JPH10178149A - Lead frame member and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame member and its manufacturing method, wherein, by screen printing method and dispense method, an inner lead fixing resin layer is formed directly. SOLUTION: With the entirety of one surface of an inner lead 112 as a lead frame raw material surface 112S, a thin-wall part 112a which is thinner than a raw material is formed at a tip end of the inner lead 112. Plural number of inner lead fixing parts 120 and 125 of insulating resin, fix all inner leads 112 while bridging and are in train as far as a tab suspension bar 114, supported with the tab suspension bar 114, while being provided in such shape as to surround a die pad 111. At least the first inner lead fixing part 120 is provided on the recessed surface side below the lead frame raw material surface 112S of the thin-wall part 112a, so as to bridge the inner leads 112. The second inner lead-fixing part 125 is provided at a place of the same thickness as the lead frame raw material of the inner lead 112, so as to bridge the inner leads 112.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame member as an assembly member of a resin-sealed semiconductor device, and more particularly to a lead frame member for a semiconductor device having a fine inner lead pitch and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the trend toward higher performance of electronic devices and lighter, thinner and smaller electronic devices, LSIs, as typified by ASICs, have been increasingly integrated and functionalized. Multi-terminal ICs, especially ASICs represented by gate arrays and standard cells, microcomputers, DS
P (Digital Signal Processo)
As a package for providing a user with high cost performance such as r), a plastic QFP (Quad Flat Package) using a lead frame has become mainstream, and has now been put to practical use up to 300 pins or more.

The QFP has been developed as a structure in which outer leads for electrically connecting to an external circuit are provided in four directions of a package and which can cope with multi-terminals.
Generally, a lead frame member 620 composed of a lead frame 630 and an inner lead fixing tape 640 shown in FIG. 6A is used. As shown in FIG.
The semiconductor element 610 is mounted on the die pad 631, and the tip of the inner lead 632, which has been subjected to a surface treatment such as silver plating, is connected to the terminal 611 of the semiconductor element 610 by a wire 612. The whole is sealed with a sealing resin 613. Stop, and
The dam bar portion 634 is cut, and the outer lead 633 is formed in a gull wing shape. FIG. 6 (a)
(B) is an enlarged view of a part of a cross section taken along line F1-F2 in FIGS. The single-layer lead frame 630 used here usually has a high electrical conductivity such as a 42 alloy (42% nickel-iron alloy) or a copper alloy.
In addition, a metal material having high mechanical strength is used as a material, and the outer shape is processed by a photo etching method or a stamping method.

FIG. 6 shows a multi-terminal resin-encapsulated semiconductor device (plastic-encapsulated package).
The production of the lead frame member shown in (a) was performed in the process shown in FIG. Hereinafter, the process shown in FIG. 7 will be briefly described. First, a lead frame material made of a thin metal plate is externally processed by etching or stamping. (FIG. 7A) The outer shape processing is performed in a state where the connecting portion 638 is provided to extend to the tip of the inner lead 632 and connect the inner leads 632 to each other. The connecting portion 638 is unnecessary when manufacturing a semiconductor device, and is removed in a step described later. In this case, it is also connected to the die pad 631. Next, a noble metal plating 650 such as silver plating is applied to the tip of the inner lead 632. (FIG. 7B) If necessary, the die pad 631 is also plated with a noble metal. Noble metal plating 6 at the tip of inner lead 632
50 is for wire bonding, and the noble metal plating of the die pad 631 is for die bonding. Next, after attaching the inner lead fixing tape 640 so as to straddle the inner lead 632,
It is attached to the inner lead 632 by thermocompression bonding. (FIG. 7 (c)) As the fixing tape 640 for the inner lead 632, a polyimide tape with an adhesive is generally used. It is attached to the inner lead 632 by crimping. Next, a connecting portion 638 extending to the inner lead 632 and connecting the inner leads 632 to each other.
Is removed with a press. (FIG. 7D) Thereafter, if necessary, the die pad 631 is subjected to downset processing. (FIG. 7E) In the case of a lead frame member used for a resin-encapsulated semiconductor device that does not require multiple terminals, the connection portion 638 is used.
In some cases, the inner lead fixing tape 640 may be attached without providing the tape. In this case, the step shown in FIG. 7D is not required in the step shown in FIG.

[0005] However, there is a strong demand for more terminals in a semiconductor device, and there is an increasing demand for miniaturization of the outer shape of a lead frame. Then, FIG.
In the miniaturization processing by thinning the lead frame material in the lead frame member 620 shown in (1), there are limitations due to the lead strength and the strength required for mounting, and the limit has been exceeded. For this reason, a lead frame has been developed in which only the tip of the inner lead is made thinner than the lead frame material, and further miniaturization is possible, and the strength of the lead and the entire lead frame is secured.

FIG. 5 shows an example in which a part of a lead frame material is formed to be thinner in order to easily explain a method of processing the outer shape of a lead frame in which only the tip of the inner lead is made thinner than the lead frame material. I will. FIG.
FIG. 3 is a cross-sectional view of each step of the inner lead tip portion for forming the inner lead tip portion into a thin shape. In addition, about the place to process the outer shape with the thickness of the lead frame material,
A resist pattern having substantially the same shape and size is formed on both sides of the lead frame material and etching is performed. In FIG.
510 is a lead frame material, 510A is a thin portion, 52
0A, 520B is a resist pattern, 530 is a first opening, 540 is a second opening, 550 is a first recess,
60 is a second concave portion, 570 is a flat surface, and 580 is an etching resistance layer (filler layer). First, after cleaning and degreasing both sides of a lead frame material made of a copper alloy and having a thickness of 0.15 mm and having a strip shape, a mixed solution of a casein aqueous solution using potassium dichromate as a photosensitive agent is used. Resist on both sides and after drying the resist,
Using a predetermined pattern plate, predetermined regions of the resist on both sides of the lead frame material are respectively exposed and developed, and a first opening 530 and a second opening 54 having a predetermined shape are formed.
The resist patterns 520A and 520B having 0 were formed. (FIG. 5 (a)) The first opening 530 is for etching the lead frame material 510 solidly from the opening and thinner than the lead frame material 510 in a later etching process. The second opening 540 is for forming the shape of the tip of the inner lead. Next, using a ferric chloride solution having a liquid temperature of 50 ° C. and a specific gravity of 46 Baume, the both surfaces of the lead frame material 510 on which the resist pattern was formed were etched at a spray pressure of 3.0 kg / cm ² to form a solid state Etching was stopped when the depth h of the first recess 550 corroded (flat) reached about ２ of the lead frame member. (FIG. 5B) In the first etching, the lead frame material 51 is used.
The reason for simultaneous etching from both sides is to shorten the second etching time to be described later by etching from both sides. Compared to the case of single-side etching only from the resist pattern 520B side, the first etching and the The total time of the second etching is reduced.

Next, a hot-melt type wax (acid wax manufactured by The Inktec Co., Ltd., model No. MR) serving as an etching resistance layer 580 is formed in the corroded first concave portion 550 on the first opening 530 side. −WB6),
It was applied using a die coater and embedded in the first concave portion 550 which was corroded in a solid shape (flat shape). The resist pattern 520B was also applied to the etching resistance layer 580. (FIG. 5C) The etching resistance layer 580 is formed by using a resist pattern 520B.
Although it is not necessary to apply the coating to the entire upper surface, it is difficult to apply the coating to only a part including the first concave portion 550. Therefore, as shown in FIG. An etching resistance layer 580 was applied to the entire surface of the portion 530 side. The etching resistance layer 580 used in the present embodiment is an alkali-soluble wax, but it is basically preferable that it is resistant to an etchant and has some flexibility at the time of etching, and is not particularly limited to the above wax. , UV curing type may be used. Thus, the etching resistance layer 580
Is embedded in the corroded first concave portion 550 on the surface side on which the pattern for forming the shape of the inner lead tip portion is formed, so that the first concave portion 550 is not corroded and becomes large during etching in a later step. As well as mechanical strength reinforcement for high-definition etching, and high spray pressure (3.0 kg / c
m ² ), which facilitates the progress of etching in the depth direction. Thereafter, a second etching is performed to remove the first concave portion 550 which has been corroded in a solid shape (flat shape).
The lead frame material 510 was etched from the concave portion 560 side opposite to the formation surface and penetrated to form a thin portion at the tip of the inner lead. (FIG. 5 (d)) The etched surface parallel to the lead frame surface produced by the first etching process is flat, but the two surfaces sandwiching this surface are concave toward the inner lead. . Then washing,
Removal of the etching resistance layer 580 and removal of the resist films (resist patterns 520A and 520B) were performed to obtain a lead frame in which the thin portion at the tip of the inner lead was finely processed. (FIG. 5E) The etching resistance layer 580 and the resist films (resist patterns 520A and 520B) were removed by dissolving with an aqueous sodium hydroxide solution.

As described above, the etching method in which etching is performed in two stages is generally referred to as a two-step etching method, and is a processing method excellent in accuracy in particular. In the manufacture of the lead frame shown in FIG. 5, a two-stage etching method and a method of externally forming the lead frame material while partially reducing the lead frame material by devising a pattern shape are employed. . still,
The method of forming the thinner end of the inner lead of the lead frame is not limited to the above etching method.

The fine processing of the thin portion at the tip of the inner lead by the above method depends on the shape of the second concave portion 860 and the thickness t of the tip of the inner lead finally obtained. When the thickness t is reduced to 50 μm, fine processing can be performed up to the inner lead tip pitch p of 0.15 mm, with the flat width W1 shown in FIG. When the plate thickness t is reduced to about 30 μm and the flat width W1 is set to about 70 μm, fine processing can be performed until the tip p of the inner lead is about 0.12 mm. However, depending on how the thickness t and the flat width W1 are set, the inner lead may be formed. The tip pitch p can be manufactured to a smaller pitch.

[0010]

However, in such a lead frame in which only the tip of the inner lead is formed thin, when the above-described tape for fixing the inner lead is used, the thickness of the thin portion and the thickness of the lead frame material are reduced. Since there is a step between the first and second portions, it is difficult to apply the fixing tape uniformly at the step, and in some cases, there is a problem that the fixing tape cannot be attached. If the fixing tape cannot be uniformly attached, the clamp during wire bonding cannot be stably performed. Also, separately
The polyimide film used as the base of the fixing tape is expensive, and since it is necessary to use a mold for its outer shape processing, there is a problem that for small-volume products, the cost is high and the delivery time is long. Response was required.

There is also known a method of forming an inner lead fixing resin layer by screen printing directly on a lead frame without using a fixing tape. According to this screen printing method, when the coating amount is small, the resin is selectively applied only to the upper surface of the lead, and a bridge structure between the leads cannot be formed. When the coating amount is large, the resin extends to the lead and the stage. It is necessary to clean the resin because it is applied, and even if the application amount can be set appropriately, the viscosity is set to a relatively low viscosity for printing, and the resin located at the bridge between the leads during the curing reaction It falls between, and the surface of the resin on the lead becomes a curved surface,
There is a problem that the clamp at the time of bonding may be insufficient. In addition, a method of directly forming a resin layer for fixing the inner lead by a dispensing method without using a fixing tape is also known.
Basically, it has the same problems as screen printing. When a resin layer for fixing the inner lead is formed by the screen printing method or the dispensing method, the resin is completely cured in order to make the surface of the resin on the lead a planar shape and to sufficiently clamp the wire bonding. Before, that is, crush the resin by thermocompression bonding in a semi-cured state,
Although the height of the surface is made uniform, the resin bleeds to the upper surface of the lead when being crushed, thereby deteriorating the accuracy of the resin layer shape. Furthermore, in the dispensing method, since the amount of application is large at the dispense start point and the dispense point, applicable leads have certain restrictions such that the tab suspension bar is used as a start point and an end point, and the width of the tab suspension bar is increased. Is necessary,
There are restrictions on applicable lead shapes. As described above, even when the resin layer for fixing the inner leads is directly formed by the screen printing method or the dispensing method without using the fixing tape, there are various problems, and a measure has been required. Under such circumstances, the present invention is based on the problem of using a fixing tape and the case where the inner lead fixing resin layer is directly formed by a screen printing method and a dispensing method without using the fixing tape. It is an object of the present invention to provide a lead frame member having a lead frame and an inner lead fixing portion, which can solve the above problem. at the same time,
An object of the present invention is to provide a method for manufacturing the lead frame member.

[0012]

A lead frame member according to the present invention is a lead frame member having a lead frame and a plurality of inner lead fixing portions, which is used for a resin-encapsulated semiconductor device. A die pad is provided, the entire surface of one surface of the inner lead is a lead frame material surface, a thin portion thinner than the thickness of the material is formed at the tip of the inner lead, and the plurality of inner lead fixing portions are , Each of which is made of insulating resin and fixed by bridging all inner leads,
Further, it is connected to the tab hanging bar and is supported by the tab hanging bar, and is provided in a shape substantially surrounding the die pad, and at least the first inner lead fixing portion is recessed from the lead frame material surface of the thin portion. The surface side is provided so as to bridge over the inner leads, and the second inner lead fixing portion is provided so as to bridge over the inner leads at the same thickness as the lead frame material of the inner leads. It is characterized by having.
The first inner lead fixing portion is provided at a distal end portion of the thin portion of the inner lead on a surface side recessed from the lead frame material surface. Further, the inner lead fixing portion is made of a single-layer insulating resin.

Further, the method for manufacturing a lead frame member according to the present invention is a method for manufacturing a lead frame member according to the present invention, wherein (A) a connection for integrally connecting to the tip of the inner lead and for connecting the inner leads together. (B) forming an insulative resin part for forming an inner lead fixing part into a predetermined shape in a semi-cured state; The insulating resin portion formed in a predetermined shape in the cured state is fixed to a predetermined position of the lead frame by thermocompression bonding, and the insulating resin portion is fixed in a (D) resin portion fixing step. A curing step of curing the insulating resin portion by a heating unit and / or an ultraviolet irradiation unit; and (E) a step of removing a connection portion of the lead frame after the curing step. . Further, the insulating resin portion fixing step described above is characterized in that all of the plurality of insulating resin portions are simultaneously fixed by thermocompression bonding.

Here, the thickness of the lead frame material is the original thickness when a lead frame is formed by etching or the like, and refers to the thickness at a location where etching does not enter. In the etching shown in FIG. , FIG.
This refers to the thickness of t ₀ shown in (e). In addition, the tip of the inner lead means the tip of the inner lead on the die pad side.

[0015]

According to the lead frame member of the present invention having such a structure, the problem in the case of using the fixing tape or the direct fixing of the inner lead by the screen printing method or the dispensing method without using the fixing tape is adopted. It is possible to provide a lead frame member including a lead frame and an inner lead fixing portion, which can solve the problem when forming a resin layer for use. As a result, it is possible to further increase the number of terminals of the resin-encapsulated semiconductor device using the lead frame member. Specifically, the lead frame is provided with a die pad, the entire surface of one side of the inner lead is used as the lead frame material surface, and a thin portion thinner than the material thickness is formed at the tip of the inner lead. The plurality of inner lead fixing portions are each made of an insulating resin, and are fixed so as to bridge over all the inner leads,
Further, it is connected to the tab hanging bar and is supported by the tab hanging bar, and is provided in a shape substantially surrounding the die pad, and at least the first inner lead fixing portion is recessed from the lead frame material surface of the thin portion. The surface side is provided so as to bridge over the inner leads, and the second inner lead fixing portion is provided so as to bridge over the inner leads at the same thickness as the lead frame material of the inner leads. This has been achieved. That is, by forming the tip of the inner lead of the lead frame to be thin, fine processing at the tip of the inner lead is enabled, and at least the first inner lead fixing portion and the second inner lead fixing portion are provided. By doing so, the inner lead is firmly fixed. In particular, since the first inner lead fixing portion is provided at the tip portion on the die pad side of the thin region of the inner lead, it is possible to more stably clamp in wire bonding. Further, by forming the inner lead fixing portion from a single layer of insulating resin, good processability is achieved.

In the method of manufacturing a lead frame member of the present invention, by adopting such a configuration, it is possible to further increase the number of terminals of the resin-encapsulated semiconductor device using the lead frame member. In particular, the insulating resin portion fixing step is to fix all of the plurality of insulating resin portions simultaneously by thermocompression bonding.
All the plurality of insulating resin portions can be simultaneously formed.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a lead frame member according to the present invention will be described with reference to the drawings. First, a first embodiment will be described. FIG. 1A is a plan view of a lead frame member according to the first embodiment, and FIG. 1B is a cross-sectional view of an inner lead portion.
1A shows a part of a cross section taken along line A1-A2, and FIGS. 1C and 1B show a cross section taken along line A3-A4 in FIG. 1B, and FIG. (B) Fig. 1
FIG. 6B shows a cross section taken along line A5-A6 of FIG.
2A is an enlarged plan view of a corner portion including a tab suspension bar of the lead frame member shown in FIG. 1, and FIG. 2B is a sectional view taken along line B1-B2 in FIG. FIG. 2C is a perspective view showing a part of the state of the inner lead fixing portion near the tab suspension lead. In FIG. 1, 100 is a lead frame member, 110 is a lead frame, 111 is a die pad, 112 is an inner lead, 112A is a thin portion, 112B is a thick portion, 11
2C is a cut surface, 112E is an etched surface, 112S is a lead frame material surface, 113 is an outer lead, 114
Is a dam bar, 115 is a tab hanging bar, 116 is a frame portion, 120 is a first inner lead fixing portion, 120C is a cut surface, 125 is a second inner lead fixing portion, 150
Is silver plating. Lead frame member 10 of the present embodiment
Reference numeral 0 denotes a lead frame member for a resin-encapsulated semiconductor device having a lead frame 110, a first inner lead fixing portion 120 for fixing inner leads, and a second inner lead fixing portion 125, The inner leads are firmly fixed. In particular, by providing the first inner lead fixing portion 120 at the tip of the inner lead, it is possible to stably clamp during wire bonding. The lead frame 110 is provided with a die pad 111. One surface of the lead frame 110 is a lead frame material surface, and the tip of the inner lead 112 is formed to be thinner than the thickness of the material. It is a structure that can handle.
Hereinafter, each part of the lead frame member 100 of this embodiment will be described.

The lead frame 110 is made of a copper material having a thickness of 0.15 mm and has an outer lead pitch of 0.1 mm.
4 mm, the lead frame member 100 is a QFP (Quad Flat) having a package size of 28 mm square.
Package). The outer shape of the lead frame 110 is formed by etching shown in FIG. 4, and the tip of the inner lead 111 has a thin portion 1 formed thinner than the thickness of the lead frame material.
12A, one surface is an etching surface 112E, and the other surface is a lead frame material surface 112S.
Only the tip of the inner lead 111 is 50 μm thick and thin, and other than that, the thickness of the lead frame material is 0.15 mm.
It is.

Also, the first inner lead fixing portion 120
And the second inner lead fixing portion 125 are both made of a thermosetting insulating resin mainly containing an epoxy resin,
Each of the inner leads is fixed so as to straddle the bridge, and is connected to the tab hanging bar 115.
15 and is provided in a shape substantially surrounding the die pad. The first inner lead fixing part 120 is
On the thin portion forming surface side of the lead frame 110, a tip portion of the thin region of the inner lead on the die pad 111 side is provided so as to bridge between the inner leads 112, and the second inner lead fixing portion 125 is provided with an inner lead. At a place having the same thickness as the lead frame material 112, the inner lead 112 is provided so as to bridge over it. As shown in FIG. 1C, the inner leads 112 are fixed to each other in a state where a part of the inner leads 112 is embedded in the inner lead fixing portion 120.
In addition, the inner lead fixing portion 12 of the inner lead 112
The amount of embedding to 0 may be such that the inner leads can be fixed to each other, but the variation in the amount of embedding of the inner leads is preferably as small as possible, and the variation in the embedding amount is preferably within 10% of the average value. In addition, the thickness of the inner lead fixing portion 120 is 25 μm in the present embodiment, but is preferably 30 μm or less.
It is preferably within 5% of the average value. In this embodiment, the silver plating 150 is not provided below the inner lead fixing portion 120, but the inner lead fixing portion 120 may be provided on the silver plating portion 150.

Since the tip surface of the inner lead of this embodiment is formed by a manufacturing method shown in FIG.
At 12C, the die pad side of the inner lead fixing portion 120 also becomes the cut surface 120C, and both cut surfaces form the same surface.

Next, a lead frame member according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3A is a plan view of the lead frame member according to the second embodiment, and FIG. 3B is a cross-sectional view of the inner lead portion.
FIG. 3C shows a part of a cross section at D2.
1A shows a cross section taken along line D3-D4 in FIG. 1B, and FIGS. 3C and 2B show D5-D in FIG. 1B.
6 shows a cross section of FIG. 3, reference numeral 300 denotes a lead frame member, 310 denotes a lead frame, 311
Is a die pad, 312 is an inner lead, 312A is a thin portion, 312B is a thick portion, 312C is a cut surface, 312E
Is the etched surface, 312S is the lead frame material surface, 3
13 is an outer lead, 314 is a dam bar, 315 is a tab hanging bar, 316 is a frame portion, 320 is a first inner lead fixing portion, 320C is a cut surface, 325 is a second inner lead fixing portion, and 350 is silver plating. is there. The lead frame member 300 of the present embodiment is different from the lead frame member of the first embodiment in that the first inner lead fixing portion 3
20, the second inner lead fixing portion 325 is formed in the hanging bar 350 so as to surround the die pad 311 in a separated state.

In the first and second embodiments, a copper alloy was used as a lead frame material, but the invention is not particularly limited to this. For example, a 42 alloy (42% nickel-iron alloy) may be used. Although an epoxy-based thermosetting resin is used as the inner lead fixing portion, an organic material having heat resistance such as a thermosetting polyimide resin may be used.

Next, an embodiment of a method for manufacturing a lead frame member according to the present invention will be described with reference to FIG. The manufacturing method according to the present embodiment is a method for manufacturing the lead frame member according to the first embodiment shown in FIG. First, a lead frame 110 having a thin portion 112A in which the tip of the inner lead 112 was formed thinner than the thickness of the lead frame material was prepared by the etching method shown in FIG. (FIG. 4A) Lead frame 1 whose outer shape has been processed by etching
The tip of the inner lead 112 is connected to the extended connecting portion 1.
18 integrally connects with the die pad 111.
Since the connecting portion 118 is unnecessary when fabricating the semiconductor device, it is removed by a press in a step described later. Next, silver plating 150 was applied to the wire bonding area of the inner lead 112 by an ordinary partial plating method. (FIG. 4
(B) If necessary, the die pad 111 is also plated with a noble metal such as silver plating for die bonding.

On the other hand, a thermosetting insulating resin 160 mainly composed of epoxy resin for forming the inner lead fixing portion 120 is formed in a shape corresponding to the inner lead fixing portion 120 of the lead frame 110 by a 100 μm thick PET. After coating and forming to a thickness of 40 μm on a resin film substrate 170 made of (polyethylene terephthalate) by screen printing, a thermosetting insulating resin mainly composed of an epoxy resin applied and formed on the resin film substrate 170 is A volatilization treatment for volatilizing the solvent was performed.
(FIG. 4C) Incidentally, FIG. 4C and FIG. 4B are E1-E2 in FIG. 4C and FIG.
FIG. The viscosity of the epoxy resin was adjusted to 200,000 cps by adding a filler to the resin, but the viscosity was from 30,000 cps to 300,000 cps.
Is preferable. It is preferable to use a solvent having a boiling point of 120 ° C. or higher in order to prevent a change in the viscosity of the resin on the screen.
N-methyl-2-pyrrolidone was used. As the filler, a low ionic impurity or a low radioactive substance containing material for a semiconductor package is used. In this embodiment, R-2 manufactured by Nippon Aerosil Co., Ltd. is used.
00 (average particle size: 0.5 μm) was used. If necessary, 3 to 30% by weight is added. The resin film substrate 170 has solvent resistance to a solvent of an epoxy resin which is a thermosetting resin to be screen-printed, and has heat resistance,
Also, an epoxy resin having releasability is suitable. PET
Besides, PPS (polyphenylene sulfide), polypropylene, PI (polyimide), aramid fiber, PE
(Polyethylene) and the like can be used. Resin film substrate 1
The thickness of 70 is desirably 12.5 μm to 120 μm, and 30 μm to 100 μm from the viewpoint of material cost and mechanical strength.
m is preferred. Epoxy resin film substrate 170
As a screen plate used for printing on the surface, a solvent-resistant emulsion (MSP-2 manufactured by Murakami Screen Co., Ltd.) 40 μm # 150 mesh screen was used. The volatilization treatment was performed by heating to 80 ° C. for 30 minutes. The volatilization condition may be 80 ° C. for 20 minutes, and the time is shorter as the temperature is increased. 1
In the case of 00 ° C., one minute is sufficient. However, when the temperature is high, the working efficiency is improved, but air bubbles are easily generated. Therefore, the temperature is preferably 60 ° C to 120 ° C. 8
It takes 10 minutes at 0 ° C and 2 minutes at 100 ° C.

Next, the resin film substrate 1 subjected to the volatilization process obtained in the step shown in FIG. 4C is applied to the lead frame after the silver plating obtained in the step shown in FIG.
The thin portion 120 of the inner lead 112 of the lead frame 110 is aligned with the thermosetting insulating resin 160 mainly composed of an epoxy resin applied and formed on the
Jigs 180 and 181 at positions straddling A and thick portion 120B.
And heat-pressed from both sides of the lead frame. (FIG. 4D) The jig 181 sandwiching the thermosetting insulating resin 160 with the lead frame 110 is formed in the shape of the lead frame 110 so that the thermosetting insulating resin 160 that has been crimped becomes flat. A matching projection 181A is provided.
In this embodiment, the thermocompression bonding was performed at 160 ° C. for 0.3 seconds, but the thermocompression bonding was performed at 40 to 260 ° C., and the compression time corresponds to the temperature, but is preferably about 0.1 to 60 seconds.

Next, the resin film substrate 170 is peeled off from the lead frame 110 while the thermosetting insulating resin 160 is still attached to the lead frame 110,
C, a curing treatment of heating and curing the thermosetting insulating resin 160 for 3 minutes was performed. (FIG. 4 (e))

Thereafter, the connecting portion 118, which is unnecessary when the semiconductor device is manufactured, is removed by pressing, and the lead frame member 100 of Example 1 shown in FIG. 1 is manufactured. (FIG. 4
(F)) Further, if necessary, down-set processing of the die pad 111 is performed.

In the method of manufacturing the lead frame member according to the present embodiment shown in FIG. 4, an octopus printing, a dispensing method or the like may be used instead of the application of the thermosetting insulating resin by screen printing. In the method for manufacturing a lead frame member of the present embodiment shown in FIG. 4, after the resin film substrate 170 is peeled off from the lead frame 110,
Although the hardening process for hardening the thermosetting insulating resin 160 is performed, the resin film substrate 170 may be separated from the lead frame 110 after the hardening process for hardening the thermosetting insulating resin 160 is performed.

The method for manufacturing the lead frame member of the present invention is not limited to the method for manufacturing the lead frame member of the above embodiment. For example, after forming a solvent-free thermosetting resin containing no varnish-like solvent in a predetermined shape on a film having releasability from the thermosetting resin, the mixture is left at room temperature and heated or depressurized to be thermoset. A viscosity increasing process for increasing the viscosity of the thermosetting resin is performed, and a thermosetting resin is attached to a predetermined portion of the inner lead of the lead frame by thermocompression bonding using a jig in the same manner as in the step of FIG. A heat treatment for peeling and removing the film from the lead frame and curing the thermosetting resin may be performed. Also in this method, the resin film substrate may be peeled off from the lead frame after performing a curing treatment for curing the thermosetting insulating resin.

The method of manufacturing the lead frame member 300 of the second embodiment shown in FIG. 3 is basically performed in the steps of the method of manufacturing the lead frame member of the above embodiment shown in FIG. The shape of the thermosetting insulating resin 160 in (c) is different. In manufacturing the lead frame member 300 according to the second embodiment shown in FIG. 3, the shape of the thermosetting insulating resin 160 in FIG. 4C is separated by a tab hanging bar as shown in FIG. However, unlike the case of the lead frame member according to the first embodiment, a printing method using a metal mask can be employed because of such a shape.

[0031]

As described above, according to the present invention, the inner lead fixing portion is directly fixed by the screen printing method and the dispensing method without using an expensive fixing tape requiring cutting by a mold as the inner lead fixing portion. In this case, it is possible to provide a lead frame member including a lead frame and a plurality of inner lead fixing portions, which can solve the problem when the resin layer is formed. At the same time, it is possible to provide a method for manufacturing a lead frame member of the present invention. As a result, the present invention makes it possible to provide a resin-encapsulated semiconductor device that can cope with the increase in the number of terminals in a resin-encapsulated semiconductor device accompanying the high integration of semiconductor elements.

[Brief description of the drawings]

FIG. 1 is a plan view and a sectional view of a main part of a lead frame member according to a first embodiment.

FIG. 2 is a partially enlarged plan view of the lead frame member according to the first embodiment.

FIG. 3 is a plan view and a cross-sectional view of a main part of a lead frame member according to a second embodiment.

FIG. 4 is a manufacturing process diagram of the lead frame member according to the first embodiment.

FIG. 5 is a manufacturing process diagram of a lead frame used for the lead frame member of the embodiment.

FIG. 6 is a view for explaining a conventional lead frame member and a resin-sealed semiconductor device using the same.

FIG. 7 is a manufacturing process diagram of a conventional lead frame member.

[Explanation of symbols]

 100, 300 Lead frame member 110, 310 Lead frame 111, 311 Die pad (tab) 112, 312 Inner lead 112A, 312A Thin portion 112B, 312B Thick portion 112C, 312C Cut surface 112E, 312E Etched surface 112S, 312S Lead frame material Surface 113, 313 Outer lead 114, 314 Dam bar 115, 315 Tab suspension lead 116, 316 Frame part 118 Connecting part 120, 320 First inner lead fixing part 125, 325 Second inner lead fixing part 120C Cutting surface 150, 350 Silver plating 160 Thermosetting insulating resin 170 Resin film substrate 180, 181 Jig 181A Projection 510 Lead frame material 510A 410A has thin portion 520A, 520B Dist pattern 530 First opening 540 Second opening 550 First recess 560 Second recess 570 Flat surface 580 Etching resistance layer (filler layer) 600 Semiconductor device 610 Semiconductor element 611 Pad of semiconductor element 612 Wire 613 Resin section 620 Lead frame member 630 Lead frame 631 Die pad section 632 Inner lead section 633 Outer lead section 634 Dam bar 635 Dam suspension bar 636 Frame (frame) section 638 Connecting section 640 Fixing tape 650 Silver plating

Claims (5)

[Claims] 1. A lead frame member having a lead frame and a plurality of inner lead fixing portions for use in a resin-sealed semiconductor device, wherein the lead frame is provided with a die pad, and one of the inner leads is provided. The entire surface is a lead frame material surface, a thin portion thinner than the thickness of the material is formed at the tip of the inner lead, and the plurality of inner lead fixing portions are each made of insulating resin, and all inner leads are formed. Is fixed so as to straddle the bridge, and is connected to the tab hanging bar, is supported by the tab hanging bar, is provided in a shape substantially surrounding the die pad, at least the first inner lead fixing portion, The side of the thin portion recessed from the lead frame material surface is provided so as to bridge over the inner leads, and the second inner lead fixing portion is A lead frame member characterized in that it is provided so as to bridge over the inner leads at the same thickness as the lead frame material of the inner leads. 2. The lead frame member according to claim 1, wherein the first inner lead fixing portion is provided at a distal end of a thin portion of the inner lead on a surface side recessed from a lead frame material surface. . 3. The lead frame member according to claim 1, wherein the inner lead fixing portion is made of a single-layer insulating resin. 4. The method of manufacturing a lead frame member according to claim 1, wherein (A) the lead is provided in a state where a connecting portion is integrally provided at the tip of the inner lead and a connecting portion connecting the inner leads is provided. Externally processing the frame, (B) forming an insulating resin portion for forming an inner lead fixing portion into a predetermined shape in a semi-cured state, and (C) forming a predetermined shape in a semi-cured state. (D) fixing the insulating resin part to the predetermined position of the lead frame by thermocompression bonding, and (D) fixing the insulating resin part fixed in the resin part fixing step. Curing step of curing by heating means and or ultraviolet irradiation means,
(E) removing the connecting portion of the lead frame after the curing step. 5. The insulating resin portion fixing step according to claim 4,
A method for manufacturing a lead frame member, wherein a plurality of insulating resin portions are all fixed simultaneously by thermocompression bonding.