JPH10190400A - Piezoelectric resonance component and manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stable vibration space and an excellent sealing property and to prevent the characteristic degradation of a piezoelectric resonator due to the exudation of a resin layer. SOLUTION: In the case of manufacturing this piezoelectric resonance component constituted by holding the piezoelectric resonator 1 for which a vibration electrode 2 for vibration excitation and a pull-out electrode 3 are installed on two main surfaces by at least two sealing plates 4 for protecting the main surfaces of the piezoelectric resonator 1 and laminating them by the method, the resin layer 5 whose main component is thermosetting resin for which a glass transition temperature after setting is higher than 100 deg.C is formed by printing so as to form the vibration space in an area near the vibration electrode on the surface in contact with the piezoelectric resonator 1 of the sealing plate 4 first. Then, the resin layer 5 is turned to a semi-set state. Thereafter, the piezoelectric resonator 1 is held by the sealing plates 4 so as to make the vibration space formation surface of the sealing plate 4 where the resin layer 5 in a semi-set state is formed and the vibration electrode 2 of the piezoelectric resonator 1 face each other. Then, the resin layer 5 in the semi-set state is truly set.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric resonance component in which a piezoelectric resonator is laminated together with a sealing plate, and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventionally known piezoelectric resonance component has a specific pattern of electrodes and a lead electrode formed on two main surfaces of a piezoelectric resonator as disclosed in Japanese Patent Application Laid-Open No. 2-309707. Are laminated between two sealing plates having a concave portion on the side facing the piezoelectric resonator, and external electrodes are formed on the fine surface of the laminated body. . FIG. 17 shows a structural example of such a piezoelectric resonance component.

FIG. 17 is an exploded perspective view of a piezoelectric resonator and a sealing plate before lamination. In the figure, 21 is a piezoelectric resonator, 2
In Nos. 2 and 23, a vibrating electrode and a lead electrode formed on the main surface thereof are provided. Reference numeral 24 denotes a sealing plate, which has a concave portion formed on the side facing the piezoelectric resonator 21, and a resin layer 25 is applied around the concave portion to form a piezoelectric resonator 2.
Adhere to 1.

FIG. 18A shows a state in which a piezoelectric resonator 21 is laminated between two sealing plates 24 to form external electrodes. FIG. 18B is a partial cross-sectional view taken along the line AA in FIG. As described above, a space is secured by the concave portion of the sealing plate 24 and the resin layer 25 so as not to hinder the vibration by the vibration electrode 22 on the piezoelectric resonator 21.

[0005]

However, in the conventional piezoelectric resonance component, the sealing plate 24 and the piezoelectric resonator 21 are formed of the resin layer 2.
5, the temperature change in the actual use environment (-4
(0 ° C. to 85 ° C.), the adhesiveness between the sealing plate 24 and the piezoelectric resonator 21 is reduced, and the sealing property of the vibration space is reduced.

Further, when heat or pressure is applied in the main curing step, the resin layer 25 flows during the curing process, and the resin layer exudes to the vibrating electrode side of the piezoelectric resonator, hinders vibration and prevents the piezoelectric resonator from vibrating. There is also a disadvantage of deteriorating characteristics.

In view of the above-mentioned problems of the conventional method, the present invention can provide a stable vibration space and a good sealing property, and can prevent the deterioration of the characteristics of the piezoelectric resonator due to the exudation of the resin layer. It is an object of the present invention to provide a piezoelectric resonance component and a method for manufacturing the same.

[0008]

According to the present invention, there is provided a piezoelectric resonator in which a vibration electrode for vibration excitation and a lead electrode are provided on two main surfaces, at least for protecting the main surface of the piezoelectric resonator. In a piezoelectric resonance component formed by sandwiching and laminating two sealing plates, a thermosetting resin having a glass transition temperature of 100 ° C. or higher is mainly contained between the sealing plate and the piezoelectric resonator. A piezoelectric resonance component is characterized in that a vibration space is formed in a region near the vibration electrode by interposing a resin layer.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS.

(Embodiment 1) A first embodiment of the piezoelectric resonance component of the present invention will be described with reference to FIGS. In the figure, 1 is a piezoelectric resonator, 2 is a vibration electrode, 3
Is a lead electrode, 4 is a sealing plate, 5 is a resin layer forming a vibration space of the piezoelectric resonator 1, and 6 is an external electrode.

FIG. 1 is a cutaway perspective view of a piezoelectric resonance component according to the first and second aspects of the present invention. FIG. 2 (a)
FIG. 2B is a perspective view of the piezoelectric resonance component, and FIG.
It is a fragmentary sectional view in the AA plane of (a). The piezoelectric resonator is made of, for example, a piezoelectric ceramic material such as PZT, and the vibration electrode 2 and the extraction electrode 3 are formed by a dry film forming method such as a sputtering method. When a voltage is applied to the vibration electrode 2 from the outside, a vibration mode in which only the vicinity of the vibration electrode 2 vibrates is excited. A resin layer 5 is provided between the piezoelectric resonator 1 and the sealing plate 4.
Are provided, and a vibration space is formed so as not to hinder the vibration of the piezoelectric resonator 1. The sealing plate 4 is made of a material such as alumina, dielectric ceramic or resin. The resin layer 5 has, as a main component, a thermosetting resin such as epoxy having a glass transition temperature of 100 ° C. or higher. However, if necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component, but the amount and type of addition thereof are such that the glass transition temperature of the resin mixture is 100 ° C.
It is adjusted so as to be as described above. The glass transition temperature of the thermosetting resin constituting the resin layer 5 is determined by using a thermal analysis method such as a TMA method. Leader electrode 3
Are electrically connected to the external electrode 6 at two end portions indicated by B in FIG. 2B. The external electrode 6
It is formed by a wet film forming method such as a plating method or a dry film forming method such as a sputtering method. According to the present invention, the temperature change (−40 ° C. to 85 ° C.)
C), it is possible to prevent a decrease in the adhesiveness between the sealing plate 4 and the piezoelectric resonator 1 and to obtain a sufficient sealing property of the vibration space.
When the thickness of the resin layer 5 is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to an external electrode is reduced. still,
In the first embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 2) Next, a second embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 1 is a piezoelectric resonator, 2 is a vibration electrode, 3 is a lead electrode, 4 is a sealing plate, and 5 is a piezoelectric resonator 1.
This is a resin layer that forms the vibration space. First, FIG.
As shown in (1), a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT. Next, as shown in FIG. 3B, screen printing is performed on the surface of the sealing plate 4 made of a material such as alumina, dielectric ceramic, or resin, except for the region near the vibration electrode of the piezoelectric resonator. Is printed to form a resin layer 5. This resin uses a thermosetting resin whose main component has a glass transition temperature of 100 ° C. or higher after curing.
The glass transition temperature was determined by TMA after the resin was cured. Next, the sealing plate 4 on which the resin layer 5 is formed is heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less. Next, as shown in FIG. 3 (c), the piezoelectric resonator is placed on the sealing plate on which the resin layer 5 is formed, and the other sealing plate is placed and clamped from above. The resin is heated at 150 ° C. for 1 hour under a pressure of 10 kg / cm ² to fully cure and integrate the resin. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the second embodiment, since the sealing plate and the piezoelectric resonator are bonded by a resin having a glass transition temperature of 100 ° C. or higher, a temperature change in an actual use environment (−40). ° C
(85 ° C. to 85 ° C.), it is possible to prevent a decrease in the adhesiveness between the sealing plate 4 and the piezoelectric resonator 1 and to obtain a sufficient sealing property of the vibration space. When the thickness of the resin layer is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to an external electrode is reduced, so that the thickness is preferably 10 μm or more and 100 μm or less.
In the first embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 3) Next, a third embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 1 is a piezoelectric resonator, 2 is a vibration electrode, 3 is a lead electrode, 4 is a sealing plate, and 5 is a piezoelectric resonator 1.
This is a resin layer that forms the vibration space. First, FIG.
As shown in (1), a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT. Next, as shown in FIG. 4B, a resin is printed by screen printing on one main surface of the piezoelectric resonator except for a region near the vibrating electrode to form a resin layer 5. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, a resin is printed on the remaining main surface of the piezoelectric resonator by screen printing except for a region near the vibrating electrode to form a resin layer 5. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. As this resin, a resin mainly composed of a thermosetting resin having a glass transition temperature of 100 ° C. or more after curing is used. Incidentally, the glass transition temperature, after curing the resin,
It was determined by the TMA method. Next, the piezoelectric resonator on which the resin layer 5 is formed is heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. Crosslink density is 6
0% or less is desirable. Next, as shown in FIG.
A sealing plate is placed and sandwiched on both sides of the piezoelectric resonator on which the resin layer is formed, and heated at 150 ° C. for 1 hour under a pressure of 1 to 10 kg / cm ² to fully cure and integrate the resin. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method of manufacturing the piezoelectric resonance component according to the third embodiment, since the sealing plate and the piezoelectric resonator are bonded by a resin having a glass transition temperature of 100 ° C. or higher, the temperature change in the actual use environment (−40). (85 ° C. to 85 ° C.), the adhesion between the sealing plate 4 and the piezoelectric resonator 1 is prevented from deteriorating, and sufficient sealing of the vibration space can be obtained. When the thickness of the resin layer 5 is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to the external electrode is reduced.
m or more and 100 μm or less is desirable. In the first embodiment, a case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 4) Next, a third embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 1 is a piezoelectric resonator, 2 is a vibration electrode, 3 is a lead electrode, 4 is a sealing plate, and 5 is a piezoelectric resonator 1.
This is a resin layer that forms the vibration space. First, FIG.
As shown in (1), a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT. Next, as shown in FIG. 5B, a resin is printed by screen printing on one main surface of the piezoelectric resonator except for a region near the vibrating electrode to form a resin layer 5. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, as shown in FIG. 5C, a resin is printed by screen printing on one surface of the sealing plate except for a region near the vibrating electrode to form a resin layer 5. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. As this resin, a resin mainly composed of a thermosetting resin having a glass transition temperature of 100 ° C. or more after curing is used. The glass transition temperature was determined by TMA after the resin was cured.
Next, the piezoelectric resonator on which the resin layer is formed and the sealing plate are heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less. next,
As shown in FIG. 5D, the piezoelectric resonator is placed on the sealing plate on which the resin layer 5 is formed, with the surface on which the resin layer 5 is formed facing up, and the other sealing plate 4 Place and pinch,
The resin is heated at 150 ° C. for 1 hour under a pressure of 1 to 10 kg / cm ^{2 to} fully cure and integrate the resin. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the fourth embodiment, since the sealing plate 4 and the piezoelectric resonator 1 are bonded with a resin having a glass transition temperature of 100 ° C. or higher, the temperature change in the actual use environment ( Even at −40 ° C. to 85 ° C.), it is possible to prevent the adhesion between the sealing plate 4 and the piezoelectric resonator 1 from deteriorating, and to obtain a sufficient sealing property of the vibration space. The thickness of the resin layer 5 is 1
When the thickness is less than 0 μm, the sealing property is reduced. When the thickness is 100 μm or more, the adhesion to an external electrode is reduced.
It is desirably 00 μm or less. In the first embodiment, 1
Although the case where one piezoelectric resonator is sandwiched between two sealing plates has been described, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 5) Next, a fifth embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 1 is a piezoelectric resonator, 2 is a vibration electrode, 3 is an extraction electrode, 4 is a sealing plate, and 7 is a piezoelectric resonator 1.
This is a resin film layer in which a vibration space is formed. First, as shown in FIG. 6A, a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT by a dry film forming method such as a sputtering method. Next, as shown in FIG. 6B, the surface of the sealing plate 4 made of a material such as alumina, dielectric ceramic, or resin is set on the surface of the sealing plate 4 except for the region near the vibration electrode of the piezoelectric resonator. Alternatively, a resin film layer 7 is formed by laminating a semi-cured resin film. This resin film has a glass transition temperature of 1 after curing.
The main component having a temperature of 00 ° C. or higher is made of a thermosetting resin. The glass transition temperature is determined by TM after curing the resin.
It was determined by Method A. Lamination conditions are determined by the softening temperature of the resin. Softening temperature and softening temperature +3
It is desirable to laminate at a temperature in the range of 0 ° C. and a pressure of 1-5 kg / cm ² . Next, as shown in FIG.
The piezoelectric resonator is placed on the sealing plate on which the resin film layer 7 is formed, and the other sealing plate 4 is placed on top of the piezoelectric resonator and sandwiched between the piezoelectric resonator and 150 ° C. under a pressure of 1 to 10 kg / cm ^2. Heat for 1 hour to fully cure and integrate the resin film. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And deposit the solder,
Form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the fifth embodiment, the sealing plate and the piezoelectric resonator are bonded by a resin film having a glass transition temperature of 100 ° C. or higher. 40 to 85
C), it is possible to prevent a decrease in the adhesiveness between the sealing plate 4 and the piezoelectric resonator 1 and to obtain a sufficient sealing property of the vibration space.
If the thickness of the resin film is less than 10 μm, the sealing property is reduced, and if it is 100 μm or more, the adhesion to an external electrode is reduced, so that the thickness is preferably 10 μm or more and 100 μm or less.
In the first embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 6) Next, a sixth embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 1 is a piezoelectric resonator, 2 is a vibration electrode, 3 is an extraction electrode, 4 is a sealing plate, and 7 is a piezoelectric resonator 1.
This is a resin film layer in which a vibration space is formed. First, as shown in FIG. 7A, a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT. Next, as shown in FIG. 7B, a resin film layer 7 is formed by laminating an uncured or semi-cured resin film on one main surface of the piezoelectric resonator except for a region near the vibrating electrode. Next, an uncured or semi-cured resin film is laminated on the remaining main surface of the piezoelectric resonator except for a region near the vibration electrode to form a resin film layer. The main component of this resin film having a glass transition temperature of 100 ° C. or higher after curing is made of a thermosetting resin. The glass transition temperature is determined by T
It was determined by the MA method. Lamination conditions are determined by the softening temperature of the resin. Softening temperature and softening temperature +
It is desirable to laminate at a temperature in the range of 30 ° C. and a pressure of 1-5 kg / cm ² . Next, as shown in FIG. 7C, a sealing plate is placed and sandwiched on both surfaces of the piezoelectric resonator on which the resin film layer 7 is formed, and under pressure of 1 to 10 kg / cm ² ,
The resin film is heated at 150 ° C. for 1 hour to fully cure and integrate. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the sixth embodiment, since the sealing plate and the piezoelectric resonator are bonded by a resin film having a glass transition temperature of 100 ° C. or higher, a temperature change in an actual use environment (− Even at 40 ° C. to 85 ° C.), it is possible to prevent a decrease in the adhesiveness between the sealing plate 4 and the piezoelectric resonator 1 and to obtain a sufficient sealing property of the vibration space. When the thickness of the resin film is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to the external electrode is reduced.
The following is desirable. In the first embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 7) Next, a seventh embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 1 is a piezoelectric resonator, 2 is a vibration electrode, 3 is an extraction electrode, 4 is a sealing plate, and 7 is a piezoelectric resonator 1.
This is a resin film layer in which a vibration space is formed. First, as shown in FIG. 8A, a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT. Next, as shown in FIG. 8B, a resin film layer is formed by laminating an uncured or semi-cured resin film on one main surface of the piezoelectric resonator except for a region near the vibrating electrode. Next, as shown in FIG. 8C, a resin film layer 7 is formed by laminating an uncured or semi-cured resin film on one surface of the sealing plate except for a region near the vibrating electrode. The main component of this resin film having a glass transition temperature of 100 ° C. or higher after curing is made of a thermosetting resin. The glass transition temperature was determined by TMA after the resin was cured. Lamination conditions are determined by the softening temperature of the resin. It is desirable to laminate at a temperature in the range of softening temperature and softening temperature + 30 ° C. at a pressure of 1 to 5 kg / cm ² . Next, FIG.
As shown in (d), the piezoelectric resonator is placed on the sealing plate on which the resin film layer is formed, with the surface on which the resin film layer is formed facing up, and the other sealing plate is placed thereon. The resin is heated at 150 ° C. for 1 hour under a pressure of 1 to 10 kg / cm ² to fully cure and integrate the resin. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the seventh embodiment, the sealing plate and the piezoelectric resonator are bonded by a resin film having a glass transition temperature of 100 ° C. or higher.
Even in a temperature change (-40 ° C to 85 ° C) in the actual use environment, it is possible to prevent the adhesion between the sealing plate 4 and the piezoelectric resonator 1 from deteriorating, and to obtain a sufficient sealing property of the vibration space. If the thickness of the resin film is less than 10 μm, the sealing property is reduced, and
When the thickness is 0 μm or more, the adhesion to an external electrode is reduced. In the first embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Eighth Embodiment) An eighth embodiment of the piezoelectric resonance component of the present invention will be described with reference to FIGS. In the figure, 11 is a piezoelectric resonator, 12 is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, 15 is a resin layer forming a vibration space of the piezoelectric resonator 11, and 16 is an external electrode. FIG. 9 is a cutaway perspective view of the piezoelectric resonance component of the present invention. FIG. 10A is a perspective view of a piezoelectric resonance component,
FIG. 10B is a partial cross-sectional view taken along the plane AA of FIG. The piezoelectric resonator is made of, for example, a piezoelectric ceramic material such as PZT, and the vibration electrode 12 and the extraction electrode 13 are formed by a dry film forming method such as a sputtering method. When a voltage is externally applied to the vibration electrode 12, a vibration mode in which only the vicinity of the vibration electrode 12 vibrates is excited. Piezoelectric resonator 1
A resin layer 15 is provided between the piezoelectric resonator 11 and the sealing plate 14 to form a vibration space so as not to hinder the vibration of the piezoelectric resonator 11. The sealing plate 14 is made of a material such as alumina, dielectric ceramic, or resin. Resin layer 15
Is mainly composed of, for example, a thermosetting resin such as epoxy having a minimum melt viscosity of 20 Pa · s or more during heat curing. However, if necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component, but the amount and type of addition thereof are such that the minimum melt viscosity at the time of heat curing as a resin mixture becomes 20 Pa · s or more. It has been adjusted as follows. The minimum melt viscosity of the thermosetting resin constituting the resin layer 15 is determined using a rheometer. The extraction electrode 13 is electrically connected to the external electrode 16 at two end portions indicated by B in FIG. The external electrode 16 is formed by a wet film forming method such as a plating method or a dry film forming method such as a sputtering method. According to the present invention, the resin layer 15 flows during the curing process due to the application of heat or pressure in the main curing step due to the above-described configuration, and the resin layer exudes to the vibration electrode side of the piezoelectric resonator to prevent vibration. The problem of deteriorating the characteristics of the piezoelectric resonator can be solved, and highly reliable and stable characteristics can be obtained.
When the thickness of the resin layer is less than 10 μm, the sealing property is reduced,
When the thickness is 100 μm or more, the adhesion to an external electrode is reduced, so that the thickness is preferably 10 μm or more and 100 μm or less. In the eighth embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 9) Next, a ninth embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 11 is a piezoelectric resonator, 12 is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, and 15 is a resin layer forming a vibration space of the piezoelectric resonator 11. First, as shown in FIG. 11A, a vibrating electrode 12 and a lead electrode 13 are formed of chromium and nickel on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT by a dry film forming method such as a sputtering method. Next, FIG.
As shown in (b), a resin is printed by screen printing on the surface of a sealing plate 14 made of a material such as alumina, dielectric ceramic, or resin, except for a region near a vibrating electrode of a piezoelectric resonator. The layer 15 is formed. As this resin, a resin mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing is used. The minimum melt viscosity of the thermosetting resin was determined using a rheometer. Next, the sealing plate on which the resin layer is formed is heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less. next,
As shown in FIG. 11 (c), a piezoelectric resonator is placed on a sealing plate on which a resin layer is formed, and the other sealing plate is placed on top of the piezoelectric resonator, and is sandwiched between 1 and 10 kg / cm ^2. 150 ° C under pressure
Heat for 1 hour to fully cure and integrate the resin. When the pressure during the main curing is higher than 10 kg / cm ² , the resin layer exudes to the vibrating electrode side of the piezoelectric resonator, hinders the vibration and deteriorates the characteristics of the piezoelectric resonator. It is necessary to use a resin in which the lower limit of is higher. Next, chromium and nickel are formed by a dry film forming method such as a sputtering method on the exposed end by exposing a part of the extraction electrode by cutting the end with a dicing device, and further thereon,
Nickel and solder are deposited by an electrolytic plating method to form external electrodes. In the method of manufacturing the piezoelectric resonance component according to the ninth embodiment, with the above-described configuration, heat and pressure are applied in the main curing step, so that the resin layer 15 flows in the curing process, and the vibration electrode of the piezoelectric resonator This solves the problem that the resin layer oozes out to the side and hinders the vibration to degrade the characteristics of the piezoelectric resonator, so that highly reliable and stable characteristics can be obtained. When the thickness of the resin layer is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to an external electrode is reduced, so that the thickness is preferably 10 μm or more and 100 μm or less. In the ninth embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

Embodiment 10 Next, a tenth embodiment relating to a method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG.
This will be described with reference to FIG. In the figure, reference numeral 11 denotes a piezoelectric resonator, 1
2 is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, 1
Reference numeral 5 denotes a resin layer forming a vibration space of the piezoelectric resonator 11. First, as shown in FIG. 12A, a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT. Next, FIG.
As shown in FIG. 2B, a resin is printed on one main surface of the piezoelectric resonator by screen printing except for a region near the vibrating electrode to form a resin layer 15. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, a resin is printed on the remaining main surface of the piezoelectric resonator by screen printing except for a region near the vibrating electrode to form a resin layer 15. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. As this resin, a resin mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing is used. The minimum melt viscosity of the thermosetting resin was determined using a rheometer. Next, the piezoelectric resonator on which the resin layer is formed is heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less. next,
As shown in FIG. 12C, a sealing plate is placed and sandwiched on both surfaces of the piezoelectric resonator on which the resin layer is formed, and the sealing plate is placed at 1 to 10 kg / cm ^2.
The resin is heated at 150 ° C. for 1 hour under the pressure described above to fully cure and integrate the resin. When the pressure during the main curing is higher than 10 kg / cm ² , the resin layer exudes to the vibrating electrode side of the piezoelectric resonator, hinders the vibration and deteriorates the characteristics of the piezoelectric resonator. It is necessary to use a resin in which the lower limit of is higher. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the tenth embodiment, due to the above-described configuration, heat and pressure are applied in the main curing step, so that the resin layer 15 flows during the curing process, and the vibration electrode of the piezoelectric resonator. This solves the problem that the resin layer oozes out to the side and hinders the vibration to degrade the characteristics of the piezoelectric resonator, so that highly reliable and stable characteristics can be obtained. The thickness of the resin layer is
When the thickness is less than 10 μm, the sealing property is reduced. When the thickness is 100 μm or more, the adhesion to an external electrode is reduced. In the tenth embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 11) Next, an eleventh embodiment of a method for manufacturing a piezoelectric resonance component according to the present invention will be described with reference to FIG.
This will be described with reference to FIG. In the figure, reference numeral 11 denotes a piezoelectric resonator, 1
2 is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, 1
Reference numeral 5 denotes a resin layer forming a vibration space of the piezoelectric resonator 11. First, as shown in FIG. 13A, a vibrating electrode 2 and a lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method on a piezoelectric resonator made of a piezoelectric ceramic material such as PZT. Next, FIG.
As shown in FIG. 2B, a resin is printed on one main surface of the piezoelectric resonator by screen printing except for a region near the vibrating electrode to form a resin layer 15. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, as shown in FIG. 13C, a resin is printed on one surface of the sealing plate by screen printing except for a region near the vibrating electrode to form a resin layer 15. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. As this resin, a resin mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing is used. The minimum melt viscosity of the thermosetting resin was determined using a rheometer. Next, the piezoelectric resonator on which the resin layer is formed and the sealing plate are heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less. Next, as shown in FIG. 13D, a piezoelectric resonator is placed on the sealing plate on which the resin layer is formed, with the surface on which the resin layer is formed facing up, and the other sealing plate is placed on the piezoelectric resonator. Is placed and clamped, under a pressure of 1 to 10 kg / cm ² ,
The resin is heated at 150 ° C. for 1 hour to fully cure and integrate the resin.
When the pressure during the main curing is higher than 10 kg / cm ² , the resin layer exudes to the vibrating electrode side of the piezoelectric resonator, hinders the vibration and deteriorates the characteristics of the piezoelectric resonator. It is necessary to use a resin in which the lower limit of is higher. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the eleventh embodiment,
When heat or pressure is applied in the main curing step, the resin layer 15 flows in the curing process, and the resin layer exudes to the vibration electrode side of the piezoelectric resonator, hinders vibration and deteriorates the characteristics of the piezoelectric resonator. It is possible to solve the problem and obtain highly reliable and stable characteristics. When the thickness of the resin layer is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to an external electrode is reduced, so that the thickness is preferably 10 μm or more and 100 μm or less. In the eleventh embodiment, a case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Twelfth Embodiment) Next, a twelfth embodiment relating to a method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG.
This will be described with reference to FIG. In the figure, reference numeral 11 denotes a piezoelectric resonator, 1
2 is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, 1
Reference numeral 7 denotes a resin film layer that forms a vibration space of the piezoelectric resonator 11. First, for example, as shown in FIG.
On the piezoelectric resonator made of a piezoelectric ceramic material such as ZT, the vibrating electrode 12 and the lead electrode 13 are formed of chromium and nickel by a dry film forming method such as a sputtering method. Next, as shown in FIG. 14B, the surface of the sealing plate 14 made of a material such as alumina, dielectric ceramic, or resin is uncured or hardened except for a region near the vibration electrode of the piezoelectric resonator. A resin film layer 17 is formed by laminating a semi-cured resin film. This resin film is
A resin mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing is used. The minimum melt viscosity of the thermosetting resin was determined using a rheometer. Lamination conditions are determined by the softening temperature of the resin. Softening temperature and softening temperature 1 to 5 at a temperature in the range of + 30 ° C
It is desirable to laminate at a pressure of kg / cm ² . Next, as shown in FIG. 14 (c), the piezoelectric resonator is placed on the sealing plate on which the resin film layer is formed, and the other sealing plate is placed and clamped from above. The resin is heated at 150 ° C. for 1 hour under a pressure of 10 kg / cm ² to fully cure and integrate the resin. When the pressure during the main curing is higher than 10 kg / cm ² , the resin layer exudes to the vibrating electrode side of the piezoelectric resonator, hinders the vibration and deteriorates the characteristics of the piezoelectric resonator. It is necessary to use a resin in which the lower limit of is higher. Next, chromium and nickel are formed by a dry film forming method such as a sputtering method on the exposed end by exposing a part of the extraction electrode by cutting the end with a dicing device,
Further, nickel and solder are deposited thereon by electrolytic plating to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the twelfth embodiment, the resin layer 15 flows during the curing process by applying heat or pressure in the main curing step due to the above-described configuration, and the vibration electrode of the piezoelectric resonator is formed. This solves the problem that the resin layer oozes out to the side and hinders the vibration to degrade the characteristics of the piezoelectric resonator, so that highly reliable and stable characteristics can be obtained. When the thickness of the resin film is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to an external electrode is reduced.
The thickness is preferably 100 μm or more and 100 μm or less. In addition, Embodiment 12
In the above, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Thirteenth Embodiment) Next, a thirteenth embodiment relating to a method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG.
This will be described with reference to FIG. In the figure, reference numeral 11 denotes a piezoelectric resonator, 1
2 is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, 1
Reference numeral 7 denotes a resin film layer that forms a vibration space of the piezoelectric resonator 11. First, for example, as shown in FIG.
On the piezoelectric resonator made of a piezoelectric ceramic material such as ZT, the vibrating electrode 12 and the lead electrode 13 are formed of chromium and nickel by a dry film forming method such as a sputtering method. Next, as shown in FIG. 15B, an uncured or semi-cured resin film is laminated on one main surface of the piezoelectric resonator except for a region in the vicinity of the vibrating electrode to form a resin film layer 17. Next, a resin film layer 17 is formed by laminating an uncured or semi-cured resin film on the remaining main surface of the piezoelectric resonator except for a region near the vibrating electrode. As the resin film, a resin mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing is used. The minimum melt viscosity of the thermosetting resin was determined using a rheometer. Lamination conditions are determined by the softening temperature of the resin. 1 at softening temperature and softening temperature + 30 ° C
It is desirable to laminate at a pressure of ５5 kg / cm ² .
Next, as shown in FIG. 15C, a sealing plate is placed and sandwiched on both sides of the piezoelectric resonator on which the resin film layer is formed,
The resin film is heated at 150 ° C. for 1 hour under a pressure of 1 to 10 kg / cm ^{2 to} fully cure and integrate the resin film. When the pressure during the main curing is higher than 10 kg / cm ² , the resin layer exudes to the vibrating electrode side of the piezoelectric resonator, hinders the vibration and deteriorates the characteristics of the piezoelectric resonator. It is necessary to use a resin in which the lower limit of is higher. Next, the end is cut by a dicing device to expose a part of the extraction electrode, and chromium and nickel are formed on the exposed end by a dry film forming method such as a sputtering method. And solder are deposited to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the thirteenth embodiment, due to the above-described configuration, heat and pressure are applied in the main curing step, so that the resin layer 15 flows during the curing process, and the vibration electrode of the piezoelectric resonator. This solves the problem that the resin layer oozes out to the side and hinders the vibration to degrade the characteristics of the piezoelectric resonator, so that highly reliable and stable characteristics can be obtained. If the thickness of the resin film is less than 10 μm, the sealing property is reduced, and if it is 100 μm or more, the adhesion to an external electrode is reduced, so that the thickness is preferably 10 μm or more and 100 μm or less. In the thirteenth embodiment, a case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 14) Next, a seventh embodiment relating to a method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, reference numeral 11 denotes a piezoelectric resonator;
Is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, 17
Is a resin film layer forming a vibration space of the piezoelectric resonator 11. First, as shown in FIG.
On the piezoelectric resonator made of a piezoelectric ceramic material such as T, the vibrating electrode 2 and the lead electrode 3 are formed of chromium and nickel by a dry film forming method such as a sputtering method. Next, as shown in FIG. 16B, an uncured or semi-cured resin film is laminated on one main surface of the piezoelectric resonator except for a region near the vibrating electrode to form a resin film layer 17.
Next, as shown in FIG. 16C, a resin film layer 17 is formed by laminating an uncured or semi-cured resin film on one surface of the sealing plate except for a region near the vibrating electrode. This resin film has a minimum melt viscosity of 20 Pa when cured by heating.
Use a resin mainly composed of a thermosetting resin of s or more.
The minimum melt viscosity of the thermosetting resin was determined using a rheometer. Lamination conditions are determined by the softening temperature of the resin. It is desirable to laminate at a temperature in the range of softening temperature and softening temperature + 30 ° C. at a pressure of 1 to 5 kg / cm ² . Next, as shown in FIG. 16 (d), the piezoelectric resonator is placed on the sealing plate on which the resin film layer is formed with the surface on which the resin film layer is formed facing up, and the other sealing is performed from above. The stopper plate is placed and sandwiched, and heated at 150 ° C. for 1 hour under a pressure of 1 to 10 kg / cm ² to fully cure the resin and integrate it. When the pressure during the main curing is higher than 10 kg / cm ² , the resin layer exudes to the vibrating electrode side of the piezoelectric resonator, hinders the vibration and deteriorates the characteristics of the piezoelectric resonator. It is necessary to use a resin in which the lower limit of is higher. Next, chromium and nickel are formed by a dry film forming method such as a sputtering method on the exposed end by exposing a part of the extraction electrode by cutting the end with a dicing device,
Further, nickel and solder are deposited thereon by electrolytic plating to form external electrodes. In the method for manufacturing a piezoelectric resonance component according to the fourteenth embodiment, with the above-described configuration, heat and pressure are applied in the main curing step, so that the resin layer 15 flows during the curing process, and the vibration electrode of the piezoelectric resonator. This solves the problem that the resin layer oozes out to the side and hinders the vibration to degrade the characteristics of the piezoelectric resonator, so that highly reliable and stable characteristics can be obtained. When the thickness of the resin film is less than 10 μm, the sealing property is reduced, and when the thickness is 100 μm or more, the adhesion to an external electrode is reduced.
It is desirable that the thickness be not less than 100 μm. In addition, Embodiment 14
In the above, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

Incidentally, in order to confirm the effects of the embodiment of the present invention described above, the sealing performance was tested for those made with various glass transition temperatures, and the results shown in Table 1 were obtained.

[0026]

[Table 1]

As is clear from Table 1, the case where the glass transition temperature is 100 ° C. or higher has high sealing performance.

The leaching coefficients of the samples prepared with different minimum melt viscosities were measured, and the results shown in Table 2 were obtained.

[0029]

[Table 2]

As is clear from Table 2, when the minimum melt viscosity is 20 or more, the leaching coefficient shows a good result. The leaching coefficient is the leaching coefficient =
It is expressed by (leaching width) / (resin thickness), and the leaching width and the resin thickness are amounts defined under conditions as shown in FIG.

[0031]

As described above, according to the present invention, since the sealing plate and the piezoelectric resonator are bonded by a resin or a resin film having a glass transition temperature of 100 ° C. or more, the temperature change in the actual use environment ( Even at −40 ° C. to 85 ° C.), it is possible to prevent the adhesion between the sealing plate 4 and the piezoelectric resonator 1 from deteriorating, and to obtain a sufficient sealing property of the vibration space.

The minimum melt viscosity during heat curing is 20P.
Since the sealing plate and the piezoelectric resonator are bonded by a resin or a resin film of at least a · s, the resin layer 15 flows in the curing process by applying heat or pressure in the main curing step, and the piezoelectric resonator This solves the problem that the resin layer exudes to the vibrating electrode side and hinders the vibration to degrade the characteristics of the piezoelectric resonator, so that highly reliable and stable characteristics can be obtained.

[Brief description of the drawings]

FIG. 1 is a cutaway perspective view of a piezoelectric resonance component according to a first embodiment of the present invention.

FIG. 2A is a perspective view of a piezoelectric resonance component according to the first embodiment, and FIG. 2B is a partial cross-sectional view taken along a line AA in FIG.

FIG. 3 is an exploded perspective view of a piezoelectric resonance component according to a second embodiment of the present invention before lamination.

FIG. 4 is an exploded perspective view of a piezoelectric resonance component according to a third embodiment of the present invention before lamination.

FIG. 5 is an exploded perspective view of a piezoelectric co-imaging component according to Embodiment 4 of the present invention before lamination.

FIG. 6 is an exploded perspective view of a piezoelectric resonance component according to a fifth embodiment of the present invention before lamination.

FIG. 7 is an exploded perspective view of a piezoelectric resonance component according to a sixth embodiment of the present invention before lamination.

FIG. 8 is an exploded perspective view of a piezoelectric co-imaging component according to Embodiment 7 of the present invention before lamination.

FIG. 9 is a cutaway perspective view of a piezoelectric resonance component according to an eighth embodiment of the present invention.

FIG. 10A is a perspective view of a piezoelectric resonance component according to the eighth embodiment, and FIG. 10B is a partial cross-sectional view taken along a line AA in FIG.

FIG. 11 is an exploded perspective view of a piezoelectric resonance component according to a ninth embodiment of the present invention before lamination.

FIG. 12 is an exploded perspective view of a piezoelectric resonance component according to Embodiment 10 of the present invention before lamination.

FIG. 13 is an exploded perspective view of a piezoelectric co-imaging component according to Embodiment 11 of the present invention before lamination.

FIG. 14 is an exploded perspective view of a piezoelectric resonance component according to a twelfth embodiment of the present invention before lamination.

FIG. 15 is an exploded perspective view of a piezoelectric resonance component according to a thirteenth embodiment of the present invention before lamination.

FIG. 16 is an exploded perspective view of a piezoelectric co-imaging component according to Embodiment 14 of the present invention before lamination.

FIG. 17 is an exploded perspective view of a conventional piezoelectric resonance component before lamination.

FIG. 18A is a perspective view of a conventional piezoelectric resonance component,
FIG. 18B is a partial cross-sectional view taken along the line AA in FIG.

FIG. 19 is a view showing a leaching coefficient used for confirming the effect of the minimum melt viscosity in the embodiment of the present invention (explanation of reference numerals) 1 piezoelectric resonator 2 vibrating electrode 3 lead electrode 4 sealing plate 5 resin layer Reference Signs List 6 external electrode 11 piezoelectric resonator 12 vibration electrode 13 extraction electrode 14 sealing plate 15 resin layer 16 external electrode 17 resin film layer 21 piezoelectric resonator 22 vibration electrode 23 extraction electrode 24 sealing plate 25 resin 26 external electrode

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Hiroyasu Ikeda 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (21)

[Claims] 1. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead electrode are provided on two main surfaces is sandwiched between at least two sealing plates for protecting the main surface of the piezoelectric resonator. In the piezoelectric resonance component formed by laminating the above, the glass transition temperature is 1 between the sealing plate and the piezoelectric resonator.
A piezoelectric resonance component, wherein a vibration space is formed in a region near the vibration electrode by interposing a resin layer mainly composed of a thermosetting resin having a temperature of 00 ° C. or higher. 2. The piezoelectric resonance component according to claim 1, wherein a thickness range of the resin layer is 10 μm or more and 100 μm or less. 3. A piezoelectric resonator in which a vibration electrode for vibration excitation and an extraction electrode are provided on two main surfaces is sandwiched between at least two sealing plates for protecting the main surface of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component formed by lamination, the glass transition temperature after curing is set such that a vibration space is formed in a region near the vibration electrode on a surface of the sealing plate that is in contact with the piezoelectric resonator. Forming a resin layer mainly composed of a thermosetting resin having a temperature of 100 ° C. or higher by printing;
The step of bringing the resin layer into a semi-cured state, and the vibration space forming surface of the pre-sealing sealing plate on which the resin layer in the semi-cured state is formed, and the vibration electrode of the piezoelectric resonator faces each other. A method of sandwiching the piezoelectric resonator with the sealing plate and a step of fully curing the semi-cured resin layer. 4. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead electrode are provided on two main surfaces is sandwiched between at least two sealing plates for protecting the main surface of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component formed by laminating the piezoelectric resonators, a glass transition temperature is formed on the main surface of the piezoelectric resonator except for a region near the vibration electrode so that a vibration space is formed in a region near the vibration electrode. Forming a resin layer mainly composed of a thermosetting resin having a temperature of 100 ° C. or higher, printing the resin layer in a semi-cured state, and forming the semi-cured resin layer on two main surfaces. A method for manufacturing a piezoelectric resonance component, comprising: a step of clamping the formed piezoelectric resonator with the sealing plate; and a step of fully curing the semi-cured resin layer. 5. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead-out electrode are provided on two main surfaces, and a first and a second two sealing members for protecting the main surfaces of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component formed by being sandwiched and laminated by a plate, a region near the vibrating electrode is removed on one main surface of the piezoelectric resonator so that a vibration space is formed in a region near the vibrating electrode. Forming a first resin layer mainly composed of a thermosetting resin having a glass transition temperature of 100 ° C. or more by printing, and a step of contacting the piezoelectric resonator of the first sealing plate with: Forming a second resin layer mainly composed of a thermosetting resin having a glass transition temperature of 100 ° C. or higher by printing so that a vibration space is formed in the vicinity of the vibration electrode; Bringing the second resin layer into a semi-cured state; The other main surface of the pendulum on which the first resin layer is not formed by printing faces the surface of the first sealing plate on which the second resin layer is formed by printing,
The piezoelectric resonator is sealed with the first and second sealing plates such that one main surface of the piezoelectric resonator on which the first resin layer is formed by printing is opposed to a second sealing plate. A method for manufacturing a piezoelectric resonance component, comprising: a step of clamping with a stop plate; and a step of fully curing the first and second resin layers in the semi-cured state. 6. The method according to claim 3, wherein a resin layer having a thickness range of 10 μm or more and 100 μm or less is formed by printing. 7. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead-out electrode are provided on two main surfaces is sandwiched and sandwiched by at least two sealing plates for protecting the main surface of the piezoelectric resonator. In the manufacturing method of the piezoelectric resonance component, the glass transition temperature after curing is set to 100 ° C. so that a vibration space is formed in a region near the vibration electrode on a surface of the sealing plate in contact with the piezoelectric resonator. A step of laminating an uncured or semi-cured resin film containing a thermosetting resin as a main component, the vibration space forming surface of a presealing sealing plate on which the resin film is laminated, and the piezoelectric resonator A step of sandwiching the piezoelectric resonator with the sealing plate so that the vibrating electrodes face each other, and a step of fully curing the resin film. 8. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead-out electrode are provided on two main surfaces is sandwiched and laminated with at least two sealing plates for protecting the main surface of the piezoelectric resonator. In the manufacturing method of the piezoelectric resonance component thus configured, the glass transition after curing, except for the region near the vibration electrode, is formed on the main surface of the piezoelectric resonator so that a vibration space is formed in the region near the vibration electrode. Laminating an uncured or semi-cured resin film mainly composed of a thermosetting resin having a temperature of 100 ° C. or higher, and sealing the piezoelectric resonator having the resin films laminated on two main surfaces. A method for manufacturing a piezoelectric resonance component, comprising: a step of clamping with a stop plate; and a step of fully curing the resin film. 9. A first and a second sealing of a piezoelectric resonator in which a vibration electrode for vibration excitation and a lead electrode are provided on two main surfaces thereof to protect the main surface of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component formed by being sandwiched and laminated by a plate, a region near the vibrating electrode is removed on one main surface of the piezoelectric resonator so that a vibration space is formed in a region near the vibrating electrode. Laminating an uncured or semi-cured first resin film mainly composed of a thermosetting resin having a glass transition temperature of 100 ° C. or more after curing, and a step of laminating the piezoelectric film of the first sealing plate. On the surface in contact with the resonator, an uncured or semi-cured second resin whose main component is a thermosetting resin having a glass transition temperature of 100 ° C. or higher after curing so that a vibration space is formed in the vicinity of the vibration electrode. 2 Laminating resin film And the other main surface of the piezoelectric resonator, on which the first resin film is not laminated, faces the surface of the first sealing plate, on which the second resin film is laminated, and The piezoelectric resonator is separated from the first and second sealing plates so that one main surface of the piezoelectric resonator on which the first resin film is laminated is opposed to a second sealing plate. A method for manufacturing a piezoelectric resonance component, comprising: a step of sandwiching; and a step of fully curing the first and second resin films. 10. The method according to claim 7, wherein a resin film having a thickness range of 10 μm or more and 100 μm or less is laminated. 11. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead electrode are provided on two main surfaces is sandwiched by at least two sealing plates for protecting the main surface of the piezoelectric resonator and laminated. In the piezoelectric resonance component thus configured, a resin layer mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing is interposed between the sealing plate and the piezoelectric resonator. A vibrating space is formed in a region near the vibrating electrode of the piezoelectric resonator. 12. The thickness range of the resin layer is 10 μm or more and 1
The piezoelectric resonance component according to claim 11, wherein the thickness is not more than 00 µm. 13. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead electrode are provided on two main surfaces is sandwiched and laminated with at least two sealing plates for protecting the main surface of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component configured as described above, the lowest melt viscosity during heat curing is 20 Pa so that a vibration space is formed in a region near the vibration electrode on a surface of the sealing plate in contact with the piezoelectric resonator. Forming a resin layer mainly composed of a thermosetting resin having a s or more by printing, a step of bringing the resin layer into a semi-cured state, and a pre-sealing in which the resin layer in the semi-cured state is formed A step of sandwiching the piezoelectric resonator with the sealing plate so that the vibration space forming surface of the stop plate and the vibration electrode of the piezoelectric resonator face each other,
A step of fully curing the semi-cured resin layer. 14. A piezoelectric resonator in which a vibration electrode for vibration excitation and an extraction electrode are provided on two main surfaces is sandwiched between at least two sealing plates for protecting the main surface of the piezoelectric resonator and laminated. In the manufacturing method of the piezoelectric resonance component configured as described above, except for the vibrating electrode vicinity region, a minimum at the time of heat curing is formed so that a vibration space is formed in the main surface of the piezoelectric resonator in the vibrating electrode vicinity region. A step of forming a resin layer mainly composed of a thermosetting resin having a melt viscosity of 20 Pa · s or more by printing, and a step of bringing the resin layer into a semi-cured state; A method for manufacturing a piezoelectric resonance component, comprising: a step of sandwiching the piezoelectric resonator on which a resin layer is formed by the sealing plate; and a step of fully curing the semi-cured resin layer. 15. A first and a second sealing of a piezoelectric resonator in which a vibration electrode for vibration excitation and a lead-out electrode are provided on two main surfaces thereof to protect the main surface of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component formed by being sandwiched and laminated by a plate, a region near the vibrating electrode is removed on one main surface of the piezoelectric resonator so that a vibration space is formed in a region near the vibrating electrode. The minimum melt viscosity during heat curing is 20 Pa
Forming a first resin layer mainly composed of a thermosetting resin of at least s by printing, and forming a first resin layer on a surface of the first sealing plate in contact with the piezoelectric resonator, in a region near the vibration electrode. Forming a second resin layer mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing by printing so that a vibration space is formed;
Bringing the second resin layer into a semi-cured state, and the other main surface of the piezoelectric resonator on which the first resin layer is not formed by printing and the second resin of the first sealing plate. The surface on which the layer is formed by printing is opposed, and one main surface of the piezoelectric resonator on which the first resin layer is formed by printing is opposed to the second sealing plate. A step of sandwiching the piezoelectric resonator between the first and second sealing plates, and a step of fully curing the first and second resin layers in the semi-cured state. A method for manufacturing a piezoelectric resonance component, comprising forming a component. 16. The resin layer has a thickness of 10 μm or more and 100 μm or more.
The method for manufacturing a piezoelectric resonance component according to claim 13, wherein the piezoelectric resonance component is formed by printing in a range of μm or less. 17. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead-out electrode are provided on two main surfaces is sandwiched and laminated by at least two sealing plates for protecting the main surface of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component configured as described above, the lowest melt viscosity during heat curing is 20 Pa so that a vibration space is formed in a region near the vibration electrode on a surface of the sealing plate in contact with the piezoelectric resonator. A step of laminating an uncured or semi-cured resin film mainly composed of a thermosetting resin that is at least s, the vibration space forming surface of the presealing sealing plate on which the resin film is laminated, and the piezoelectric element. Forming a piezoelectric resonance component having a laminated structure, comprising: a step of sandwiching the piezoelectric resonator with the sealing plate, and a step of fully curing the resin film so that the vibration electrode of the resonator faces the vibration electrode. To A method for manufacturing a piezoelectric resonance component. 18. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead-out electrode are provided on two main surfaces, and sandwiched by at least two sealing plates for protecting the main surface of the piezoelectric resonator and laminated. In the manufacturing method of the piezoelectric resonance component configured as described above, except for the vibrating electrode vicinity region, a minimum at the time of heat curing is formed so that a vibration space is formed in the main surface of the piezoelectric resonator in the vibrating electrode vicinity region. A step of laminating an uncured or semi-cured resin film mainly composed of a thermosetting resin having a melt viscosity of 20 Pa · s or more, and the piezoelectric resonator in which the resin films are laminated on two main surfaces. A method for manufacturing a piezoelectric resonance component, comprising: a step of sandwiching with a sealing plate; and a step of fully curing the resin film, wherein a piezoelectric resonance component having a laminated structure is formed. 19. A piezoelectric resonator in which a vibration electrode for vibration excitation and a lead-out electrode are provided on two main surfaces, and a first and a second two sealing members for protecting the main surfaces of the piezoelectric resonator. In the method for manufacturing a piezoelectric resonance component formed by being sandwiched and laminated by a plate, a region near the vibrating electrode is removed on one main surface of the piezoelectric resonator so that a vibration space is formed in a region near the vibrating electrode. The minimum melt viscosity during heat curing is 20 Pa
A step of laminating an uncured or semi-cured first resin film mainly containing a thermosetting resin that is not less than s, and a surface of the first sealing plate which is in contact with the piezoelectric resonator,
As a vibration space is formed in the vicinity of the vibration electrode,
An uncured or semi-cured second material mainly composed of a thermosetting resin having a minimum melt viscosity of 20 Pa · s or more during heat curing.
Laminating the resin film, and the other main surface of the piezoelectric resonator, on which the first resin film is not laminated, and the surface of the first sealing plate, on which the second resin film is laminated. Are opposed to each other, and the first and second sealing plates are opposed to each other so that one main surface of the piezoelectric resonator on which the first resin film is laminated is opposed to a second sealing plate. 2. A method for manufacturing a piezoelectric resonance component, comprising: a step of sandwiching the first and second resin films with a sealing plate; and a step of fully curing the first and second resin films to form a piezoelectric resonance component having a laminated structure. 20. The method according to claim 17, wherein a resin film having a thickness range of 10 μm or more and 100 μm or less is laminated. 21. The method according to claim 13, wherein the main curing is performed under a pressure of 10 kg / cm ² or less.
20. A method for manufacturing a piezoelectric resonance component according to claim 19.