成することにより、ア
ンダーフィル樹脂中の気化性の混和物を脱気することが
でき、使用時の気化物の熱膨張による接合部の剥離を防
止することができる。According to the present invention, the underfill resin injected into the gap between the electronic component with bumps and the substrate is provided with a void and an opening communicating from the void to the outside, so that the vaporization in the underfill resin is improved. Can be degassed, and peeling of the joint due to thermal expansion of the vaporized material during use can be prevented.
【０００９】[0009]
【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１（ａ）は本発明の一実施の形態
のバンプ付電子部品の実装構造の側断面図、図１（ｂ）
は同バンプ付電子部品の実装構造の平断面図、図２
（ａ），（ｂ），（ｃ），（ｄ）は同バンプ付電子部品
の実装方法の工程説明図である。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1A is a side sectional view of a mounting structure of an electronic component with bumps according to an embodiment of the present invention, and FIG.
Is a plan sectional view of the mounting structure of the electronic component with bumps, FIG.
(A), (b), (c), (d) is a process explanatory view of the mounting method of the electronic component with bumps.
【００１０】まず図１（ａ），（ｂ）を参照してバンプ
付電子部品の実装構造を説明する。図１（ａ）におい
て、基板１にはバンプ付電子部品２が実装されている。
バンプ付電子部品２のバンプ３は基板１と接合されてい
る。バンプ付電子部品２の下面と基板１の間の隙間には
アンダーフィル樹脂４が注入されている。アンダーフィ
ル樹脂４はエポキシ樹脂より成り、バンプ付電子部品２
を基板１に固着させ、バンプ３と基板２の接合部にヒー
トサイクルにより作用する熱応力を緩和する機能を有す
る。First, a mounting structure of an electronic component with bumps will be described with reference to FIGS. In FIG. 1A, an electronic component 2 with bumps is mounted on a substrate 1.
The bumps 3 of the electronic component 2 with bumps are joined to the substrate 1. An underfill resin 4 is injected into a gap between the lower surface of the bumped electronic component 2 and the substrate 1. The underfill resin 4 is made of epoxy resin, and the electronic component 2 with bumps
Is fixed to the substrate 1, and has a function of alleviating the thermal stress acting on the joint between the bump 3 and the substrate 2 by the heat cycle.
【００１１】図１（ｂ）に示すように、アンダーフィル
樹脂４は、バンプ付電子部品２の下面全体には注入され
ておらず、中央にはアンダーフィル樹脂４が存在しない
空隙部５が形成され、空隙部５は各辺に設けられた開孔
６により外部と連通している。この開孔６は、アンダー
フィル樹脂４中の気化性混和物を外部に導く脱気孔とな
っている。この空隙部５の形状は、バンプ付電子部品２
の種類に応じてバンプ３の接合部に対して必要とされる
補強の度合いが異るため、この補強の必要度合いを考慮
した上で決定されるものである。すなわち、電子部品の
種類によってはパッケージの隅部のみを補強すれば十分
なものもあり、またバンプ接合部を含めてできるだけ広
い範囲の補強が必要なものもあるため、前述の脱気の必
要度と、補強の必要度を勘案した上で決定される。As shown in FIG. 1B, the underfill resin 4 is not injected into the entire lower surface of the electronic component 2 with bumps, and a gap 5 where the underfill resin 4 does not exist is formed in the center. The gap 5 communicates with the outside through openings 6 provided on each side. The opening 6 is a deaeration hole for guiding the vaporizable admixture in the underfill resin 4 to the outside. The shape of the gap 5 is determined by the electronic component 2 with bumps.
The degree of reinforcement required for the joints of the bumps 3 varies depending on the type of the bump. Therefore, the degree of reinforcement is determined in consideration of the degree of reinforcement. In other words, depending on the type of electronic component, it is sufficient to reinforce only the corners of the package, and in some cases it is necessary to reinforce as wide a range as possible including the bump joint. Is determined in consideration of the necessity of reinforcement.
【００１２】また、空隙部５とともに開孔６を外部に連
通させることにより、実装後にリペアを行うためにバン
プ付電子部品２を取外す必要が生じた場合には、この開
孔６を電子部品取り外し用のツール挿入部位として用い
ることができ、リペア時の電子部品取外し作業を容易に
行うことができる。In addition, by connecting the opening 6 to the outside together with the gap 5, when it becomes necessary to remove the electronic component 2 with bumps for repair after mounting, the opening 6 is removed. As a tool insertion part for electronic devices, and can easily perform an electronic component removal operation at the time of repair.
【００１３】次に、図２を参照してバンプ付電子部品の
実装方法について説明する。図２（ａ），（ｂ），
（ｃ），（ｄ）はこの実装方法を工程順に示すものであ
る。まず図２（ａ）に示すように、基板１上にバンプ付
電子部品２が位置決めされ、次いで図２（ｂ）に示すよ
うに、バンプ付き電子部品２のバンプ３が基板１の上面
の電極面に半田接合される。Next, a method for mounting an electronic component with bumps will be described with reference to FIG. 2 (a), (b),
(C) and (d) show this mounting method in the order of steps. First, as shown in FIG. 2 (a), the electronic component 2 with bumps is positioned on the substrate 1, and then, as shown in FIG. 2 (b), the bumps 3 of the electronic component 2 with bumps are placed on the electrodes on the upper surface of the substrate 1. Soldered to the surface.
【００１４】この後基板１は樹脂塗布装置に送られ、ア
ンダーフィル樹脂４の注入が行われる。図２（ｃ）に示
すように、アンダーフィル樹脂４の吐出手段であるディ
スペンサ７の吐出量、および吐出位置を制御することに
より、バンプ付電子部品２の各隅部に所定量のアンダー
フィル樹脂４を吐出する。Thereafter, the substrate 1 is sent to a resin coating device, and the underfill resin 4 is injected. As shown in FIG. 2C, by controlling the discharge amount and the discharge position of the dispenser 7 serving as the discharge means of the underfill resin 4, a predetermined amount of the underfill resin is formed at each corner of the electronic component 2 with bumps. 4 is discharged.
【００１５】この後、時間の経過とともにアンダーフィ
ル樹脂４はバンプ付電子部品２の下面の隙間を内部に向
って進入し、所定時間経過後には図２（ｄ）に示すよう
にバンプ付電子部品２の中央部下面にアンダーフィル樹
脂４の空隙部５を残した状態で停止し、この状態では空
隙部５は開孔６によって外部と連通している。この後基
板１をリフロー炉に送り加熱することにより、アンダー
フィル樹脂４が硬化し、図１に示すバンプ付電子部品の
実装構造が完成する。Thereafter, as time passes, the underfill resin 4 penetrates into the gap on the lower surface of the electronic component 2 with bumps, and after a lapse of a predetermined time, as shown in FIG. In the state where the gap 5 of the underfill resin 4 is left on the lower surface of the center portion of the second 2, the gap 5 is in communication with the outside through the opening 6 in this state. Thereafter, the substrate 1 is sent to a reflow furnace and heated, whereby the underfill resin 4 is cured, and the mounting structure of the electronic component with bumps shown in FIG. 1 is completed.
【００１６】このように、アンダーフィル樹脂４を吐出
させる工程で、吐出量と吐出位置を制御することによ
り、アンダーフィル樹脂４の注入形態を所望の形状とす
ることができ、実装後の信頼性確保に必要な補強として
のアンダーフィル樹脂４の機能を満足しつつ、脱気に必
要な空隙部５および開孔６をそれぞれのバンプ付き電子
部品２の必要に応じた形状で形成することができる。As described above, in the step of discharging the underfill resin 4, by controlling the discharge amount and the discharge position, the injection form of the underfill resin 4 can be formed into a desired shape, and the reliability after mounting is improved. While satisfying the function of the underfill resin 4 as reinforcement required for securing, the voids 5 and the openings 6 required for degassing can be formed in the shapes required for the respective electronic components 2 with bumps. .
【００１７】[0017]
【発明の効果】本発明によれば、バンプ付電子部品と基
板の隙間に注入されるアンダーフィル樹脂に空隙部とこ
の空隙部から外部へ通じる開孔を形成することにより、
アンダーフィル樹脂中の気化性の混和物を脱気すること
ができるので、実装後の信頼性確保に必要な補強として
のアンダーフィル樹脂の機能を満足しつつ、脱気に必要
な空隙部および開孔をそれぞれの電子部品の必要に応じ
た形状で形成することができる。したがって、実装後の
使用時に熱環境によってアンダーフィル樹脂中の気化性
混和物が熱膨張してバンプ接合部を剥離させることを防
止して実装後の信頼性を高めることができる。According to the present invention, the underfill resin injected into the gap between the electronic component with bumps and the substrate is formed with a gap and an opening communicating from the gap to the outside.
Vaporizable admixtures in the underfill resin can be degassed, so the gaps and openings required for degassing are satisfied while satisfying the function of the underfill resin as reinforcement necessary to ensure reliability after mounting. The holes can be formed in a shape required for each electronic component. Accordingly, it is possible to prevent the vaporizable admixture in the underfill resin from thermally expanding due to the thermal environment due to the thermal environment at the time of use after mounting, and to peel off the bump joint, thereby improving the reliability after mounting.
【図１】（ａ）本発明の一実施の形態のバンプ付電子部
品の実装構造の側断面図 （ｂ）本発明の一実施の形態のバンプ付電子部品の実装
構造の平断面図FIG. 1A is a side sectional view of a mounting structure of an electronic component with bumps according to an embodiment of the present invention. FIG. 1B is a plan sectional view of a mounting structure of an electronic component with bumps according to an embodiment of the present invention.
【図２】（ａ）本発明の一実施の形態のバンプ付電子部
品の実装方法の工程説明図 （ｂ）本発明の一実施の形態のバンプ付電子部品の実装
方法の工程説明図 （ｃ）本発明の一実施の形態のバンプ付電子部品の実装
方法の工程説明図 （ｄ）本発明の一実施の形態のバンプ付電子部品の実装
方法の工程説明図FIGS. 2A and 2B are process explanatory views of a method for mounting an electronic component with bumps according to an embodiment of the present invention; and FIGS. (D) Process explanatory diagram of the mounting method of the electronic component with bump according to one embodiment of the present invention (d) Process explanatory diagram of the mounting method of the electronic component with bump according to one embodiment of the present invention
１ 基板 ２ 電子部品 ３ バンプ ４ アンダーフィル樹脂 ５ 空隙部 ６ 開孔 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electronic component 3 Bump 4 Underfill resin 5 Void 6 Opening
Claims (2)
とバンプ付電子部品の間の隙間にアンダーフィル樹脂を
注入して成るバンプ付電子部品の実装構造であって、前
記アンダーフィル樹脂中に空隙部とこの空隙部から外部
へ通じる開孔が形成されており、アンダーフィル樹脂中
の封入気体をこの開孔から脱気させることを特徴とする
バンプ付電子部品の実装構造。1. A mounting structure for an electronic component with bumps, wherein the electronic component with bumps is mounted on a substrate, and an underfill resin is injected into a gap between the substrate and the electronic component with bumps. A mounting structure for an electronic component with bumps, wherein a void portion and an opening communicating with the outside from the void portion are formed therein, and the gas enclosed in the underfill resin is degassed from the opening.
付電子部品のバンプを基板と接合した後に、基板とバン
プ付電子部品の間の隙間にアンダーフィル樹脂を注入す
るバンプ付電子部品の実装方法であって、前記アンダー
フィル樹脂の注入に際し、アンダーフィル樹脂を吐出す
る吐出手段の吐出量および吐出位置を制御することによ
り、前記アンダーフィル樹脂中に空隙部とこの空隙部か
ら外部へ通じる開孔を形成することを特徴とするバンプ
付電子部品の実装方法。2. An electronic component with a bump, comprising: mounting an electronic component with a bump on a substrate; bonding a bump of the electronic component with a bump to the substrate; and injecting an underfill resin into a gap between the substrate and the electronic component with the bump. In the mounting method, when injecting the underfill resin, by controlling a discharge amount and a discharge position of a discharge unit that discharges the underfill resin, the underfill resin communicates with the void portion and the void portion to the outside from the void portion. A method for mounting an electronic component with bumps, comprising forming an opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9327759A JPH11163049A (en) | 1997-11-28 | 1997-11-28 | Structure and method of mounting electronic component with bump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9327759A JPH11163049A (en) | 1997-11-28 | 1997-11-28 | Structure and method of mounting electronic component with bump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11163049A true JPH11163049A (en) | 1999-06-18 |
Family
ID=18202679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9327759A Pending JPH11163049A (en) | 1997-11-28 | 1997-11-28 | Structure and method of mounting electronic component with bump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11163049A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009260247A (en) * | 2008-03-19 | 2009-11-05 | Fujitsu Ltd | Electronic part, and method of manufacturing electronic part |
| WO2010095362A1 (en) * | 2009-02-20 | 2010-08-26 | パナソニック株式会社 | Resin coating apparatus and resin coating data creation apparatus |
| JP2010192727A (en) * | 2009-02-19 | 2010-09-02 | Panasonic Corp | Electronic component packaging body and method of coating resin |
| JP2011119731A (en) * | 2009-11-30 | 2011-06-16 | Numonyx Bv | Package including underfill material in portion of area between package and substrate or another package |
| US9204551B2 (en) | 2010-11-22 | 2015-12-01 | Lenovo Innovations Limited (Hong Kong) | Mounting structure and mounting method |
| US9331047B2 (en) | 2009-04-24 | 2016-05-03 | Panasonic Intellectual Property Management Co., Ltd. | Mounting method and mounting structure for semiconductor package component |
| CN107706157A (en) * | 2016-08-08 | 2018-02-16 | 株式会社藤仓 | The manufacture method of fixing body and the fixing body |
| DE102013109531B4 (en) * | 2012-12-28 | 2021-02-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for a packaging reinforcement |
-
1997
- 1997-11-28 JP JP9327759A patent/JPH11163049A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009260247A (en) * | 2008-03-19 | 2009-11-05 | Fujitsu Ltd | Electronic part, and method of manufacturing electronic part |
| JP2010192727A (en) * | 2009-02-19 | 2010-09-02 | Panasonic Corp | Electronic component packaging body and method of coating resin |
| WO2010095362A1 (en) * | 2009-02-20 | 2010-08-26 | パナソニック株式会社 | Resin coating apparatus and resin coating data creation apparatus |
| JP2010192789A (en) * | 2009-02-20 | 2010-09-02 | Panasonic Corp | Resin-coating apparatus and device for creating data for coating resin |
| CN102326240A (en) * | 2009-02-20 | 2012-01-18 | 松下电器产业株式会社 | Resin coating apparatus and resin coating data creation apparatus |
| US9331047B2 (en) | 2009-04-24 | 2016-05-03 | Panasonic Intellectual Property Management Co., Ltd. | Mounting method and mounting structure for semiconductor package component |
| JP2011119731A (en) * | 2009-11-30 | 2011-06-16 | Numonyx Bv | Package including underfill material in portion of area between package and substrate or another package |
| US9374902B2 (en) | 2009-11-30 | 2016-06-21 | Micron Technology, Inc. | Package including an underfill material in a portion of an area between the package and a substrate or another package |
| US9204551B2 (en) | 2010-11-22 | 2015-12-01 | Lenovo Innovations Limited (Hong Kong) | Mounting structure and mounting method |
| DE102013109531B4 (en) * | 2012-12-28 | 2021-02-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for a packaging reinforcement |
| CN107706157A (en) * | 2016-08-08 | 2018-02-16 | 株式会社藤仓 | The manufacture method of fixing body and the fixing body |
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