JP2001274271A - Manufacturing method of electronic part device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component device, which enables airtight sealing completely without affecting an electronic component inserted in a housing 6. SOLUTION: A sealing material 3 is applied in advance to a surface at the side of a case 4 of a metallic housing 6 and a sealing material storage part (fillet part) 3a in contact with an inner wall surface of a side wall 4a at the housing side is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component device that can be surface-mounted on a printed wiring board, and includes an electronic component housed in a housing and sealed with a metal lid. The present invention relates to a method for manufacturing a device.

[0002]

2. Description of the Related Art Conventionally, microcomputers and the like have been frequently used for communication equipment and electronic equipment, and electronic parts such as a clock oscillation circuit have been connected to such microcomputers. Such an electronic component device is configured to be surface-mounted on a printed wiring board. For example, a surface-mounted electronic component device as shown in FIG. 4 is known. Here, a description will be given of a piezoelectric resonator with a built-in capacitor.

FIG. 4 is a cross-sectional view of the electronic component device 100. The electronic component device 100 has a housing 40 having an opening at the top surface and a lead terminal 50 formed by embedding a lead wire into the embedding portion 500a from the bottom surface. In the housing 40, a capacitor element in which three (one in the cross-sectional view in the drawing) connection electrodes 231 to 251 are provided on the lower surface of the strip-shaped dielectric substrate 21 to form two capacitance components 20 and the capacitor element 2
A piezoelectric resonator 113 having vibration electrodes 111 and 112 formed on both main surfaces of a strip-shaped piezoelectric substrate 110 is electrically connected to the upper surface of the piezoelectric substrate 113 via a conductive connecting agent (not shown in the sectional view of the drawing). The stacked body is stored. Then, the housing 40
Sealant 3 between side wall 42 of inner side and the inner periphery of metal lid 60.
0 is sealed.

[0004]

However, in the structure shown in FIG. 4, the housing 40 is sealed with a sealing material (for example, a resin adhesive) 30 applied to the upper surface of the opening of the housing 40 and a metal material. Although the inside of the housing 40 is hermetically sealed by the lid 60, the sealing material 30 and the metal lid 60 are made of different materials, so that sufficient bonding strength between them cannot be obtained. There has been a problem that peeling occurs due to an external factor, that is, a drop impact or a thermal cycle test of an electronic component device, because the thermal expansion and contraction rates of the metal lid 60 and the sealing material 30 are different.

Further, when the electronic component device 100 in a hermetically sealed state is heated to cure the sealing material 30,
The pressure is increased by the air expansion in the inside, the sealing material 30 interposed between the upper surface of the side wall portion 42 of the housing 40 and the metal lid 60 is melted, and many holes called blow-through are vacant, resulting in poor sealing. Was known to do.

In particular, when the amount of the sealing material 30 applied to the housing 40 is small, when the metal lid 60 is sealed in the housing 40, the pool of the sealing material 30 is reduced. There was a problem that the through-hole easily made a hole.

[0007] Therefore, due to poor sealing, the hermeticity of the accommodating portion is lost, and the moisture resistance may be reduced, the electrode of the piezoelectric resonator may be corroded, and the characteristics of the piezoelectric resonator may be fluctuated or defective. .

On the other hand, when the applied amount of the sealing material 30 is large, the sealing material 30 flows into the case 40 from the opening of the case 40 and adheres to the laminated body inserted therein, There is also a problem that characteristics are deteriorated. As a result, the piezoelectric element 1 inserted into the case 40
It was very difficult to secure stable hermetic sealing while preventing the sealing material 30 from adhering to the substrate 10.

The present invention has been devised in view of the above-mentioned problems, and has as its object to provide a process for attaching a metal lid for sealing an opening of a housing via a sealing agent. Also, an electronic component device that can prevent the occurrence of blow-through when the sealing material is heated and cured and can perform hermetic sealing without affecting electronic components such as piezoelectric elements inserted into the housing. It is to provide a manufacturing method.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is to accommodate electronic components in a resin housing having an opening on the upper surface and to have a metal lid on the upper surface of the housing. Is mounted so as to cover the opening, and thereafter, the upper surface of the housing and the lower surface of the metal lid are joined via a sealing material. The materials are
It is characterized in that it has a sealing material accumulating part at a position which is previously attached to the lower surface of the metal lid and which is in contact with or close to the inner wall surface of the housing when placed on the upper surface of the housing. And a method for manufacturing an electronic component device.

According to the structure of the present invention, since the sealing material accumulating portion has the sealing material accumulating portion at a position in contact with or close to the inner wall surface of the housing, the sealing material is heated. -Even when blow-through occurs due to air expansion in the housing during curing, the sealing material accumulation portion is melted and immediately flows into the hole to close it, thereby preventing poor sealing.

In particular, when the sealing material accumulating portion is brought into contact with the inner wall surface of the housing, the sealing material accumulating portion not only joins the lower surface of the metal lid and the upper surface of the housing but also forms the housing. Since the inner wall surface of the body is also bonded to the metal lid, the bonding strength can be increased and the airtightness can be further improved.

In addition, when the lower surface of the metal lid is joined to the upper surface of the housing, the sealing material accumulating portion to be applied to the lower surface of the metal lid in advance contacts or approaches the inner wall surface of the housing. Therefore, the sealing material accumulating portion can also serve to position the metal lid.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component device according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an external appearance of a built-in capacitive piezoelectric resonator A which is an example of an electronic component device of the present invention. FIG. 2 is a sectional view taken along line XX of FIG. 1, and FIG. FIG.

In FIG. 1, a piezoelectric resonator A with a built-in capacitance is used.
Are an electronic component B inside, a housing 4 having an upper opening and housing the electronic component B, and lead terminals 5 (5a, 5b) arranged on the bottom surface of the housing (hereinafter simply referred to as "case") 4. , 5
c) and a metal lid 6 for sealing the upper part of the case 4. The electronic component B includes a piezoelectric resonator 1 and a capacitor element 2 as shown in FIG.

The piezoelectric resonance element 1 includes PT (lead titanate),
It is composed of a strip-shaped piezoelectric substrate 10 made of a piezoelectric ceramic material such as PZT (lead zirconate titanate), a single crystal material such as quartz, lithium tantalate, and lithium niobate, and vibrating electrodes 11 and 12. This piezoelectric substrate 10
The vibrating electrodes 11 and 12 are formed so as to face each other near the center of both main surfaces of the piezoelectric substrate 10. The vibrating electrodes 11 and 12 are formed on both main surfaces of the piezoelectric substrate 10 and extend to different ends. Further, the vibrating electrode 12 is formed on the lower surface of the piezoelectric substrate and extends to one end. Vibrating electrodes 11 and 12
Is formed of, for example, a thin film conductor film mainly composed of an Ag-based material.

The capacitor element 2 is made of PT (lead titanate), PZT (lead zirconate titanate), BaTiO ₃
A strip-shaped dielectric substrate 20 made of a dielectric ceramic material such as (barium titanate) and a plurality of capacitance electrodes 21 and 22 for forming two capacitance components on both upper and lower main surfaces of the dielectric substrate 20 It is configured. Note that the planar shape of the dielectric substrate 20 is the same as the planar shape of the piezoelectric substrate 10 described above.

The two capacitor electrodes 21 and 22 formed on the main surface of the upper surface of the dielectric substrate 20 are connected to three lead terminals 5.
(5a, 5b, 5c) and a connection electrode (simply referred to as an electrode) 23, 24, 25 for achieving the connection form a capacitance component.

The upper electrode 21 and the lower electrode 2
3 is connected via a conductor film formed on one end face or side face of the dielectric substrate 20, and the upper electrode 22
The lower electrode 24 is connected to the lower electrode 24 via a conductor film formed on the other end surface or side surface of the dielectric substrate 20.

Further, the electrode 2 on the upper surface of the dielectric substrate 20
Some of the electrodes 1 and 22 face the electrode 25 on the lower surface side of the dielectric substrate 20. That is, when the electrode 25 on the lower surface of the dielectric substrate 20 is viewed as a center, a predetermined capacitance component is formed between the electrode 21 on the upper surface and the electrode 21 on the upper surface through the thickness of the dielectric substrate 20. A predetermined capacitance component is formed.

The electrodes 21 to 25 are formed on the upper and lower main surfaces of the dielectric substrate 20 by selective printing and baking of a conductive paste mainly containing Ag or the like.

The above-described piezoelectric resonance element 1 and capacitor element 2
Are mechanically joined and electrically connected to each other at predetermined intervals by conductive joining members 15 and 16 interposed in the vicinity of both ends on the contact surface side of both substrates.

The conductive joining members 15 and 16 are made of a conductive adhesive sheet or a conductive resin paste having a predetermined thickness. The distance between the piezoelectric resonance element 1 and the capacitor element 2 can be controlled by the thickness of the conductive adhesive sheet, the number of sheets to be laminated, the amount of conductive paste printed, and the number of times of overprinting. Can be controlled.

The conductive bonding member 15 is formed, for example, by vibrating electrodes 11 of the piezoelectric element 1 led out through one end of the piezoelectric substrate and the upper surface 21 of the dielectric substrate 20 which is the capacitor element 2 (further, The conductive bonding member 16 is electrically connected to the electrode 23) via one end of the dielectric substrate 20, and is connected to the vibration electrode 12 of the piezoelectric resonance element 1 and the dielectric substrate 20 which is the capacitor element 2. It is electrically connected to the upper electrode 22 (and the connection 24 via the other end of the dielectric substrate 20).

It should be noted that the above-mentioned electrical connection is ensured,
In order to ensure mechanical joining between the piezoelectric resonance element 1 and the capacitor element 2, the piezoelectric element 1 and the capacitor element 2 are continuously laminated on the end faces of the piezoelectric resonance element 1 and the capacitor element 2 while the piezoelectric element 1 and the capacitor element 2 are stacked. It is desirable to arrange the members and the like for joining.

The case 4 is made of a resin material having excellent heat resistance such as polyetheretherketone (PEEK), epoxy resin, PPS (polyphenylene sulfide), or the like. The electronic component storage area 40 is formed by the internal space covered by the side wall 41a to be formed. The shape of the case 4 may be any shape such as a rectangular parallelepiped shape that is rectangular or square when viewed from above the opening 41, or a cylindrical shape such that the opening 41 is circular when viewed from above.

The electronic component storage area 40 of the case 4 has a shape substantially sufficient to store a laminated body in which the piezoelectric element 1 and the capacitor element 2 are stacked. The shape of the piezoelectric element 1 and the capacitor element 2 can be easily set in the electronic component housing area 40 by slightly expanding from the area of the bottom surface of the area 40.
Can be accommodated and arranged.

The inner surface of the side wall 41a of the case 4 has an opening 41 so that the stacked body of the housed piezoelectric element 1 and capacitor element 2 can be easily positioned at the center of the case.
It is formed in a slope that opens to the side.

Further, on the outer peripheral surface of the side wall 41 a of the case 4, a step portion 41 which is located below the upper surface 41 b of the side wall 41 and is engaged with the peripheral portion 6 a of the metal lid 6 while covering the same.
When the metal cover 6 is mounted on the case 4, the side wall of the case 4 and the side wall of the peripheral portion 6a of the metal cover 6 coincide with each other to form a flat shape. Thereby, the mounting density can be increased. The upper outer peripheral surface from the upper surface 41b of the case 4 to the step portion 41c is formed as a mountain-shaped convex inclined surface.

Further, phosphor bronze,
One end of a lead terminal 5 made of a metallic member made of nickel-white or the like is integrally molded, and the coefficient of linear expansion of these metals is set to be close to the coefficient of linear expansion of the case 4.

The integrally formed lead terminal 5 is divided into two parts so as to extend from the bottom surface of the case 4 to both sides, and is bent at a corner formed between the bottom surface and the side surface of the case 4. The two other ends extend to the side surfaces of the case 4, respectively.

Specifically, the metal hoop material (open state before cutting and bending) serving as the lead terminal 5 is
Is fixed to the bottom surface of the case 4 by a resin mold at the time of molding, is cut to a predetermined length, and is bent to form a groove along the side surface of the case 4. A part of the fixed lead terminal 5 is exposed at the inside of the case 50a to 50c.

The lead terminal 5 exposed inside the case 4
A conductive resin paste such as Ag serving as the conductive connection member 7 is applied and supplied thereon, cured, and joined. The conductive connection member 7 is formed by a mechanically and electrically connected connection electrode 23, 24, 25 on the lower surface of the capacitor element 2 and the lead terminal 5 in a laminate comprising the piezoelectric resonance element 1 and the capacitor element 2 in the case 4. Make electrical connections.

Thus, the conductive electrode connection member 7 connected to the connection electrode 23 allows the vibration electrode 11 of the piezoelectric resonance element 1 to be connected.
Of the piezoelectric element 1 and the electrode 22 of the capacitor element 2 to the outside by the conductive connecting member 7 connected to the connection 24 of the capacitor element 2. Further, the conductive connection member 7 connected to the connection electrode 25 of the capacitor element 2 allows one of the two capacitance components of the capacitor element 2 to be commonly led to the outside so as to have the ground potential.

The metal cover 6 has a flat portion and a peripheral portion 6a. In the present invention, the present invention is also applicable to only the flat portion. The flat portion has a shape conforming to the opening 41 of the case 4 and is made of stainless steel, 42 alloy, nickel silver, or the like, and its peripheral portion 6a is engaged along the upper outer peripheral surface of the side wall 41a of the case 4. The opening angle of the peripheral portion 6a is determined so as to be compatible. Here, the reason why the metal lid 6 is made of metal will be described. That is, the sealing material 3 and the lid 6 described below
This is because, in terms of adhesive strength, the resin lid 6 can provide a higher bonding strength, but the overall strength is lower when the resin lid 6 is used. In order to increase the strength with the resin lid 6, it is necessary to form the resin lid 6 thicker, but the problem of reducing the overall height of the apparatus cannot be solved. Therefore, the metal lid 6 is used because the strength of the entire apparatus can be obtained and the apparatus can be formed thin.

A sealing material 3 is previously formed on the entire surface (lower surface) of the metal lid 6 on the case 4 side. The thickness u of the sealing material 3 is usually 2 to 3 μm.
As a material of the sealing material 3, an adhesive, glass, solder, or the like can be considered, but an epoxy-based material is excellent in both adhesiveness and heat resistance to both the metal lid 6 and the case 4. Are preferred. In the present invention, the metal cover 6 is used.
Temporary curing may be performed after applying the sealing material 3 to the sealing material 3, but the present invention is not limited to this.

Further, as shown in FIG. 2, if the thickness u of the sealing material 3 applied to the case 4 side of the metal lid 6 alone is used, blow-through occurs at the time of thermosetting during the joining operation. Therefore, a fillet portion 3a (sealing material accumulation portion) having a thickness equal to or greater than the thickness of the sealing material 3 is formed. This fillet portion 3a is formed over the entire circumference and has a uniform thickness and width. Further, as shown in FIG. 3, when the metal cover 6 is put on and joined to the case 4, the fillet portion 3 a contacts the inner surface of the side wall 41 a of the case 4. By forming the fillet portion 3a, the positioning of the metal lid 6 and the case 4 becomes possible.

Note that the fillet portion 3a does not necessarily have to contact the inner surface of the side wall 41a of the case 4 and may be formed near. The distance is such that when the metal lid 6 is closed and heated and cured, the fillet portion 3a that has melted the hole formed by blow-through due to the air pressure can be closed.

When the thickness of the fillet portion 3a is t and its width is W, the approximate sectional area Wt of the fillet portion 3a is
When the fillet portion 3a is formed so as to satisfy the range of 0.02 to 0.1 mm ² , the occurrence of blow-through can be reliably prevented. The width W of the fillet portion 3 is a distance applied from the side wall 41a of the case 4 toward the inner peripheral side. If W exceeds 0.5 mm, a material that does not contribute to the prevention of blow-through due to too much sealing material 3 Therefore, the width W is preferably set to 0.5 mm or less from the viewpoint of cost. The thickness t of the fillet portion 3a is measured by an average thickness measured in the width direction of the fillet portion 3a.

The corner of the metal lid 6 where the peripheral edge 6a is bent has a shape of R0.1 to R0.3 mm to form a sufficiently large fillet 3a to form an accumulation space for the sealant 3. .

The case 4 in which the electronic component B is housed and which has been preheated at a predetermined temperature may be sealed and joined with the metal cover 6 coated with the sealing material 3 in advance. good. Thereby, the change of the air expansion in the case 4 can be suppressed, and the one in which the occurrence of blow-through changes depending on the size of the case 4 usually forms the fillet portion 3a regardless of the size of the case 4. It is possible to obtain a certain sealing performance only by the above. Therefore, forming the fillet portion 3a having the approximate sectional area Wt in the range of 0.02 to 0.1 mm ² enables reliable sealing.

Next, a method for manufacturing an electronic component device according to the present invention will be described. First, an epoxy-based adhesive (sealant 3) is applied to the entire surface of the metal cover 6 with the back surface of the metal cover 6 facing upward by a dispenser. At this time, the predetermined fillet portion 3 a is formed uniformly on the peripheral edge of the metal lid 6. By forming the fillet portion 3a in a predetermined size in this way, the sealing material 3 that has entered the boundary between the metal lid 6 and the side wall 41a of the case 4 is sufficiently filled to obtain a predetermined adhesive strength. Become.

Next, it is dried at 80 ° C. and temporarily cured so as not to adhere during handling. Thus, the metal cover 6 is
Since the sealing material is applied and temporarily cured on the back of
The sealing material 3 is prevented from flowing into the opening portion 41 of the first embodiment.

Next, after the electronic components are inserted and arranged in the case 4, the case 4 is heated to 150.degree. In the state of the heated case 4, the metal lid 6 coated with the above-mentioned sealing material 3 is put over the opening 41 of the case 4 and sealed. At this time, since the fillet portion 3a is formed between the case 4 and the metal lid 6, even if the internal pressure is increased and blow-through occurs, it is applied toward the inside of the metal lid 6. The sealing material is melted and immediately flows into the hole to close the hole, thereby completing the hermetically sealed electronic component device.

The present invention can of course be applied to all other piezoelectric components such as filters, in addition to the resonator as in the above embodiment.

[0046]

EXAMPLES The following experiments were conducted to confirm the effects of the present invention. (Experimental Example 1) An electronic component device was manufactured based on the configuration shown in FIGS. Specifically, a rectangular parallelepiped case (3 × 1 mm) having an opening was prepared, and an electronic component including a capacitor element and a piezoelectric resonator was housed inside the case. Next, an epoxy-based adhesive was applied to the entire surface of the metal cover with the back surface facing upward by a dispenser, and a predetermined fillet portion was formed on the periphery thereof. At this time, assuming the width W and the thickness t of the fillet portion, the approximate sectional area Wt was 0.08 mm ² . Next, the case containing the electronic components is pre-baked at 150 ° C.
While maintaining this temperature, the metal lid to which the above-mentioned adhesive was applied was sealed and joined to produce an electronic component device.
In addition, 50 electronic component devices manufactured by such a method were manufactured. The metal cover of the obtained electronic component device was peeled off from the case using a resin peeling liquid, and it was examined whether a cavity or an external through-hole due to blow-through occurred at the boundary between the metal cover and the case.

As a result, out of 50 electronic component devices, 5
In each of the zero adhesive layers, a plurality of air layers were observed in the adhesive layer, but none of them had a through hole formed from inside to outside by blow-through. (Experimental example 2) A cylindrical case with a circular opening (diameter 6 m)
The experiment was performed under the same conditions as in Example 1 except that the experiment was performed in m). As a result, among the 50 electronic component devices, a plurality of air layers were found in the adhesive layer in all of the 50 electronic component devices, but none of them had a through-hole formed by blow-through from inside to outside. . Therefore, even if the size of the case changes, blow-through can be prevented by using the manufacturing method of the present invention. (Experimental example 3) The approximate sectional area Wt was set to 0.01 mm ² and 0.2 mm
Two types of electronic component devices similar to those of Experimental Example 1 were prepared except that the thickness was set to 0 mm ² . Fifty electronic devices were manufactured, and the state of blow-through was examined in the same procedure as in Experimental Example 1.

As a result, the approximate sectional area Wt is 0.01 mm
^In the electronic component device ² , the manufactured electronic component device 50 is used.
Through holes were found in three of them.
However, the other 47 were within the usable range.

In the electronic component device having a cross-sectional area of 0.20 mm ² , the adhesive was adhered on the electronic component (piezoelectric element) in five of the 50 electronic component devices manufactured. The other 45 were within the usable range.

Regarding the adhesion of the adhesive to the electronic component, the metal lid coated with the adhesive is dried at 80 ° C. to temporarily cure the adhesive, and then sealed in a case heated to a predetermined temperature. A second experiment improved the problem.

Therefore, in order to reliably prevent the adhesive from adhering to the through-holes and electronic components due to the blow-through, the approximate cross-sectional area Wt of the fillet portion should be 0.02 to 0.1 mm.
It is understood that the formation in the range of ² is preferable.

[0052]

As described above, according to the manufacturing method of the present invention, the sealing material accumulation portion formed on the lower surface of the metal lid is sealed at a position in contact with or close to the inner wall surface of the housing. Since it has a material accumulating part, even when blow-through occurs due to air expansion in the housing during heating and curing of the sealing material, the sealing material accumulating part melts and immediately flows into the hole and closes, The sealing failure can be prevented.

In particular, when the sealing material accumulating portion is brought into contact with the inner wall surface of the housing, the sealing material accumulating portion not only joins the lower surface of the metal lid and the upper surface of the housing but also forms the housing. Since the inner wall surface of the body is also bonded to the metal lid, the bonding strength can be increased and the airtightness can be further improved.

When the lower surface of the metal lid is joined to the upper surface of the housing, the sealing material accumulating portion applied to the lower surface of the metal lid in advance contacts or approaches the inner wall surface of the housing. Therefore, it is possible to double the positioning of the metal lid in the sealing material accumulation section, and it is possible to manufacture an electronic component device with high mass productivity.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component device of the present invention.

FIG. 2 is a sectional view taken along the line XX of a piezoelectric resonator with a built-in capacitor, which is an example of the electronic component device of the present invention.

FIG. 3 is a sectional view taken along line YY of a piezoelectric resonator with a built-in capacitor, which is an example of the electronic component device of the present invention.

FIG. 4 is a diagram illustrating a sealing structure of a conventional electronic component device.

[Explanation of symbols]

 A: Built-in capacitance type piezoelectric resonator (electronic component device) B: Electronic component 1: Piezoelectric resonator 2: Capacitor element 3: Sealing material 4: Case (housing) 40: Electronic component storage area 41: Opening 41a: Side wall 41b: Side wall upper surface 5: Lead terminal 5a: Lead terminal embedded portion 6: Metal lid 6a: Peripheral portion

Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat II (reference) H05K 5/06 H05K 5/06 DF term (reference) 4E360 AB13 AB33 BA08 BC20 CA01 EA18 EA27 ED03 ED07 ED22 ED27 EE02 FA09 GA06 GA11 GA23 GB99 GC02 GC08 5J108 BB02 BB04 CC04 EE03 EE18 GG03 GG08 GG15 GG18 JJ02 KK04

Claims (1)

[Claims] An electronic component is accommodated in a resin housing having an opening on an upper surface, and a metal lid is placed on the upper surface of the housing so as to cover the opening. A method for manufacturing an electronic component device in which an upper surface of a housing and a lower surface of a metal lid are joined via a sealing material, wherein the sealing material is previously attached to the lower surface of the metal lid. A method for manufacturing an electronic component device, comprising a sealing material accumulating portion at a position in contact with or close to an inner wall surface of a housing when placed on an upper surface of the housing.