JPH10194452A - Ic test equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily set the moving amount of a Z-axis, by using a pulse driving- type motor as a Z-axis driving means, and specifying the down stroke of a vacuum suction head on the basis of the number of pulses. SOLUTION: The moving amount from the start of the drive of a Z-axis driving means 30 to the stop of the same at a desired down position, can be managed on the basis of the number of pulses by using a pulse driving motor as a Z-axis driving motor 31. Accordingly in a case when an IC socket for testing 12, is changed, a vacuum suction head 10 is once made to collide with an IC socket for testing 12 by using a collision block 13, for protecting the IC socket for testing 12. On this occasion, the number of pulses given by the time when the rotation of the Z-axis driving motor 31 is stopped, is stored, to set the driving amount of the Z-axis. After the setting, the Z-axis driving motor 31, is stopped at a position specified by the height of the collision block 13 without fail, so that the operation can be performed without using the collision block 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC testing apparatus for testing various ICs, and more particularly, to transporting an IC to a test IC socket by a horizontal transport means, and transferring the IC under test to the test IC socket at that position. The present invention proposes an improvement in the Z-axis driving means for making the pressure contact.

[0002]

2. Description of the Related Art FIG. 3 shows an example of a Z-axis driving means used in a conventional IC testing apparatus. In the figure, reference numeral 10 denotes a vacuum suction head. The vacuum suction head 10 is supported by the horizontal transfer means 20 and moves in the horizontal direction (X-Y direction).
The IC under test 11 is sucked and adsorbed at the supply point position of C, and the IC under test 11 is transported to the upper part of the test IC socket 12, and is moved downward by the Z-axis driving means 30 at the transported position. Test IC socket 12
Pressure contact.

In the test IC socket 12, a butting block 13 is arranged on the periphery of the testing IC socket 12.
The shim 14 for adjusting the stork of the Z-axis driving means 30 is disposed on the surface of the IC 3 and the thickness of the shim 14 is selected to determine the thickness of the IC 1 to be tested.
The pressure contact force for pressing the test piece 1 to the test IC socket 12 is adjusted. The abutment block 13 is provided with a guide pin 15A protruding therefrom. A guide hole 15B is provided in the vacuum suction head 10 with respect to the guide pin 15A, and the guide hole 15B is engaged with the guide pin 15A so that the IC under test 11 is formed.
Are positioned so that the IC under test 11 is accurately positioned and pressed against the test IC socket 12.

The Z-axis driving means 30 is disposed to face the upper part of the test IC socket 12 so as to drive the vacuum suction head 10 downward. In the example shown in FIG. 3, a motor 31 for lowering the vacuum suction head 10 to the vicinity of the test IC socket 12 and an air cylinder 32 for lowering the vacuum suction head 10 by a predetermined amount from the position where the motor 31 is lowered. This shows the case where the configuration is made as follows.

That is, the motor 31 moves the push rod 33 up and down by the ball screw 31A. The push rod 33 abuts the support 16 supporting the vacuum suction head 10 and moves the support 16 downward. With the vacuum suction head 10 lowered to a prescribed position by the motor 31, the air cylinder 32 is protruded downward, and the driving force of the air cylinder 32 presses the vacuum suction head 10 against the shim 14, corresponding to the thickness of the shim 14. Then, the IC under test 11 is pressed against the test IC socket 12 at a predetermined contact pressure.

[0006]

As described above, conventionally, the air cylinder 32 is driven so that the vacuum suction head 10 abuts against the surfaces of the butting block 13 and the shim 14, and the thickness of the butting block 13 and the shim 14 is increased. Thus, the pressure contact force with the test IC socket 12 is adjusted. That is, shim 14
Are available in various thicknesses, and test IC socket 1
The shim 14 is replaced in various ways, for example, when the 2 is replaced, and the shim 14 is adjusted so as to obtain an appropriate pressing force. Therefore, there is an inconvenience that the adjustment is troublesome and a troublesome work is forced. That is, the IC is tested with the pressure applied to the test IC socket 12 set to a certain tentative state. As a result of the test, if the rate of occurrence of defects is large, the pressure applied is often inappropriate, 14 is replaced and adjusted so as to reduce the defect occurrence rate. Therefore, there is a disadvantage that the adjustment is troublesome.

[0007] Further, a test I
Since the pressure contact force to the C socket 12 is obtained, there is a disadvantage that the pressure contact force fluctuates due to the pressure fluctuation of the air pressure source that applies air pressure to the air cylinder. Z axis driving means 30
In addition to the combination of the motor driving means 31 and the air cylinder 32, a combination of a pair of air cylinders and the like are conceivable. However, in any case, the pressure contact with the test IC socket 12 is obtained by the air cylinder. The inconvenience that the pressure contact force fluctuates due to the pressure fluctuation of the air pressure source cannot be eliminated.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a Z-axis driving means capable of uniquely determining a descending stroke of a vacuum suction head, easily setting a press-contact force to a test IC socket, and obtaining a constant press-contact force. It is intended to provide an IC test apparatus having the following.

[0009]

According to the present invention, a pulse-driven motor is used as the Z-axis driving means, and the descending stroke of the vacuum suction head is defined by the number of pulses. Therefore, according to the present invention, the stroke in the Z-axis direction can be managed by the number of pulses, so that it is not necessary to particularly adjust the pressure contact stroke by the abutment block and the shim. Therefore, it is possible to easily set the pressure contact force to the test IC socket and to obtain a constant pressure contact force.

[0010]

FIG. 1 shows an embodiment of the present invention. Parts corresponding to those in FIG. 3 are denoted by the same reference numerals. In the present invention, a Z-axis drive motor 31 constituting the Z-axis drive means 30 is a pulse drive type motor, such as a pulse motor or a servo motor, whose rotation amount can be defined by the number of pulses.

When the Z-axis drive motor 31 is a pulse drive type motor, the Z-axis drive means 30 starts to be driven.
The amount of movement until stopping at a desired lowering position can be managed by the number of pulses. Therefore, the test IC socket 1
2 is replaced, the vacuum suction head 10 is abutted against the test IC socket 12 by using the butting block 13 in order to protect the test IC socket. At this time, the rotation of the Z-axis drive motor 31 is stopped. The drive amount of the Z-axis can be set only by storing the number of pulses given until the stop. After this setting, the Z-axis drive motor 31 always stops at the position defined by the height of the abutment block 13, so that the abutment block 13 is not always necessary and can be operated without the abutment block.

FIG. 2 shows an example of a drive control device for the Z-axis drive motor 31. Reference numeral 40 denotes a Z-axis drive control device. In this example, a case is shown in which the Z-axis drive control device 40 is configured by a microcomputer. As is well known, the microcomputer includes a central processing unit 41, a read-only ROM 42 storing a dedicated program and the like, a RAM 43 temporarily storing input data and the like, an input port 44,
It comprises an output port 45, input means 46, and the like.

In the embodiment of the present invention, the RAM 43 is provided with a descending stroke storage means 43A. The number of pulses given to the motor 31 until it hits the abutment block 13 is stored in the descending stroke storage means 43A, and the descending stroke is stored. The storage of this descending stroke causes the Z-axis driving means 30 to move downward, and the driving of the Z-axis driving motor 31 is stopped in a state where the vacuum suction head 10 has hit the butting block 13 or the shim 14. By operating the return key R provided on the input means 46 in this state, the number of pulses counted during the descent can be stored in the descent stroke storage means 43A.

The number of pulses stored in the descending stroke storage means 43A can be displayed on the display 47. Further, the descending stroke stored in the descending stroke storage means 43A can be corrected to an arbitrary value by inputting a numerical value corresponding to the number of pulses from the input means 46. Therefore, the IC test is performed with the descending stroke set once, and when the defect occurrence rate is high, the number of pulses stored in the descending stroke storage means 43A is changed by inputting a numerical value from the input means 46. By doing so, it is possible to change the Z-axis stroke equivalent to replacing the shim 14. At this time, shim 1
In the case where adjustment is performed using the number 4, the shim 14 is replaced with a value of 0.
Although the pressure contact stroke is adjusted at a pitch of 05 mm, in the case of a pulse control type motor, there is an advantage that a descending stroke can be set at a fine pitch of about 0.01 mm per pulse.

[0015]

As described above, according to the present invention, the descending amount of the vacuum suction head 10 can be set by the number of pulses applied to the Z-axis drive motor 31. The moving amount of the Z-axis driving means can be set only by determining the lowering position of the vacuum suction head 10 and measuring the number of pulses for moving to the lowering position. Therefore, the movement amount of the Z axis can be easily set.

When the vacuum suction head 10 is lowered, the Z-axis drive motor 31 maintains the stopped state, so that the pressure applied to the test IC socket 12 is maintained at a constant value. Therefore, the IC under test 11 can be brought into contact with the test IC socket 12 with a constant pressing force. Also,
If you start the test and find that the defect rate is high,
Conventionally, the pressing force was adjusted by changing the thickness of the shim 14 shown in FIG. 3, but according to the present invention, it is not necessary to replace the shim 14 and the number of drive pulses for defining the lowering position of the vacuum suction head 10 is reduced. Adjustment may be performed, and an advantage that fine adjustment of the pressing force can be easily performed can be obtained.

[Brief description of the drawings]

FIG. 1 is a side view for explaining an embodiment of the present invention.

FIG. 2 is a block diagram for explaining a configuration of an electric control circuit used in the embodiment shown in FIG.

FIG. 3 is a side view for explaining a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Vacuum suction head 11 IC under test 12 Test IC socket 13 Butt block 14 Shim 15A Guide pin 15B Guide hole 16 Supporter 20 Horizontal transfer means 30 Z-axis drive means 31 Z-axis drive motor

Claims (1)

[Claims] 1. A. First Embodiment B. a vacuum suction head for sucking and supporting the IC under test; X-moving the vacuum suction head in the XY directions
Y transport means; Z-axis driving means for bringing the IC under test sucked by the vacuum suction head into contact with the test IC socket while the vacuum suction head is transported to the upper position of the test IC socket. In an IC test apparatus: An IC test apparatus, wherein the Z-axis driving means is constituted by a pulse-driven motor driven by a pulse, and the stroke in the Z-axis direction is defined by the number of pulses applied to the pulse-driven motor.