JPH10219465A - Electroless plating method - Google Patents
Electroless plating methodInfo
- Publication number
- JPH10219465A JPH10219465A JP9022218A JP2221897A JPH10219465A JP H10219465 A JPH10219465 A JP H10219465A JP 9022218 A JP9022218 A JP 9022218A JP 2221897 A JP2221897 A JP 2221897A JP H10219465 A JPH10219465 A JP H10219465A
- Authority
- JP
- Japan
- Prior art keywords
- minutes
- electroless plating
- plating
- room temperature
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板、
電子部品等の銅回路パターン上に無電解めっき皮膜を形
成するための無電解めっき方法に関する。The present invention relates to a printed wiring board,
The present invention relates to an electroless plating method for forming an electroless plating film on a copper circuit pattern of an electronic component or the like.
【０００２】[0002]
【従来の技術】近年、プリント配線板の高密度化が進ん
でおり、配線板に直接半導体チップを実装するＣＯＢ、
ＭＣＭ等の需要が伸びている。これらのチップ実装基板
とチップの接続方法には、主にワイヤボンディングが使
用されている。このＣＯＢ、ＭＣＭ等の実装基板側のワ
イヤボンディング接続用端子の構造は基板上に形成した
銅回路パターンによるワイヤボンディング接続用端子上
に、ニッケル、金等の皮膜を順次形成したものであり、
この形成には、無電解めっきによって皮膜を形成する方
法を用いることがある。半導体チップ実装基板のワイヤ
ボンディング接続用端子には、表面の平滑性が金ワイヤ
と回路パターンとの密着のために重要であり、この端子
表面の平滑性を確保するために、従来では、無電解めっ
き前処理に、酸脱脂、アルカリ脱脂、溶剤脱脂、又はプ
ラズマ処理（ドライエッチング）等を行って、端子表面
を清浄化してから無電解めっきを行っていた。2. Description of the Related Art In recent years, the density of printed wiring boards has been increasing, and COBs in which semiconductor chips are directly mounted on wiring boards have been developed.
Demand for MCM and the like is growing. Wire bonding is mainly used as a method for connecting the chip mounting board and the chip. The structure of the terminal for wire bonding connection on the mounting board side such as COB and MCM is such that a film of nickel, gold or the like is sequentially formed on the terminal for wire bonding connection by a copper circuit pattern formed on the board,
For this formation, a method of forming a film by electroless plating may be used. For the terminals for wire bonding connection of the semiconductor chip mounting substrate, the smoothness of the surface is important for the close contact between the gold wire and the circuit pattern. In the pretreatment of plating, acid degreasing, alkali degreasing, solvent degreasing, plasma treatment (dry etching) or the like is performed to clean the terminal surface, and then electroless plating is performed.
【０００３】[0003]
【発明が解決しようとする課題】ところで、従来の技術
のうち、前処理に、酸脱脂、アルカリ脱脂、溶剤脱脂を
行う方法では、端子表面が十分に清浄化できずに、無電
解めっきを行った後に、回路パターンに階段状のめっき
皮膜が発生するという課題があった。また、従来の技術
のうち、プラズマ処理を前処理に用いた場合、その後に
無電解めっきを行うと、無電解めっき皮膜の表面にこぶ
状の析出が発生するという課題があった。[0005] Among the conventional techniques, in the method of performing acid degreasing, alkali degreasing, and solvent degreasing in the pretreatment, the surface of the terminal cannot be sufficiently cleaned and electroless plating is performed. After that, there is a problem that a step-like plating film is generated in the circuit pattern. Further, among the conventional techniques, when plasma treatment is used for pretreatment, if electroless plating is performed thereafter, there is a problem that a bump-like precipitation occurs on the surface of the electroless plating film.
【０００４】本発明は、平滑性に優れた半導体チップ実
装基板の銅回路パターン上に無電解めっきを行う前処理
法を提供することを目的とする。It is an object of the present invention to provide a pretreatment method for performing electroless plating on a copper circuit pattern of a semiconductor chip mounting substrate having excellent smoothness.
【０００５】[0005]
【課題を解決するための手段】本発明の無電解めっき方
法は、銅回路パターン上に無電解めっき皮膜を形成する
前処理として、プラズマ処理とアルカリ処理を順次行う
ことを特徴とする。The electroless plating method of the present invention is characterized by sequentially performing a plasma treatment and an alkali treatment as a pretreatment for forming an electroless plating film on a copper circuit pattern.
【０００６】[0006]
【発明の実施の形態】本発明に用いる無電解めっき皮膜
には、ニッケル、パラジウム、金の一種類以上の金属を
用いることができ、これらの無電解めっき皮膜は、それ
ぞれの皮膜を単独でも、連続して多層化しても使用でき
る。BEST MODE FOR CARRYING OUT THE INVENTION The electroless plating film used in the present invention can use one or more metals of nickel, palladium, and gold. It can be used even if it is continuously multilayered.
【０００７】無電解ニッケルめっきには、めっき液中の
ニッケルイオンがニッケルイオンの還元剤の働きによっ
て、銅の活性化した表面にニッケルを析出させるもので
あればよく特に限定しない。The electroless nickel plating is not particularly limited as long as the nickel ions in the plating solution precipitate nickel on the activated copper surface by the action of the nickel ion reducing agent.
【０００８】また、無電解パラジウムめっきには、置換
型、還元型どちらでも良く、置換パラジウムめっきに
は、下地のニッケルとめっき液中のパラジウムイオンの
置換反応によって、ニッケル表面にパラジウム皮膜を形
成するものであればどのようなものでも使用でき、ま
た、還元型無電解パラジウムめっきは、めっき液中のパ
ラジウムイオンを還元剤の働きによって、ニッケル表面
にパラジウムとして析出させるものであればよく特に限
定しない。In the electroless palladium plating, either a substitution type or a reduction type may be used. In the substitution palladium plating, a palladium film is formed on the nickel surface by a substitution reaction between the underlying nickel and palladium ions in the plating solution. Any type can be used as long as it is used, and the reduction type electroless palladium plating is not particularly limited as long as palladium ions in the plating solution are deposited as palladium on the nickel surface by the action of a reducing agent. .
【０００９】無電解金めっきには、置換型、還元型どち
らでも使用でき、また、連続しためっきでも良い。置換
金めっきは、下地のパラジウムと溶液中の金イオンとの
置換反応によって、パラジウム表面に金皮膜を形成する
ものであり、還元型無電解めっきは、めっき液中の金イ
オンが金イオンの還元剤の働きによって、金表面に金を
析出させるものであればよく特に限定しない。For the electroless gold plating, either a substitution type or a reduction type can be used, and continuous plating may be used. In displacement gold plating, a gold film is formed on the surface of palladium by a substitution reaction between underlying palladium and gold ions in a solution. In reduction type electroless plating, gold ions in a plating solution reduce gold ions. There is no particular limitation as long as the agent deposits gold on the gold surface by the action of the agent.
【００１０】本発明に用いるプラズマ処理のプラズマに
は、酸素プラズマが好ましい。アルカリ処理には、アル
カリ金属の水酸化物を含む水溶液である水溶液が好まし
く、水酸化ナトリウム、水酸化カリウム等のアルカリ金
属水酸化物を含む水溶液であれば良く、炭酸ナトリウ
ム、燐酸ナトリウム等の緩衝剤、界面活性剤等を含んで
も良い。The plasma used in the present invention is preferably an oxygen plasma. For the alkali treatment, an aqueous solution that is an aqueous solution containing an alkali metal hydroxide is preferable, and any aqueous solution containing an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide may be used, and a buffer solution such as sodium carbonate or sodium phosphate may be used. Agents, surfactants and the like.
【００１１】銅回路パターンを支持する基材の種類に
は、セラッミク、半導体、樹脂基板等が使用でき、特に
限定するものではない。樹脂基板についてもフェノー
ル、エポキシ、ポリイミド等のものがあるが特に限定す
るものではない。As the type of the substrate for supporting the copper circuit pattern, ceramics, semiconductors, resin substrates and the like can be used, and there is no particular limitation. The resin substrate also includes phenol, epoxy, polyimide and the like, but is not particularly limited.
【００１２】[0012]
実施例１ 銅張り積層板を穴あけ、スルーホールめっき、エッチン
グレジスト形成、エッチング、半田レジスト形成後の導
体パターンの露出した銅端子上に、以下の処理を以下の
順に行う。 (1)プラズマ処理 ・プラズマ処理装置：ＤＥＡ５０６（日電アネルバ株式
会社製、商品名） ・条件：０．５ＫＷ、３分、酸素濃度＝５０ＳＣＣＭ (2)アルカリ処理 ・組成：ＮａＯＨ水溶液・・・・・・・・・・・・・・
・・・・・１５ｇ／ｌ ・条件：５０℃、３分 (3)水洗（１分、室温） (4)ソフトエッチング ・組成：過硫酸アンモニウム・・・・・・・・・・・・
・・・・１００ｇ／ｌ ・条件：室温、１分 (5)水洗（２分、室温） (6)酸洗 ・組成：１０％硫酸 ・条件：室温、１分 (7)水洗（２分、室温） (8)活性化 ・組成：SA-100（日立化成工業株式会社製、商品名） ・条件：室温、５分 (9)水洗（２分、室温） (10)無電解ニッケルめっき ・組成：NIPS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、２０分 (12)水洗（２分、室温） (12)置換金めっき ・組成：HGS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、１０分 (13)水洗（２分、室温） (14)無電解金めっき ・組成：HGS-2000（日立化成工業株式会社製、商品名 ・条件：６５℃、４０分Example 1 A copper-clad laminate is perforated, through-hole plating, etching resist formation, etching and solder resist formation are performed on the exposed copper terminals of the conductor pattern in the following order. (1) Plasma treatment-Plasma treatment device: DEA506 (trade name, manufactured by Nidec Anelva Co., Ltd.)-Condition: 0.5 KW, 3 minutes, oxygen concentration = 50 SCCM (2) Alkaline treatment-Composition: NaOH aqueous solution ...・ ・ ・ ・ ・ ・ ・ ・ ・
····· 15 g / l · Condition: 50 ° C, 3 minutes (3) Rinse with water (1 minute, room temperature) (4) Soft etching · Composition: Ammonium persulfate ···
・ ・ ・ ・ 100g / l ・ Condition: Room temperature, 1 minute (5) Washing with water (2 minutes, room temperature) (6) Pickling ・ Composition: 10% sulfuric acid ・ Condition: Room temperature, 1 minute (7) Washing with water (2 minutes, (Room temperature) (8) Activation-Composition: SA-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.)-Conditions: room temperature, 5 minutes (9) Rinse with water (2 minutes, room temperature) (10) Electroless nickel plating-Composition : NIPS-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.)-Conditions: 85 ° C, 20 minutes (12) Rinse (2 minutes, room temperature) (12) Displacement gold plating-Composition: HGS-100 (Hitachi Chemical Co., Ltd.)・ Company name: 85 ° C, 10 minutes (13) Rinse with water (2 minutes, room temperature) (14) Electroless gold plating ・ Composition: HGS-2000 (manufactured by Hitachi Chemical Co., Ltd. ・ Product name ・ Conditions: 65 ° C, 40 minutes
【００１３】比較例１ 銅張り積層板を穴あけ、スルーホールめっき、エッチン
グレジスト形成、エッチング、半田レジスト形成後の導
体パターンの露出した銅端子上に、以下の処理を行う。 (1)プラズマ処理 ・プラズマ処理装置：ＤＥＡ５０６（日電アネルバ株式
会社製、商品名） ・条件：０．５ＫＷ、３分、酸素濃度＝５０ＳＣＣＭ (2)ソフトエッチング ・組成：過硫酸アンモニウム・・・・・・・・・・・・
・・・・１００ｇ／ｌ ・条件：室温、１分 (3)水洗（２分、室温） (4)酸洗 ・組成：１０％硫酸 ・条件：室温、１分 (5)水洗（２分、室温） (6)活性化 ・組成：SA-100（日立化成工業株式会社製、商品名） ・条件：室温、５分 (7)水洗（２分、室温） (8)無電解ニッケルめっき ・組成：NIPS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、２０分 (9)水洗（２分、室温） (10)置換金めっき ・組成：HGS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、１０分 (11)水洗（２分、室温） (12)無電解金めっき ・組成：HGS-2000（日立化成工業株式会社製、商品名） ・条件：６５℃、４０分Comparative Example 1 A copper-clad laminate is drilled, and the following processing is performed on the exposed copper terminals of the conductor pattern after through-hole plating, etching resist formation, etching, and solder resist formation. (1) Plasma treatment ・ Plasma treatment device: DEA506 (trade name, manufactured by Nidec Anelva Co., Ltd.) ・ Condition: 0.5 KW, 3 minutes, oxygen concentration = 50 SCCM (2) Soft etching ・ Composition: ammonium persulfate・ ・ ・ ・ ・ ・ ・
・ ・ ・ ・ 100g / l ・ Condition: Room temperature, 1 minute (3) Washing with water (2 minutes, room temperature) (4) Pickling ・ Composition: 10% sulfuric acid ・ Condition: Room temperature, 1 minute (5) Washing with water (2 minutes, (6) Activation ・ Composition: SA-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Condition: Room temperature, 5 minutes (7) Rinse with water (2 minutes, room temperature) (8) Electroless nickel plating ・ Composition : NIPS-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Condition: 85 ° C, 20 minutes (9) Rinse (2 minutes, room temperature) (10) Displacement gold plating ・ Composition: HGS-100 (Hitachi Chemical Co., Ltd.)・ Conditions: 85 ° C, 10 minutes (11) Rinse (2 minutes, room temperature) (12) Electroless gold plating ・ Composition: HGS-2000 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Conditions : 65 ° C, 40 minutes
【００１４】比較例２ 銅張り積層板を穴あけ、スルーホールめっき、エッチン
グレジスト形成、エッチング、半田レジスト形成後の導
体パターンの露出した銅端子上に、以下の処理を行う。 (1)プラズマ処理 ・プラズマ処理装置：ＤＥＡ５０６（日電アネルバ株式
会社製、商品名） ・条件：０．５ＫＷ、３分、酸素濃度＝５０ＳＣＣＭ (2)酸性脱脂 ・組成：Z-200（ワールドメタル株式会社製、商品名） ・条件：５０℃、３分 (2)水洗（１分、室温） (3)ソフトエッチング ・組成：過硫酸アンモニウム・・・・・・・・・・・・
・・・・１００ｇ／ｌ ・条件：室温、１分 (4)水洗（２分、室温） (5)酸洗 ・組成：１０％硫酸 ・条件：室温、１分 (6)水洗（２分、室温） (7)活性化 ・組成：SA-100（日立化成工業株式会社製、商品名） ・条件：室温、５分 (8)水洗（２分、室温） (9)無電解ニッケルめっき ・組成：NIPS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、２０分 (10)水洗（２分、室温） (11)置換金めっき ・HGS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、１０分 (12)水洗（２分、室温） (13)無電解金めっき ・組成：HGS-2000（日立化成工業株式会社製、商品名） ・条件：６５℃、４０分Comparative Example 2 A copper-clad laminate is perforated, through-hole plating, etching resist formation, etching, and the following processing are performed on the exposed copper terminals of the conductor pattern after the formation of the solder resist. (1) Plasma treatment ・ Plasma treatment equipment: DEA506 (manufactured by Nidec Anelva Co., Ltd., trade name) ・ Condition: 0.5 kW, 3 minutes, oxygen concentration = 50 SCCM (2) Acid degreasing ・ Composition: Z-200 (World Metal Stock・ Company name: 50 ° C, 3 minutes (2) Rinse with water (1 minute, room temperature) (3) Soft etching ・ Composition: ammonium persulfate
・ ・ ・ ・ 100g / l ・ Condition: Room temperature, 1 minute (4) Washing with water (2 minutes, room temperature) (5) Pickling ・ Composition: 10% sulfuric acid ・ Condition: Room temperature, 1 minute (6) Washing with water (2 minutes, (7) Activation ・ Composition: SA-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Condition: Room temperature, 5 minutes (8) Rinse with water (2 minutes, room temperature) (9) Electroless nickel plating ・ Composition : NIPS-100 (Hitachi Chemical Industries, Ltd., trade name) ・ Condition: 85 ° C, 20 minutes (10) Rinse (2 minutes, room temperature) (11) Displacement gold plating ・ HGS-100 (Hitachi Chemical Industries, Ltd.)・ Trade name: 85 ° C, 10 minutes (12) Rinse with water (2 minutes, room temperature) (13) Electroless gold plating ・ Composition: HGS-2000 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Condition: 65 ℃, 40 minutes
【００１５】比較例３ 銅張り積層板を穴あけ、スルーホールめっき、エッチン
グレジスト形成、エッチング、半田レジスト形成後の導
体パターンの露出した銅端子上に、以下の処理を行う。 (1)アルカリ処理 ・組成：ＮａＯＨ水溶液・・・・・・・・・・・・・・
・・・・・１５ｇ／ｌ ・条件：５０℃、３分 (2)水洗（１分、室温） (3)ソフトエッチング ・組成：過硫酸アンモニウム・・・・・・・・・・・・
・・・・１００ｇ／ｌ ・条件：室温、１分 (4)水洗（２分、室温） (5)酸洗 ・組成：１０％硫酸 ・条件：室温、１分 (6)水洗（２分、室温） (7)活性化 ・組成：SA-100（日立化成工業株式会社製、商品名） ・条件：室温、５分 (8)水洗（２分、室温） (9)無電解ニッケルめっき ・組成：NIPS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、２０分 (10)水洗（２分、室温） (11)置換金めっき ・組成：HGS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、１０分 (12)水洗（２分、室温） (13)無電解金めっき ・組成：HGS-2000（日立化成工業株式会社製、商品名） ・条件：６５℃、４０分COMPARATIVE EXAMPLE 3 A copper-clad laminate is perforated, and the following processing is performed on the exposed copper terminals of the conductor pattern after through-hole plating, etching resist formation, etching and solder resist formation. (1) Alkaline treatment-Composition: NaOH aqueous solution ...
····· 15 g / l · Condition: 50 ° C, 3 minutes (2) Rinse with water (1 minute, room temperature) (3) Soft etching · Composition: Ammonium persulfate ···
・ ・ ・ ・ 100g / l ・ Condition: Room temperature, 1 minute (4) Washing with water (2 minutes, room temperature) (5) Pickling ・ Composition: 10% sulfuric acid ・ Condition: Room temperature, 1 minute (6) Washing with water (2 minutes, (7) Activation ・ Composition: SA-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Condition: Room temperature, 5 minutes (8) Rinse with water (2 minutes, room temperature) (9) Electroless nickel plating ・ Composition : NIPS-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.)-Condition: 85 ° C, 20 minutes (10) Rinse (2 minutes, room temperature) (11) Displacement gold plating-Composition: HGS-100 (Hitachi Chemical Co., Ltd.)・ Company name: 85 ° C, 10 minutes (12) Rinse with water (2 minutes, room temperature) (13) Electroless gold plating ・ Composition: HGS-2000 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Conditions : 65 ° C, 40 minutes
【００１６】比較例４ 銅張り積層板を穴あけ、スルーホールめっき、エッチン
グレジスト形成、エッチング、半田レジスト形成後の導
体パターンの露出した銅端子上に、以下の処理を行う。 (1)酸性脱脂 ・組成：Z-200（ワールドメタル株式会社製、商品名） ・条件：５０℃、３分 (2)水洗（１分、室温） (3)ソフトエッチング ・組成：過硫酸アンモニウム・・・・・・・・・・・・
・・・・１００ｇ／ｌ ・条件：室温、１分 (4)水洗（２分、室温） (5)酸洗 ・組成：１０％硫酸 ・室温、１分 (6)水洗（２分、室温） (7)活性化 ・組成：SA-100（日立化成工業株式会社製、商品名） ・条件：室温、５分 (8)水洗（２分、室温） (9)無電解ニッケルめっき ・組成：NIPS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、２０分 (10)水洗（２分、室温） (11)置換金めっき ・組成：HGS-100（日立化成工業株式会社製、商品名） ・条件：８５℃、１０分 (12)水洗（２分、室温） (13)無電解金めっき ・組成：HGS-2000（日立化成工業株式会社製、商品名） ・条件：６５℃、４０分COMPARATIVE EXAMPLE 4 A copper-clad laminate is drilled, and the following processing is performed on the exposed copper terminals of the conductor pattern after through-hole plating, etching resist formation, etching, and solder resist formation. (1) Acid degreasing ・ Composition: Z-200 (trade name, manufactured by World Metal Co., Ltd.) ・ Condition: 50 ° C, 3 minutes (2) Rinse with water (1 minute, room temperature) (3) Soft etching ・ Composition: ammonium persulfate ...
・ ・ ・ ・ 100g / l ・ Condition: Room temperature, 1 minute (4) Washing with water (2 minutes, room temperature) (5) Pickling ・ Composition: 10% sulfuric acid ・ Room temperature, 1 minute (6) Washing with water (2 minutes, room temperature) (7) Activation-Composition: SA-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.)-Condition: room temperature, 5 minutes (8) Rinse with water (2 minutes, room temperature) (9) Electroless nickel plating-Composition: NIPS -100 (manufactured by Hitachi Chemical Co., Ltd.) • Condition: 85 ° C, 20 minutes (10) Rinse (2 minutes, room temperature) (11) Replacement gold plating • Composition: HGS-100 (manufactured by Hitachi Chemical Co., Ltd.)・ Condition: 85 ° C, 10 minutes (12) Rinse with water (2 minutes, room temperature) (13) Electroless gold plating ・ Composition: HGS-2000 (trade name, manufactured by Hitachi Chemical Co., Ltd.) ・ Condition: 65 ℃, 40 minutes
【００１７】実施例と比較例１、２、３、４で得たプリ
ント配線板の銅パターン上の表面形状は違っていた。実
施例の無電解金めっき表面は、平滑な無電解めっき表面
でワイヤボンディング性は良好であったのに対して、比
較例１、２の無電解金めっき表面はこぶ状析出であり、
比較例３、４は段差めっきであり、ワイヤボンディング
は不可能であった。以上のように、本発明は平滑な無電
解めっき表面を得ることに優れている無電解めっき方法
である。The surface shapes on the copper patterns of the printed wiring boards obtained in the example and comparative examples 1, 2, 3, and 4 were different. The surface of the electroless gold plating of Example was a smooth electroless plating surface and the wire bonding property was good, whereas the surface of the electroless gold plating of Comparative Examples 1 and 2 was bump-like precipitation.
Comparative Examples 3 and 4 were step plating, and wire bonding was not possible. As described above, the present invention is an electroless plating method that is excellent in obtaining a smooth electroless plating surface.
【００１８】[0018]
【発明の効果】以上に説明したように、本発明によっ
て、平滑な無電解めっき表面を得ることに優れた無電解
めっき方法を提供することができる。As described above, according to the present invention, it is possible to provide an electroless plating method excellent in obtaining a smooth electroless plating surface.
Claims (4)
成する前処理として、プラズマ処理とアルカリ処理を順
次行うことを特徴とする無電解めっき方法。1. An electroless plating method comprising sequentially performing a plasma treatment and an alkali treatment as a pretreatment for forming an electroless plating film on a copper circuit pattern.
ム、金の一種類以上の金属を含むことを特徴とする請求
項１に記載の無電解めっき方法。2. The electroless plating method according to claim 1, wherein the electroless plating film contains at least one metal of nickel, palladium, and gold.
であることを特徴とする請求項１又は２に記載の無電解
めっき方法。3. The electroless plating method according to claim 1, wherein the plasma in the plasma processing is oxygen plasma.
を含む水溶液であることを特徴とする請求項１〜３のう
ちいずれかに記載の無電解めっき方法。4. The electroless plating method according to claim 1, wherein the alkali treatment is an aqueous solution containing an alkali metal hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02221897A JP3669460B2 (en) | 1997-02-05 | 1997-02-05 | Electroless plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02221897A JP3669460B2 (en) | 1997-02-05 | 1997-02-05 | Electroless plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10219465A true JPH10219465A (en) | 1998-08-18 |
| JP3669460B2 JP3669460B2 (en) | 2005-07-06 |
Family
ID=12076672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02221897A Expired - Fee Related JP3669460B2 (en) | 1997-02-05 | 1997-02-05 | Electroless plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3669460B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016100533A (en) | 2014-11-25 | 2016-05-30 | セイコーエプソン株式会社 | Electronic component and manufacturing method of the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989758A (en) * | 1982-11-12 | 1984-05-24 | Hitachi Ltd | Production of metallic matrix for reproduction of plate-like body having information for ruggedness |
| JPS60200967A (en) * | 1984-03-24 | 1985-10-11 | C-Ren Kk | Method for plating organic polymer sheet with metal |
| JPS617688A (en) * | 1984-06-21 | 1986-01-14 | 日立化成工業株式会社 | Method of producing printed circuit board |
| JPH05110247A (en) * | 1991-10-18 | 1993-04-30 | Shin Etsu Chem Co Ltd | Manufacture of board for flexible printed wiring |
| JPH07207450A (en) * | 1994-01-13 | 1995-08-08 | Nitto Denko Corp | Production of partially plated fluororesin porous sheet |
| JPH0823166A (en) * | 1994-07-06 | 1996-01-23 | Hitachi Ltd | Manufacture of multi-layer wiring substrate |
-
1997
- 1997-02-05 JP JP02221897A patent/JP3669460B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989758A (en) * | 1982-11-12 | 1984-05-24 | Hitachi Ltd | Production of metallic matrix for reproduction of plate-like body having information for ruggedness |
| JPS60200967A (en) * | 1984-03-24 | 1985-10-11 | C-Ren Kk | Method for plating organic polymer sheet with metal |
| JPS617688A (en) * | 1984-06-21 | 1986-01-14 | 日立化成工業株式会社 | Method of producing printed circuit board |
| JPH05110247A (en) * | 1991-10-18 | 1993-04-30 | Shin Etsu Chem Co Ltd | Manufacture of board for flexible printed wiring |
| JPH07207450A (en) * | 1994-01-13 | 1995-08-08 | Nitto Denko Corp | Production of partially plated fluororesin porous sheet |
| JPH0823166A (en) * | 1994-07-06 | 1996-01-23 | Hitachi Ltd | Manufacture of multi-layer wiring substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3669460B2 (en) | 2005-07-06 |
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