JPH02299310A - Piezoelectric resonator and its manufacture - Google Patents
Piezoelectric resonator and its manufactureInfo
- Publication number
- JPH02299310A JPH02299310A JP12014489A JP12014489A JPH02299310A JP H02299310 A JPH02299310 A JP H02299310A JP 12014489 A JP12014489 A JP 12014489A JP 12014489 A JP12014489 A JP 12014489A JP H02299310 A JPH02299310 A JP H02299310A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- piezoelectric
- vibration
- sides
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000012945 sealing adhesive Substances 0.000 claims abstract description 8
- 239000003566 sealing material Substances 0.000 claims description 32
- 230000001681 protective effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 11
- 238000000605 extraction Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 2
- 239000002648 laminated material Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 15
- 230000001070 adhesive effect Effects 0.000 abstract description 15
- 238000005530 etching Methods 0.000 abstract description 2
- 230000002452 interceptive effect Effects 0.000 abstract description 2
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 239000004576 sand Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、圧電フィルターや発振子等として用いられる
チップ型の圧電共振子とその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip-type piezoelectric resonator used as a piezoelectric filter, an oscillator, etc., and a method for manufacturing the same.
従来の圧電共振子の一例を第８図に示す、これは、例え
ば第７図に示すような振動エレメント１０を中空の筒状
ケース２１内に納めて振動電極２を中空で支持させ、筒
状ゲース２１の両端に金属キャップ２２を被せ、振動エ
レメント１０の外部引き出し電ｆ！３と金属キャップ２
２を導電ペイントや半田２３で導通させ、筒状ケース２
１の端部外周に形成された蒸着膜（図示せず）と金属キ
ャツブ２２とを半田付けして密閉性を得ている。An example of a conventional piezoelectric resonator is shown in FIG. 8. In this, for example, a vibrating element 10 as shown in FIG. 7 is housed in a hollow cylindrical case 21, a vibrating electrode 2 is supported in the hollow, and The metal caps 22 are placed on both ends of the gauge 21, and the vibration element 10 is externally drawn out. 3 and metal cap 2
2 with conductive paint or solder 23, and connect the cylindrical case 2.
A vapor-deposited film (not shown) formed on the outer periphery of the end of the metal cap 22 is soldered to obtain airtightness.
また、第９図に示すものは他の従来例である。Moreover, what is shown in FIG. 9 is another conventional example.
これは、外部電極膜２６を形成されたセラミック製ベー
ス２４の上に振動エレメント１０を載置して外部引き出
し電極３と外部電極膜２３とを半田付けして振動エレメ
ント１０を固定し、振動エレメント１０の上からベース
２４の上に箱状をしたカバー２５を載置し、カバー２５
の下面とベース２４との間を接着剤などで封止している
。This is done by placing the vibrating element 10 on a ceramic base 24 on which an external electrode film 26 is formed, and fixing the vibrating element 10 by soldering the external lead electrode 3 and the external electrode film 23. A box-shaped cover 25 is placed on the base 24 from above 10, and the cover 25
The space between the lower surface of the base 24 and the base 24 is sealed with an adhesive or the like.
しかしながら、第８図もしくは第９図のいずれの従来例
にあっても、その構造上内部に大きな空間が生じるので
、圧電共振子の小型化に限界があり、圧電共振子の外形
が振動エレメントに比べて大きかった。また、いずれの
従来例にあっても一つ一つの圧電共振子を個々に組み立
てなければならず、加工にも手間がかかつており、量産
性の点で問題があった。However, in either of the conventional examples shown in Fig. 8 or 9, a large space is created inside due to the structure, so there is a limit to miniaturization of the piezoelectric resonator, and the external shape of the piezoelectric resonator is It was big in comparison. In addition, in any of the conventional examples, each piezoelectric resonator must be assembled individually, which requires time and effort in processing, and there is a problem in terms of mass production.
しかして、本発明は、上記従来例の欠点に鑑みてなされ
たものであり、その目的とするところは簡単な構造によ
って振動エレメントを内部に封止することができ、また
従来よりも一層小型化でき、さらに量産性にも優れた圧
電共振子を提供することにある。The present invention has been made in view of the drawbacks of the above-mentioned conventional examples, and its purpose is to seal the vibrating element inside with a simple structure, and to further reduce the size of the vibration element compared to the conventional example. The object of the present invention is to provide a piezoelectric resonator that can be manufactured easily and is also excellent in mass production.
このため本発明の圧電共振子は、圧電基板の両面に振動
電極と外部引き出し電極を形成し、これらの電極を挟ん
で圧電基板の両面に保護基板を積層し、圧電基板の両端
部と保護基板の両端部を封止用の接着剤によって接着し
、この基板積層体の両端面に前記外部引き出し電極と導
通した外部電極を形成し、基板積層体の両側面にシール
用材を貼り付けたことを特徴としているや
また、本発明の圧電共振子の製造方法は、両面に振動電
極と外部引き出し電極を備えた圧電母基板を用意する工
程と、前記圧電母基板の両面に保護母基板を積層し、前
記圧電母基板の両端部と保護母基板の両端部とを封止用
の接着剤によって接着して母基板の積層体を形成する工
程と、前記母基板の積層体を所定の位置で切断し、単体
の基板積層体とする工程と、前記母基板の積層体もしく
は単体の基板積層体の両側面にシール用材を貼り付ける
工程と、前記母基板の積層体もしくは単体の基板積層体
の両端面に前記外部引き出し電極と導通する外部引き出
し電極を形成する工程からなることを特徴としている。Therefore, in the piezoelectric resonator of the present invention, vibration electrodes and external lead-out electrodes are formed on both sides of a piezoelectric substrate, protective substrates are laminated on both sides of the piezoelectric substrate with these electrodes sandwiched between them, and both ends of the piezoelectric substrate and the protective substrate are laminated. Both ends of the board are adhered with a sealing adhesive, external electrodes that are electrically connected to the external lead electrodes are formed on both end faces of the board laminate, and a sealing material is pasted on both sides of the board laminate. In addition, the method for manufacturing a piezoelectric resonator of the present invention includes the steps of preparing a piezoelectric motherboard having vibrating electrodes and external lead-out electrodes on both sides, and laminating protective motherboards on both sides of the piezoelectric motherboard. , a step of bonding both ends of the piezoelectric motherboard and both ends of the protective motherboard with a sealing adhesive to form a motherboard laminate; and cutting the motherboard laminate at a predetermined position. and a step of forming a single board laminate, a step of pasting a sealing material on both sides of the mother board laminate or a single board laminate, and a step of attaching a sealing material to both sides of the mother board laminate or a single board laminate. The method is characterized in that it comprises a step of forming an external extraction electrode electrically connected to the external extraction electrode on the surface.
本発明の圧電共振子にあっては、圧電基板の両面に保護
基板を積層して基板積層体を形成し、基板積層体の両端
部を封止用の接着剤によって封止し、基板積層体の両側
面をシール用材で封止している。したがって、簡単な構
造によって圧電基板を内部に密閉することができ、しか
も従来例のように内部に大きな空間が存在せず、圧電共
振子をより小型化できる。In the piezoelectric resonator of the present invention, protective substrates are laminated on both sides of the piezoelectric substrate to form a substrate laminate, and both ends of the substrate laminate are sealed with a sealing adhesive. Both sides are sealed with sealing material. Therefore, the piezoelectric substrate can be sealed inside with a simple structure, and unlike the conventional example, there is no large space inside, and the piezoelectric resonator can be further miniaturized.
また、本発明の圧電共振子の製造方法にあっては、圧電
母基板と保護母基板を積層した基板積層体を切断するこ
とによって単体の基板積層体を一括して多数個製造する
ことができ、さらに単体の基板積層体の両側面にシール
用材を貼り付けると共に両端に外部電極を形成すること
により本発明に係る圧電共振子を得ることができ、前記
圧電共振子の量産性にすぐれ、製造コストも安価にでき
る。Furthermore, in the piezoelectric resonator manufacturing method of the present invention, a large number of single substrate laminates can be manufactured at once by cutting a substrate laminate in which a piezoelectric motherboard and a protective motherboard are laminated. Furthermore, the piezoelectric resonator according to the present invention can be obtained by pasting a sealing material on both sides of a single substrate laminate and forming external electrodes at both ends, and the piezoelectric resonator has excellent mass productivity and is easy to manufacture. The cost can also be reduced.
以下、本発明の実施例を添付図に基づいて詳述する。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
第１図には、本発明の一実施例を示し、第２図（ａ）〜
（ｅ）にはその製造方法を示しである。製造手順に沿っ
て説明すれば、第２図（ａ）は圧電セラミックス等の圧
電母基板ＩＡの両面にスパッタリングや真空蒸着、ある
いは導電ペーストの印刷及び焼き付は等によって電極を
形成したところであり、表裏で対向した部分が振動電極
２となっており、端部の重複していない部分が外部引き
出し電極３となっている０次いで、振動電極２の部分を
除くようにして圧電母基板ＩＡの表裏両端縁に接着剤５
を塗布し、圧電母基板ＩＡの表裏両面にセラミックス製
の保護母基板４Ａを重ねて接着する。こうして、第２図
（ｂ）に示すような母基板の積層体６Ａが得られるが、
この積層体６Ａにおいては圧電母基板ＩＡと保護母基板
４Ａの間に接着剤５の塗布厚みと等しい薄い振動空間９
が形成され、振動電′！ｆ１２は振動がダンピングされ
ないように振動空間９内に納められており、振動空間９
の両端は接着剤５によって封止されている。この後、母
基板の積層体６Ａを第２図（ｂ）の各Ｃ−Ｃ線で切断す
ると、振動エレメント１０の両面に保護基板４を貼り合
わせられた基板積層体６が得られるのである。ここで、
圧電母基板ＩＡから切断された振動エレメント１０は、
第７図のように圧電基板１の両面に振動電極２と外部引
き出し電極３を設けられた構造となる。さらに、基板積
層体６の両端部には、第２図（Ｃ）に示すように外部引
き出し電極３と導通させるようにして外部電極７が形成
される。第２図（ｃ）の状態では、振動エレメント１０
の両側面は保護基板４の両側面と面一になっており、し
かも振動エレメント１０の両側端まで振動電極２が位置
しているので、第２図（ｄ）に示すように、振動エレメ
ント１０の両側面をサンドブラスト、研磨、エツチング
等の方法によってごくわずか削除する。こうして振動エ
レメント１０の両側面に削除部１１を凹設した後、基板
積層体６の両側面にシール用材８を接着剤で接着したり
、溶着させたりして、第１図及び第２図（ｅ）に示すよ
うに基板積層体６の両側面をシール用材８で封止してチ
ップ型の圧電共振子１２を得る。シール用材８は、硬質
のもの、柔軟なものいずれでもよく、例えば耐熱性のあ
る樹脂板や耐熱性樹脂フィルム、セラミック板、セラミ
ックシート等を用いることができる。こうして、振動電
極２を納めた振動空間９は、封止用の接着剤５とシール
用材８によって確実に封止されている。このように、基
板積層体６の両側面にシール用材８を貼り付けたにも拘
らず、振動エレメント１０の両側面を削除しであるので
、振動電極２がシール用材８と干渉する恐れがない。逆
に言えば、削除部１１は振動エレメント１０の全長にわ
たる必要はないが、少なくとも振動電８ｉ！２の部分は
削除する必要がある。また、削除する量はごく僅かでよ
いが、シール用材８の貼り付は時にシール用材８が振動
エレメント１０に触れない程度、およびシール用材８に
外部応力が加わってもシール用材８が振動電極２に触れ
ない程度に削除する必要がある。また、振動エレメント
１０の削除時には、すでに外部電極７が形成されている
ので、周波数の変化を見ながら振動電極２の両側部を削
除し、圧電共振子１２の周波数調整を個々に行うことも
できる。こうして得られた圧電共振子１２は、振動エレ
メント１０と比較すると、厚みは大きくなるものの、幅
と長さは振動エレメント１０と大差なく、特に実装時の
占有面積が振動エレメント１０とほとんど変わらない。FIG. 1 shows an embodiment of the present invention, and FIGS.
(e) shows the manufacturing method. Explaining the manufacturing procedure, FIG. 2(a) shows electrodes formed on both sides of a piezoelectric motherboard IA made of piezoelectric ceramics or the like by sputtering, vacuum evaporation, or printing and baking a conductive paste. The opposing parts on the front and back sides are the vibrating electrodes 2, and the non-overlapping ends are the external extraction electrodes 3.Next, the front and back sides of the piezoelectric motherboard IA are removed by removing the vibrating electrodes 2. Adhesive 5 on both edges
A protective mother substrate 4A made of ceramic is overlaid and adhered to both the front and back surfaces of the piezoelectric mother substrate IA. In this way, a motherboard laminate 6A as shown in FIG. 2(b) is obtained.
In this laminate 6A, a thin vibration space 9 equal to the coating thickness of the adhesive 5 is provided between the piezoelectric motherboard IA and the protective motherboard 4A.
is formed, and a vibrating electric '! f12 is housed in the vibration space 9 so that vibrations are not damped, and the vibration space 9
Both ends are sealed with adhesive 5. Thereafter, when the mother board laminate 6A is cut along each line C--C in FIG. 2(b), a substrate laminate 6 in which the protective substrate 4 is bonded to both sides of the vibrating element 10 is obtained. here,
The vibrating element 10 cut from the piezoelectric motherboard IA is
As shown in FIG. 7, the structure is such that a vibrating electrode 2 and an external extraction electrode 3 are provided on both sides of a piezoelectric substrate 1. Further, external electrodes 7 are formed at both ends of the substrate stack 6 so as to be electrically connected to the external lead electrodes 3, as shown in FIG. 2(C). In the state shown in FIG. 2(c), the vibration element 10
Both side surfaces of the vibration element 10 are flush with both side surfaces of the protective substrate 4, and the vibration electrodes 2 are located up to both ends of the vibration element 10, so that the vibration element 10 A very small amount is removed from both sides by sandblasting, polishing, etching, etc. After recessing the removed portions 11 on both sides of the vibrating element 10, the sealing material 8 is adhered or welded to both sides of the substrate laminate 6 with an adhesive, as shown in FIGS. 1 and 2. As shown in e), both sides of the substrate laminate 6 are sealed with a sealing material 8 to obtain a chip-type piezoelectric resonator 12. The sealing material 8 may be either hard or flexible, and may be, for example, a heat-resistant resin plate, a heat-resistant resin film, a ceramic plate, a ceramic sheet, or the like. In this way, the vibration space 9 containing the vibration electrode 2 is reliably sealed by the sealing adhesive 5 and the sealing material 8. In this way, even though the sealing material 8 is pasted on both sides of the substrate laminate 6, both sides of the vibrating element 10 are removed, so there is no risk that the vibrating electrode 2 will interfere with the sealing material 8. . Conversely, the deleted portion 11 does not need to span the entire length of the vibrating element 10, but at least the vibrating element 8i! Part 2 needs to be deleted. In addition, although the amount to be removed may be very small, the sealing material 8 may sometimes be pasted to such an extent that it does not touch the vibrating element 10, and even if external stress is applied to the sealing material 8, the sealing material 8 may not stick to the vibrating electrode 10. It is necessary to remove it to the extent that it does not touch. Furthermore, since the external electrode 7 has already been formed when the vibrating element 10 is removed, it is also possible to individually adjust the frequency of the piezoelectric resonator 12 by removing both sides of the vibrating electrode 2 while observing changes in frequency. . Although the thus obtained piezoelectric resonator 12 is thicker than the vibrating element 10, its width and length are not much different from the vibrating element 10, and in particular, the area occupied when mounted is almost the same as the vibrating element 10.
なお、上記の製造順序は、必要に応じて変更することが
でき、例えば外部電極よりも先に基板積層体の両側面に
シール用材を貼り付け、その後に外部電極を形成するこ
とも好ましい。すなわち、第２図（ｃ）の工程と第２図
（ｄ）（ｅ）の工程は、上述の順序とは逆にしてもよい
。また、母基板の積層体の両端部に外部電極を形成した
後に母基板の積層体を切断して個々の基板積層体にして
も差し支えない。Note that the above manufacturing order can be changed as necessary. For example, it is also preferable to apply sealing materials to both sides of the substrate laminate before applying the external electrodes, and then form the external electrodes. That is, the process of FIG. 2(c) and the steps of FIG. 2(d) and (e) may be performed in the reverse order from the above-mentioned order. Furthermore, after forming external electrodes on both ends of the motherboard laminate, the motherboard laminate may be cut into individual substrate laminates.
第３図（ａ）（ｂ）は、多数の基板積層体６の両側面に
一度にシール用材８を貼り付ける方法を示している。す
なわち、大きなシール用材８の上面に接着剤を塗布し、
この上に側面を下にして多数の基板積層体６を並べ、こ
れらの基板積層体６の側面の上に接着剤を塗布したシー
ル用材８を重ねる。FIGS. 3(a) and 3(b) show a method of pasting the sealing material 8 on both sides of a large number of substrate laminates 6 at once. That is, apply adhesive to the upper surface of the large sealing material 8,
A large number of substrate laminates 6 are arranged on top of this with their sides facing down, and a sealing material 8 coated with an adhesive is stacked on the side surfaces of these substrate laminates 6.
そして接着剤が硬化した後、カッター刃やレーザー等に
よってシール用材８を切断して個々の圧電共振子１２に
分離するものであり、一層重産性が向上する。After the adhesive has hardened, the sealing material 8 is cut using a cutter blade, a laser, or the like to separate it into individual piezoelectric resonators 12, which further improves productivity.
第４図に示すものは、本発明のさらに他側であり、接着
剤５により圧電母基板ＩＡの両面に保護母基板４Ａを貼
り合わせて母基板の積層体６Ａを形成した状態である（
第２図の実施例の第２図（ｂ）の工程に対応する。）。What is shown in FIG. 4 is still another aspect of the present invention, in which a protective mother substrate 4A is bonded to both sides of a piezoelectric mother substrate IA with an adhesive 5 to form a mother substrate laminate 6A (
This corresponds to the process shown in FIG. 2(b) of the embodiment shown in FIG. ).
この実施例では、圧電母基板ＩＡの振動電極２の部分に
対応させて保護母基板４Ａの内面に振動電極２よりも幅
広の凹溝１３を全長にわたって予め凹設しである。しな
かって、保護母基板４Ａに予め設けられた凹溝１３と接
着剤５の厚みを加えた高さの振動空間９が形成され、こ
の振動空間９内に振動電極２が納められている。In this embodiment, a groove 13 wider than the vibrating electrode 2 is previously formed on the inner surface of the protective motherboard 4A over its entire length in correspondence with the vibrating electrode 2 of the piezoelectric motherboard IA. Instead, a vibration space 9 having a height equal to the thickness of the adhesive 5 and the groove 13 provided in advance on the protective motherboard 4A is formed, and the vibration electrode 2 is housed within this vibration space 9.
第５図に示すものは、本発明のさらに別な実施例であり
、基板積層体６の両側面にシール用材８を貼り付けた状
態（第２図の実施例の第２図（ｅ）の工程に対応する。What is shown in FIG. 5 is still another embodiment of the present invention, in which sealing material 8 is pasted on both sides of the substrate laminate 6 (as shown in FIG. 2(e) of the embodiment in FIG. 2). Corresponds to the process.
）の断面図である。この実施例では、両シール用材８の
内面に凹部１４を設けである。この凹部１４は、シール
用材８の内面に上下全長にわたって設けられたものでな
く、振動電極２の部分に対応してシール用材８の中央部
にのみ凹設されたものであり、これによって振動電極２
とシール用材８が接触して干渉するのを防止している。) is a cross-sectional view of. In this embodiment, recesses 14 are provided on the inner surfaces of both sealing materials 8. This recess 14 is not provided on the inner surface of the sealing material 8 over the entire vertical length, but is recessed only in the center of the sealing material 8 corresponding to the vibrating electrode 2. 2
This prevents the sealing material 8 from coming into contact with and interfering with the sealing material 8.
第６図（ａ）（ｂ）に示すものは、本発明のさらに他例
である。第６図（ａ）に示すものは、第２図の実施例に
おける圧電母基板ＩＡよりも幅の広い圧電母基板ＩＢの
両面に複数組の振動電ｆｆ１２と外部引き出し電極３を
形成したものである。また、第６図（ｂ）に示すものは
、この圧電母基板ＩＢの両面に第２図の実施例における
保護母基板４Ａよりも幅の広い保護母基板４Ｂを接着剤
５を用いて積層した母基板の積層体６Ｂである。この積
層体６Ｂを縦方向に切断すれば、第２図（ｂ）と同じよ
うな積層体６Ａを得ることができる。しかして、このよ
うな幅広の圧電母基板ＩＢ及び保護母基板４Ｂを用いれ
ば、一枚の積層体６Ｂからより多数の圧電共振子を製造
することができ、さらに量産性が向上する。なお、この
実施例では、積層体６Ｂを幅方向に切断してから両側面
にシール用材を貼り、その後側々の積層体に切り離し、
その両端に電極を形成することも可能である。What is shown in FIGS. 6(a) and 6(b) is yet another example of the present invention. The one shown in FIG. 6(a) has a plurality of sets of vibrating electrodes ff12 and external lead-out electrodes 3 formed on both sides of a piezoelectric motherboard IB which is wider than the piezoelectric motherboard IA in the embodiment shown in FIG. be. Furthermore, in the case shown in FIG. 6(b), a protective motherboard 4B having a wider width than the protective motherboard 4A in the embodiment shown in FIG. 2 is laminated on both sides of the piezoelectric motherboard IB using an adhesive 5. This is a laminate 6B of mother substrates. By cutting this laminate 6B in the longitudinal direction, a laminate 6A similar to that shown in FIG. 2(b) can be obtained. Therefore, if such a wide piezoelectric motherboard IB and protective motherboard 4B are used, a larger number of piezoelectric resonators can be manufactured from one laminate 6B, and mass productivity is further improved. In this example, the laminate 6B is cut in the width direction, a sealing material is applied to both sides, and then the laminate is cut into the laminates on the sides.
It is also possible to form electrodes on both ends.
なお、本発明は適宜変更して実施することも可能であり
、たとえば第２図（ｂ）の工程では加工途中のストレス
や劣化を防止するための物質（図示せず）で振動空間を
カバーしておき、基板積層体に切断した後の工程でこの
物質を除去してもよい。Note that the present invention can be implemented with appropriate modifications; for example, in the process shown in FIG. 2(b), the vibration space may be covered with a substance (not shown) to prevent stress and deterioration during processing. This material may be removed in a step after cutting into substrate stacks.
また、シール用材が振動電極に接触するのを防止する方
法としては、シール用材を基板積層体の側面に貼る接着
剤の塗布厚みによってシール用材が振動エレメントの側
面に接触しないようにしてもよい。Further, as a method for preventing the sealing material from coming into contact with the vibrating electrode, the sealing material may be prevented from coming into contact with the side surface of the vibrating element by adjusting the thickness of the adhesive applied to the side surface of the substrate laminate.
本発明の圧電共振子によれば、圧電基板に積層した保護
基板とシール用材と封止用の接着剤によって圧電基板を
密閉でき、内部に無駄な空間が存在しないので、圧電共
振子をより小型化することができる９丈な、本発明の圧
電共振子の製造方法によれば、母基板の状態で圧電基板
の両面に保護基板を接着し、母基板の積層体を切断して
基板積層体を一括して本発明の圧電共振子を多数形成す
ることができ、量産性にすぐれ、コストも低廉にするこ
とができる。According to the piezoelectric resonator of the present invention, the piezoelectric resonator can be sealed with the protective substrate laminated on the piezoelectric substrate, the sealing material, and the sealing adhesive, and there is no wasted space inside, so the piezoelectric resonator can be made smaller. According to the method for manufacturing a piezoelectric resonator of the present invention, which can be made into a 9-length piezoelectric resonator, protective substrates are bonded to both sides of the piezoelectric substrate in the mother substrate state, and the mother substrate laminate is cut to form a substrate laminate. A large number of piezoelectric resonators of the present invention can be formed at once, and mass production is excellent and costs can be reduced.
第１図は本発明の一実施例を示す斜視図、第２図（ａＨ
ｂ）（ｃＨｄ）（ｅ）は同上の製造方法を示す説明図、
第３図（ａ＞（ｂ）は本発明の他例であって製造の中間
工程における斜視図及び正面図、第４図は本発明のさら
に他例の製造の中間工程における正面図、第５図は本発
明のさらに別な実施例の製造の中間工程における断面図
、第６図（ａ）（ｂ）は本発明のさらに他例の製造の中
間工程における斜視図及び正面図、第７図は振動エレメ
ントの斜視図、第８図は従来例を示す一部破断した正面
図、第９図は他の従来例を示す一部破断した正面図であ
る。
１・・・圧電基板 ＩＡ・・・圧電母基板２・・
・振動電極 ３・・・外部引き出し電極４・・・
保護基板 ４Ａ・・・保護母基板５・・・接着剤
６・・・基板積層体６Ａ・・・母基板の積層
体
７・・・外部電極 ８・・・シール用材第３
ＣＧ）
第４図
（ｂ）
【
第５図FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 (aH
b) (cHd) (e) is an explanatory diagram showing the same manufacturing method as above,
3(a>(b) is a perspective view and a front view of another example of the present invention in an intermediate step of manufacturing, FIG. 4 is a front view of still another example of the present invention in an intermediate step of manufacturing, and FIG. The figure is a cross-sectional view at an intermediate step in the manufacture of still another embodiment of the present invention, FIGS. 6(a) and 6(b) are perspective views and front views at an intermediate step in the manufacture of still another embodiment of the present invention, and FIG. is a perspective view of a vibrating element, FIG. 8 is a partially broken front view showing a conventional example, and FIG. 9 is a partially broken front view showing another conventional example. 1... Piezoelectric substrate IA...・Piezoelectric motherboard 2...
・Vibration electrode 3... External extraction electrode 4...
Protective board 4A... Protective mother board 5... Adhesive 6... Substrate laminate 6A... Mother board laminate 7... External electrode 8... Sealing material No. 3 CG) Fig. 4 (b) [Figure 5
Claims (2)
形成し、これらの電極を挟んで圧電基板の両面に保護基
板を積層し、圧電基板の両端部と保護基板の両端部とを
封止用の接着剤によって接着し、この基板積層体の両端
面に前記外部引き出し電極と導通した外部電極を形成し
、基板積層体の両側面にシール用材を貼り付けたことを
特徴とする圧電共振子。(1) Vibration electrodes and external extraction electrodes are formed on both sides of the piezoelectric substrate, protective substrates are laminated on both sides of the piezoelectric substrate with these electrodes in between, and both ends of the piezoelectric substrate and both ends of the protective substrate are sealed. A piezoelectric resonator characterized in that external electrodes that are electrically connected to the external extraction electrodes are formed on both end surfaces of the substrate laminate, and sealing materials are attached to both sides of the substrate laminate. .
母基板を用意する工程と、 前記圧電母基板の両面に保護母基板を積層し、前記圧電
母基板の両端部と保護母基板の両端部とを封止用の接着
剤によって接着して母基板の積層体を形成する工程と、 前記母基板の積層体を所定の位置で切断し、単体の基板
積層体とする工程と、 前記母基板の積層体もしくは単体の基板積層体の両側面
にシール用材を貼り付ける工程と、前記母基板の積層体
もしくは単体の基板積層体の両端面に前記外部引き出し
電極と導通する外部引き出し電極を形成する工程からな
ることを特徴とする圧電共振子の製造方法。(2) A step of preparing a piezoelectric motherboard with vibrating electrodes and external lead-out electrodes on both sides, and laminating a protective motherboard on both sides of the piezoelectric motherboard, both ends of the piezoelectric motherboard and both ends of the protective motherboard. a step of bonding the mother board with a sealing adhesive to form a mother board laminate; a step of cutting the mother board laminate at a predetermined position to form a single board laminate; A step of pasting a sealing material on both sides of a laminated body of substrates or a single laminated body of substrates, and forming external lead-out electrodes that are electrically connected to the external lead-out electrodes on both end faces of the laminated body of substrates or a laminated body of single substrates. A method for manufacturing a piezoelectric resonator, comprising the steps of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1120144A JP2555729B2 (en) | 1989-05-13 | 1989-05-13 | Piezoelectric resonator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1120144A JP2555729B2 (en) | 1989-05-13 | 1989-05-13 | Piezoelectric resonator and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02299310A true JPH02299310A (en) | 1990-12-11 |
| JP2555729B2 JP2555729B2 (en) | 1996-11-20 |
Family
ID=14779056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1120144A Expired - Lifetime JP2555729B2 (en) | 1989-05-13 | 1989-05-13 | Piezoelectric resonator and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2555729B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04236512A (en) * | 1991-01-18 | 1992-08-25 | Murata Mfg Co Ltd | Ladder type piezoelectric component |
| JPH04247708A (en) * | 1991-02-01 | 1992-09-03 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JPH04345205A (en) * | 1991-05-22 | 1992-12-01 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JPH0529868A (en) * | 1991-07-19 | 1993-02-05 | Murata Mfg Co Ltd | Piezoelectric resonator and its production |
| JPH0595247A (en) * | 1991-10-01 | 1993-04-16 | Murata Mfg Co Ltd | Piezoelectric resonator and its manufacture |
| JP2005286576A (en) * | 2004-03-29 | 2005-10-13 | Murata Mfg Co Ltd | Manufacturing method for piezoelectric resonator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110217A (en) * | 1982-12-14 | 1984-06-26 | Murata Mfg Co Ltd | Piezoelectric oscillating parts in chip shape and its manufacture |
| JPS6012810A (en) * | 1983-07-02 | 1985-01-23 | Murata Mfg Co Ltd | Piezoelectric oscillation parts and their manufacture |
| JPS62250680A (en) * | 1986-04-23 | 1987-10-31 | Murata Mfg Co Ltd | Laminate-type bimorph cell |
-
1989
- 1989-05-13 JP JP1120144A patent/JP2555729B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110217A (en) * | 1982-12-14 | 1984-06-26 | Murata Mfg Co Ltd | Piezoelectric oscillating parts in chip shape and its manufacture |
| JPS6012810A (en) * | 1983-07-02 | 1985-01-23 | Murata Mfg Co Ltd | Piezoelectric oscillation parts and their manufacture |
| JPS62250680A (en) * | 1986-04-23 | 1987-10-31 | Murata Mfg Co Ltd | Laminate-type bimorph cell |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04236512A (en) * | 1991-01-18 | 1992-08-25 | Murata Mfg Co Ltd | Ladder type piezoelectric component |
| JPH04247708A (en) * | 1991-02-01 | 1992-09-03 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JPH04345205A (en) * | 1991-05-22 | 1992-12-01 | Murata Mfg Co Ltd | Manufacture of chip type piezoelectric resonator |
| JPH0529868A (en) * | 1991-07-19 | 1993-02-05 | Murata Mfg Co Ltd | Piezoelectric resonator and its production |
| JPH0595247A (en) * | 1991-10-01 | 1993-04-16 | Murata Mfg Co Ltd | Piezoelectric resonator and its manufacture |
| JP2005286576A (en) * | 2004-03-29 | 2005-10-13 | Murata Mfg Co Ltd | Manufacturing method for piezoelectric resonator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2555729B2 (en) | 1996-11-20 |
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