JPH10239391A - Ic testing method and equipment executing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily enable recognizing whether a device in the course of carriage in one which has not yet been inspected or one which has been inspected, and reduce interference and collision between devices. SOLUTION: A buffer stage ST4 is arranged movably in the X direction which uses two contact heads delivering a device between a device inspection part E and a contact arm operating stage ST3, and delivers a device between a contact arm operating stage ST3, a loader arm operating stage ST1 and an unloader arm operating stage ST2. A loader buffer carrier 41 movably in the Y direction and an unloader buffer carrier 51 are installed on a buffer stage ST4. The loader buffer carrier 41 carries only devices which have not yet been inspected from the loader arm stage ST1 to the contact arm operating stage ST3. The unloader buffer carrier 51 carries only inspected devices from the contact arm operating stage ST3 to the unloader arm operating stage ST2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC test method and an apparatus for performing the method, and more particularly, to a transfer device for a loader arm operation stage for transferring only untested devices, and a transfer device for an unloader arm operation stage for inspection. The present invention relates to an IC test method for transporting only completed devices and an apparatus for performing the method.

[0002]

2. Description of the Related Art A conventional example will be described with reference to FIGS. 1 and 2 show that the untested device 19 is moved from the loader arm operation stage ST1 to the loader buffer operation stage S.
FIG. 1 is a conceptual diagram illustrating a path for transporting to an unloader arm operation stage ST2 via T4, a contact arm operation stage ST3, and an unloader buffer operation stage ST5. FIG. 1 is a plan view and FIG. 2 is a side view.

[0003] In FIG. 1 and FIG.
9 is stored in a tray 11 for storing untested devices. A pick-and-place 13 is attached to the lower part of the distal end of the loader arm 10 provided on the loader arm operation stage ST1. Reference numeral 1Z denotes a Z-direction loader carrier rail that is driven in the vertical direction. The pick and place 13 is attached to the Z-direction loader carrier rail 1Z via the loader arm 10 and is driven in the vertical direction. Reference numeral 1Y denotes a Y-direction loader carrier rail that is driven in the vertical direction, and the Z-direction loader carrier rail 1Z is attached to the Y-direction loader carrier rail 1Y and driven in the vertical direction. Further, 1X is X that is driven in the lateral direction.
1 shows a direction loader carrier rail, and a Y-direction loader carrier rail 1Y is attached to the X-direction loader carrier rail 1X and driven in a lateral direction. These X-direction loader carrier rail 1X and Y-direction loader carrier rail 1
The Y, Z direction loader carrier rail 1Z constitutes a transfer device for the loader arm operation stage ST1.

A pick and place 23 is attached to the lower part of the tip of the unloader arm 20 provided on the unloader arm operation stage ST2. 2Z denotes a Z-direction unloader carrier rail that is driven in a vertical direction.
0 and is attached to the Z-direction unloader carrier rail 2Z and driven in the vertical direction. Reference numeral 2Y denotes a Y-direction unloader carrier rail that is driven in the vertical direction, and the Z-direction unloader carrier rail 2Z is attached to the Y-direction unloader carrier rail 2Y and driven in the vertical direction. Further, 2X indicates an X-direction unloader carrier rail that is driven in the horizontal direction, and the Y-direction unloader carrier rail 2Y is mounted on the X-direction unloader carrier rail 2X and driven in the horizontal direction. The X-direction unloader carrier rail 2X, the Y-direction unloader carrier rail 2Y, and the Z-direction unloader carrier rail 2Z constitute a transfer device for the unloader arm operation stage ST2. The inspected devices 29 are stored in the inspection device sorting storage tray 21.

[0005] A contact head H is attached to the lower end of the contact arm 30 provided on the contact arm operation stage ST3. Reference numeral 3Z denotes a Z-direction head carrier rail driven in the vertical direction, and the contact head H is attached to the Z-direction head carrier rail 3Z via the contact arm 30 and is driven in the vertical direction. Reference numeral 3Y denotes a Y-direction head carrier rail driven in the vertical direction, and the Z-direction head carrier rail 3Z is attached to the Y-direction head carrier rail 3Y and driven in the vertical direction. Further, 3X indicates an X-direction head carrier rail that is driven in the horizontal direction, and the Y-direction head carrier rail 3Y is mounted on the X-direction head carrier rail 3X and driven in the horizontal direction.

The loader buffer operation stage ST4 is formed from the loader arm operation stage ST1 to the contact arm operation stage ST3. Reference numeral 4Y denotes a Y-direction loader buffer carrier rail, to which a loader buffer carrier 41 on which the untested device 19 is loaded is attached and driven in the vertical direction. The unloader buffer operation stage ST5 is a contact arm operation stage ST.
3 to the unloader arm operation stage ST2. Reference numeral 5Y denotes a Y-direction unloader buffer carrier rail. The unloader buffer carrier 51 on which the tested device 29 is loaded is attached and driven in the vertical direction.

Here, the transport of the device is executed in this order from to. First, the loader arm 10 is driven by driving the X-direction loader carrier rail 1X and the Y-direction loader carrier rail 1Y.
Is positioned above the tray 11. Next, the Z-direction loader carrier rail 1Z is driven to apply the pick-and-place 13 to the untested device 19 at the position, and the pickup is picked up by suction.

When the pick and place 13 sucks and picks up the untested device 19, the X-direction loader carrier rail 1 X, the Y-direction loader carrier rail 1 Y, and the Z-direction loader carrier rail 1 Z are driven to move the loader arm 10 to the loader buffer carrier. 41, the suction of the pick-and-place 13 is released, and the untested device 19 is moved to the loader buffer carrier 41.
To load. Y direction loader buffer carrier rail 4
Y is driven to transfer the loader buffer carrier 41 loaded with the untested device 19 from the loader arm operation stage ST1 to the contact arm operation stage ST3.

[0009] Contact arm operation stage ST3
, The X-direction head carrier rail 3X, the Y-direction head carrier rail 3Y, and the Z-direction head carrier rail 3Z are driven to position the contact arm 30 on the transferred loader buffer carrier 41, and the contact head H is moved to the loader buffer carrier 41. The operation is applied to the untested device 19 to be loaded, and the device is suctioned and picked up.

When the contact head H sucks and picks up the untested device 19, the X-direction head carrier rail 3 X and the Y-direction head carrier rail 3
By driving the Y, Z direction head carrier rail 3Z, the contact arm 30 is positioned above the device inspection section E, the suction of the contact head H is released, and the uninspected device 19 is positioned in the device inspection section E for test inspection. Is carried out.

[0011] X direction head carrier rail 3X, Y
The direction head carrier rail 3Y and the Z direction head carrier rail 3Z are driven to position the contact arm 30 in the device inspection section E, and the contact head H is inspected in the device inspection section E.
The operation is applied and the suction pickup is performed. In a state where the contact head H sucks and picks up the inspected device 29, the X-direction head carrier rail 3X, the Y-direction head carrier rail 3Y, and the Z-direction head carrier rail 3Z are driven to move the contact arm 30 to the unloader in the unloader buffer operation stage ST5. Positioned above the buffer carrier 51,
The suction of the contact head H is released to unload the inspected device 29 into the unloader buffer carrier 51. The unloader buffer carrier 51 on which the inspected device 29 has been unloaded is driven vertically in the Y-direction unloader buffer carrier rail 5Y, and is transferred to the unloader arm operation stage ST2.

X-direction unloader carrier rail 2
The unloader carrier rail 2Y in the X and Y directions and the unloader carrier rail 2Z in the Z direction are driven to position the unloader arm 20 above the unloader buffer carrier 51, and the pick and place 23 is unloaded into the unloader buffer carrier 51. Apply suction to the device 29.

[0013] In a state where the pick-and-place 23 sucks and picks up the inspected device 29, X
The unloader carrier rail 2X, the Y-direction unloader carrier rail 2Y, and the Z-direction unloader carrier rail 2Z are driven to position the unloader arm 20 at the position of the inspection device selection / storage tray 21, and the suction of the pick-and-place 23 is released. Tested device 2
9 is unloaded onto the inspection device sorting / storage tray 21.

In the conventional example described above, each mechanical element constituting the transfer device for transporting the uninspected device 19 to the device inspection section E and transporting the inspected device 29 from the device inspection section E includes one contact arm 30. As such, there is no room for the mechanical elements to collide or otherwise interfere during transport of the device. But,
Since the transfer is performed by using one contact arm 30, the transfer efficiency of the device is naturally lower than that of the device using two contact arms described later.

A second conventional example using two contact arms will be described with reference to FIG. When this conventional example is made to correspond to the conventional example of FIGS. 1 and 2, the contact arm operation stage ST3 is changed to the contact arm operation stage ST3 _1.
And are two sets configuration of ST3 _2. It has an X-direction head carrier rail 3X, a Y-direction head carrier rail 3Y, and a Z-direction head carrier rail 3Z for transferring the contact arm 30 to each contact arm operation stage ST3. Then, the contact arm operation stage S
T3 ₁ and the contact arm operating stage ST3 ₂ is,
A configuration in which a loader buffer operation stage ST4 formed from the loader arm operation stage ST1 to the contact arm operation stage ST3 and an unloader buffer operation stage ST5 formed from the contact arm operation stage ST3 to the unloader arm operation stage ST2 are shared. from where the both contact arm operating stage ST becomes possible to form the contact arm operation interfering stage ST3 ₁₂ overlapping each other.

The second conventional example is a contact arm 3
Since the transport of the uninspected device 19 and the transport of the inspected device 29 are performed using _two of the contact arms 30 ₁ and 30 ₂ , the operation of both contact arms is appropriately controlled to make the contact arm 1 The transfer efficiency can be improved as compared with the single use. However, unless the drive control device including the electric circuit for controlling the operation of the contact arm is completed, the contact arms 30 will not be able to operate the contact arm operation interference stage S
Interference in T3 _12, there is a case to fail to collide.

Referring to FIG. 4, a third conventional example will be described. In this third conventional example, two contact arms 30 ₁ and 30 ₂ are used, and two contact arms 30 are used.
₁ and 30 ₂ as one X-direction head carrier rail 3X
To the common head carrier rail 3X
Is adopted. In the case of this example, since both the loader / unloader buffer units 400 and 500 handle and transport the uninspected devices 19 and 29, when the transport device or other stoppage due to an error, is the device being transported an uninspected device? In some cases, it cannot be distinguished from the appearance that the device is a tested device.

[0018]

SUMMARY OF THE INVENTION The object of the present invention is to
An object of the present invention is to provide an IC test apparatus and a test method in which the transfer efficiency of a C device is high and collision between contact arms is unlikely to occur.

[0019]

According to the present invention, an IC is provided.
I for transferring the device to the device inspection unit and testing
The C apparatus includes: a loader arm operation stage having a loader arm for transporting an uninspected device; an unloader arm operation stage having an unloader arm for collecting and transporting an inspected device; First and second contact heads for carrying in and out, a contact arm operation stage having first and second contact head carrier means for controlling the movement of the first and second contact heads, and the loader on which an untested device is mounted A loader buffer carrier for transferring an arm operation stage to the contact arm operation stage, an unloader buffer carrier for mounting an inspected device from the contact arm operation stage to the unloader arm operation stage, and the loader buffer carrier , Y moving control between the contact arm operating stage and the loader arm operating stage
A buffer stage in which a Y-direction unloader buffer carrier rail for controlling the movement of the unloader buffer carrier between the contact arm operation stage and the unloader arm operation stage is spaced apart from each other; An X-direction buffer carrier for controlling the movement of the buffer stage in the X direction, wherein the buffer stage is interposed across three members of the loader arm operation stage, the unloader arm operation stage, and the contact arm operation stage. Are located.

In the above-mentioned IC test apparatus, the first and the second fixed to the contact arm operation stage.
The device loading / unloading position is determined so that at least a part of the buffer stage is adjacent to the device inspection unit side and is spaced at intervals in the X direction. First and second loading positions and first and second unloading positions are fixedly determined on the unloader arm operation stage at intervals in the X direction, and the buffer stage is at least the first device. A loading / unloading position, a first stop position facing the first loading position, at least a first device loading / unloading position, and the first loading / unloading position.
A second stop position facing the unloading position, and a third stop position facing at least the second device loading / unloading position and the second unloading position are determined.

In the above-mentioned IC testing apparatus, the loader buffer carrier and the unloader buffer carrier are controlled to move in synchronization with each other on the Y-direction loader buffer carrier rail and the Y-direction unloader buffer carrier rail in opposite directions. The movement of the first and second contact heads is controlled synchronously in opposite directions by the first and second contact head carrier means.

In the above-mentioned IC test apparatus, the Y-direction loader buffer carrier rail for controlling the movement of the loader buffer carrier and the Y-direction unloader buffer carrier rail for controlling the movement of the unloader buffer carrier are spaced apart from each other on the buffer stage in parallel. It is attached with putting. In the above-mentioned IC test apparatus, the above-mentioned Y for controlling movement of the above-mentioned loader buffer carrier
The direction loader buffer carrier rail and the Y direction unloader buffer carrier rail for controlling the movement of the unloader buffer carrier are mounted symmetrically inclining with respect to the Y direction so as to approach each other as approaching the device inspection side.

In the IC test apparatus, the loader arm, the unloader arm, the first contact head, and the second contact head can each be configured to handle a plurality of devices. According to the present invention,
An IC test method of loading an uninspected device into the device inspecting unit and unloading the inspected device from the device inspecting unit includes the following steps: (a) loading the uninspected device by the loader arm on the loader arm operation stage; (B) collecting and transporting the inspected device by an unloader arm on an unloader arm operation stage; and (c) loading and unloading the device to and from the device inspection unit by first and second contact heads. The first and second contact heads are first and second
Movement control by contact head carrier means, (d)
An uninspected device is placed on the loader buffer carrier and transported from the loader arm operation stage to the contact arm operation stage. (E) An inspected device is placed on the unloader buffer carrier and the contact arm operation stage is moved to the unloader arm operation stage. (F) controlling the movement of the loader buffer carrier between the contact arm operation stage and the loader arm operation stage by a Y-direction loader buffer carrier rail provided on the buffer stage; The unloader buffer carrier is moved between the contact arm operation stage and the unloader arm operation stage by a Y-direction unloader buffer carrier rail provided at a distance from the direction loader buffer carrier rail. In movement control, to control moving the buffer stage in the X direction by (g) X-direction buffer carrier rail.

In the above-mentioned IC test method, the first and the second fixed to the contact arm operation stage.
The device loading / unloading position is determined so that at least a part of the buffer stage is adjacent to the device inspection unit side and is spaced at intervals in the X direction. First and second loading positions and first and second unloading positions are fixedly determined on the unloader arm operation stage at intervals in the X direction, and the buffer stage is at least the first device. A loading / unloading position, a first stop position facing the first loading position, at least a first device loading / unloading position, and the first loading / unloading position.
A second stop position facing the unloading position, and a third stop position facing at least the second device loading / unloading position and the second unloading position are determined.

In the above IC test method, the above step
(f) controlling the movement of the loader buffer carrier and the unloader buffer carrier on the Y-direction loader buffer carrier rail and the Y-direction unloader buffer carrier rail in synchronization with each other in opposite directions;
And the movement of the second contact head is controlled synchronously by the first and second contact head carrier means in mutually opposite directions.

In the above IC test method, the above step
(f) controlling the movement of the loader buffer carrier and the unloader buffer carrier in opposite directions along the loader buffer carrier and the unloader carrier buffer rail parallel to the Y direction at intervals. In the above-mentioned IC test method, the step (f) includes the Y-direction loader buffer carrier rail and the Y-direction loader rail, which are mounted symmetrically inclined with respect to the Y direction so as to approach each other on the buffer stage as approaching the device inspection side.
Along the direction unloader buffer carrier rail, the loader buffer carrier and the unloader buffer carrier are controlled to move in mutually opposite directions.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an embodiment of the present invention will be described.
This will be described with reference to FIG. Contact arm stage S
T3 is two Y-direction head carrier rails 3Y₁ And 3
Y_Two And one X-direction head carrier rail 3X
I have. Y direction head carrier rail 3Y₁ Contact
Head carrier rail with head L attached
Le 3Z ₁ Are moved in the Y direction. And Y direction
Head carrier rail 3Y_Two Has a contact head R
Mounted Z-direction head carrier rail 3Z_Two Is Y
Moved in the direction. In buffer stage ST4
Two Y-direction loader buffer carrier rails 4Y₁ as well as
4Y_Two Is attached, and this buffer
The entire stage ST4 moves in the X direction on the X direction carrier 4X.
Dynamic control. Loader arm operation stage ST1 and
FIG. 1 shows the configuration of the loader arm operation stage ST2.
Is the same as

The loader buffer carrier 41 by the Y-direction loader buffer carrier rail 4Y _1, although the unloader loader buffer carrier 51 is moved to each other in the Y direction by the Y-direction loader buffer carrier rail 4Y _2, the common X direction It can be moved on the X direction carrier 4X. Also for the contact head L and the contact head R, the Y-direction head carrier rail 3Y
The ₁ and 3Y _2, but each is moved to each other in the Y direction, for the X-direction is moved only on a common head carrier rail 3X. The order of transporting the devices in FIG. 5 is briefly shown in FIGS. 6A and 6B. That is, the flow of the device relating to the contact head L is as follows: →→→ L → C → L →→→
It is. The flow of devices related to the contact head R is as follows: →→→ R → C → R →→→.

Here, reference numerals commonly used in the following description will be described. For the description of the reference numerals, refer particularly to FIG. 7 for explaining the positional relationship among the loader buffer carrier 41, the unloader buffer carrier 51, the contact head L, and the contact head R. P1: Point at which an untested device received from the loader arm 10 is transferred from the loader buffer carrier 41 to the contact head L (loading position) P2: Point at which an untested device received from the loader arm 10 is transferred from the loader buffer carrier 41 to the contact head R (Loading position) Q1: Point at which the device after inspection received from the contact head L is transferred from the unloader buffer carrier 51 to the unloader arm 20 (unloading position) Q2: The inspected device received from the contact head R is transferred from the unloader buffer carrier 51 Point to be transferred to the unloader arm 20 (unloading position) E: Device inspection section S: Transfer of the uninspected device from the point P1 from the loader buffer carrier 41 to the contact head L The point (transfer position) at which the inspected device from the inspection unit E is transferred to the unloader buffer carrier 51 (the transfer position). T: The uninspected device from the point P2 is transferred from the loader buffer carrier 41 to the contact head R, and is inspected from the inspection unit E Point for transferring the device to the unloader buffer (transfer position) These positions P1, P2, Q1, Q2, S, and T are predetermined fixed positions on the fixed stages ST1, ST2, and ST3, respectively. −P
2, P2-Q1, Q1-Q2, and ST are all equal.

FIGS. 8A and 8B are diagrams for explaining the movement of the contact head L and the contact head R. FIG. In FIG. 8A, the contact head R is transferred from the point T to the device inspection unit E, and in synchronization with this, the contact head L is transferred from the device inspection unit E to the point S. In FIG. 8B, the contact head L is at the point S
Are transferred from the device inspection unit E to the point T in synchronization with the transfer.

FIGS. 9A, 9B, 10A and 10B are views for explaining the movement of the loader buffer carrier 41 and the movement of the unloader buffer carrier 51 in the loader buffer stage ST4. 9A, 9B, 10A, 10B
, The operating position of the loader buffer carrier 41 is indicated by lower case alphabets a to d, and the operating position of the unloader buffer carrier 51 is indicated by upper case alphabet A.
ＤD.

Referring to FIG. 9A, when the loader buffer carrier 41 (position a) is delivered from the loader arm 10 at the point P1 to the untested device 19,
The unloader buffer carrier 51 (position A) receives the inspected device from the contact head L at point S. At this time, the contact head R is being inspected by the device inspection unit E.

Referring to the transition from the state of FIG. 9A to the state of FIG. 9B, the buffer stage ST4 moves in the X direction by a distance from the point (loading position) P1 to P2, and the loader buffer carrier 41 (position b). )
Moves from point P1 to position b in the Y direction. The unloader buffer carrier 51 moves from point S (position A) to position B in the Y direction. At the point S in FIG. 9B, the untested device 19 is the loader buffer carrier 41.
From the contact head L (see FIG. 6A). Then, at the point Q1, the inspected device 29 is moved from the unloader buffer carrier 51 to the unloader arm 2.
Passed to 0. Thereafter, the contact head L transfers the untested device from 41 to the device inspection unit E, and the contact head R transfers the inspected device from the inspection unit E to the point T. Also, the buffer carriers 41 and 51
Are moved to positions c and C in the Y direction shown in FIG. 10A, respectively.

Referring to FIG. 10A, the inspected device 29 is transferred from the contact head R to the unloader buffer carrier 51 (position C) at a point T. Then, the untested device 19 is moved from the loader arm 10 to the loader buffer carrier 41 at point P2.
(Position c). At this time, the contact head L is inspecting the IC device. Then, FIG. 10B
As shown in (5), the buffer stage ST4 moves in the X direction, and the buffer carriers 41 and 51 move to positions d and D in the Y direction, respectively.

Referring to FIG. 10B, the untested device 1
9 is a loader buffer carrier 41 at point T
It is delivered to the contact head R from (position d). The inspected device 29 is transferred from the unloader buffer carrier 51 (position D) to the unloader arm 20 at the point Q2. At this time, the contact head R is transferred to the device inspection unit E, while the contact head L is transferred to the point S.

Next, the state returns to the state of FIG. 9A from the state of FIG. 10B. Here, the operation has returned to the original state by making a complete round. This test is continuously repeated to transfer the device to the loader arm, the unloader arm, the contact head L, and the contact head R at each of the points P1, P2, Q1, and Q2. FIG.
Another embodiment of the present invention will be described with reference to the perspective views A to 15. In the above embodiment, the devices are transported one by one, but the other embodiments are examples in which a plurality of devices are transported. The movements of the buffer stage ST4, the loader buffer carrier 41, the unloader buffer carrier 51, the contact head L, and the contact head R described above can be better understood by referring to the perspective views of FIGS.

Referring to FIG. 11A, the loader buffer carrier 41 is moved from the loader arm 10 to the untested device 19.
Unloader buffer carrier 5
1 receives the inspected device from the contact head L. Referring to FIG. 11B, the buffer stage ST4 shifts by one stage in the positive X direction, and the loader buffer carrier 41 shifts in the positive Y direction, and the untested device 19 that has been transferred is held by the contact head L. . On the other hand, the unloader buffer carrier 51 moves in the Y negative direction.

Referring to FIG. 12A, when the buffer stage ST4 is in the same position as in FIG.
9 moves to the device inspection section E, the loader buffer carrier 41 moves in the negative Y direction, and the untested device 19 moves from the loader arm 10.
Returns to the original position where the device is passed, and the next uninspected device 1
9 is delivered. On the other hand, the unloader buffer carrier 51 moves in the positive Y direction and returns to a position where the inspected device can be received from the contact head R, and the contact head R transfers the inspected device from the device inspection unit E to the unloader buffer carrier 51. Return to position. At this time, since the first inspection has not been performed yet, the contact head R does not hold the inspected device 29.

Referring to FIG. 12B, the buffer stage ST4 moves one step further in the X positive direction, and the loader buffer carrier 41 moves in the Y positive direction to move the untested device 1
9 is transferred to the contact head R, and the contact head L installs the held uninspected device 19 in the device inspecting unit E to perform the inspection. On the other hand, the unloader buffer carrier 51 moves in the negative Y direction while remaining empty.

Referring to FIG. 13A, the buffer stage ST4 shifts by two stages in the negative X direction and returns to the original position shown in FIG. 11A, and the loader buffer carrier 41 shifts in the negative Y direction and moves out of the loader arm 10. The inspection device 19 is delivered. On the other hand, the unloader buffer carrier 51 moves in the positive Y direction and returns to a position where the inspected device 29 can be received from the contact head L, and
The contact head L takes out the inspected device 29 from the device inspection section E, and unloads the unloader buffer carrier 5.
Transfer to 1 and pass. Further, the contact head R holding the uninspected device 19 moves to the device inspection section E.

Referring to FIG. 13B, the buffer stage ST4 shifts by one stage in the positive X direction, the loader buffer carrier 41 shifts in the positive Y direction, and the delivered untested device 19 is moved to the contact head L. While being held, the contact head R places the held uninspected device 19 in the device inspection section E to perform the inspection. Then, the unloader buffer carrier 51 to which the inspected device 29 is transferred in FIG. 13A moves in the negative Y direction, and the inspected device 29 is held by the unloader arm 20.

Referring to FIG. 14A, the untested device 1
9 moves to the device inspection section E, the loader buffer carrier 41 moves in the negative Y direction, and the untested device 19
The device returns to the original position where the device has been delivered, and the untested device 19 is delivered. On the other hand, the unloader buffer carrier 51
Moves in the positive Y direction to return to the original position where the inspected device 29 can be received from the contact head R, and the contact head R moves to the position where the inspected device is transferred from the device inspection unit E to the unloader buffer carrier 51. Returning, the inspected device 29 is delivered.

Referring to FIG. 14B, the buffer stage ST4 shifts one step further in the X positive direction, and the loader buffer carrier 41 shifts in the Y positive direction, and the untested device 19 that has been delivered is contact head R. And the contact head L installs the uninspected device 19 retained in the device inspection section E to perform the inspection.
In FIG. 10G, the unloader buffer carrier 51 to which the inspected device 29 has been transferred moves in the negative Y direction.
Passed to 0.

Referring to FIG. 10I, the buffer stage ST4 shifts two steps in the negative X direction and returns to the original position. This state is equivalent to the state of FIG. 13A. Hereinafter, FIGS.
The operation of 4B is repeated. The movement of the buffer stage ST4 in the above-described embodiment, and the loader buffer carrier 41 and the unloader buffer carrier 51 on the Y-direction loader buffer carrier rails 4Y ₁ and 4Y ₂ arranged in parallel with each other by moving the stage ST4 in the X direction. FIG. 16 summarizes the components and the Y direction movement components of the buffer carriers 41 and 51. Arrow a ₁ ~a ₅ shows the movement of the loader buffer carrier 41, the arrow b ₁ ~b ₅ shows the movement of the unloader buffer carrier 51. Each arrow indicates a moving direction and an approximate moving distance. Thus, in the above-described embodiment, the buffer carriers 41, 51
Are Y parallel to each other on the buffer stage ST4.
Y on the direction loader buffer carrier rails 4Y ₁ and 4Y ₂
Stage ST4 moves in the X direction at position P.
After moving two steps in the positive direction at the pitch intervals of 1, P2, Q1, and Q2, it returns to the original position (negative direction). Therefore, in this one cycle, the total moving distance of the stage ST4 is 2 (a ₂ + a ₅ ).
In this example, if a ₂ = a ₅ = d, 4d is obtained. Also, the maximum movement width of the stage ST4 (center line Yo-Yo '
Distance D) is 2d. If the total moving distance 4d of the stage ST4 is large, the moving time will be lengthened accordingly. To shorten the moving time, it is necessary to increase the driving power of the stage ST4. An embodiment in which this point is improved is shown in FIG. 17 in comparison with FIG.

In the embodiment shown in FIG. 17, the buffer stage S
The Y-direction loader buffer carrier rails 4Y ₁ and 4Y ₂ for the loader buffer carrier 41 and the unloader buffer carrier 51 on T4
The stages ST1 and S2 are symmetrically inclined with respect to the center line Y _{O in} the Y-axis direction so that the distance between the stages ST1 and P2 increases.
The positions S and P2 are on the center line Y _O , and the positions P1 and Q
1 are symmetrical with respect to the center line Y _O. In this example, between P1 and P2, between Q1 and Q2, S
All distances between -T are d.

The loader buffer carrier 41 receives the untested device at the position P1, and the unloader buffer carrier 51 receives the tested device at the position S. next,
With buffer carrier 41, 51 along the respective Y-direction buffer carrier rails 4Y ₁ and 4Y ₂ move in opposite directions (a _1, b _1), a buffer stage ST4
Moves in the X direction (a ₂ , b ₂ ) and reaches the positions S and Q1, and the former sends the uninspected device to the inspecting unit E at the position S,
The latter passes the tested device to the unloader arm 20 at position Q1. Next, the buffer carriers 41 and 51 respectively move in the opposite directions along the buffer carrier rails 4Y ₁ and 4Y ₂ (a ₃ , b ₃ ), and the buffer stage ST4 moves in the X direction (a ₄ , b). ₄ ), the buffer carriers 41 and 51 reach the positions P2 and T, respectively. At those locations, buffer carriers 41 and 51 receive the untested device and the tested device, respectively. next,
With buffer carrier 41, 51 along the buffer carrier rail 4Y ₁ and 4Y ₂ are moved in opposite directions (a _5, b _5), a buffer stage ST4 moves in the X direction (a _6, b _6), The positions reach T and Q2, respectively. Then, the buffer carriers 41 and 51 each send the untested device to the testing unit E and pass the tested device to the unloader arm 20. After that, the buffer stage ST4 returns to the initial untested device loading position, and the buffer carriers 41 and 51 are respectively moved to the position P.
1. Return to S. Other configurations are the same as those of the embodiment of FIG.

According to the configuration of FIG. 17, since a ₄ + a ₆ = d,
The total moving distance of the buffer stage ST4 is 2 (a ₂ + a ₄ + a ₆ ) = 2
(a ₂ + d). As is clear from the figure, since a ₂ <d, the total moving distance of the stage ST4 is shorter than in the case of FIG. Also, of course, the maximum movement width D 'of the stage ST4.
= (A ₂ + d) is also smaller than in FIG. Therefore, the one-cycle operation cycle of the buffer carriers 41 and 51 can be shortened.

In the embodiment of FIG._Two= b_Two= d, a_Four= b_Four
= 0, the total movement distance of the stage ST4 is as shown in FIG.
It becomes the same as the case. In this case, the distance between P2 and Q1 is d
Therefore, the loader arm 10 in FIG.
The unloader arms 20 move near points P2 and Q1.
Is less likely to collide. In the embodiment of FIG.
Indicates that the positions of points S and P2 in the X direction are the same, and
When the position in the X direction of T1 and Q1 is the same (so that
18 and the distance between ST and ST are the same.
As shown in the figure, the point ST between point P2 and Q1
Between points S and P2 in the X direction and point
Even if the position in the X direction of the
The same effect as in FIG. 17 can be obtained. That is, in this case as well,
The total travel distance of page ST4 is 2 (a_Two+ a_Four+ a₆) And a_Two+ a_Four=
d, the distance is 2 (d + a₆). However, in this case
If the distance between ST is b_Two+ b_Four= a_Four+ a₆= a_Two+ a _Four And follow
And a_Two= a₆ It is. Also in this case a_Two= a₆If <d
The total moving distance of the stage ST4 is smaller than that of FIG.
You.

[0049]

As described above, the device inspection unit E
Using two contact heads for transferring a device between the contact arm operating stage ST3, the loader arm operating stage ST1, and the unloader arm operating stage ST2
The transfer device of the loader arm operation stage ST1 transfers only the untested device, and the transfer device of the unloader arm operation stage ST2 is the tested device via the buffer stage ST4 for transferring the device between the three devices. By transporting only the device, even if the IC test device stops operating due to a transport device or other error, the transport device can easily distinguish whether the device being transported is an untested device or a tested device. it can.

The movement of the loader buffer carrier 41 and the unloader buffer carrier 51 is controlled on the respective Y-direction loader buffer carrier rails 4Y in synchronization with each other in opposite directions, and one contact head L and the other contact head R are respectively controlled. Since the movements of the heads are controlled synchronously in the opposite directions on the Y-direction head carrier rail 3Y, there is no risk that both heads will encounter at the same position, interfere, collide, and fail.

One of the Y-direction loader buffer carrier rails 4 for controlling the movement of the loader buffer carrier 41
The other Y-direction loader buffer carrier rail 4Y ₂ to control the movement of the Y ₁ and unloader buffer carrier 51 by mounting inclined with respect to the Y direction, it is possible to reduce the movement amount in the X direction of the buffer stage ST4.

Further, a loader arm, an unloader arm,
One contact head L, the other contact head R
Since each of them has a configuration for handling a plurality of devices, it is possible to improve the transfer efficiency as compared with a device using one contact arm.

[Brief description of the drawings]

FIG. 1 is a conceptual plan view illustrating an example of a conventional device test apparatus.

FIG. 2 is a side view of FIG. 1;

FIG. 3 is a diagram illustrating another conventional example of a test apparatus.

FIG. 4 is a diagram illustrating still another conventional example.

FIG. 5 is a mechanism diagram illustrating a first embodiment of the present invention.

6A is a diagram showing a device transfer route in the embodiment of FIG. 5, and FIG. 6B is a diagram showing a device transfer order in FIG. 6A.

FIG. 7 is a diagram illustrating a positional relationship among a loader buffer carrier, an unloader buffer carrier, and a contact head.

8A is a diagram illustrating the mutual movement of the contact heads in FIG. 6A, and FIG. 8B is another diagram illustrating the mutual movement of the contact heads.

9A is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the first state in FIG. 6A, and FIG. 9B is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the second state. .

10A is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the third state in FIG. 6A, and FIG. 10B is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the fourth state. .

FIG. 11A is a first view of a loader buffer carrier and an unloader buffer carrier according to a second embodiment of the present invention;
FIG. 8B is a diagram for explaining the movement in the second state, and FIG. 8B is a diagram for explaining the movement in the second state of the loader buffer carrier and the unloader buffer carrier.

FIG. 12A is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the third state according to the second embodiment, and FIG. 12B is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the fourth state. Figure to do.

FIG. 13A is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the fifth state in the second embodiment, and FIG. 13B is the description of the movement of the loader buffer carrier and the unloader buffer carrier in the sixth state. Figure to do.

FIG. 14A is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the seventh state in the second embodiment, and FIG. 14B is a diagram illustrating the movement of the loader buffer carrier and the unloader buffer carrier in the eighth state. Figure to do.

FIG. 15 is a view for explaining movement of a loader buffer carrier and an unloader buffer carrier in a ninth state in the second embodiment.

FIG. 16 is a diagram illustrating movement of a buffer stage, a loader buffer carrier, and an unloader buffer carrier according to the first embodiment for comparison with the third embodiment.

FIG. 17 is a diagram illustrating movement of a buffer stage, a loader buffer carrier, and an unloader buffer carrier according to a third embodiment.

FIG. 18 is a view showing a modified example of FIG. 17;

[Explanation of symbols]

ST1: Loader arm operation stage ST2: Unloader arm operation stage ST3: Contact arm operation stage ST4: Buffer stage 1X, 1Y, 1Z: X, Y, Z direction loader carrier rail 2X, 2Y, 2Z: X, Y, Z direction unloader carrier rail 3X: X-direction head carrier rail 3Y _1, 3Y _2: Y-direction head carrier rail 4X: X-direction buffer carrier rail 4Y _1: loader buffer carrier rail 4Y _2: unloader buffer carrier rail 10: loader arm 20: unloader arm 30 : Contact arm 19: Untested device 29: Tested device 41: Loader buffer carrier 51: Unloader buffer carrier R, L: Contact head

Claims (11)

[Claims] 1. An IC device for transporting an IC device to a device inspection unit for testing, including: a loader arm operation stage having a loader arm for transporting and supplying an uninspected device; and collecting an inspected device. An unloader arm operation stage having an unloader arm for transporting, first and second contact heads for loading and unloading devices to and from the device inspection section, and first and second movement control of the first and second contact heads A contact arm operation stage having a contact head carrier means; a loader buffer carrier for carrying an uninspected device and transporting the device from the loader arm operation stage to the contact arm operation stage; Unloader arm operation An unloader buffer carrier for transporting the unloader buffer carrier to the stage, a Y-direction loader buffer carrier rail for controlling the movement of the loader buffer carrier between the contact arm operation stage and the loader arm operation stage, and a contact arm operation stage for the unloader buffer carrier. A buffer stage in which a Y-direction unloader buffer carrier rail for controlling movement between the unloader arm operation stages is mounted at an interval from each other; and an X-direction buffer carrier for controlling movement of the buffer stage in the X direction. The buffer stage is interposed between the loader arm operation stage, the unloader arm operation stage, and the contact arm operation stage. 2. The IC test apparatus according to claim 1, wherein the first and second device loading / unloading positions fixed with respect to the contact arm operation stage are at least between the device inspection unit side of the buffer stage. Some are adjacent and determined side by side with an interval in the X direction,
First and second loading positions and first and second unloading positions are fixedly determined on the loader arm operation stage and the unloader arm operation stage of the buffer stage at intervals in the X direction. The buffer stage has at least a first stop position facing the first device loading / unloading position and the first loading position, and a second stopping position facing at least the first device loading / unloading position and the first unloading position. A stop position, and at least a third stop position facing the second device loading / unloading position and the second unloading position are determined. 3. The IC test apparatus according to claim 2, wherein the loader buffer carrier and the unloader buffer carrier are respectively arranged on the Y-direction loader buffer carrier rail and the Y-direction unloader buffer carrier rail in opposite directions. The movement of the first and second contact heads is controlled in synchronization with the first and second contact heads.
The movement is controlled synchronously in opposite directions by the contact head carrier means. 4. The IC test apparatus according to claim 1, 2 or 3, wherein the Y-direction loader buffer carrier rail for controlling the movement of the loader buffer carrier and the Y-direction unloader buffer carrier for controlling the movement of the unloader buffer carrier. The rails are mounted on the buffer stage in parallel with and spaced from each other. 5. The IC test apparatus according to claim 1, 2 or 3, wherein the Y-direction loader buffer carrier rail for controlling the movement of the loader buffer carrier and the Y-direction unloader buffer carrier for controlling the movement of the unloader buffer carrier. The rails are attached to be inclined symmetrically with respect to the Y direction so as to approach each other as approaching the device inspection side. 6. The IC test apparatus according to claim 1, wherein the loader arm, the unloader arm, the first contact head, and the second contact head each have a configuration for handling a plurality of devices. 7. An IC test method for loading an uninspected device into a device inspecting unit and ejecting an inspected device from the device inspecting unit, including the following steps: (a) Loader arm operation of the uninspected device (B) The inspected devices are collected and transported by the unloader arm on the operation stage of the unloader arm, and (c) the devices are loaded into and out of the device inspection section by the first and second contact heads. (D) placing an untested device on a loader buffer carrier and moving the contact arm from the loader arm operation stage. (E) Place the tested device on the unloader buffer carrier (F) transferring the loader buffer carrier between the contact arm operation stage and the loader arm operation stage by the Y-direction loader buffer carrier rail provided on the buffer stage; The unloader buffer carrier is moved by the Y-direction unloader buffer carrier rail provided on the buffer stage at a distance from the Y-direction loader buffer carrier rail. (G) The movement of the buffer stage in the X direction is controlled by the X-direction buffer carrier rail. 8. The IC testing method according to claim 7, wherein the first and second device loading / unloading positions fixed with respect to the contact arm operation stage are at least located between the device inspection unit side of the buffer stage. Some are adjacent and determined side by side with an interval in the X direction,
First and second loading positions and first and second unloading positions are fixedly determined on the loader arm operation stage and the unloader arm operation stage of the buffer stage at intervals in the X direction. The buffer stage has at least a first stop position facing the first device loading / unloading position and the first loading position, and a second stopping position facing at least the first device loading / unloading position and the first unloading position. A stop position, and at least a third stop position facing the second device loading / unloading position and the second unloading position are determined. 9. The IC test method according to claim 8, wherein said step (f) includes: loading said loader buffer carrier and said unloader buffer carrier into said Y
Movement control is performed on the direction loader buffer carrier rail and the Y-direction unloader buffer carrier rail in synchronization with each other in opposite directions, and the first and second contact heads are oppositely moved by the first and second contact head carrier means. Movement control is synchronized with. 10. The IC test method according to claim 9, wherein said step (f) comprises: loading said loader buffer carrier and said unloader buffer carrier at a distance from each other and paralleling the loader buffer carrier and the unloader carrier buffer rail in the Y direction. Are controlled to move in mutually opposite directions. 11. The IC test method according to claim 7, 8 or 9, wherein the step (f) is symmetrically inclined with respect to the Y direction so as to approach each other on the buffer stage as approaching the device inspection side. The loader buffer carrier and the unloader buffer carrier are controlled to move in opposite directions along the attached Y-direction loader buffer carrier rail and the attached Y-direction unloader buffer carrier rail.