JPH10235674A - Lead frame heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To heat a lead frame uniformly and miniaturize a derive by rotating a plate on which the lead frame is mounted with the help of a heat-resistant cylinder and heating the lead frame on the plate by a far infrared heater. SOLUTION: One piece of lead frame 87 is drawn out onto a plate 1 and is mounted in one of the grooves of the plate 1. The plate 1 is rotated 180 deg. by a cylinder 3, then a second lead frame 8 is drawn out onto the plate 1 and is mounted in the other groove. The lead frames 7, 8 are aligned and as such, are heated to a specified temperature level by the plate 1 heated by a far infrared heater 2. After that, the plates 7, 8 are conveyed by a transfer loading mechanism into a metal mold. Thus the plates 7, 8 are heated in a non-contact fashion, so that, irregularities of heating temperature are minimized. In addition, the unit can be simplified and also miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a lead frame transfer molding machine, and more particularly to a lead frame heating apparatus for preheating a lead frame.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional example mainly showing a heating portion of a lead frame transfer molding machine. As shown in FIG. 4, a portion P where mini-tablets (not shown) are arranged in two rows and preheated is shown. , A mechanism S for supporting the mini-tablet, and a set portion R of the lead frame. The portion P for preheating the mini-tablet is connected to the box-shaped heating unit 1P, the waveguide 2P communicating with the heating unit 1P, the high-frequency generator 3P at the base of the waveguide 2P, and the rod electrode 4P. Electrode plate 5P, 6P
The guide cylinder 7P, which is transported and heated by the mini-tablet sandwiched between the electrode plates 5P and 6P, is arranged corresponding to the pot arrangement of the mold (not shown).

A mechanism S for supporting a mini-tablet
Has a push-up bar 8S which supports and pushes up the mini-tablet from below in the guide cylinder 7P, and a drive unit thereof.

[0004] Further, a lead frame setting portion R is provided on both sides of an upper portion of the lead frame mounting portion 1 around a guide portion 9R of the mini-tablet communicating with the guide cylinder 7P.
0R1 to 10R4, and a fixed table 12R.
The lead frame supplied from one direction onto the mounting portion 10R1 is rotated by 180 ° and positioned on the mounting portion 10R2. Then, the lead frame is transferred from the turntable 11R to the fixed table 12R by a transfer mechanism (not shown). As a result, the lead frame is supplied and preheated over all the mounting portions 10R1 to 10R4. Thus, the preheated lead frame and the mini-tablet formed by the above-described high-frequency heating are transferred to the mold by the transfer mechanism. FIG. 4 shows an outline of a conventional example mainly of a heating portion of a transfer molding machine.

Here, focusing on the preheating of the lead frame, there is a commonly used means for performing the preheating as shown in FIG. 5, and the preheating is performed in the residual heat table 21 on which the lead frame 20 is mounted. Cartridge heater 2
2 and a plate (not shown) on which the lead frame 20 is mounted when the lead frame 20 is rotated.
Are floated and rotated, the plate is lowered after rotation, and the lead frame 20 is replaced.

[0006]

However, in the above-described preheating mechanism, the heat from the cartridge heater 22 is transmitted to the residual heat table 21 by heat conduction, and then to the plate on which the lead frame 20 is mounted. There is a problem that the temperature varies depending on the heat conduction state between the plate 21 and the plate, and it is difficult to perform uniform heating.

Further, the plate on which the lead frame is mounted performs an ascending operation, a rotating operation, and a descending operation, and the mechanism becomes complicated unlike the case of only the point rotating operation, which leads to an increase in the size of the unit. There is a problem that an operation check sensor is required.

[0008] These problems occur in a situation where parts such as a table portion must be replaced in accordance with recent various types of lead frames.
It cannot be ignored.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a lead frame heating apparatus in which the temperature of a lead frame is uniformly heated and the apparatus is downsized.

[0010]

The present invention that achieves the above object has the following matters specifying the invention.

(1) A lead frame heating apparatus for preheating a lead frame in a transfer molding machine for supplying a lead frame into a molding die by a transfer mechanism, and a plate on which the lead frame is placed, And a far-infrared heater arranged to heat the lead frame on the plate.

(2) In the above item (1), the portion of the plate on which the lead frame is placed is either a groove or a through groove with a bottom removed.

By providing a far-infrared heater at a distance from the plate of the lead frame, the heater may be connected to a mechanism that simply rotates the plate without incorporating a heater in the plate itself or integrating the heater. Even if it changes, only the plate needs to be changed.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Here, an example of an embodiment of the present invention will be described with reference to FIGS. 1 and 2 show an example of a heating device. In the drawings, a heat-resistant cylinder 3 having a shaft capable of turning by 180 ° or more and a far-infrared heater 2 on both sides thereof are provided on a base plate 4. A bracket 5 for mounting is mounted. The plate 1 for aligning the lead frames 7 and 8 is mounted on a flange 6 mounted on the shaft of the heat-resistant cylinder 3. On the bracket 5,
The far-infrared heater 2 is mounted. In this case, the far-infrared heater 2 is positioned corresponding to the lead frame mounting portion of the plate 1 and has a gap that does not contact the lower surface of the plate 1. Be provided.

Further, as an example of a detailed configuration, a far-infrared heater made of a ceramic material is used, and four far-infrared heaters are arranged under a plate 1 for aligning a lead frame. And the temperature can be raised to about 250 ° C. by taking out a temperature feedback signal. Also, the lead frame 7,
The plate 1 for aligning the lead frames 8 has grooves for positioning the lead frames 7 and 8, which are the above-described lead frame mounting portions.
It is painted black to enhance heat absorption. The gap between the plate 1 for aligning the lead frames 7 and 8 and the far infrared heater 2 is set to about 5 mm, and the heat-resistant temperature is about 1 mm.
The plate 1 is attached to the flange 6 of the heat-resistant cylinder 3 at 00 ° C. In this case, the plate 1 can be replaced with another according to the type of the lead frames 7 and 8,
It is removable.

In the structure as described above, heating of the lead frames 7, 8 is performed as follows. That is, one lead frame 7 is pulled out on the plate 1 and
When the plate 1 is placed in one of the grooves, the plate 1 is rotated by 180 ° by the cylinder 3, and the second lead frame 8 is pulled out again on the plate 1 and placed in the other one of the grooves. The frame 7 and the lead frame 8 are aligned. In this state, the lead frame 7 and the lead frame 8 are heated to a predetermined temperature by the plate 1 heated by the far-infrared heater 2, and then transported into the mold by the transfer mechanism.

FIG. 3 shows another example in which a part of the plate 1 is enlarged together with the lead frame 7. In this example, the lead frame mounting portion of the plate 1 shows a so-called bottomed through groove structure. The lead frame 7 is placed between the guide rails 10 and 11 to support the lead frame. The guide rails 10 and 11 also have a role of a conveyance guide, similarly to the grooves of the lead frame 7 shown in FIGS. Guide rails 10 and 1 for lead frame 8
Of course, 1 may be provided. in this case,
Although the lead frame 7 is not contacted by the far infrared heater 2 from below, it is directly heated by far infrared rays.

In the above description, the far-infrared heater 2 is arranged below the plate 1, but it may be arranged above the plate 1 in a non-contact manner with the lead frame mounting portion.

[0019]

As described above, according to the present invention, the lead frame can be heated through the plate or directly by the far-infrared heater without contact, so that the heating effect can be improved and the heating can be achieved even when the lead frame is far away. Variations in temperature with respect to the lead frame are reduced, and only the plate rotation mechanism is structurally possible, and the plate can be attached to and detached from the rotary cylinder. Simplification and downsizing can be achieved. Moreover, even if the type of the lead frame is changed, it can be dealt with only by replacing the plate.

[Brief description of the drawings]

FIG. 1 is a partial perspective view of an example of an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a partial perspective view showing another example.

FIG. 4 is an overall configuration diagram of the related art.

FIG. 5 is a cross-sectional configuration diagram of a conventional heating unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame alignment plate 2 Far infrared heater 3 Cylinder 4 Base plate 5 Bracket 6 Flange 7,8 Lead frame 9 Thermocouple 10,11 Guide rail

Claims (2)

[Claims] 1. A lead frame heating apparatus for preheating a lead frame in a transfer molding machine for supplying a lead frame into a molding die by a transfer mechanism, comprising: a plate on which the lead frame is placed; A lead frame heating device, comprising: a heat-treated cylinder to be rotated; and a far infrared heater arranged to heat a lead frame on the plate. 2. The lead frame heating device according to claim 1, wherein the portion of the plate on which the lead frame is placed is one of a groove and a through groove having a bottom.