JP5031486B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component in which an electronic component element such as a piezoelectric vibrator is mounted on a dielectric substrate and sealed with a case.

Conventionally, an electronic component in which an electronic component element is mounted on a dielectric substrate and sealed with a case has been used in various fields. For example, an electronic component using a piezoelectric vibration element as an electronic component element is used for a clock source of a microcomputer used in communication equipment and electronic equipment (see, for example, Patent Document 1). The electronic component described in Patent Document 1 has a structure in which a piezoelectric vibration element is mounted on a dielectric substrate and is housed in a case. The case and the dielectric substrate are bonded by an adhesive made of a resin material. The mounted piezoelectric vibration element is electrically connected to a conductor film formed from the upper surface to the side surface of the dielectric substrate, and functions as an element of an electric circuit of a circuit board on which electronic components are mounted.
JP 2003-224221 A

  However, in the adhesion between the case and the dielectric substrate, the adhesion force of the region located on the conductor film is different from that of the other region because the oxide film is formed on the surface of the conductor film mainly composed of metal. Therefore, there is a problem that water or the like easily enters between the case and the conductor film. A piezoelectric component with low airtightness tends to change the characteristics of the piezoelectric vibrator due to infiltrated water or the like, and shortens the life of communication equipment and electronic equipment using this.

  For this reason, the process which removes the substance which inhibits adhesion | attachment with respect to a conductor film, such as an oxide film, was needed, and the process required for manufacture of an electronic component was increased.

  The present invention has been devised in view of such problems in the prior art, and an object of the present invention is to provide an electronic component with high airtightness and reduced fluctuations in characteristics.

  The electronic component according to the present invention includes an electronic component element, a case in which a concave portion that opens to the lower side is provided and the electronic component element is housed in the concave portion, and an upper surface that joins the opening peripheral surface of the case, In an electronic component comprising a dielectric substrate in which a conductive film mainly composed of a metal electrically connected to the electronic component element is formed from the upper surface to the side surface, on the conductive film on the peripheral surface of the opening The width of the positioned region is larger than the width of the other region of the peripheral surface of the opening.

  In the electronic component of the present invention, in the above configuration, the lower side of the case has a quadrangular shape, and the conductive film on the opening peripheral surface of the opening peripheral surface along any one side of the lower side of the case The width of the region located above is larger than the width of the other region of the peripheral surface of the opening.

  The electronic component according to the present invention is characterized in that, in the above configuration, the case has an outer side surface in contact with the peripheral edge surface of the opening that is flush with the side surface of the dielectric substrate.

  According to the electronic component of the present invention, an electronic component element, a case in which a recess opening downward is provided and the electronic component element is accommodated in the recess, an upper surface is joined to the opening peripheral surface of the case, And a dielectric substrate having a metal film as a main component electrically connected to the component element formed from the upper surface to the side surface, and is located on the conductor film on the peripheral edge of the opening of the case Since the width of the region is larger than the width of the other region of the peripheral surface of the opening, water or the like hardly passes through between the case and the conductor film and enters the interior in which the electronic component element is stored. Therefore, it is possible to provide an electronic component that is highly airtight and has less variation in characteristics.

  Further, according to the electronic component of the present invention, the lower side of the case has a quadrangular shape, and the width of the region located on the conductor film on the opening peripheral surface is the opening peripheral surface along one side of the lower side of the case. The difference between the bonding strength of the region located on the conductor film on the opening peripheral surface of the case and the bonding strength of the other region on the opening peripheral surface of the case when the width is larger than the width of the other region of the opening peripheral surface. Therefore, even when pressure is applied from the outside, it is difficult for water or the like to enter the area located on the conductor film on the peripheral edge of the opening of the case. Sex can be made higher.

  Further, according to the electronic component of the present invention, when the outer side surface in contact with the peripheral surface of the opening is flush with the side surface of the dielectric substrate, the entire side surface of the electronic component is flattened and foreign matter such as water is present. Since there is no place to accumulate, there is less opportunity for water or the like to enter, and the air tightness of the electronic component can be further increased.

  Hereinafter, an electronic component of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is an external perspective view showing an example of an embodiment of an electronic component of the present invention, and FIG. 2 is a cross-sectional view of the electronic component of FIG. In this example, a piezoelectric component will be described as an electronic component. The electronic component 10 shown in these drawings has, as a basic configuration, an input / output terminal electrode for sealing the piezoelectric element 1 mounted on the dielectric substrate 7 with a case 2 and electrically connecting to an external circuit. 4 and the ground terminal electrode 5 are formed.

  The electronic component element 1 is, for example, a piezoelectric vibration element in which vibration electrodes 1a and 1b are formed on the upper and lower surfaces of a piezoelectric substrate 1c. The piezoelectric substrate 1c is formed as a rectangular flat plate having a length of about 0.4 mm to 4 mm, a width of about 0.2 mm to 3 mm, and a thickness of about 40 μm to 1 mm, for example, in the thickness direction, the width direction, or the length direction. Polarized. Examples of the material of the piezoelectric substrate 1c include piezoelectric ceramics based on lead zirconate titanate, sodium niobate, potassium niobate, bismuth layered compounds, etc., and piezoelectric single crystals such as quartz, lithium tantalate, and lithium niobate. It can be formed using crystals. The vibrating electrode 1a is formed in a region extending from the central portion of the upper surface of the piezoelectric substrate 1c to one end portion, and the vibrating electrode 1b is formed in a region extending from the central portion of the lower surface of the piezoelectric substrate 1c to the other end portion. It has been done. As a material of the vibrating electrodes 1a and 1b, for example, a metal such as gold, silver, copper, and aluminum can be used, and each is formed to a thickness of about 0.1 μm to 3 μm. Such an electronic component element 1 is a resonant component element that generates a thickness vibration or a thickness shear vibration at a specific frequency in a region where the vibration electrodes 1a and 1b face each other when a voltage is applied to both ends.

  3A is a perspective view of the case 2 of the electronic component 10 of FIG. 1 viewed from below, and FIG. 3B is an external perspective view of the case of the electronic component 10 of FIG. As shown in FIGS. 2 and 3, in the electronic component 10 of the present invention, the above-described electronic component element 1 is made of the dielectric substrate 7 using the conductive adhesives 6a and 6b formed at both ends. The element mounting conductor film 3b formed on the upper surface is electrically connected and fixed.

  The conductive adhesives 6 a and 6 b also have a function of maintaining a predetermined gap between the upper surface of the dielectric substrate 7 and the electronic component element 1. As a material of such conductive adhesives 6a and 6b, for example, a highly reliable resin material such as a silicone resin or an epoxy resin contains 75 to 95% by mass of a metal powder such as silver, copper or nickel. Can be used.

  The dielectric substrate 7 is a substrate having a high dielectric constant, for example, formed as a rectangular flat plate having a length of about 0.6 mm to 5 mm, a width of about 0.5 mm to 4 mm, and a thickness of about 0.05 mm to 1 mm. As a material of the dielectric substrate 7, for example, a dielectric ceramic material such as forsterite, alumina, titanium oxide, magnesium oxide, barium titanate, lead titanate, lead zirconate titanate can be used.

  On the upper and lower surfaces of the dielectric substrate 7, an element mounting conductor film 3b, an input / output conductor film 3c, and a ground conductor film 3d, which are mainly composed of metal, are formed. As the material for the element mounting conductor film 3b, the input / output conductor film 3c, and the ground conductor film 3d, a conductive resin in which metal powder such as gold, silver, copper, and aluminum is dispersed in the resin, A thick film conductor or the like obtained by adding an additive such as glass to a metal powder and baking it can be used. The element mounting conductor film 3b formed on the upper surface of the dielectric substrate 7 has a function as an electrode pad on which the electronic component element 1 is mounted as described above, and has the shortest distance to the side surface of the dielectric substrate 7. A reaching extension 3e is provided, and the extension 3e and the input / output terminal electrode 4 are electrically connected. The element mounting conductor film 3b is provided with a capacitance forming portion 3f extending toward the central portion of the dielectric substrate. The capacitance forming portion 3f is formed at the center of the lower surface of the dielectric substrate 7 and has a ground potential. Capacitance can be obtained with the ground conductor film 3d. The ground conductor film 3 d having the ground potential reaches the side surface of the dielectric substrate 7 and is electrically connected to the ground terminal electrode 5. The input / output conductor film 3c formed on the lower surface of the dielectric substrate 7 is located in a region substantially opposite to the element mounting conductor film 3b and the extending portion 3e with the dielectric substrate 7 interposed therebetween. The input / output terminal electrode 4 formed so as to extend in the thickness direction of the dielectric substrate 7 is electrically connected. As described above, the dielectric substrate 7 includes the element mounting conductor film 3b and the extending portions of the element mounting conductor film 3b, which are conductor films mainly composed of a metal electrically connected to the electronic component element 1. The input / output terminal electrode 4 is formed from the upper surface to the side surface. The ground terminal electrode 5 is formed on the side surface of the dielectric substrate 7 in parallel with the pair of input / output terminal electrodes 4 at a substantially intermediate position.

  In addition, the electronic component 10 of the present invention has a capacitance forming portion 3f of the element mounting conductor film 3b and a ground potential at both ends of the electronic component element 1 as a piezoelectric vibration element with the dielectric substrate 7 interposed therebetween. Capacitances obtained between the ground conductor films 3d are respectively provided. Note that the input / output conductor film 3c and the ground conductor film 3d formed on the lower surface of the dielectric substrate 7 are formed from a circuit board or the like constituting an external circuit, particularly when formed using a conductive resin. This is preferable because the stress applied to the substrate 7 can be relaxed and the function of protecting the dielectric substrate 7 can be provided.

  FIG. 4 is an equivalent circuit diagram of the electronic component 10 of the present invention. As shown in FIG. 4, the electronic component 10 of the present invention includes a piezoelectric resonant circuit in which a load capacitance is formed between the both ends of the piezoelectric resonant element and the ground. For example, the electronic component 10 is used for a communication device or an electronic device. It can be set as the oscillation component used for the clock source of the microcomputer.

  FIG. 5 is a cross-sectional view of the electronic component 10 shown in FIG. As shown in FIG. 2 and FIG. 5, in the electronic component 10 of the present invention, an opening recess 2 a is provided on the lower side of the case 2, and the electronic component element 1 mounted on the upper surface of the dielectric substrate 7. Is housed in the recess 2a.

  The case 2 has a function of protecting the electronic component element 1 stored therein from physical and chemical influences from the outside, and an airtight sealing function for preventing entry of foreign matters such as water. . As a material of such a case 2, for example, resin, glass, ceramics, or the like can be used. In the electronic component 10 of the present invention, an insulating resin material such as an epoxy resin is used because a bulk vibration piezoelectric resonator element is used as the electronic component element 1, and the proportion of the inorganic filler is 25 to 80% by mass. By reducing the difference in thermal expansion coefficient between the dielectric substrate 7 and the dielectric substrate 7, the difference in thermal expansion and contraction generated between the case 2 and the dielectric substrate 7 due to temperature change is reduced. Has improved.

  According to the electronic component 10 of the present invention, the element mounting metal film 3b on the extended peripheral surface 3b of the opening peripheral surface 2b of the case 2 as shown in FIG. The width W1 of the located region S is larger than the width W2 of the other region of the opening peripheral surface 2b. In the adhesion between the case 2 and the dielectric substrate 7, on the surface of the conductor film mainly composed of metal, an oxide film is formed on the exposed metal surface. Since the adhesive force of the region S is lower than the adhesive force of other regions, there is a problem that water or the like is likely to enter between the case 2 and the extending portion 3e of the element mounting conductor film 3b. According to the electronic component 10 of the present invention, water or the like tries to enter between the extended portion 3e of the element mounting metal film 3b and the opening peripheral surface 2b of the case 2 positioned thereon. When it does, the distance which reaches | attains the space where the electronic component element 1 is accommodated becomes long. That is, in the electronic component 10 of the present invention, water or the like hardly passes through between the case 2 and the extending portion 3e of the element mounting conductor film 3b and enters the interior in which the electronic component element 1 is accommodated. As a result, the airtightness is high and the variation in characteristics is reduced, and the life of the communication device or electronic device using the electronic component 10 of the present invention can be extended.

  The above electronic component 10 can be manufactured, for example, by the following method.

  In the first step, a piezoelectric vibration element as the electronic component element 1 and the dielectric substrate 7 are prepared.

  If piezoelectric ceramics are used, the piezoelectric substrate 1c constituting the piezoelectric vibration element is, for example, a method in which a raw material powder is pressed by adding a binder, or the raw material powder is mixed with water or a dispersant using a ball mill and then dried. Then, by adding a binder, a solvent, a plasticizer, etc. to form a green sheet by a method using a doctor blade, etc., after baking this at a peak temperature of about 1100 ° C. to 1400 ° C. to form a substrate, 80 ° C. It is formed by applying a voltage of about 3 kV / mm to 6 kV / mm in the thickness direction at a temperature of about 200 ° C. and applying a polarization treatment. The vibrating electrodes 1a and 1b formed on the upper and lower surfaces of the piezoelectric substrate 1c are formed by depositing metal films on the upper and lower surfaces of the piezoelectric substrate 1c using, for example, a vacuum deposition method, a PVD method, a sputtering method, and the like. A photoresist film of about 10 μm is formed on each metal film by using a spin coat method or the like and then patterned by photoetching to form the upper and lower surfaces of the piezoelectric substrate 1c.

  The dielectric substrate 7 is formed by, for example, a method in which a binder is added to a raw material powder and pressed, or the raw material powder is mixed and dried using a ball mill together with water and a dispersant, and a doctor blade is added by adding a binder, a solvent, a plasticizer, and the like. The green sheet can be produced by a method such as molding using a green sheet, and the green sheet is fired at a peak temperature of about 1100 ° C. to 1400 ° C.

  If the conductive film is used for the element mounting conductor film 3b, the input / output conductor film 3c, and the ground conductor film 3d, for example, a metal powder such as silver, copper, or nickel is used as a conductive filler. A conductive resin paste dispersed in an epoxy resin in an amount of about mass% is prepared, and this conductive resin paste is applied to the dielectric substrate 7 using, for example, a screen printing method or a roller transfer method. Then, the element mounting conductor film 3b, the input / output conductor film 3c, and the ground conductor film 3d can be formed by curing by heating or ultraviolet irradiation. The thickness may be, for example, about 10 μm to 60 μm, and a plating film may be formed on the surface using copper, nickel, tin, gold or the like in order to improve solderability. When using a thick film conductor baked with metal powder, a paste for thick film conductor formed by adding glass powder or solvent to silver powder is applied to the upper surface of the dielectric substrate 7 using a screen printing method or the like. Then, by baking at a peak temperature of about 400 ° C. to 800 ° C., for example, a thickness of about 5 μm to 30 μm can be formed.

  In the next step, the electronic component element 1 is mounted on the dielectric substrate 7 using the conductive adhesives 6a and 6b.

  As the conductive adhesives 6a and 6b, a conductive adhesive obtained by dispersing metal powder in a resin is applied onto the element mounting conductor film 3b using a dispenser or the like, and the electronic component element 1 is formed thereon. And cured by heating or ultraviolet irradiation. In a state before the conductive adhesive is cured, the conductive adhesives 6a and 6b wrap around from the lower surface side to the upper surface side at the respective end portions of the electronic component element 1, so that the conductive adhesive 6a. Is electrically connected to the vibrating electrode 1a, and the conductive adhesive 6b is electrically connected to the vibrating electrode 1b.

  In the next step, the opening peripheral surface 2 b of the recess 2 a on the lower side of the case 2 is joined to the upper surface of the dielectric substrate 7 so as to cover the electronic component element 3.

  The case 2 is prepared and prepared in advance by injection molding of a thermosetting resin in which an inorganic filler is dispersed in a resin. A thermosetting insulating adhesive is applied to the lower peripheral edge 2b of the prepared case 2 so that the electronic component element 1 is positioned inside the recess 2a. Put it on the top surface. After that, the case 2 is heated to a temperature equal to or higher than the glass transition point of the resin to cure the insulating adhesive, and the resin in the region S in contact with the extending portion 3e of the element mounting metal film 3b is used as the element mounting metal. Pressurization is performed downward so as to expand the thickness of the extending portion 3e of the film 3b. As described above, the width W1 of the region S located on the extension portion 3e of the element mounting metal film 3b on the opening peripheral surface 2b of the case 2 is larger than the width W2 of other regions on the opening peripheral surface 2b. In this manner, the case 2 is bonded to the upper surface of the dielectric substrate 7. In addition, in this way, it is not necessary to remove a substance that hinders adhesion such as an oxide film to the conductor film, and the number of steps required for manufacturing the electronic component 10 can be reduced. For example, when an epoxy resin having a glass transition point of 155 ° C. is used as the resin material of the case 2, it is necessary to heat to a temperature of 156 ° C. or higher. If the temperature of the case 2 becomes too high, the conductive adhesives 6a and 6b may be deformed inside the recess 2a. In this case, it is preferable to heat to about 160 ° C. In addition, it is preferable to polish and remove the portion of the case 2 that protrudes from the upper surface of the dielectric substrate 7 so that the input / output terminal electrode 4 and the ground terminal electrode 5 described later can be easily formed.

  In the last step, the input / output terminal electrode 4 and the ground terminal electrode 5 are formed on the side surface of the electronic component 10.

  For the input / output terminal electrode 4 and the ground terminal electrode 5, a conductive resin paste in which metal powder is dispersed in resin is prepared, and this conductive resin paste is applied to the side surface of the electronic component 10, for example, by screen printing. Alternatively, the conductive resin paste can be applied by using a roller transfer method or the like, and then cured by heating or ultraviolet irradiation. In forming the input / output terminal electrode 4, a conductive resin paste is applied so as to cover the exposed portion of the element mounting conductor film 3b and the end of the input / output conductor film 3c. Apply a conductive paste so as to cover the end of the ground conductor film 3d.

  If the outer periphery of the opening peripheral surface 2b of the recess 2a on the lower side of the case 2 is positioned inside the outer periphery of the upper surface of the dielectric substrate 7, the extension portion 3e of the element mounting conductor film 3b Since a large exposed portion can be secured, the electrical connection between the input / output terminal electrode 4 and the extending portion 3e of the element mounting conductor film 3b can be stabilized. In addition, in this case, the region S located on the extended peripheral portion 2e of the element mounting conductor film 3b on the opening peripheral surface 2b of the concave portion 2a on the lower side of the case 2 is not only inside the concave portion 2a but also outside the case 2. The configuration can be expanded. In other words, the width W1 of the region S located on the extended portion 3e of the element mounting conductor film 3b on the opening peripheral surface 2b of the recess 2a on the lower side of the case 2 is widely formed on both the outer side of the case 2 and the recess 2a side. can do.

  In addition, according to the electronic component 10 of the present invention, the lower side of the case 2 has a quadrangular shape, and the element mounting metal film 3b on the opening peripheral surface 2b on the opening peripheral surface 2b along one side of the lower side of the case 2. When the width of the region S located on the extending portion 3e is larger than the width of the other region of the opening peripheral surface 2b, the extending portion of the element mounting metal film 3b on the opening peripheral surface 2b of the case 2 Since the difference between the bonding strength of the region S located above 3e and the bonding strength of the other region of the opening peripheral surface 2b of the case 2 is small, even when pressure is applied from the outside, Concentration on the region S located on the extension portion 3e of the element mounting metal film 3b on the peripheral surface 2b of the opening is less likely to cause water or the like to enter, and the airtightness of the electronic component 10 can be further increased. it can.

  It should be noted that the present invention is not limited to the embodiments described above, and various modifications and improvements can be made without departing from the scope of the present invention.

  For example, in the above-described example of the electronic device 10 of the present invention, the element mounting conductor film 3b, the input / output conductor film 3c, the ground conductor film 3d, and the input / output terminal electrodes as the conductor films formed on the dielectric substrate 7 are used. 4 and the ground terminal electrode 5 may use conductive resins having the same composition.

  In the example of the electronic device 10 of the present invention described above, the case 2 and the dielectric substrate 7 are bonded using an adhesive, but may be bonded by a method that does not use an adhesive. For example, the resin can be bonded to the dielectric substrate 7 by using an adhesive resin as the material of the case 2.

  Further, according to the electronic component 10 of the present invention, when the case 2 has an outer side surface in contact with the peripheral edge surface 2b of the case 2 that is flush with the side surface of the dielectric substrate 7, the entire side surface of the electronic component 10 becomes flat. Since there is no place where foreign matters such as water are accumulated, the opportunity for water to enter is reduced, and the airtightness of the electronic component 10 can be further increased. Such an electronic component 10 includes a multi-piece collective substrate as the dielectric substrate 7 and a multi-piece collective case member having a plurality of recesses 2a on the lower side as the case 2, and After mounting the electronic component elements 1 on the upper surface, the collective case member is placed on the collective substrate so that the concave portions 2a correspond to the respective electronic component elements 1 on a one-to-one basis. The assembly case member is joined to the assembly substrate by applying pressure downward while heating to the temperature, cut along the boundaries of each electronic component 10 by dicing, etc., and enters the side surface of each obtained electronic component 10 It can be manufactured by forming the output terminal electrode 4 and the ground terminal electrode 5. Further, according to such a manufacturing method of the electronic component 10, the resin in the portion of the dielectric substrate 7 that contacts the extension portion 3e of the element mounting metal film 3b by pressing the assembly case member is the recess 2a of the case 2. As a result of the synergistic effect that water or the like hardly accumulates in the vicinity of the opening peripheral surface 2b of the case 2 in the outer surface of the electronic component 10, the water and the like are separated from the case and the element. Since it is possible to minimize the intrusion into the inside where the electronic component element 1 is stored through the space between the extending portion 3e of the mounting metal film 3b, the airtightness is particularly high and the variation in characteristics is reduced. Electronic parts.

  Samples of the electronic component 10 of the present invention were produced, and the airtight state was evaluated.

  As the electronic component element 1, an energy confinement type piezoelectric vibration element using a fundamental wave of a thickness-shear mode polarized in the long side direction of a rectangular piezoelectric substrate 1c mainly composed of lead titanate was used. In addition, as the case 2, an insulating resin obtained by dispersing silicon dioxide powder as an inorganic filler occupying 80% by mass and alumina silicate glass powder occupying 3% by mass in an epoxy resin is used. It was processed as a collective case member provided with a plurality of recesses 2a on the lower side by injection molding.

  As the dielectric substrate 7, an aggregate substrate in which a large number of rectangular flat plates mainly composed of barium titanate are taken is produced, and silver powder occupying 85 mass% of the whole is dispersed in an epoxy resin. Using resin, the element mounting conductor film 3b was formed on the upper surface, and the input / output conductor film 3c and the ground conductor film 3d were formed on the lower surface. Further, the thickness of the element mounting conductor film 3b on the upper surface of the dielectric substrate 7 is set to a target value of 30 [mu] m, and the height of the element mounting conductor film 3b alone is set so as not to hinder the vibration of the electronic component element 1 to be mounted. In this way, the resin in the portion in contact with the element mounting metal film 3b is sufficiently spread when the case 2 is pressurized.

  Conductive adhesives 6a and 6b in which silver powder occupying 80% by mass of the whole in silicone resin are applied to each element mounting conductor film 3b on the upper surface of the prepared dielectric substrate 7 using a dispenser. Furthermore, the electronic component element 1 was mounted on the dielectric substrate 7 and then the conductive adhesives 6a and 6b were cured to mount the electronic component element 1 on the dielectric substrate 7. Next, an insulating adhesive made of an epoxy resin is applied to the lower peripheral edge 2b of the case 2 so that each electronic component element 1 is positioned inside the corresponding recess 2a. The insulating adhesive was cured by placing it on the upper surface of the substrate 7 and then pressing the case 2 downward at 0.2 MPa for 40 minutes while heating the case 2 to 160 ° C. Then, the input / output terminal electrode 4 and the ground terminal electrode 5 are formed on the side surface of the electronic component 10 exposed by cutting along a boundary of each electronic component 10 using a dicing saw and being cut. A sample of the electronic component 10 was produced. In the obtained sample, the peripheral edge of the opening of the case 2 is deformed along the shape of the extending portion 3e of the metal film 3b for mounting the element, and the metal film 3b for mounting the element on the peripheral edge 2b of the case 2 is extended. The width of the region S located on the portion 3e is 5 to 10% larger than the width of the other region of the opening peripheral surface 2b.

  Further, when the insulating adhesive was cured using the same material as the sample of the electronic component 10 of the present invention, the comparative example was produced by pressing downward at 0.2 MPa for 40 minutes while heating to 150 ° C. A sample of was prepared. In the obtained sample, the width of the region located on the element mounting metal film 3b on the opening peripheral surface 2b of the case 2 was not different from the width of other regions on the opening peripheral surface 2b.

  Regarding the sample of the electronic component 10 of the present invention and the sample of the comparative example, the sample prepared by subjecting the element mounting conductor film 2b to intentional oxidation for 48 hours under the conditions of a temperature of 85 ° C. and a humidity of 85% When the pressure cooker test was conducted for 96 hours at 100% humidity and 2 atm, and the frequency of occurrence of defects due to changes in piezoelectric characteristics after the test was compared for each of 100 samples, no defects occurred for the sample of the electronic component 10 of the present invention. However, 7% of defects occurred in the comparative sample.

  That is, in the sample of the electronic component 10 of the present invention, the width of the region S located on the extension portion 3e of the element mounting metal film 3b on the opening peripheral surface 2b of the case 2 is the other region of the opening peripheral surface 2b. Therefore, the space between the extending portion 3e of the element mounting metal film 3b and the opening peripheral surface 2b of the case 2 positioned thereon reaches the space in which the electronic component element 1 is accommodated. The electronic component element passes through between the case 2 having a relatively weak adhesive force and the extension portion 3e of the element mounting conductor film 3b which is a conductor film mainly composed of metal. It was confirmed that the airtightness was high and the fluctuation of the characteristics was reduced because the intrusion into the inside of the housing 1 was reduced.

It is an external appearance perspective view which shows an example of embodiment of the electronic component of this invention. FIG. 2 is a cross-sectional view taken along line A-A ′ of the electronic component in FIG. 1. (A) is the perspective view which looked at the case of the electronic component of FIG. 1 from the downward direction, (b) is the perspective view which removed the case of the electronic component of FIG. It is an equivalent circuit diagram of the electronic component of the present invention. It is a B-B 'line sectional view of electronic part 10 of Drawing 1.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component element 1a, 1b ... Vibrating electrode 1c ... Piezoelectric substrate 2 ... Case 2a ... Recessed part 2b ... Opening peripheral surface of a recessed part 3 ... Dielectric substrate 3b ... Element mounting conductor film 3c: input / output conductor film 3d: ground conductor film 3e: extension portion of element mounting conductor film 3f: capacitance forming portion of element mounting conductor film 4 ... Input / output terminal electrodes 5 ... Ground terminal electrodes 6a, 6b ... Conductive adhesive
10 ... Electronic components

Claims (3)

An electronic component element;
A recess that opens on the lower side, and the electronic component element is housed in the recess;
An electronic device comprising: a dielectric substrate in which a top surface is bonded to the peripheral edge surface of the opening of the case, and a conductive film mainly composed of a metal electrically connected to the electronic component element is formed from the top surface to the side surface. In parts,
An electronic component, wherein a width of a region located on the conductor film on the peripheral surface of the opening is larger than a width of another region on the peripheral surface of the opening.   The lower side of the case has a quadrangular shape, and the width of a region located on the conductor film on the peripheral edge surface of the opening along the one side of the lower side of the case is the peripheral edge of the opening. The electronic component according to claim 1, wherein the electronic component is larger than a width of another region of the surface.   2. The electronic component according to claim 1, wherein an outer side surface of the case that contacts the peripheral edge surface of the opening is flush with a side surface of the dielectric substrate.

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