JPH10242594A - Manufacture of hollow conductor substrate and printed wiring board - Google Patents
Manufacture of hollow conductor substrate and printed wiring boardInfo
- Publication number
- JPH10242594A JPH10242594A JP3819197A JP3819197A JPH10242594A JP H10242594 A JPH10242594 A JP H10242594A JP 3819197 A JP3819197 A JP 3819197A JP 3819197 A JP3819197 A JP 3819197A JP H10242594 A JPH10242594 A JP H10242594A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- hollow
- drilling
- hollow portion
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、中空導体基板及
びプリント配線基板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a hollow conductor substrate and a printed wiring board.
【０００２】[0002]
【従来の技術】従来樹脂基材部の一部を除去したプリン
ト配線基板として、市販の片面銅張ガラスエポキシ基材
や片面銅張フレキシブル基材の、樹脂側からボル盤やレ
ーザでざぐり加工したものが一部で試行されているが、
このようなプリント配線基板は樹脂が硬化した後であっ
て、回路形成後にしか加工することができないため、製
造が困難であって高価なものとなるという問題がある。2. Description of the Related Art Conventionally, as a printed wiring board from which a part of a resin base has been removed, a commercially available single-sided copper-clad glass epoxy base or a single-sided copper-clad flexible base has been counterbored from the resin side with a bolster or a laser. Some things have been tried,
Since such a printed wiring board can be processed only after the resin is cured and after the circuit is formed, there is a problem that the printed wiring board is difficult and expensive to manufacture.
【０００３】[0003]
【発明が解決しようとする課題】ところでこのようなプ
リント配線基板は、中空部を有することによって、表
裏からアクセスすることが可能となって、電子部品の実
装密度、自由度が向上し、中空部となっている部位を
誘電体として利用することができるので、例えば平面ア
ンテナのような高周波部品に応用することが可能であ
り、中空部に金属めっき加工することにより、又は導
体を充填する等によって導体回路を形成することが可能
なことから、平面的な回路配線からＺ方向への回路成形
が可能となって、配線密度、自由度が向上し、また大き
な導体厚が必要な大電流用基板への応用が可能となり、
中空部に電子部品を埋込み、中空導体を放熱層として
利用することが可能であって、ヒートシンク効果をうる
ことができる等の利点があることから、それが簡単な加
工技術によって容易製造することができて、安価に提供
することができる技術が待望されている。By the way, such a printed wiring board has a hollow portion, so that it can be accessed from the front and back, and the mounting density and the degree of freedom of electronic components are improved, and the hollow portion is improved. Can be used as a dielectric, so it can be applied to high-frequency components such as planar antennas, for example, by plating metal in hollows, or by filling conductors, etc. Since it is possible to form a conductor circuit, it is possible to form a circuit in the Z direction from planar circuit wiring, thereby improving the wiring density and the degree of freedom, and a large current substrate requiring a large conductor thickness. Can be applied to
It is possible to embed an electronic component in the hollow part and use the hollow conductor as a heat dissipation layer, and there are advantages such as a heat sink effect. Therefore, it can be easily manufactured by a simple processing technique. There is a need for a technology that can be provided at low cost.
【０００４】そこでこの発明の目的は、前記のような待
望に応えて、有用なプリント配線基板及びそのための中
空導体基板の従来の製造方法のもつ問題を解消し、簡単
な工程でこの種のプリント配線基板及びそのための中空
導体基板を製造することができて、これらの中空導体基
板これを用いて製造されるプリント配線板を安価なもの
とすることのできる中空導体基板及びプリント配線基板
の製造方法を提供するにある。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the problems of the conventional method of manufacturing a useful printed wiring board and a hollow conductor board therefor in order to meet the above-mentioned long-awaited needs, and to provide a simple printed circuit board of this kind. A method of manufacturing a hollow conductor substrate and a printed wiring board capable of manufacturing a wiring substrate and a hollow conductor substrate therefor, and reducing the cost of a printed wiring board manufactured using the hollow conductor substrate To provide.
【０００５】[0005]
【課題を解決するための手段】この発明は、前記のよう
な目的を達成するために、中空導体基板の製造方法にお
いて、基材に半硬化状態とした熱硬化性絶縁樹脂層を形
成し、所要個所に孔明加工によって孔を形成し、前記半
硬化状態とした熱硬化性絶縁樹脂層に導体材料を接着す
ることによって、中空部を形成することを特徴とするも
のである。In order to achieve the above object, the present invention provides a method for manufacturing a hollow conductor substrate, comprising forming a semi-cured thermosetting insulating resin layer on a base material, A hole is formed by drilling at a required portion, and a hollow portion is formed by bonding a conductive material to the thermosetting insulating resin layer in the semi-cured state.
【０００６】また前記のような目的を達成するために、
プリント配線基板の製造方法において、ガラスエポキシ
板に、半硬化状態の熱硬化性のエポキシ樹脂シートを接
着し、これの必要個所に孔明加工によって孔を形成し、
エポキシ樹脂シートの表面に銅箔を接着して、中空部を
形成した中空導体基板の必要個所に孔明加工によって厚
さ方向の孔を形成し、必要個所にエッチングレジストを
形成し、不要部の銅箔をエッチング法等によって除去
し、残存するエッチングレジストを除去して、中空部を
形成することを特徴とするものである。In order to achieve the above-mentioned object,
In a method of manufacturing a printed wiring board, a thermosetting epoxy resin sheet in a semi-cured state is bonded to a glass epoxy plate, and holes are formed in necessary portions of the sheet by drilling,
A copper foil is adhered to the surface of the epoxy resin sheet, a hole in the thickness direction is formed by drilling at a necessary portion of the hollow conductor substrate having a hollow portion, an etching resist is formed at a necessary portion, and copper at an unnecessary portion is formed. The foil is removed by an etching method or the like, and the remaining etching resist is removed to form a hollow portion.
【０００７】[0007]
【発明の実施の形態】図１〜７には、この発明の中空導
体基板の第１〜７実施形態１−１〜７が示されているの
でこれらについて説明する。図１には第１実施形態１−
１の製造工程が示されており、この実施形態１−１は、
0.4ｔガラスエポキシ板２（ａ）に、半硬化状態の熱硬
化性のエポキシ樹脂シート３を、140℃×20分、２ＭＰ
ａＦで片面に接着（ｂ）後、これの必要個所に孔明加工
（ドリリング、ルータ、打抜等）によって、４φの丸孔
及び５×５mm，10×10mmの角孔（図示を省略）４を形成
し（ｃ）、エポキシ樹脂シート２の表面に厚さ18μmの
銅箔５を接着して、中空部６を有する第１実施形態１−
１の成形を終了する（ｄ）。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 7 show first to seventh embodiments 1-1 to 7 of a hollow conductor substrate according to the present invention, which will be described. FIG. 1 shows a first embodiment 1-
1 is shown, and the embodiment 1-1 includes:
A semi-cured thermosetting epoxy resin sheet 3 is placed on a 0.4 t glass epoxy plate 2 (a) at 140 ° C. × 20 minutes, 2MP
After bonding to one side with aF (b), a 4φ round hole and 5 × 5 mm, 10 × 10 mm square holes (not shown) 4 are drilled at necessary places by drilling (drilling, router, punching, etc.). Formed (c), a copper foil 5 having a thickness of 18 μm is adhered to the surface of the epoxy resin sheet 2 to form a hollow portion 6 of the first embodiment 1-
1 is completed (d).
【０００８】図２には中空導体基板１の第２実施形態１
−２の成形工程が示されており、この第２実施形態１−
２は、0.1ｔの片面銅箔７張ガラスエポキシ板８（ａ）
の、銅箔７の反対側の面に半硬化状態の熱硬化性のエポ
キシシート９を140℃×20分、２ＭＰａＦで接着した後
（ｂ）、これの必要個所に0.2φの丸孔、0.2×5mmmの角
孔（図示を省略）10を孔明加工によって形成し（ｃ）、
エポキシ樹脂シート９の表面に厚さ70μmの銅箔11を180
℃×60分、３ＭＰａＦで接着して、中空部12を有する第
２実施形態１−２の成形を終了する（ｄ）。FIG. 2 shows a second embodiment 1 of the hollow conductor substrate 1.
-2 of the second embodiment 1-
2 is a 0.1-ton single-sided copper foil 7-clad glass epoxy plate 8 (a)
After bonding a thermosetting epoxy sheet 9 in a semi-cured state to the opposite side of the copper foil 7 at 140 ° C. × 20 minutes with 2 MPaF (b), a round hole of 0.2φ, 0.2 A square hole (not shown) 10 of × 5 mm is formed by drilling (c),
180 μm of copper foil 11 having a thickness of 70 μm is
Bonding is performed at 3 ° C. for 60 ° C. for 3 minutes to complete the molding of the second embodiment 1-2 having the hollow portion 12 (d).
【０００９】中空導体基板１の第３実施形態１−３は、
その材料を除く層構成が第２実施形態１−２と同様にな
っているので、図２を参照して同様の部分には符号にダ
ッシュを付したものをかっこして示して説明することと
する。この第３実施形態１−３は、0.4ｔの片面銅箔
７′張ガラスエポキシ板８′（ａ）の、銅箔７′の反対
側の面に、半硬化状態の熱硬化性ガラスエポキシ（通称
プリプレグ）９′を、140℃×50分、２ＭＰａＦで接着
した後（ｂ）、これの必要個所に孔明加工によって0.2
φの丸孔及び0.2×5mmの角孔（図示を省略）10′を形成
し（ｃ）、プリプレグ９′の表面に厚さ70μmの銅箔1
1′を接着して、中空部12′有する第３実施形態１−３
の成形を終了する（ｄ）。The third embodiment 1-3 of the hollow conductor substrate 1 is as follows.
Since the layer configuration excluding the material is the same as that of the second embodiment 1-2, the same portions as those of the second embodiment 1-2 will be described with parentheses with reference numerals with dashes. I do. In the third embodiment 1-3, a 0.4-t single-sided copper foil 7'-clad glass epoxy plate 8 '(a) is provided with a semi-cured thermosetting glass epoxy ( After prepreg 9 ′ was bonded at 140 ° C. × 50 minutes with 2 MPaF (b), 0.2 parts were drilled at necessary places by drilling.
A circular hole of φ and a square hole of 0.2 × 5 mm (not shown) 10 ′ are formed (c), and a 70 μm thick copper foil 1 is formed on the surface of the prepreg 9 ′.
3rd Embodiment 1-3 having hollow portion 12 'by bonding 1'
Is completed (d).
【００１０】図３には中空導体基板１の第４実施形態１
−４の成形工程が示されており、この第４実施形態１−
４は、0.4ｔ片面銅箔13張ガラスエポキシ板14の、銅箔1
3の反対側の面に熱硬化性エポキシ系樹脂16付銅箔17を1
30℃×20分、２ＭＰａＦで接着し（ａ）、これの必要個
所に孔明加工によって0.5φ，1.0φ，3.0φ，4.0φの丸
孔18を形成し（ｂ）、エポキシ系樹脂16付銅箔17をエッ
チング法等によって除去し（ｃ）、樹脂16の表面に0.3
ｔ銅板19を180℃×60分、３ＭＰａＦで接着して、中空
部21を有する第４実施形態１−４の成形を終了する
（ｄ）。FIG. 3 shows a fourth embodiment 1 of the hollow conductor substrate 1.
-4 of the fourth embodiment 1-
4 is a copper foil 1 of 0.4 t single-sided copper foil 13 covered glass epoxy board 14
On the opposite side of 3, add 1 copper foil 17 with thermosetting epoxy resin 16
Bonded at 2 ° F for 2 minutes at 30 ° C for 20 minutes (a). Holes of 0.5φ, 1.0φ, 3.0φ, 4.0φ were formed by drilling in necessary places of this (b), and copper with epoxy resin 16 was formed. The foil 17 is removed by an etching method or the like (c), and 0.3
The copper plate 19 is bonded at 180 ° C. for 60 minutes at 3 MPaF to complete the forming of the fourth embodiment 1-4 having the hollow portion 21 (d).
【００１１】図４には中空導体基板１の第５実施形態１
−５の成形工程が示されており、この第４実施形態１−
５は、銅箔24，24′付の１対の熱硬化性エポキシ系樹脂
23，23′の内面に、0.4ｔアルミニユーム25を130℃×20
分、２ＭＰａＦで接着した後（ａ）、一方の銅箔24′を
エッチング法等によって除去し（ｂ）、必要個所に孔明
加工によって孔26を形成し（ｃ）、樹脂23の表面に厚さ
70μmの銅箔27を180℃×60分、３ＭＰａＦで接着して、
中空部28を有する第５実施形態１−５の成形を終了する
（ｄ）。FIG. 4 shows a hollow conductor substrate 1 according to a fifth embodiment.
5 is shown, and the fourth embodiment 1-
5 is a pair of thermosetting epoxy resin with copper foil 24, 24 '
0.4t aluminum 25 at 130 ℃ × 20 on the inner surface of 23,23 '
After bonding with 2 MPaF (a), one of the copper foils 24 'is removed by an etching method or the like (b), holes 26 are formed at necessary places by drilling (c), and the thickness of the surface of the resin 23 is reduced.
A 70 μm copper foil 27 is bonded at 180 ° C. for 60 minutes with 3 MPaF,
The molding of the fifth embodiment 1-5 having the hollow portion 28 is completed (d).
【００１２】図５には中空導体基板１の第６実施形態１
−６の成形工程が示されており、この第６実施形態１−
６は、0.06ｔ片面銅箔31張ガラスエポキシ板32（ａ）
の、ガラスエポキシ板32の銅箔31の反対側に熱硬化性の
エポキシ樹脂シート33を、140℃×20分、２ＭＰａＦで
接着し（ｂ）、これの必要個所に孔明加工によって0.5
φ，1.0φ，3.0φ，4.0φの丸孔34を形成した（ｃ）積
層板Ａと、0.08ｔ樹脂36付銅箔37（ｘ）の、前記の孔34
に対向した位置に孔明加工によって0.5φ，1.0φ，3.0
φ，4.0φの丸孔38を形成し（ｙ）、樹脂36の銅箔37の
反対側の面に130℃×20分、0.5ＭＰａＦで厚さ35μmの
銅箔39を接着して、必要なパターンの、中空部40を形成
した（ｚ）積層板Ｂとを用意し、積層板Ａのエポキシ樹
脂シート33と、積層板Ｂの銅箔37とを180℃×60分、３
ＭＰａＦで接着して、中空部40を有する第６実施形態１
−６の成形を終了する。FIG. 5 shows a sixth embodiment 1 of the hollow conductor substrate 1.
-6 is shown, and the sixth embodiment 1-
6 is a 0.06 t single-sided copper foil 31 covered glass epoxy board 32 (a)
A thermosetting epoxy resin sheet 33 is bonded to the opposite side of the copper foil 31 of the glass epoxy plate 32 at 140 ° C. for 20 minutes at 2 MPaF (b).
(c) Laminated plate A having round holes 34 of φ, 1.0φ, 3.0φ, and 4.0φ, and the aforementioned holes 34 of copper foil 37 (x) with 0.08 t resin 36.
0.5φ, 1.0φ, 3.0 by drilling at the position facing
A round hole 38 of φ, 4.0φ is formed (y), and a copper foil 39 having a thickness of 35 μm is adhered to the opposite side of the copper foil 37 of the resin 36 at 130 ° C. × 20 minutes at 0.5 MPaF, and required. A (z) laminate B having a hollow portion 40 of the pattern is prepared, and the epoxy resin sheet 33 of the laminate A and the copper foil 37 of the laminate B are bonded at 180 ° C. for 60 minutes for 3 minutes.
Sixth Embodiment 1 having a hollow portion 40 bonded by MPaF
The molding of -6 is completed.
【００１３】図６には中空導体基板１の第７実施形態１
−７の成形工程が示されており、この第７実施形態１−
７は、0.05ｔ半硬化状態の熱硬化性のエポキシ樹脂シー
ト41で、必要個所に孔明加工によって0.5φ，1.0φ，3.
0φ，4.0φの丸孔42を形成したもの（ａ）と、0.2ｔ片
面銅箔43張ガラスエポキシ板44（ｂ）とを用意し、ガラ
スエポキシ板44の片面銅箔43と反対側の面にエポキシ樹
脂シート41を接着し（ｃ）、エポキシ樹脂シート41を厚
さ35μmの銅箔45とガラスエポキシ板44との間に挿入し
て、180℃×60分、２ＭＰａＦで接着して、中空部46を
有する第７実施形態１−７の成形を終了する（ｄ）。FIG. 6 shows a seventh embodiment 1 of the hollow conductor substrate 1.
-7 is shown, and the seventh embodiment 1-
Numeral 7 denotes a thermosetting epoxy resin sheet 41 in a half-cured state of 0.05 t.
One having a round hole 42 of 0φ and 4.0φ (a) and a 0.2t single-sided copper foil 43 covered glass epoxy plate 44 (b) were prepared, and the surface of the glass epoxy plate 44 opposite to the single-sided copper foil 43 was prepared. (C), insert the epoxy resin sheet 41 between the copper foil 45 having a thickness of 35 μm and the glass epoxy plate 44, and adhere at 180 ° C. × 60 minutes with 2 MPaF to form a hollow. The forming of the seventh embodiment 1-7 having the portion 46 is completed (d).
【００１４】図７には中空導体基板１の第８実施形態１
−８の成形工程が示されており、この第７実施形態１−
８は、両面に１対の銅箔48，48′付フッ素基板49を用意
し（ａ）、片面の銅箔48′をエッチング法等によって除
去し（ｂ）、この除去面にボンディングフィルム51を所
定条件下で仮接着し（ｃ）、必要個所に孔明加工によっ
て２φの丸孔52，53をマトリック状に形成し（ｄ）、ボ
ンディングフィルム51の表面に厚さ70μmの銅箔54を所
定条件下で接着して中空部56，57を形成し（ｅ）、中空
部57の開口部をめっきレジスト58で閉鎖して閉鎖空所59
を形成し（ｆ）、銅箔48、中空部56及びボンディングフ
ィルム51の表面にめっき皮膜61，61′を形成し（ｇ）、
めっきレジスト58を除去して、第８実施形態１−８の成
形を終了する（ｈ）。FIG. 7 shows an eighth embodiment 1 of the hollow conductor substrate 1.
-8 is shown, and the seventh embodiment 1-
8, a pair of copper foils 48, 48 'are provided on both surfaces of a fluorine substrate 49 (a), and one side of the copper foil 48' is removed by etching or the like (b), and a bonding film 51 is provided on the removed surface. Temporary bonding is performed under predetermined conditions (c), and 2φ round holes 52 and 53 are formed in a matrix at required locations by drilling (d). A 70 μm thick copper foil 54 is formed on the surface of the bonding film 51 under predetermined conditions. The lower portions are adhered to form hollow portions 56 and 57 (e), and the opening portion of the hollow portion 57 is closed with a plating resist 58 to form a closed space 59.
(F), and plating films 61, 61 'are formed on the surfaces of the copper foil 48, the hollow portion 56 and the bonding film 51 (g),
The plating in the eighth embodiment 1-8 is completed by removing the plating resist 58 (h).
【００１５】図８にはプリント配線基板55の第１実施形
態55−１の製造工程が示されており、この第１実施形態
55−１は、前記中空導体基板１の第１実施形態１−１を
使用して製造するものであり、中空導体基板１−１の必
要個所に孔明加工によって厚さ方向の孔63を形成し
（ａ）、必要個所にエッチングレジスト64を形成し
（ｂ）、不要部の銅箔５をエッチング法等によって除去
し（ｃ）、残存するエッチングレジスト64を除去して第
１実施形態55−１が形成される。FIG. 8 shows a manufacturing process of the first embodiment 55-1 of the printed wiring board 55.
55-1 is manufactured by using the first embodiment 1-1 of the hollow conductor substrate 1, and a hole 63 in a thickness direction is formed in a necessary portion of the hollow conductor substrate 1-1 by drilling. (A), an etching resist 64 is formed at a necessary portion (b), an unnecessary portion of the copper foil 5 is removed by an etching method or the like (c), and the remaining etching resist 64 is removed to obtain the first embodiment 55-1. Is formed.
【００１６】図９にはプリント配線基板55の第２実施例
55−２の製造工程が示されており、この第２実施形態55
−２は、前記中空導体基板１の第２〜７実施形態１−２
〜７を使用して製造するものであり、中空導体基板１−
２について説明し、他の中空導体基板１−３〜７につい
ては同様に製造されることからその説明を省略する。前
記の中空導体基板１−２の必要個所に孔明加工によって
厚さ方向の孔66を形成し（ａ）、必要個所にエッチング
レジスト67を形成し（ｂ）、不要部の銅箔７をエッチン
グ法等によって除去し（ｃ）、残存するエッチングレジ
スト67を除去して第２形態55−２が形成される（ｄ）。FIG. 9 shows a second embodiment of the printed wiring board 55.
The manufacturing process of the second embodiment 55-2 is shown.
-2 are the second to seventh embodiments 1-2 of the hollow conductor substrate 1
7 and the hollow conductor substrate 1-
2 will be described, and the other hollow conductor substrates 1-3 to 7 will be described in the same manner, and will not be described. A hole 66 in the thickness direction is formed by drilling at a necessary portion of the hollow conductor substrate 1-2 (a), an etching resist 67 is formed at a necessary portion (b), and an unnecessary portion of the copper foil 7 is etched. (C), and the remaining etching resist 67 is removed to form a second embodiment 55-2 (d).
【００１７】[0017]
【発明の効果】この発明は、前記のようであって、中空
導体基板の製造方法において、基材に半硬化状態とした
熱硬化性絶縁樹脂層を形成し、所要個所に孔明加工によ
って形成し、前記半硬化状態とした熱硬化性絶縁樹脂層
に導体材料を接着することによって中空部を形成し、ま
たプリント配線基板の製造方法において、ガラスエポキ
シ板に、半硬化状態の熱硬化性のエポキシ樹脂シートを
接着し、これの必要個所に孔明加工によって孔を形成
し、エポキシ樹脂シートの表面に銅箔を接着して、中空
部を形成した中空導体基板の必要個所に孔明加工によっ
て厚さ方向の孔を形成し、必要個所にエッチングレジス
トを形成し、不要部の銅箔をエッチング法等によって除
去し、残存するエッチングレジストを除去して、中空部
を形成するので、これらの中空導体基板及びプリント配
線基板は、この中空部を利用して、表裏からアクセスし
て電子部品の実装密度、自由度を向上し、中空部を誘電
体として利用して高周波部品として応用され、中空部を
利用して導体回路を形成して、平面的な回路配線からＺ
方向への回路を成形し、また中空部に電子部品を埋込
み、中空導体を放熱層として利用することが可能で、業
界の待望に応えることができて応用性の広い、中空導体
基板及びプリント配線基板を、簡単な工程で製造するこ
とができて、それらを安価なものとすることのできると
いう効果がある。As described above, the present invention provides a method of manufacturing a hollow conductor substrate, comprising forming a semi-cured thermosetting insulating resin layer on a base material, and forming the thermosetting insulating resin layer at a required portion by drilling. Forming a hollow portion by bonding a conductive material to the thermosetting insulating resin layer in the semi-cured state, and forming a semi-cured thermosetting epoxy on a glass epoxy plate in the method of manufacturing a printed wiring board. A resin sheet is adhered, holes are formed by drilling where necessary, and a copper foil is adhered to the surface of the epoxy resin sheet. Holes are formed, an etching resist is formed at necessary places, unnecessary portions of the copper foil are removed by an etching method or the like, and the remaining etching resist is removed to form a hollow portion. These hollow conductor boards and printed wiring boards are accessed from the front and back using this hollow part to improve the mounting density and flexibility of electronic components, and are applied as high-frequency components using the hollow part as a dielectric. , A conductor circuit is formed using the hollow portion, and Z
It is possible to form a circuit in the direction, embed electronic components in the hollow part, use the hollow conductor as a heat dissipation layer, meet the industry's long-awaited, widely applicable hollow conductor substrate and printed wiring There is an effect that the substrates can be manufactured by a simple process and they can be made inexpensive.
【図１】この発明の中空導体基板製造の第１実施形態の
工程説明図である。FIG. 1 is a process explanatory view of a first embodiment of manufacturing a hollow conductor substrate according to the present invention.
【図２】同上の第２，３実施形態の工程説明図である。FIG. 2 is a process explanatory view of the second and third embodiments.
【図３】同上の第４実施形態の工程説明図である。FIG. 3 is a process explanatory view of a fourth embodiment of the above.
【図４】同上の第５実施形態の工程説明図である。FIG. 4 is a process explanatory view of the fifth embodiment.
【図５】同上の第６実施形態の工程説明図である。FIG. 5 is a process explanatory view of the sixth embodiment.
【図６】同上の第７実施形態の工程説明図である。FIG. 6 is a process explanatory view of the seventh embodiment.
【図７】同上の第８実施形態の工程説明図である。FIG. 7 is a process explanatory view of the eighth embodiment.
【図８】この発明のプリント配線基板製造の第１実施形
態の工程説明図である。FIG. 8 is a process explanatory view of the first embodiment of the manufacture of a printed wiring board according to the present invention.
【図９】同上の第２実施形態の工程説明図である。FIG. 9 is a process explanatory view of the second embodiment.
１ 中空導体基板 ２ ガラスエポキシ
板 ３ エポキシ樹脂シート ４ 孔 ５ 銅箔 ６ 中空部 ７ 銅箔 ８ ガラスエポキシ
板 ９ エポキシシート 10 孔 11 銅箔 12，12′ 中空部 13 銅箔 14 ガラスエポキシ
板 16 樹脂層 17 銅箔 18 丸孔 19 銅板 21 中空部 23 樹脂 24 銅箔 25 アルミニユーム 26 孔 27 銅箔 28 中空部 31 銅箔 32 ガラスエポキシ板 33 エポキシ樹脂シ
ート 34 丸孔 36 樹脂 37 銅箔 38 丸孔 39 銅箔 40 中空部 41 エポキシ樹脂シート 42 丸孔 43 銅箔 44 ガラスエポキシ
板 45 銅箔 46 中空部 48，48′ 銅箔 49 フッ素基板 51 ボンディングフィルム 52 丸孔 53 丸孔 54 銅箔 55 プリント配線基板 56 中空部 57 中空部 58 めっきレジスト 59 閉鎖空所 61 めっき皮膜 62 めっき皮膜 63 孔 64 エッチングレジスト 66 孔 67 エッチングレジストDESCRIPTION OF SYMBOLS 1 Hollow conductor board 2 Glass epoxy board 3 Epoxy resin sheet 4 Hole 5 Copper foil 6 Hollow part 7 Copper foil 8 Glass epoxy board 9 Epoxy sheet 10 Hole 11 Copper foil 12, 12 'Hollow part 13 Copper foil 14 Glass epoxy board 16 Resin Layer 17 Copper foil 18 Round hole 19 Copper plate 21 Hollow part 23 Resin 24 Copper foil 25 Aluminium 26 Hole 27 Copper foil 28 Hollow part 31 Copper foil 32 Glass epoxy plate 33 Epoxy resin sheet 34 Round hole 36 Resin 37 Copper foil 38 Round hole 39 Copper foil 40 Hollow part 41 Epoxy resin sheet 42 Round hole 43 Copper foil 44 Glass epoxy plate 45 Copper foil 46 Hollow part 48, 48 'Copper foil 49 Fluorine substrate 51 Bonding film 52 Round hole 53 Round hole 54 Copper foil 55 Printed wiring board 56 Hollow part 57 Hollow part 58 Plating resist 59 Enclosed space 61 Plating film 62 Plating film 63 Hole 64 Etching resist 66 Hole 67 Etching resist
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成９年５月２８日[Submission date] May 28, 1997
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００２[Correction target item name] 0002
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００２】従来樹脂基材部の一部を除去したプリント
配線基板として、市販の片面銅張ガラスエポキシ基材や
片面銅張フレキシブル基材の、樹脂側からボール盤やレ
ーザでざぐり加工したものが一部で試行されているが、
このようなプリント配線基板は樹脂が硬化した後であっ
て、回路形成後にしか加工することができないため、製
造が困難であって高価なものとなるという問題がある。Conventionally, as a printed wiring board from which a part of a resin base portion is removed, a commercially available single-sided copper-clad glass epoxy base material or a single-sided copper-clad flexible base material which has been counterbored from a resin side with a drilling machine or a laser is known. Has been tried in the department,
Since such a printed wiring board can be processed only after the resin is cured and after the circuit is formed, there is a problem that the printed wiring board is difficult and expensive to manufacture.
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００６[Correction target item name] 0006
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００６】また前記のような目的を達成するために、
プリント配線基板の製造方法において、ガラスエポキシ
板に、半硬化状態の熱硬化性のエポキシ樹脂シートを接
着し、これの必要個所に孔明加工によって孔を形成し、
エポキシ樹脂シートの表面に銅箔を接着して、中空部を
形成した中空導体基板の必要個所に孔明加工によって厚
さ方向の孔を形成し、必要個所にエッチングレジストを
形成し、不要部の銅箔をエッチング法、引きはがし法等
によって除去し、残存するエッチングレジストを除去し
て、中空部を形成することを特徴とするものである。In order to achieve the above-mentioned object,
In a method of manufacturing a printed wiring board, a thermosetting epoxy resin sheet in a semi-cured state is bonded to a glass epoxy plate, and holes are formed in necessary portions of the sheet by drilling,
A copper foil is adhered to the surface of the epoxy resin sheet, a hole in the thickness direction is formed by drilling at a necessary portion of the hollow conductor substrate having a hollow portion, an etching resist is formed at a necessary portion, and copper at an unnecessary portion is formed. The foil is removed by an etching method, a peeling method, or the like, and the remaining etching resist is removed to form a hollow portion.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１４[Correction target item name] 0014
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１４】図７には中空導体基板１の第８実施形態１
−８の成形工程が示されており、この第７実施形態１−
８は、両面に１対の銅箔48，48′付フッ素基板49を用意
し（ａ）、片面の銅箔48′をエッチング法等によって除
去し（ｂ）、この除去面にボンディングフィルム51を所
定条件下で仮接着し（ｃ）、必要個所に孔明加工によっ
て２φの丸孔52，53をマトリック状に形成し（ｄ）、ボ
ンディングフィルム51の表面に厚さ70μmの銅箔54を所
定条件下で接着して中空部56，57を形成し（ｅ）、中空
部57の所望開口部をめっきレジスト58で閉鎖して閉鎖空
所59を形成し（ｆ）、銅箔48、中空部56及びボンディン
グフィルム51の表面にめっき皮膜61を形成し（ｇ）、め
っきレジスト58を除去して、第８実施形態１−８の成形
を終了する（ｈ）。FIG. 7 shows an eighth embodiment 1 of the hollow conductor substrate 1.
-8 is shown, and the seventh embodiment 1-
8, a pair of copper foils 48, 48 'are provided on both surfaces of a fluorine substrate 49 (a), and one side of the copper foil 48' is removed by etching or the like (b), and a bonding film 51 is provided on the removed surface. Temporary bonding is performed under predetermined conditions (c), and 2φ round holes 52 and 53 are formed in a matrix at required locations by drilling (d). A 70 μm thick copper foil 54 is formed on the surface of the bonding film 51 under predetermined conditions. The hollow portions 56 and 57 are formed by bonding below (e), and a desired opening of the hollow portion 57 is closed with a plating resist 58 to form a closed space 59 (f), and the copper foil 48 and the hollow portion 56 are formed. Then, a plating film 61 is formed on the surface of the bonding film 51 (g), the plating resist 58 is removed, and the molding of the eighth embodiment 1-8 is completed (h).
【手続補正５】[Procedure amendment 5]
【補正対象書類名】図面[Document name to be amended] Drawing
【補正対象項目名】図７[Correction target item name] Fig. 7
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図７】 FIG. 7
Claims (15)
脂層を形成し、所要個所に孔明加工によって孔を形成
し、前記半硬化状態とした熱硬化性絶縁樹脂層に導体材
料を接着することによって中空部を形成することを特徴
とする中空導体基板の製造方法。1. A semi-cured thermosetting insulating resin layer is formed on a base material, holes are formed at required locations by drilling, and a conductive material is applied to the semi-cured thermosetting insulating resin layer. A method for manufacturing a hollow conductor substrate, wherein a hollow portion is formed by bonding.
れに半硬化状態の熱硬化性のエポキシ樹脂シートを接着
し、これの必要個所に孔明加工によって孔を形成し、エ
ポキシ樹脂シートの表面に銅箔を接着して、中空部を形
成することを特徴とする請求項１に記載の中空導体基板
の製造方法。2. The base material is made of a glass epoxy plate, a semi-cured thermosetting epoxy resin sheet is adhered to the glass epoxy plate, and holes are formed at necessary places by drilling. The method for manufacturing a hollow conductor substrate according to claim 1, wherein a hollow portion is formed by bonding a copper foil to the substrate.
反対側の面に半硬化状態の熱硬化性のエポキシ樹脂シー
ト又はプリプレグを接着し、これの必要個所に孔明加工
によって孔を形成し、エポキシ樹脂シートの表面に銅箔
を接着して、中空部を形成することを特徴とする中空導
体基板の製造方法。3. A semi-cured thermosetting epoxy resin sheet or prepreg is bonded to the surface of the one-sided copper foil-clad glass epoxy plate on the side opposite to the copper foil, and holes are formed at necessary places by drilling. And bonding a copper foil to the surface of the epoxy resin sheet to form a hollow portion.
反対側に半硬化状態の熱硬化性樹脂層付銅箔を接着し、
これの必要個所に孔明加工によって孔を形成し、銅箔を
エッチング等によって除去し、樹脂層の表面に銅板を接
着して、中空部を形成することを特徴とする中空導体基
板の製造方法。4. A semi-cured copper foil with a thermosetting resin layer is bonded to the opposite side of the copper foil of the single-sided copper foil-clad glass epoxy plate,
A method for manufacturing a hollow conductor substrate, comprising: forming a hole in a necessary portion by drilling; removing a copper foil by etching or the like; and bonding a copper plate to a surface of the resin layer to form a hollow portion.
板の中間にアルミニユームを接着し、これの一方の銅箔
をエッチング法等によって除去し、必要個所に孔明加工
によって孔を形成し、樹脂の表面に銅箔を接着して、中
空部を形成することを特徴とする中空導体基板の製造方
法。5. An aluminum sheet is bonded to the center of a pair of thermosetting epoxy resin sheets with copper foil, one of the copper foils is removed by an etching method or the like, and a hole is formed by drilling at a required portion. And bonding a copper foil to the surface of the resin to form a hollow portion.
対側に半硬化状態の熱硬化性のエポキシ樹脂シートを接
着し、これの必要個所に孔明加工によって孔を形成した
積層板Ａと、樹脂付銅箔の前記の孔に対向した位置に孔
明加工によって孔を形成し、樹脂の銅箔の反対側の面に
銅箔を接着して、必要なパターンの中空部を形成した積
層板Ｂとを重積し、積層板Ａのエポキシ樹脂シートと、
積層板Ｂの銅箔とを接着して、中空部を形成することを
特徴とする中空導体基板の製造方法。6. A laminated board A in which a semi-cured thermosetting epoxy resin sheet is bonded to the opposite side of the copper foil of a single-sided copper foil-clad glass epoxy board, and holes are formed at necessary places by drilling. A laminated plate in which holes are formed by drilling at positions opposite to the holes of the resin-coated copper foil, and the copper foil is bonded to the opposite surface of the resin copper foil to form a hollow portion of a required pattern. B and the epoxy resin sheet of the laminate A,
A method for manufacturing a hollow conductor substrate, wherein a hollow portion is formed by bonding a copper foil of a laminate B to a hollow portion.
ートで、必要個所に孔明加工によって孔を形成したもの
と、片面銅箔張ガラスエポキシ板とを用意し、ガラスエ
ポキシ板の片面銅箔と反対側の面にエポキシ樹脂シート
を接着し、エポキシ樹脂シートを銅箔とガラスエポキシ
板との間に挿入接着して、中空部を形成することを特徴
とする中空導体基板の製造方法。7. A thermosetting epoxy resin sheet in a semi-cured state, in which holes are formed by drilling in necessary places, and a single-sided copper foil-clad glass epoxy plate are prepared. A method for manufacturing a hollow conductor substrate, comprising: adhering an epoxy resin sheet to a surface on the side opposite to the above, and inserting and bonding the epoxy resin sheet between a copper foil and a glass epoxy plate to form a hollow portion.
片面の銅箔をエッチング法等によって除去し、この除去
面にボンディングフィルムを仮接着し、必要個所に孔明
加工によって孔を形成し、ボンディングフィルムの表面
に銅箔を接着して中空部を形成し、中空部の開口部の必
要部をめっきレジストで閉鎖して閉鎖空所を形成し、銅
箔の表面及び中空部内壁の表面にめっき皮膜を形成し、
めっきレジストを除去して、中空部を形成することを特
徴とする中空導体基板の製造方法。8. A pair of fluorine plates with copper foil is prepared on both sides,
The copper foil on one side is removed by etching, etc., a bonding film is temporarily bonded to this removed surface, holes are formed by drilling at necessary places, and the copper foil is bonded to the surface of the bonding film to form a hollow part. A required portion of the opening of the hollow portion is closed with a plating resist to form a closed space, and a plating film is formed on the surface of the copper foil and the surface of the inner wall of the hollow portion,
A method for manufacturing a hollow conductor substrate, comprising forming a hollow portion by removing a plating resist.
化性のエポキシ樹脂シートを接着し、これの必要個所に
孔明加工によって孔を形成し、エポキシ樹脂シートの表
面に銅箔を接着して、中空部を形成した中空導体基板の
必要個所に孔明加工によって厚さ方向の貫通孔を形成
し、必要個所にエッチングレジストを形成し、不要部の
銅箔をエッチング法等によって除去し、残存するエッチ
ングレジストを除去して、中空部を形成することを特徴
とするプリント配線基板の製造方法。9. A thermosetting epoxy resin sheet in a semi-cured state is bonded to a glass epoxy plate, holes are formed in required portions of the epoxy resin sheet by drilling, and a copper foil is bonded to the surface of the epoxy resin sheet. In a hollow conductor substrate having a hollow portion, a through hole in the thickness direction is formed by drilling at a necessary portion, an etching resist is formed at a necessary portion, and an unnecessary portion of the copper foil is removed by an etching method or the like to remain. A method for manufacturing a printed wiring board, wherein a hollow portion is formed by removing an etching resist.
の反対側の面に半硬化状態の熱硬化性のエポキシ樹脂シ
ート又はプリプレグを接着し、これの必要個所に孔明加
工によって孔を形成し、エポキシ樹脂シート又はプリプ
レグの表面に銅箔を接着して、中空部を形成した中空導
体基板の必要個所に孔明加工によって厚さ方向の貫通孔
を形成し、必要個所にエッチングレジストを形成し、不
要部の銅箔をエッチング法等によって除去し、残存する
エッチングレジストを除去して、中空部を形成すること
を特徴とするプリント配線基板の製造方法。10. A semi-cured thermosetting epoxy resin sheet or prepreg is adhered to a single-sided copper foil-clad glass epoxy plate on the opposite side of the copper foil, and holes are formed at necessary places by drilling. Then, a copper foil is adhered to the surface of the epoxy resin sheet or prepreg, a through hole in the thickness direction is formed by drilling at a necessary portion of the hollow conductor substrate having a hollow portion, and an etching resist is formed at a necessary portion. A method for manufacturing a printed wiring board, comprising: removing an unnecessary portion of a copper foil by an etching method or the like; removing a remaining etching resist to form a hollow portion;
の反対側の面に半硬化状態の熱硬化性エポキシ系樹脂層
付銅箔を接着し、これの必要個所に孔明加工によって孔
を形成し、銅箔をエッチング法等によって除去し、前記
エポキシ系樹脂層の表面に銅板を接着して、中空部を形
成した中空導体基板の必要個所に孔明加工によって厚さ
方向の貫通孔を形成し、必要個所にエッチングレジスト
を形成し、不要部の銅箔をエッチング法等によって除去
し、残存するエッチングレジストを除去して、中空部を
形成することを特徴とするプリント配線基板の製造方
法。11. A semi-cured copper foil with a thermosetting epoxy resin layer is adhered to the surface of the one-sided copper foil-clad glass epoxy plate on the side opposite to the copper foil, and holes are drilled at necessary places by drilling. Formed, the copper foil is removed by an etching method or the like, a copper plate is adhered to the surface of the epoxy resin layer, and a through hole in the thickness direction is formed at a necessary portion of the hollow conductor substrate having a hollow portion by drilling. And forming a hollow portion by removing an unnecessary portion of the copper foil by an etching method or the like, removing an unnecessary portion of the copper foil by an etching method or the like, and forming a hollow portion.
板の中間にアルミニユームを接着し、これの一方の銅箔
をエッチング法等によって除去し、必要個所に孔明加工
によって孔を形成し、樹脂の表面に銅箔を接着して、中
空部を形成した中空導体基板の必要個所に孔明加工によ
って厚さ方向の孔を形成し、必要個所にエッチングレジ
ストを形成し、不要部の銅箔をエッチング法等によって
除去し、残存するエッチングレジストを除去して、中空
部を形成することを特徴とするプリント配線基板の製造
方法。12. An aluminum sheet is bonded in the middle of a pair of thermosetting epoxy resin plates with copper foil, one of the copper foils is removed by an etching method or the like, and holes are formed at necessary places by drilling. By bonding copper foil to the surface of the resin, forming holes in the thickness direction by drilling at necessary places on the hollow conductor substrate where the hollow part is formed, forming an etching resist at the necessary places, And removing the remaining etching resist by etching or the like to form a hollow portion.
反対側の面に半硬化状態の熱硬化性のエポキシ樹脂シー
トを接着し、これの必要個所に孔明加工によって孔を形
成した積層板Ａと、樹脂付銅箔の前記の孔に対向した位
置に孔明加工によって孔を形成し、樹脂の銅箔の反対側
の面に銅箔を接着して、必要なパターンの中空部を形成
した積層板Ｂとを用意し、積層板Ａのエポキシ樹脂シー
トと、積層板Ｂの銅箔とを接着して、中空部を形成した
中空導体基板の必要個所に孔明加工によって厚さ方向の
孔を形成し、必要個所にエッチングレジストを形成し、
不要部の銅箔をエッチング法等によって除去し、残存す
るエッチングレジストを除去して、中空部を形成するこ
とを特徴とするプリント配線基板の製造方法。13. A laminated board in which a semi-cured thermosetting epoxy resin sheet is adhered to a surface of a single-sided copper foil-clad glass epoxy plate opposite to the copper foil, and holes are formed at necessary positions by drilling. A, a hole was formed by drilling at a position facing the hole of the resin-coated copper foil, and the copper foil was bonded to the surface on the opposite side of the resin copper foil to form a hollow portion of a required pattern. A laminate B is prepared, and the epoxy resin sheet of the laminate A and the copper foil of the laminate B are adhered to each other, and a hole in the thickness direction is formed at a necessary portion of the hollow conductor substrate having a hollow portion by drilling. Forming, forming an etching resist in the required places,
A method for manufacturing a printed circuit board, comprising removing an unnecessary portion of a copper foil by an etching method or the like and removing a remaining etching resist to form a hollow portion.
シートで、必要個所に孔明加工によって孔を形成したも
のと、片面銅箔張ガラスエポキシ板とを用意し、ガラス
エポキシ板の片面銅箔と反対側にエポキシ樹脂シートを
接着し、エポキシ樹脂シートを銅箔とガラスエポキシ板
との間に挿入接着して、中空部を形成した中空導体基板
の必要個所に孔明加工によって厚さ方向の孔を形成し、
必要個所にエッチングレジストを形成し、不要部の銅箔
をエッチング法等によって除去し、残存するエッチング
レジストを除去して、中空部を形成することを特徴とす
るプリント配線基板の製造方法。14. A thermosetting epoxy resin sheet in a semi-cured state, in which holes are formed by drilling in necessary places, and a single-sided copper foil-clad glass epoxy plate are prepared. An epoxy resin sheet is adhered to the opposite side, and the epoxy resin sheet is inserted and adhered between the copper foil and the glass epoxy plate. To form
A method for manufacturing a printed wiring board, comprising: forming an etching resist at a necessary portion; removing unnecessary portions of copper foil by an etching method or the like; removing a remaining etching resist to form a hollow portion.
し、片面の銅箔をエッチング法等によって除去し、この
除去面にボンディングフィルムを仮接着し、必要個所に
孔明加工によって孔を形成し、ボンディングフィルムの
表面に銅箔を接着して中空部を形成し、この中空部の開
口部をめっきレジストで閉鎖して閉鎖空所を形成し、銅
箔の表面及び中空部内壁の表面にめっき皮膜を形成し、
めっきレジストを除去して、中空部を形成した中空導体
基板の必要個所に、孔明加工によって厚さ方向の孔を形
成し、必要個所にエッチングレジストを形成し、不要部
の銅箔をエッチング加工によって除去し、残存するエッ
チングレジストを除去して、中空部を形成することを特
徴とするプリント配線基板の製造方法。15. A pair of fluorine plates with copper foil is prepared on both sides, one side of the copper foil is removed by an etching method or the like, a bonding film is temporarily bonded to the removed surface, and holes are drilled in necessary places by drilling. Forming and bonding a copper foil to the surface of the bonding film to form a hollow portion, closing the opening of this hollow portion with a plating resist to form a closed space, and forming a surface of the copper foil and the surface of the inner wall of the hollow portion Form a plating film on
The plating resist is removed, holes in the thickness direction are formed by drilling at necessary places on the hollow conductor substrate where the hollow parts are formed, an etching resist is formed at the necessary places, and copper foil at unnecessary parts is etched. A method for manufacturing a printed wiring board, comprising: removing a remaining etching resist to form a hollow portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3819197A JPH10242594A (en) | 1997-02-21 | 1997-02-21 | Manufacture of hollow conductor substrate and printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3819197A JPH10242594A (en) | 1997-02-21 | 1997-02-21 | Manufacture of hollow conductor substrate and printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10242594A true JPH10242594A (en) | 1998-09-11 |
Family
ID=12518483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3819197A Pending JPH10242594A (en) | 1997-02-21 | 1997-02-21 | Manufacture of hollow conductor substrate and printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10242594A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100919986B1 (en) * | 2003-03-29 | 2009-10-05 | 삼성테크윈 주식회사 | Substrate for semiconductor package, semiconductor package therewith and manufacturing method thereof |
| JP2011165889A (en) * | 2010-02-09 | 2011-08-25 | Asahi Kasei E-Materials Corp | Method of manufacturing flexible wiring board, and flexible wiring board |
| JP2011228493A (en) * | 2010-04-20 | 2011-11-10 | Asahi Kasei E-Materials Corp | Method for manufacturing flexible wiring board |
-
1997
- 1997-02-21 JP JP3819197A patent/JPH10242594A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100919986B1 (en) * | 2003-03-29 | 2009-10-05 | 삼성테크윈 주식회사 | Substrate for semiconductor package, semiconductor package therewith and manufacturing method thereof |
| JP2011165889A (en) * | 2010-02-09 | 2011-08-25 | Asahi Kasei E-Materials Corp | Method of manufacturing flexible wiring board, and flexible wiring board |
| JP2011228493A (en) * | 2010-04-20 | 2011-11-10 | Asahi Kasei E-Materials Corp | Method for manufacturing flexible wiring board |
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