JPH10200368A - Piezoelectric resonant component and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To expand the area of electric connection between an external electrode and a pull-out electrode and to attain improvement in connection reliability by forming the external electrode so as to electrically connect it on the end face of the pull-out electrode and a main surface where a resin adhesive agent layer for the pull-out electrode is not formed. SOLUTION: A resin adhesive agent layer 15 is formed even at the outermost terminal part of the pull-out electrode 13 so as not to expose one part of the main surface part of the pull-out electrode 13. The pull-out electrode 13 is electrically connected to an external electrode 16 at two end face parts of the element main body. Namely, the pull-out electrode 13 is electrically connected with the external electrode 16 at its end face part B and one part A of the main surface part where the resin adhesive agent layer 15 is not formed. Thus, the area of electric connection between the pull-out electrode 13 and the external electrode 16 is expanded, the problem of disconnection caused by the thermal impulse of solder immersion, etc., can be solved and high reliability can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric resonator, such as a filter or an oscillator, in which a piezoelectric resonator is laminated together with a sealing plate, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A conventionally known piezoelectric resonance component includes:
As disclosed in Japanese Patent Application Laid-Open No. Hei 2-309707, a piezoelectric resonator in which a specific pattern of electrodes and a lead electrode are formed on two main surfaces of the piezoelectric resonator is provided on the side facing the piezoelectric resonator. It is configured by arranging and laminating between two sealing plates in which a concave portion is formed, and forming an external electrode on an end face of the laminated body. FIG. 7 shows a structural example of such a piezoelectric resonance component.

FIG. 7 is an exploded perspective view of a piezoelectric resonance component, and is a perspective view before a piezoelectric resonator is laminated on a sealing plate.
In the drawing, reference numeral 71 denotes a piezoelectric resonator, and reference numerals 72 and 73 each include a vibration electrode and a lead electrode formed on the main surface thereof. A sealing plate 74 has a concave portion formed on the side facing the piezoelectric resonator 71, and a resin adhesive layer 75 is applied around the concave portion to adhere to the piezoelectric resonator 71.

FIG. 8A is a completed perspective view of a piezoelectric resonance component, in which a piezoelectric resonator 81 is laminated between two sealing plates 84 and an external electrode 86 is formed. FIG. 8B is a partial cross-sectional view taken along a plane AA in FIG. In this way, a space is secured by the concave portion of the sealing plate 84 and the resin layer 85 so that the vibration by the vibration electrode 82 on the piezoelectric resonator 81 is not hindered. The external electrode 86 and the extraction electrode 83 are connected to each other at a position indicated by an ellipse B.
When a voltage is applied to the external electrode 86, a voltage is applied to the piezoelectric resonator 81 from the vibration electrode 82 through the extraction electrode 83, and the piezoelectric resonator 81 is connected to the piezoelectric resonator 81. By vibrating 81, a function such as a filter is obtained.

[0005]

However, in such a conventional piezoelectric resonance component, the thicknesses of the vibrating electrode and the lead electrode are determined according to the operating frequency in order to effectively utilize the vibration of the piezoelectric resonator. When the thickness of the electrode and the lead electrode increases, vibration of the piezoelectric resonator is inhibited,
It is desirable to make the thickness as thin as possible. For example, in the case of a 10.8 MHz filter utilizing the thickness longitudinal vibration of a piezoelectric resonator, the thickness of the vibrating electrode and the extraction electrode is desirably 2 μm or less. For this reason, the thickness of the vibration electrode and the extraction electrode
Since there is an upper limit, the electrical connection area (thickness cross-sectional area) becomes narrow, and there is a problem that the connection location is disconnected when a thermal shock is applied due to solder immersion or the like. Further, at the time of thermal shock, stress is applied to the connection surface between the extraction electrode and the external electrode due to the difference in the thermal expansion coefficient between each component member and the extraction electrode, and there is also a problem of disconnection due to the small electrical connection area.

The present invention has been made in consideration of the above-mentioned problems of the conventional piezoelectric resonance component, and even if a thermal shock is applied due to solder immersion or the like, each connection member is disconnected or each component member is connected to a lead electrode when the thermal shock is applied. It is an object of the present invention to provide a piezoelectric resonance component in which a stress is applied to a connection surface between an extraction electrode and an external electrode due to a difference in thermal expansion coefficient between the extraction electrodes and the electrical connection area, thereby preventing disconnection due to a small electrical connection area.

[0007]

According to a first aspect of the present invention, there is provided a piezoelectric resonance component having a vibration electrode facing each other and a lead electrode connected to the vibration electrode formed on a main surface thereof. A piezoelectric resonator, and a resin adhesive layer respectively formed on each main surface of the piezoelectric resonator in a region excluding at least a vibration region of the piezoelectric resonator,
In a piezoelectric resonance component including an element main body having a sealing plate bonded to each main surface of the piezoelectric resonator by the resin adhesive layer, the resin adhesive layer is an outermost end of the lead electrode. The external electrodes that are not formed on the main surface of the element body and are formed at least at the ends of the element body are formed on the end surface of the extraction electrode and the main surface of the extraction electrode on which the resin adhesive layer is not formed. A piezoelectric resonance component having a configuration formed so as to be electrically connected, and having a large electrical connection area between an external electrode and a lead electrode to improve connection reliability.

Further, in the first method of manufacturing a piezoelectric resonance component according to the present invention, a step of manufacturing a piezoelectric resonator in which a vibration electrode facing each other and a lead electrode connected to each of the vibration electrodes is formed on a main surface thereof. And a step of manufacturing a sealing plate that covers each main surface of the piezoelectric resonator. Each main surface of the piezoelectric resonator in a region excluding a vibration region of the piezoelectric resonator and an outermost end of the lead-out electrode. A step of forming a resin adhesive layer on each of the above, and a step of laminating and bonding each of the sealing plates to each main surface of the piezoelectric resonator with the resin adhesive layer, and A step of obtaining an element body including a plate and the resin adhesive layer, and electrically connecting the end surface of the extraction electrode and the main surface of the outermost end where the resin adhesive layer of the extraction electrode is not formed. , The element body A piezoelectric resonance component having a configuration including a step of forming an external electrode at least at an end portion, wherein an electrical connection area between the external electrode and the extraction electrode is increased to improve connection reliability. It is a manufacturing method of.

Further, according to a second method of manufacturing a piezoelectric resonance component of the present invention, a step of manufacturing a piezoelectric resonator having opposing vibration electrodes and lead electrodes connected to the vibration electrodes formed on the main surface thereof. And a step of manufacturing a sealing plate covering each main surface of the piezoelectric resonator, and forming a resin adhesive layer on each main surface of the piezoelectric resonator in a region excluding at least a vibration region of the piezoelectric resonator. Through the steps of forming and laminating and bonding the sealing plate to each main surface of the piezoelectric resonator by the adhesive layer, the piezoelectric resonator, the sealing plate, and the resin adhesive layer A step of obtaining an element body comprising: a step of partially removing the resin adhesive layer exposed at an end of the element body to a desired depth from an end face of the element body; and a step of partially removing the resin adhesive layer. Forming an external electrode at least at an end of the element body so as to be electrically connected to a main surface of an outermost end of the extraction electrode and an end surface of the extraction electrode. The present invention is characterized in that the electrical connection area between the electrode and the extraction electrode is increased to improve the connection reliability.

Further, a second piezoelectric resonance component according to the present invention comprises:
A piezoelectric resonator in which a vibrating electrode and a lead electrode connected to the vibrating electrode facing each other are formed on a main surface thereof, and a piezoelectric resonator on at least a main surface of the piezoelectric resonator in a region excluding at least a vibration region of the piezoelectric resonator. A piezoelectric resonance component comprising an element main body having a resin adhesive layer formed on each of the above, and a sealing plate adhered to each main surface of the piezoelectric resonator by the resin adhesive layer, wherein the resin adhesive The layer is not formed on the main surface of the outermost end of the extraction electrode, and a conductive layer is formed on the main surface of the extraction electrode on which the resin adhesive layer is not formed. An external electrode is formed in the portion, and the conductive layer has a configuration in which the external electrode and the extraction electrode are electrically connected to each other, so that an electrical connection area between the external electrode and the extraction electrode is increased. A piezoelectric resonance component, characterized in that with improved-reliability.

Further, in a third method of manufacturing a piezoelectric resonance component according to the present invention, a step of manufacturing a piezoelectric resonator in which a vibration electrode facing each other and a lead electrode connected to the vibration electrode are formed on a main surface thereof. And a step of manufacturing a sealing plate that covers each main surface of the piezoelectric resonator. Each main surface of the piezoelectric resonator in a region excluding a vibration region of the piezoelectric resonator and an outermost end of the lead-out electrode. A step of forming a resin adhesive layer on each of the above, and a step of laminating and bonding each of the sealing plates to each main surface of the piezoelectric resonator with the resin adhesive layer, and A step of obtaining an element body including a plate and the resin adhesive layer, a step of forming a conductive layer on the main surface of the outermost end of the lead electrode where the resin adhesive layer is not formed, and at least the conductive layer Electrical connection to As described above, it has a configuration that includes a step of forming an external electrode on at least an end portion of the element body,
A method for manufacturing a piezoelectric resonance component, characterized in that the electrical connection area between an external electrode and a lead electrode is increased to improve connection reliability.

Further, according to a fourth method of manufacturing a piezoelectric resonance component of the present invention, a step of manufacturing a piezoelectric resonator in which a vibration electrode facing each other and a lead electrode connected to each of the vibration electrodes is formed on a main surface thereof. And a step of manufacturing a sealing plate covering each main surface of the piezoelectric resonator, and forming a resin adhesive layer on each main surface of the piezoelectric resonator in a region excluding at least a vibration region of the piezoelectric resonator. Forming and laminating the sealing plate on each main surface of the piezoelectric resonator by the resin adhesive layer, respectively, through the step of bonding,
Obtaining an element body including the piezoelectric resonator, the sealing plate, and the resin adhesive layer, and partially removing the resin adhesive layer exposed at an end of the element body from an end surface of the element body to a desired depth. Performing a step of forming a conductive layer at least at the part where the part is removed, and forming an external electrode at least at an end of the element body so as to be electrically connected to at least the conductive layer. Has a configuration,
A method for manufacturing a piezoelectric resonance component, characterized in that an electrical connection area between an external electrode and a lead electrode is increased to improve connection reliability.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

(Embodiment 1) A first embodiment of the piezoelectric resonance component of the present invention will be described with reference to FIG. FIG. 1A is a cross-sectional view of the piezoelectric resonance component according to the first embodiment, and FIG. 1B is a partially enlarged view centered on the outermost end of the extraction electrode 13. In the figure, 11 is a piezoelectric resonator, 12 is a vibration electrode, 13 is a lead electrode, 14 is a sealing plate, 15 is a resin adhesive layer forming a vibration space of the piezoelectric resonator 1, and 16 is an external electrode. The piezoelectric resonator 11 is made of a piezoelectric ceramic material such as PZT. Vibrating electrode 12
The lead electrode 13 is formed by a dry film forming method such as a sputtering method. When a voltage is externally applied to the vibration electrode 12, a vibration mode in which only the vicinity of the vibration electrode 12 vibrates is excited. Although a resin adhesive layer 15 is formed between the piezoelectric resonator 11 and the sealing plate 14, the resin adhesive layer 15 is formed in a vibration space portion so as not to hinder the vibration of the piezoelectric resonator 11. Not. Further, the resin adhesive layer 15
Indicates that the extraction electrode 1 is located at the outermost end of the extraction electrode 13.
3 is not formed so that a part of the main surface portion is exposed. The sealing plate 14 is made of a material such as alumina, dielectric ceramic, or resin. The resin adhesive layer 15 has a thermosetting resin such as epoxy as a main component. But,
If necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component. However, the amount and type of the additive are such that the glass transition temperature of the resin mixture is 10% after curing.
0 ° C. or higher, and the minimum melt viscosity during heat curing is 20 Pa
・ Adjusted to be s or more.

The extraction electrode 13 is electrically connected to the external electrode 16 at two end surfaces of the element body shown in FIG. That is, the end surface portion B of the extraction electrode 13
And the part A of the main surface where the above-mentioned resin adhesive layer 15 is not formed is electrically connected to the external electrode 16 (see FIG. 1B). The external electrode 16 is formed by a wet film forming method such as a plating method or a dry film forming method such as a sputtering method.

According to the present invention, the electrical connection area between the extraction electrode 13 and the external electrode 16 can be increased by adopting the above-described configuration, so that a highly reliable electrical connection can be obtained even in a solder immersion test (260 ° C., 10 seconds). Can get a connection
No disconnection occurred. In the first embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 2) Next, a second embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 21 is a piezoelectric resonator, 22 is a vibration electrode, 23 is a lead electrode, 24 is a sealing plate, 25 is a resin adhesive layer, 26 is a first external electrode, 26 'is a second external electrode, 27 Is a concave portion.

First, as shown in FIG.
The vibration electrode 22 and the lead electrode 23 are formed on a piezoelectric resonator made of a piezoelectric ceramic material such as ZT by using a dry film forming method such as a sputtering method using chromium and nickel. Next, as shown in FIG. 2B, a resin is printed by screen printing on one main surface of the piezoelectric resonator except for the vicinity of the vibrating electrode 22 and the outermost end of the lead-out electrode 23. The agent layer 25 is formed. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, a resin is printed by screen printing on the remaining main surface of the piezoelectric resonator except for a region in the vicinity of the vibration electrode 22 and an outermost end of the extraction electrode 23 to form a resin adhesive layer 25. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. The resin adhesive layer 25 has a thermosetting resin such as epoxy as a main component. However, if necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component, but the amount and type of addition thereof are such that the glass transition temperature of the resin mixture is 100 ° C. or more after curing, and It is adjusted so that the minimum melt viscosity at the time of curing becomes 20 Pa · s or more.

Next, the piezoelectric resonator 21 on which the resin adhesive layer 25 is formed is heated to a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less. Next, as shown in FIG. 2C, the sealing plates 2 are formed on both surfaces of the piezoelectric resonator 21 on which the resin adhesive layer 25 is formed.
4 is placed and clamped, and under a pressure of 1 to 10 kg / cm2, 15
After heating at 0 ° C. for 1 hour, the resin adhesive layer 25 is fully cured and integrated as shown in FIG.

Next, the end of the element body is cut by a dicing device. Since the resin adhesive layer 25 is not formed at the outermost end of the extraction electrode 23, a recess 27 is formed.
A part of the main surface of the extraction electrode 23 is exposed in the recess 27. Next, as shown in FIG. 2 (e), a first external electrode 26 is formed on the concave portion 27 and the end of the element body by a dry film forming method such as a sputtering method, and further thereon. Then, nickel and solder are deposited by an electrolytic plating method to form a second external electrode 26 '. The reason why the external electrodes 26 and 26 'are formed twice in this manner is that the formation of the first external electrode 26 only once
This is because a concave is formed in the concave portion 27, and the second external electrode 26 'is further coated thereon. The thickness of the resin adhesive layer 25 is desirably 10 μm or more and 100 μm or less.
If the thickness is less than 10 μm, the composition is easily heated, so that the curing proceeds too much.
If the thickness is 100 μm or more, the hardening of the outermost surface of the resin layer proceeds excessively due to heat conduction.

The present invention provides a highly reliable solder immersion test (260 ° C. for 10 seconds) by enlarging the electrical connection area between the extraction electrode 23 and the external electrodes 26 and 26 ′ by the above-described manufacturing method. Electrical connection can be obtained,
No disconnection occurred. As a method of forming the resin adhesive layer 25, a similar result can be obtained by punching a sheet-like resin into a desired shape and then laminating the resin on the piezoelectric resonator 21. The first external electrode 26 is formed by ion plating, vapor deposition or electroless plating, and the second external electrode 26 'is formed by sputtering, ion plating, vapor deposition or electroless plating. You can also. The first
The thickness of the external electrode 26 is desirably 1 μm or less. In the second embodiment, a case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 3) Next, a third embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 31 is a piezoelectric resonator, 32 is a vibration electrode, 33 is a lead electrode, 34 is a sealing plate, 35 is a resin adhesive layer, 36 is a first external electrode, 36 'is a second external electrode, 37 Is a concave portion. First, as shown in FIG. 3A, a vibrating electrode 32 and a lead electrode 33 are formed on a piezoelectric resonator 31 made of a piezoelectric ceramic material such as PZT by a dry film forming method such as a sputtering method. . Next, as shown in FIG. 3B, a resin is printed on one main surface of the piezoelectric resonator 31 by screen printing except for a region near the vibrating electrode 32, and a resin adhesive layer 35 is formed.
To form Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, a resin is printed on the remaining main surface of the piezoelectric resonator 31 by screen printing except for a region near the vibration electrode 32 to form a resin adhesive layer 35. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. The resin adhesive layer 35 has a thermosetting resin such as epoxy as a main component. However, if necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component, but the amount and type of addition thereof are such that the glass transition temperature of the resin mixture is 100 ° C. or more after curing, and It is adjusted so that the minimum melt viscosity at the time of curing becomes 20 Pa · s or more. Next, the piezoelectric resonator 31 on which the resin adhesive layer 35 is formed is heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less.

Next, as shown in FIG. 3C, a sealing plate 34 is placed and sandwiched on both sides of the piezoelectric resonator on which the resin layer is formed, and is pressed under a pressure of 1 to 10 kg / cm 2. After heating at 150 ° C. for 1 hour, the resin adhesive layer 35 is fully cured and integrated as shown in FIG. Next, the end of the element body is cut by a dicing device. Next, as shown in FIG. 3E, the resin adhesive layer 35 was immersed in an aqueous solution of potassium permanganate.
Is dissolved and removed. A first external electrode 36 is formed on the concave portion 37 formed at the end of the element body by dissolution and removal, and chromium and nickel by a dry film forming method such as a sputtering method on the end portion of the element body. Nickel and solder are deposited by plating, and the second external electrode 3
6 'is formed. The thickness of the resin adhesive layer 35 is desirably 10 μm or more and 100 μm or less. If the thickness is less than 10 μm, the resin layer is easily heated, so that the curing proceeds excessively. If the thickness is 100 μm or more, the outermost surface of the resin layer hardens due to heat conduction.

The present invention provides a highly reliable electrical connection even in a solder immersion test (260 ° C. for 10 seconds) by increasing the electrical connection area between the extraction electrode 33 and the external electrode 36 by the above-described manufacturing method. And no disconnection occurred. As a method of forming the resin adhesive layer 35, after punching a sheet-like resin into a desired shape,
Similar results can be obtained by laminating the piezoelectric resonator 31. The first external electrode 36 is formed by ion plating, vapor deposition, or electroless plating, and the second external electrode 36 'is formed by sputtering, ion plating, vapor deposition, or electroless plating. You can also. Note that the thickness of the first external electrode 36 is desirably 1 μm or less. In the third embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 4) A fourth embodiment of the piezoelectric resonance component of the present invention will be described with reference to FIG. In FIG. 3A, 41 is a piezoelectric resonator, 42 is a vibrating electrode,
43 is a lead electrode, 44 is a sealing plate, 45 is a resin adhesive layer forming a vibration space of the piezoelectric resonator 41, 46 is an external electrode, and 47 is a conductive layer. FIG. 4A is a sectional view of the piezoelectric resonance component according to the fourth aspect, and FIG. 4B is a partially enlarged view centered on the extraction electrode 43. Piezoelectric resonator 4
1 is made of a piezoelectric ceramic material such as PZT. The vibration electrode 42 and the extraction electrode 43 are formed by a dry film forming method such as a sputtering method. When a voltage is externally applied to the vibration electrode 42, a vibration mode in which only the vicinity of the vibration electrode 42 vibrates is excited. A resin adhesive layer 45 is formed between the piezoelectric resonator 41 and the sealing plate 44, and is not formed in a portion of the vibration space so as not to hinder the vibration of the piezoelectric resonator 41. Further, the resin adhesive 45 is not formed on the outermost end of the extraction electrode 43, and a part of the main surface of the extraction electrode 43 is exposed. The sealing plate 44 is made of a material such as alumina, dielectric ceramic, or resin. The resin adhesive layer 45 has a thermosetting resin such as epoxy as a main component. However, if necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component, but the amount and type of addition thereof are such that the glass transition temperature of the resin mixture is 100 ° C. or more after curing, and It is adjusted so that the minimum melt viscosity at the time of curing becomes 20 Pa · s or more.

The lead electrode 43 is electrically connected to the external electrode 46 at the two end faces of the element body shown in FIG. That is, the end surface portion C of the lead electrode 43 is directly electrically connected to the external electrode 46, and a part D of the main surface portion where the resin adhesive layer 45 is not formed is electrically connected to the conductive layer 47 ( FIG. 4 (b)). The conductive layer 47 is electrically connected to the external electrode 46.
The conductive layer 47 is formed by applying a conductive paste mainly containing a metal powder and a resin and then curing the conductive paste by heating. The external electrode 46 is formed thereon by a wet film forming method such as a plating method or the like. It is formed by a dry film forming method such as a sputtering method.

According to the present invention, by adopting the above-described configuration, the electrical connection area between the extraction electrode 43 and the external electrode 46 is increased, so that a highly reliable electrical test can be performed even in a solder immersion test (260 ° C., 10 seconds). Connection can be obtained,
No disconnection occurred. In the fourth embodiment, a case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 5) Next, a fifth embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 51 is a piezoelectric resonator, 52 is a vibration electrode, 53 is a lead electrode, 54 is a sealing plate, 55 is a resin adhesive layer, 56 is an external electrode, 57 is a recess, and 58 is a conductive layer. First, for example, as shown in FIG.
A piezoelectric resonator 51 made of a piezoelectric ceramic material such as T
The vibrating electrode 52 and the lead electrode 53 are formed of chromium and nickel by a dry film forming method such as a sputtering method.
Next, as shown in FIG. 5B, a region near the vibrating electrode 52 and an extraction electrode 53 are provided on one main surface of the piezoelectric resonator 51.
The resin is printed by screen printing except for the outermost end of the resin adhesive layer to form the resin adhesive layer 55. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, a resin is printed by screen printing on the remaining main surface of the piezoelectric resonator 51 except for a region in the vicinity of the vibration electrode 52 and an outermost end of the extraction electrode 53 to form a resin adhesive layer 55. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. The resin adhesive layer 55 has a thermosetting resin such as epoxy as a main component. However, if necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component, but the amount and type of addition thereof are such that the glass transition temperature of the resin mixture is 100 ° C. or more after curing, and It is adjusted so that the minimum melt viscosity at the time of curing becomes 20 Pa · s or more. Next, the piezoelectric resonator 51 on which the resin adhesive layer 55 is formed is heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less.

Next, as shown in FIG. 5C, sealing plates 5 are provided on both surfaces of the piezoelectric resonator 51 on which the resin adhesive layer 55 is formed.
4 is placed and clamped, and under a pressure of 1 to 10 kg / cm2, 15
After heating at 0 ° C. for 1 hour, the resin adhesive layer 55 is fully cured and integrated as shown in FIG. Next, the end of the element body is cut by a dicing device. Since the resin adhesive layer 55 is not formed at the outermost end of the extraction electrode 53, the concave portion 57 is exposed. A part of the main surface of the extraction electrode 53 is exposed in the recess 57.

Next, as shown in FIG. 5E, a conductive paste made of a metal powder such as silver or copper and a resin such as epoxy is applied, and the recess 57 is filled. In addition, the filling property is improved by performing the application under reduced pressure during the application. Next, the conductive paste is cured by heating at a temperature lower than the depolarization temperature of the piezoelectric resonator to form the conductive layer 58. The depolarization temperature is 150 ° C. when PZT is used. Next, as shown in FIG. 5 (f), nickel and solder are further deposited thereon as external electrodes by electrolytic plating to form external electrodes 56. The thickness of the resin adhesive layer 55 is desirably 10 μm or more and 100 μm or less. If the thickness is less than 10 μm, the resin layer is easily heated, so that the curing proceeds excessively. If the thickness is 100 μm or more, the outermost surface of the resin layer hardens due to heat conduction.

The present invention provides a highly reliable electrical connection even in a solder immersion test (260 ° C. for 10 seconds) by increasing the electrical connection area between the extraction electrode 53 and the external electrode 56 by the above-described manufacturing method. And no disconnection occurred. Further, as a method of forming the resin adhesive layer 55, after punching a sheet-like resin into a desired shape,
Similar results can be obtained by laminating the piezoelectric resonator 51. Further, as a method for forming the external electrode 56, sputtering, ion plating, vapor deposition, or electroless plating can also be used. In the fifth embodiment, a case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

(Embodiment 6) Next, a sixth embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. In the figure, 61 is a piezoelectric resonator, 62 is a vibration electrode, 63 is a lead electrode, 64 is a sealing plate, 65 is a resin adhesive layer, 66 is an external electrode, 67 is a recess, and 68 is a conductive layer. First, as shown in FIG.
A piezoelectric resonator 61 made of a piezoelectric ceramic material such as T
The vibrating electrode 62 and the lead electrode 63 are formed of chromium and nickel by a dry film forming method such as a sputtering method.
Next, as shown in FIG. 6B, a resin is printed on one main surface of the piezoelectric resonator 61 by screen printing except for a region near the vibrating electrode 62 to form a resin adhesive layer 65. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. Next, a resin is printed on the remaining main surface of the piezoelectric resonator 61 by screen printing except for a region in the vicinity of the vibration electrode 62 to form a resin adhesive layer 65. Next, the resin is dried until the solvent in the resin is volatilized and tackiness is lost. The resin adhesive layer 65
The main component is a thermosetting resin such as epoxy. However, if necessary, a thermoplastic resin or a filler-like glass may be added as an auxiliary component, but the amount and type of addition thereof are such that the glass transition temperature of the resin mixture is 100 ° C. or more after curing, and Minimum melt viscosity during curing is 20
It is adjusted so as to be Pa · s or more. next,
The piezoelectric resonator 61 on which the resin adhesive layer 65 is formed is heated to be in a semi-cured state. The heating conditions are determined by the crosslink density of the resin. The crosslink density is desirably 60% or less. next,
As shown in FIG. 6C, a sealing plate 64 is placed and sandwiched on both surfaces of the piezoelectric resonator 61 on which the resin adhesive layer 65 is formed, and is pressed at 150 ° C. under a pressure of 1 to 10 kg / cm 2. After heating for one hour, the resin adhesive layer 65 is fully cured and integrated as shown in FIG. 6 (d) to obtain an element body. Next, the end of the element body is cut by a dicing device.

Next, as shown in FIG. 6E, the resin adhesive layer 65 is immersed in an aqueous solution of potassium permanganate to dissolve and remove a part of the resin adhesive layer 65. Recess 6 formed at the end of element body by dissolution and removal
7, a part of the main surface of the extraction electrode 63 is exposed.
Next, as shown in FIG. 6F, a conductive paste made of a metal powder such as silver or copper and a resin such as epoxy is applied, and the recess 67 is filled. In addition, the filling property is improved by performing the application under reduced pressure during the application. Next, the conductive paste is cured by heating at a temperature lower than the depolarization temperature to form the conductive layer 68. The depolarization temperature is 150 ° C. when PZT is used. Further, nickel and solder are deposited thereon as an external electrode by electrolytic plating to form an external electrode 66. The thickness of the resin adhesive layer 65 is desirably 10 μm or more and 100 μm or less. If the thickness is less than 10 μm, the resin layer is easily heated, so that the curing proceeds excessively. If the thickness is 100 μm or more, the outermost surface of the resin layer hardens due to heat conduction.

The present invention provides a highly reliable electrical connection even in a solder immersion test (260 ° C. for 10 seconds) by increasing the electrical connection area between the extraction electrode 63 and the external electrode 66 by the above-described manufacturing method. And no disconnection occurred. Further, as a method of forming the resin adhesive layer 65, after punching a sheet-like resin into a desired shape,
The same result can be obtained by laminating the piezoelectric resonator 61. Further, as a method for forming the external electrode 66, sputtering, ion plating, vapor deposition, or electroless plating can also be used. In the sixth embodiment, the case where one piezoelectric resonator is sandwiched between two sealing plates has been described. However, a similar effect can be obtained when a plurality of piezoelectric resonators are sandwiched.

[0035]

As described above, according to the present invention, since the external electrode and the lead electrode are electrically connected at least at a part of the main surface of the lead electrode, the electrical connection area is larger than in the prior art. The problem of disconnection due to thermal shock such as solder immersion can be solved, and high reliability can be obtained.

[0036]

[Brief description of the drawings]

[0037]

FIG. 1 is a sectional view of a piezoelectric resonance component according to a first embodiment of the present invention.

[0038]

FIG. 2 is a cross-sectional view illustrating a method for manufacturing a piezoelectric resonance component according to Embodiment 2 of the present invention.

[0039]

FIG. 3 is a cross-sectional view illustrating a method for manufacturing a piezoelectric resonance component according to Embodiment 3 of the present invention.

[0040]

FIG. 4 is a sectional view of a piezoelectric resonance component according to a fourth embodiment of the present invention.

[0041]

FIG. 5 is a sectional view showing a method for manufacturing a piezoelectric resonance component according to a fifth embodiment of the present invention.

[0042]

FIG. 6 is a sectional view illustrating a method for manufacturing a piezoelectric resonance component according to a sixth embodiment of the present invention.

[0043]

FIG. 7 is an exploded perspective view of a conventional piezoelectric resonance component.

[0044]

8A is a perspective view of a conventional piezoelectric resonance component, and FIG. 8B is a partial cross-sectional view taken along a plane AA in FIG.

[0045]

[Explanation of symbols]

11, 21, 31, 41, 51, 61, 71, 81 Piezoelectric resonators 12, 22, 32, 42, 52, 62, 72, 82 Vibration electrodes 13, 23, 33, 43, 53, 63, 73, 83 Leader electrode 14, 24, 34, 44, 54, 64, 74, 84 Sealing plate 15, 25, 35, 45, 55, 65, 75, 85 Resin layer 16, 46, 56, 66, 76, 86 External electrode 26, 36 First external electrode 26 ', 36' Second external electrode

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Takayuki Takeuchi 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] 1. A piezoelectric resonator in which a vibration electrode facing each other and a lead electrode connected to the vibration electrode are formed on a main surface thereof, and the piezoelectric resonator at least in a region excluding a vibration region of the piezoelectric resonator. A piezoelectric resonance component provided with an element body having a resin adhesive layer formed on each main surface of the piezoelectric resonator and a sealing plate bonded to each main surface of the piezoelectric resonator by the resin adhesive layer. The resin adhesive layer is not formed on the main surface of the outermost end of the extraction electrode, and the external electrode formed on at least the end of the element body is formed on the end surface of the extraction electrode and the extraction electrode. A piezoelectric resonance component formed to be electrically connected to a main surface of an electrode on which the resin adhesive layer is not formed. 2. A step of manufacturing a piezoelectric resonator in which a vibrating electrode facing each other and a lead electrode connected to the vibrating electrode are respectively formed on a main surface thereof, and a seal covering each main surface of the piezoelectric resonator. Manufacturing a stop plate, and forming a resin adhesive layer on each main surface of the piezoelectric resonator in a region excluding the vibration region of the piezoelectric resonator and an outermost end of the lead electrode, Through a step of laminating and bonding the sealing plates to each main surface of the piezoelectric resonator with a resin adhesive layer, an element body including the piezoelectric resonator, the sealing plate, and the resin adhesive layer is obtained. Process and
Forming an external electrode at least at an end of the element body so as to be electrically connected to an end surface of the extraction electrode and a main surface of an outermost end where the resin adhesive layer of the extraction electrode is not formed; A method for manufacturing a piezoelectric resonance component, comprising: 3. A step of manufacturing a piezoelectric resonator in which a vibrating electrode facing each other and a lead electrode connected to the vibrating electrode are respectively formed on a main surface thereof, and a sealing method for covering each main surface of the piezoelectric resonator. A step of manufacturing a stop plate; a step of forming a resin adhesive layer on each main surface of the piezoelectric resonator in a region excluding at least a vibration region of the piezoelectric resonator; and a step of forming the piezoelectric resonator by the adhesive layer. Through the step of laminating and bonding the sealing plate to each main surface,
A step of obtaining an element body including the piezoelectric resonator, the sealing plate, and the resin adhesive layer, and partially exposing the resin adhesive layer exposed at an end of the element body to a desired depth from the element body end face. Removing, and at least an end portion of the element main body so as to be electrically connected to a main surface of an outermost end portion of the extraction electrode exposed by partial removal of the resin adhesive layer and an end surface of the extraction electrode. Forming an external electrode. 4. A piezoelectric resonator in which a vibration electrode facing each other and a lead electrode connected to the vibration electrode are formed on a main surface thereof, and the piezoelectric resonator at least in a region excluding a vibration region of the piezoelectric resonator. A piezoelectric resonance component provided with an element body having a resin adhesive layer formed on each main surface of the piezoelectric resonator and a sealing plate bonded to each main surface of the piezoelectric resonator by the resin adhesive layer. The resin adhesive layer is not formed on the main surface of the outermost end of the lead electrode, and a conductive layer is formed on the main surface of the lead electrode where the resin adhesive layer is not formed;
An external electrode is formed at least at an end of the element body,
The piezoelectric resonance component, wherein the conductive layer electrically connects the external electrode and the lead electrode. 5. A step of manufacturing a piezoelectric resonator in which a vibrating electrode facing each other and a lead electrode connected to the vibrating electrode are formed on a main surface thereof, and a seal covering each main surface of the piezoelectric resonator. Manufacturing a stop plate, and forming a resin adhesive layer on each main surface of the piezoelectric resonator in a region excluding the vibration region of the piezoelectric resonator and an outermost end of the lead electrode, Through a step of laminating and bonding the sealing plates to each main surface of the piezoelectric resonator with a resin adhesive layer, an element body including the piezoelectric resonator, the sealing plate, and the resin adhesive layer is obtained. Process and
Forming a conductive layer on the main surface of the outermost end of the lead electrode where the resin adhesive layer is not formed, and externally connecting at least an end of the element body so as to be electrically connected to at least the conductive layer. Forming an electrode. 6. A step of manufacturing a piezoelectric resonator in which a vibrating electrode facing each other and a lead electrode connected to the vibrating electrode are formed on a main surface thereof, and a seal covering each main surface of the piezoelectric resonator. A step of manufacturing a stop plate; a step of forming a resin adhesive layer on each main surface of the piezoelectric resonator in at least a region excluding the vibration region of the piezoelectric resonator; and a step of forming the piezoelectric resonance layer by the resin adhesive layer. A step of laminating and sealing the sealing plate on each main surface of the element to obtain an element body including the piezoelectric resonator, the sealing plate, and the resin adhesive layer; and an end of the element body. Partially removing the resin adhesive layer exposed at the portion from the end surface of the element body to a desired depth, forming a conductive layer at least at the partially removed portion, and electrically connecting at least the conductive layer Forming an external electrode at least at an end portion of the element body. 7. The method according to claim 5, wherein the external electrode is further electrically connected to an end face of the extraction electrode. 8. The step of forming the external electrode includes the step of forming a first external electrode by any of sputtering, ion plating, vapor deposition, or electroless plating, and the step of forming a first external electrode on the first external electrode. 4. The method according to claim 2, further comprising the step of forming a second external electrode by battering, ion plating, vapor deposition, electroless plating or electrolytic plating. . 9. The method according to claim 5, wherein the step of forming the external electrode comprises a step of forming the external electrode by sputtering, ion plating, vapor deposition, electroless plating, or electrolytic plating. A method for manufacturing a piezoelectric resonance component. 10. The method according to claim 3, wherein the step of partially removing includes a step of partially removing the resin adhesive layer with an aqueous solution of potassium permanganate. 11. The step of forming the conductive layer includes a step of applying a conductive paste, a step of filling the conductive paste in a portion where the partial removal has been performed under reduced pressure, and a step of lowering the depolarization temperature of the piezoelectric resonator. 7. The method according to claim 5, further comprising the step of: