JPH10294207A - Composite element and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain, with a single body, characteristics equivalent to those of a series circuit of a thermistor and a resistor, by providing a terminal electrode and a resistor layer on each of both end surfaces and lateral surfaces of a thermistor element, and sequentially connecting the terminal electrode and the resistor layer in series. SOLUTION: Conductor layers 2, 3 and insulating layers 4, 5 are formed on both sides of a thermistor element 1, and a conductor layer 6 is formed on the conductor layer 2 between the insulating layers 4, 5. A conductor layer 7 is formed on the insulating layer 4, and a resistor layer 8 is formed between the conductor layers 6, 7. Insulating layers 11, 12 and terminal electrodes 13, 14 are formed on both end surfaces of the thermistor element 1. With this structure, the terminal electrode 13 is conductive only to the conductor layer 7, and the terminal electrode 14 is conductive only to the conductor layer 3. Therefore, a resistor-thermistor series connection element is provided in which the terminal electrode 13, the conductor layer 7, the resistor layer 8, the conductor layer 6, the conductor layer 2, the thermistor element 1, the conductor layer 3, and the terminal electrode 14 are connected in this order. With this composite element, a temperature compensation circuit or the like constituted by a thermistor, a capacitor and a resistor can be miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite element in which a resistor and a thermistor are connected in series and a method of manufacturing the same. More specifically, the present invention relates to a temperature compensation circuit for a temperature compensation circuit such as a crystal oscillator. The present invention relates to a composite device suitable for compensation and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, when a series circuit of a thermistor and a resistor is formed, such as a temperature compensation circuit of a crystal oscillator, a plurality of electronic components such as a thermistor and a chip resistor are individually flown on the same substrate. Mounting is performed by reflow soldering.

[0003]

However, when a circuit is formed by using a plurality of individual electronic components such as a thermistor and a chip resistor as described above, a plurality of components are mounted on the same substrate. Therefore, the mounting area has been increased, which has been a great limitation in miniaturizing the circuit.

The present invention provides a composite element which realizes characteristics equivalent to a series circuit of a thermistor and a resistor in a single chip by employing a method of forming a thick film of a resistance material on the surface of a thermistor body, and a method of manufacturing the same. The purpose is to provide.

[0005]

According to the present invention, there is provided a composite element comprising a chip-shaped thermistor element, terminal electrodes formed on both end faces of the thermistor element, and a resistor formed on a side face of the thermistor element. And a body layer, and one terminal electrode, the resistor layer, the thermistor element, and the other terminal electrode are connected in series in this order.

According to the present invention, a composite element having characteristics equivalent to a series circuit of a thermistor and a resistor can be realized as a single element. The use of the composite device according to the present invention enables the miniaturization of an electronic circuit such as a temperature compensation circuit including a thermistor, a capacitor, and a resistor. In particular, this element is useful as a temperature compensating circuit for a temperature-compensated crystal oscillator or the like for which there is a strong need for miniaturization.

The method of manufacturing a composite element according to the present invention comprises the steps of forming conductor layers 22 and 23 on both surfaces of a thin thermistor element, and forming a predetermined interval on one of the conductor layers 22. Forming an insulating layer 24 in a strip shape, forming an insulating layer 30 extending in the same direction as the insulating layer 24 on the other conductive layer 23 at a predetermined interval; The conductor layer 26 is formed on the conductor layer 22 between the layers 24, 24, and the conductor layer 27 is formed only on the insulator layer 24 so that the edge of the conductor layer 27 is located on the insulator layer 30. Forming the conductive layer so as to coincide with the position of the edge;
Forming the resistor layer 28 over the conductor layer 26, forming an insulator layer covering the conductor layer 26 and the resistor layer 28, and applying the thin plate-shaped thermistor element in a direction orthogonal to the longitudinal direction of these strip-shaped layers. Cutting into strips, forming an insulator layer on the side surfaces of the obtained strip-shaped body, and forming the strip-shaped body into a conductor layer 27 and an insulator layer in a direction orthogonal to the longitudinal direction thereof. A step of cutting the chip along a predetermined cutting line C along the edge of the chip 30 into terminal chips; terminal electrodes on both end surfaces of the obtained chip; And the other terminal electrode 14 is formed so as to be conductive only to the conductor layer 3 on the other chip side surface.

[0008]

FIG. 1A is a cross-sectional view of a composite device according to an embodiment, in which conductor layers 2 and 3 are formed on both surfaces of a thermistor body 1. FIG. Conductor layer 2 on top side of figure
Are formed on the conductor layer 2 between the insulator layers 4 and 5 so as to extend between the insulator layers 4 and 5. The conductor layer 6 is formed.

A conductor layer 7 is formed on insulator layer 4 so as to be spaced from conductor layer 6. A resistor layer 8 is formed so as to extend between the conductor layers 6 and 7.

An insulator layer 9 is formed so as to expose only a part of the conductor layer 7 and to cover the resistor layer 8, the conductor layer 6, and the insulator layer 5. The insulator layer 9 reaches the right end of the thermistor body 1 in the figure, but is separated from the left end of the thermistor body 1, and the conductor layer 7 is located on the left side of the insulator layer 9. Not covered with 9.

On the lower surface side of the thermistor body 1 in the figure, an insulator layer 10 is formed on the conductor layer 3. The insulator layer 10 reaches the left edge of the figure but is separated from the right edge, and the conductor layer 3 is not covered by the insulator layer 10 on the right end side.

An insulating layer 1 is provided on both end faces of the thermistor body 1.
1 and 12 are formed, and terminal electrodes 13 and 14 are formed thereon. The insulator layer 11 on the left insulates the conductor layers 2 and 3 from the terminal electrode 13, and the insulator layer 12 on the right insulates the conductor layers 2 and 3 from the terminal electrode 14. For this reason, the terminal electrode 13 conducts only to the conductor layer 7, and the terminal electrode 14 conducts only to the conductor layer 3. Therefore, FIG.
As shown in the equivalent circuit of (b), the terminal electrode 13-the conductor layer 7-
A resistor / thermistor serially connected element connected like the resistor layer 8-the conductor layer 6-the conductor layer 2-the thermistor element 1-the conductor layer 3-the terminal electrode 14 is obtained.

Although not shown, FIG.
An insulator layer is also provided on the side surface in the direction parallel to the plane of FIG.

Next, a method of manufacturing the composite device will be described with reference to FIG.

First, conductor layers 22 and 23 are formed on the entire surface of both surfaces of the thermistor thin plate 21. A film-like insulator layer 24 is formed on the conductor layer 22, and an insulator layer 30 is formed on the conductor layer 23. Note that the insulator layers 24 and 30 extend in the same direction. A predetermined interval is provided between the insulator layers 24 and between the insulator layers 30.

Conductor layer 2 between insulator layers 24, 24
2, a strip-shaped conductor layer 26 is formed, and a strip-shaped conductor layer 27 is formed only on the insulator layer 24. There is a predetermined space between the conductor layers 26 and 27. A strip-shaped resistor layer 28 extends over the conductor layers 26 and 27.
To form An insulator layer 29 (not shown) is formed in a strip shape so as to cover the resistor layer 28, the conductor layer 26, and the insulator layer 24, and to expose most of the conductor layer 27.

Next, the thermistor thin plate 21 is cut in a direction orthogonal to the longitudinal direction of these strip-shaped layers to form a strip-shaped element.

Next, after an insulating layer is formed on the cut side surface of the strip-shaped element, the strip-shaped element is placed on the conductor layer 27 in the direction orthogonal to the longitudinal direction as indicated by a two-dot chain line C. The chip is cut along the edge opposite to the resistor layer 28 (the left edge in the figure). Note that the two-dot chain line C in FIG. 1 (c) indicates the planned cutting line at this time. After forming insulating layers 11 and 12 by coating insulating resin layers on both end surfaces of the chip, and forming terminal electrodes 13 and 14, a composite element is obtained.

Although the present invention is not particularly limited, the thermistor material may be Mn-Co-Cu,
-Co-Fe-based materials and the like can be used.

The insulator layers 24, 25, 29 (not shown), 3
0 is formed, for example, by printing a glass paste by screen printing or the like, drying and baking. Note that the insulator layer 29 forms the insulator layer 9 later.

The conductor layers 22, 23, 26 and 27 are formed by, for example, printing a conductive electrode paste by screen printing or the like, drying and printing. Note that the conductor layer and the resistor layer may be baked together.

The resistor layer 28 is formed by printing a resistor paste of RuO ₂ or the like by screen printing, drying and baking. Note that the insulator layer can also be formed by applying an insulating resin material such as a one-component epoxy resin. When the insulating layer is formed using this insulating resin material, the terminal electrodes 13 and 14 are formed using a conductive resin material.

[0023]

Embodiments will be described below.

(1) A sheet thermistor (sintered body) 21 having a size of 30 × 50 × 0.6 mm is prepared, and a commercially available conductive electrode paste (Ag) is applied to both surfaces of the sheet body. Is printed by screen printing and dried (150
(15 ° C., 15 minutes), and baked at 850 ° C. × 15 minutes to form conductor layers 22 and 23. (2) A commercially available glass paste (insulating) is printed by a screen printing method so as to form a predetermined band-shaped pattern on both sides of the thin plate-shaped body on which the conductor layer is formed, and dried (150 ° C., 15 minutes). ), Bake at 850 ° C x 15 minutes,
Insulator layers 24 and 30 were formed. Note that the insulator layer 24,
The width of the band glass having a width of 30: 1.52 mm The interval between the band glass: 0.10 mm. (3) A conductive electrode paste (Ag) is printed on one surface of the thin plate body on which the insulator layers 24 and 30 are formed in a predetermined pattern by a screen printing method, and dried (150 ° C., 15 minutes). ) Conductor layers 26 and 27 were formed. (4) Next, a resistor paste is printed on the surface of the thin plate-shaped body by a screen printing method so as to have a predetermined pattern, dried (150 ° C., 15 minutes), and baked at 850 ° C. × 15 minutes. The resistor layer 28 was formed. The resistance material used was a ruthenium oxide (RuO ₂ ) -based material.

(5) Further, a glass paste is printed on the surface of the thin plate-shaped element body on which the resistor layer 28 is formed by a screen printing method so as to form a predetermined pattern.
This was baked at 850 ° C. for 15 minutes to form an insulator layer 29 (not shown). (6) The thin plate was cut into strips having a width of 0.72 mm using a dicing machine. (7) A commercially available glass paste is printed on two sides (cut surfaces) of the strip-shaped element body by a screen printing method, and after drying (1)
(50 ° C., 15 minutes) and baking at 850 ° C. × 15 minutes to form an insulator layer. (8) The strip-shaped element was cut into 1.52 mm-wide chip-shaped elements at a position shown by C in FIG. 1C using a dicing machine. (9) An insulating resin is adhered to both ends of the chip-shaped body by a dip method, and after drying (120 ° C., 15 minutes), 15
Thermal curing was performed at 0 ° C. for 30 minutes to form insulator layers 11 and 12. As the insulating resin, a one-component epoxy compound resin was used. (10) A commercially available resin-based filler Ag electrode is adhered to both ends of the chip-shaped element by a dipping method, and dried (15).
(0 ° C., 15 minutes) and thermosetting at 150 ° C. × 1 hour, and Ni plating and solder plating were performed thereon by electrolytic barrel plating to form terminal electrodes 13 and 14. The Ni plating thickness is about 4 μm, and the solder plating thickness is about 5 μm. As a result, a composite device having the equivalent circuit of FIG. 1B was obtained.

[0026]

As described above, according to the present invention, by forming an insulator layer, a conductor layer, and a resistor layer in a predetermined pattern on the surface of the thermistor body, the resistance of the thermistor and the resistor is reduced. A composite device having characteristics equivalent to a series circuit is provided.

According to this composite element, an element having characteristics equivalent to a series circuit of a thermistor and a resistor can be realized as a single element.
It is possible to reduce the size of a circuit such as a temperature compensating circuit composed of a resistance value. In particular, this element is useful as a temperature compensating circuit for a temperature-compensated crystal oscillator or the like for which there is a strong need for miniaturization.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view, an equivalent circuit diagram, and a manufacturing process diagram of a composite device according to an embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermistor body 2, 3 Conductor layer 4, 5 Insulator layer 6, 7 Conductor layer 8 Resistor layer 9, 10, 11, 12 Insulator layer 13, 14 Terminal electrode 21 Thermistor thin plate 22, 23 Conductor layer 24 Insulator layer 26,27 Conductor layer 28 Resistor layer 30 Insulator layer

Claims (3)

[Claims] 1. A terminal comprising: a chip-shaped thermistor element; terminal electrodes formed on both end faces of the thermistor element; and a resistor layer formed on a side surface of the thermistor element. A composite element in which an electrode, the resistor layer, the thermistor element, and the other terminal electrode are connected in series in this order. 2. The device according to claim 1, wherein the resistor layer is provided on one side surface of the thermistor element, and one terminal electrode is insulated from the thermistor element and conducts only to the resistor layer; A composite element, wherein the other terminal electrode conducts only to the thermistor element and is insulated from the resistor layer. 3. A step of forming conductive layers 22 and 23 on the entire surface of both plate surfaces of the thin plate-shaped thermistor body, and forming a strip-shaped insulating layer 24 on one of the conductive layers 22 at a predetermined interval. Forming an insulating layer 30 extending in the same direction as the insulating layer 24 on the other conductive layer 23 at a predetermined interval; and forming a conductive layer between the insulating layers 24, 24. The conductor layer 26 is formed on the body layer 22, and the conductor layer 27 is formed only on the insulator layer 24 so that the position of the edge of the conductor layer 27 matches the position of the edge of the insulator layer 30. And a resistor layer 28 over these conductor layers 26 and 27.
Forming an insulating layer covering the conductor layer 26 and the resistor layer 28; cutting the thin plate-shaped thermistor body in a direction orthogonal to the longitudinal direction of these strip-shaped layers to form a strip. Performing the step of forming an insulator layer on the side surface of the obtained strip-shaped element body; and cutting the strip-shaped element body along the edges of the conductor layer 27 and the insulator layer 30 in a direction orthogonal to the longitudinal direction thereof. A step of cutting along the predetermined line C to form a chip, and terminal electrodes on both end surfaces of the obtained chip, one terminal electrode 13 being electrically connected only to the conductor layer 7 on one chip side surface, and Forming the terminal electrode 14 so as to be conductive only to the conductor layer 3 on the other chip side surface.