JPH10169082A - Lightweight woody material - Google Patents

Lightweight woody material

Info

Publication number
JPH10169082A
JPH10169082A JP32656596A JP32656596A JPH10169082A JP H10169082 A JPH10169082 A JP H10169082A JP 32656596 A JP32656596 A JP 32656596A JP 32656596 A JP32656596 A JP 32656596A JP H10169082 A JPH10169082 A JP H10169082A
Authority
JP
Japan
Prior art keywords
wood
heat insulating
resin foam
phenol resin
insulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32656596A
Other languages
Japanese (ja)
Inventor
Yasuo Yanagawa
靖夫 柳川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nara Prefecture
Original Assignee
Nara Prefecture
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nara Prefecture filed Critical Nara Prefecture
Priority to JP32656596A priority Critical patent/JPH10169082A/en
Publication of JPH10169082A publication Critical patent/JPH10169082A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an excellent heat insulating function or sound absorbing function by filling the internal space of a panel, the recess of an I-type beam or the internal space of a box-type beam with an insulation material made of phenol resin expanded material and a wood chip, an insulation material made of a phenol resin expanded material and wood powder, or the like. SOLUTION: The internal space of a panel formed out a surface material 1a and a frame material 2a is filled with an insulation material made of phenol resin expanded material and wood chips, an insulation material 3b made of phenol resin expanded material and wood powder, or an insulation material 3c made of a phenol resin expanded material, wood chips and wood powder. Then, the surface material 1a formed out of plywood, plaster board or the like is subjected to flame proof finishing treatment, using one type or a plurality of types of compounds among a phosphorus compound, a boron compound. a halogen compound, an aluminum compound and an antimony compound. Thus, the appearance of dew condensation in the panel or the wall can be prevented.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は住宅等の壁材、床
材、天井材、屋根材等として用いられるパネル状の木質
系材料及び住宅の柱や梁といった構造用材料として用い
られる木質系構造用材料に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel-like wooden material used as a wall material, a floor material, a ceiling material, a roof material and the like of a house, and a wooden structure used as a structural material such as a pillar and a beam of a house. For materials.

【0002】[0002]

【従来の技術】阪神・淡路大震災では木造住宅の倒壊が
大きな問題となった。なかでも在来工法、いわゆる軸組
工法で建てられた家に大きな被害が発生した割合が高
く、一方2×4工法やプレハブ工法で建てられた家では
相対的に被害が少なかったことが報告されている。この
認識に基づき在来軸組工法による家の設計でも2×4工
法やプレハブ工法の長所を取り入れる試みがなされてい
る。かかる試みの一つとしてパネルを床、壁、天井、屋
根等に使用するというものがあり、現在様々なパネルが
開発されている。そして、現在開発中のパネルの多くの
ものはパネル内部に断熱材を充填したものである。
2. Description of the Related Art In the Great Hanshin-Awaji Earthquake, collapse of wooden houses became a major problem. In particular, it was reported that houses built using the conventional method, the so-called framing method, had a high rate of severe damage, while houses built using the 2x4 method or the prefabricated method had relatively little damage. ing. Based on this recognition, attempts have been made to incorporate the advantages of the 2 × 4 construction method and the prefabricated construction method even in the design of a house by the conventional framing method. One of such attempts is to use panels for floors, walls, ceilings, roofs and the like, and various panels are currently being developed. Many of the panels currently under development are filled with insulation inside the panels.

【0003】一方、柱材や梁材といった構造用材料につ
いては、軽い程よいといわれている。これは地震時の揺
れにより建築物に加わるエネルギーはその建築物の重さ
と密接な関係があること、及び材料の接合部や建物の基
礎に加わる力は、建築物の重さに左右されることが主な
理由である。そこで木質系の構造用材料でもI型梁やボ
ックス型梁などのように、軽量化を図った製品が開発さ
れている。
[0003] On the other hand, it is said that the lighter the structural material such as a column material or a beam material, the better. This means that the energy added to the building due to the shaking during the earthquake is closely related to the weight of the building, and that the force applied to the joints of the materials and the foundation of the building depends on the weight of the building Is the main reason. Therefore, even wood-based structural materials such as I-beams and box-shaped beams have been developed to reduce the weight.

【0004】[0004]

【発明が解決しようとする課題】[Problems to be solved by the invention]

1、 内部に断熱材を充填したパネルには、その充填し
た断熱材の種類に応じ以下のような問題点がある。すな
わち、断熱材としてグラスウールを使用した場合には圧
縮強度や曲げ強度が弱く、大きな機械強度を期待できな
い。また、吸湿性が低く透湿性が高いため表面で結露を
生じ易く、パネル自体やひいては建築物が腐朽するおそ
れがある。
1. A panel filled with a heat insulating material has the following problems depending on the type of the filled heat insulating material. That is, when glass wool is used as the heat insulating material, the compressive strength and the bending strength are weak, and large mechanical strength cannot be expected. In addition, since moisture absorption is low and moisture permeability is high, dew condensation is likely to occur on the surface, and the panel itself and eventually the building may be decayed.

【0005】また、断熱材として硬質ウレタンフォーム
を使用した場合には圧縮強度や曲げ強度が比較的弱く、
大きな耐震性を期待できない。また、吸放湿性を有しな
いため結露を生じ易く、パネル自体やひいては建築物が
腐朽するおそれがある。更には燃焼性が高いことから火
災時に簡単に燃焼してしまい、しかも有毒ガスが発生す
るなど被害の拡大化のおそれが高い。
[0005] When rigid urethane foam is used as a heat insulating material, the compressive strength and bending strength are relatively weak.
Large earthquake resistance cannot be expected. Moreover, since it does not have moisture absorption and desorption properties, dew condensation is likely to occur, and there is a risk that the panel itself and eventually the building will decay. Furthermore, since the flammability is high, it is easily burned at the time of a fire, and furthermore, there is a high possibility that the damage is increased, such as generation of toxic gas.

【0006】2、 従来例にかかるI型梁やボックス型
梁は、軽量であるという長所を有するが耐火性に劣ると
いう欠点がある。
2. I-beams and box-type beams according to the prior art have the advantage of being lightweight, but have the disadvantage of poor fire resistance.

【0007】3、 本発明は従来例の以上のような欠点
に鑑み、圧縮強度や曲げ強度が強いが故に大きな耐震性
を有し、また、吸放湿性を有し、かつ、透湿性が低いが
ゆえに結露を生じにくく、更には燃えにくさ、断熱性、
吸音性に優れたパネル状の軽量木質系材料を提供するこ
と並びに軽量であり、かつ、燃えにくいがゆえに火災時
の安全性に優れた柱材や梁材といった構造用の軽量木質
系材料を提供することを目的とする。
3. In view of the above-mentioned drawbacks of the prior art, the present invention has large earthquake resistance because of its high compressive strength and bending strength, and also has moisture absorption / release properties and low moisture permeability. Therefore, dew condensation hardly occurs, furthermore, it is difficult to burn, heat insulation,
Providing lightweight panel-like wood-based materials with excellent sound absorption properties, and providing lightweight wood-based materials for structures such as pillars and beams that are lightweight and resistant to fire due to their low fire resistance. The purpose is to do.

【0008】[0008]

【課題を解決するための手段】[Means for Solving the Problems]

1、 上記課題を解決するために、本発明に係る軽量木
質系材料では以下のような手段を講じた。
1. In order to solve the above problems, the following measures were taken in the lightweight wood-based material according to the present invention.

【0009】 フェノール樹脂発泡体と木材削片とか
ら成る断熱材、フェノール樹脂発泡体と木粉から成る断
熱材またはフェノール樹脂発泡体と木材削片と木粉とか
ら成る断熱材をパネルの中やI型梁の凹部、ボックス型
梁の内部に充填する。
A heat insulating material composed of a phenol resin foam and wood chips, a heat insulating material composed of a phenol resin foam and wood flour, or a heat insulating material composed of a phenol resin foam, wood chips and wood flour, Fill the recess of the I-beam and the inside of the box-shaped beam.

【0010】 表面材にリン化合物、ホウ素化合物、
ハロゲン化合物、窒素化合物、ケイ素化合物、アルミニ
ウム化合物、アンチモン化合物中のいずれか1種類もし
くは複数の化合物で難燃化処理を行う。
[0010] Phosphorus compounds, boron compounds,
The flame retarding treatment is performed with one or more of a halogen compound, a nitrogen compound, a silicon compound, an aluminum compound, and an antimony compound.

【0011】 表面材として石膏ボードを用いる。A gypsum board is used as a surface material.

【0012】 断熱材中の木材削片や木粉にリン化合
物、ホウ素化合物、ハロゲン化合物、窒素化合物、ケイ
素化合物、アルミニウム化合物、アンチモン化合物中の
いずれか1種類もしくは複数の化合物で難燃化処理を行
う。以下、かかる解決手段がいかなる作用を有するかを
述べる。
[0012] The wood chips and wood flour in the heat insulating material are subjected to a flame retarding treatment with any one or more of a phosphorus compound, a boron compound, a halogen compound, a nitrogen compound, a silicon compound, an aluminum compound, and an antimony compound. Do. Hereinafter, what action the solution has will be described.

【0013】2、 本発明に係る軽量木質系材料では木
材削片あるいは木粉あるいはその双方とフェノール樹脂
発泡体とで構成された断熱材(以下軽量体Aと呼ぶ)を
使用している。この軽量体Aは表1に示すようにフェノ
ールフォームから成る断熱材や硬質ウレタンフォームか
ら成る断熱材より圧縮強度が強い。よって係る特質を有
する軽量体Aを使用したパネル状の軽量木質系材料や構
造用の軽量木質系材料は強度が高く耐震性に優れたもの
となるのである。
2. In the lightweight wood-based material according to the present invention, a heat insulating material (hereinafter referred to as a lightweight body A) composed of wood chips and / or wood flour and a phenol resin foam is used. As shown in Table 1, this lightweight body A has higher compressive strength than a heat insulating material made of phenol foam or a heat insulating material made of hard urethane foam. Therefore, a panel-shaped lightweight wood-based material using the lightweight body A having such characteristics and a lightweight wood-based material for a structure have high strength and excellent earthquake resistance.

【0014】3、 また、軽量体Aは、フェノールフォ
ームから成る断熱材や硬質ウレタンフォームから成る断
熱材が有しない吸放湿性を有している。よって、係る特
質を有する軽量体Aを使用したパネル状の軽量木質系材
料や構造用の軽量木質系材料では、その内部や表面に結
露が生ぜず木材腐朽が発生しない。
3. Further, the lightweight body A has a moisture absorbing and releasing property which is not provided by a heat insulating material made of phenol foam or a heat insulating material made of hard urethane foam. Therefore, in the case of a panel-shaped lightweight wood-based material or a lightweight wood-based material for a structure using the lightweight body A having such characteristics, dew condensation does not occur on the inside or on the surface, and wood decay does not occur.

【0015】4、 表面材にリン化合物、ホウ素化合
物、ハロゲン化合物、窒素化合物、ケイ素化合物、アル
ミニウム化合物、アンチモン化合物中のいずれか1種類
もしくは複数の化合物で難燃化処理を行なったり、ある
いは断熱材中の木材削片や木粉にリン化合物、ホウ素化
合物、ハロゲン化合物、窒素化合物、ケイ素化合物、ア
ルミニウム化合物、アンチモン化合物中のいずれか1種
類もしくは複数の化合物で難燃化処理を行うことで、本
発明に係る軽量木質系材料はより難燃性を高めることが
できる。具体的には、軽量体Aに燐酸アンモニウム水溶
液で難燃化処理を行った(以下軽量体Bと呼ぶ)場合に
は、該軽量体Bは、表3に示すように硬質ウレタンフォ
ームを断熱材として使用した場合に比べ、優れた難燃性
を有することになる。
4. The surface material is subjected to a flame retarding treatment with one or more of a phosphorus compound, a boron compound, a halogen compound, a nitrogen compound, a silicon compound, an aluminum compound, and an antimony compound, or a heat insulating material. By subjecting the wood chips and wood flour to flame retardant treatment with one or more of phosphorus compounds, boron compounds, halogen compounds, nitrogen compounds, silicon compounds, aluminum compounds, and antimony compounds, The lightweight wood-based material according to the invention can further enhance the flame retardancy. Specifically, when the flame-retarding treatment was performed on the lightweight body A with an aqueous solution of ammonium phosphate (hereinafter referred to as “light body B”), the lightweight body B was made of a hard urethane foam as shown in Table 3 As a result, it has excellent flame retardancy as compared with the case where it is used.

【0016】5、 難燃性をさらに高めたい場合には表
面材として石膏ボードを使用する。石膏ボードは耐火性
に優れたものであるので難燃性がより高まるのである。
5. If it is desired to further increase the flame retardancy, a gypsum board is used as the surface material. The gypsum board is excellent in fire resistance, so that the flame retardancy is further enhanced.

【0017】[0017]

【表1】 [Table 1]

【0018】[0018]

【表2】 [Table 2]

【0019】[0019]

【表3】 [Table 3]

【0020】[0020]

【発明の実施の形態】以下、好ましい発明の実施の形態
につき図面を参照しながら述べる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

【0021】1、 図1は請求項1記載に係るパネル状
の軽量木質系材料の斜視図である。表面材(1a)と枠
材(2a)からなるパネルの内部にフェノール樹脂発泡
体と木材削片とから成る断熱材(3a)、フェノール樹
脂発泡体と木粉から成る断熱材(3b)またはフェノー
ル樹脂発泡体と木材削片と木粉とから成る断熱材(3
c)を充填してある。表面材(1a)には製材品、集成
材、合板、木質ボードなどを使用する。一方、枠材(2
a)には製材品や集成材などを使用する。
1, FIG. 1 is a perspective view of a panel-like lightweight wood-based material according to the first aspect. Insulation material (3a) composed of phenolic resin foam and wood chips, heat insulation material (3b) composed of phenolic resin foam and wood flour, or phenol inside a panel composed of surface material (1a) and frame material (2a) Insulation material consisting of resin foam, wood chips and wood flour (3
c) is filled. As the surface material (1a), a lumber product, a laminated wood, a plywood, a wooden board, or the like is used. On the other hand, the frame material (2
For a), a lumber product, a laminated wood, or the like is used.

【0022】2、 請求項2記載に係る軽量木質系材料
は、請求項1記載に係る軽量木質系材料において枠材
(2a)を使用しないものである。
2. The lightweight wood-based material according to the second aspect does not use the frame material (2a) in the lightweight wood-based material according to the first aspect.

【0023】3、 図2は請求項4記載に係る柱状の軽
量木質系材料の斜視図である。この軽量木質系材料はフ
ランジ(5)及びウエブ(6)からなるI型の枠材(2
b)と、該枠材(2b)の凹部(4)に充填された断熱
材と、凹部(4)上に被せられる表面材(1b)とから
形成されている。尚、断熱材はフェノール樹脂発泡体と
木材削片とから成る断熱材(3a)、フェノール樹脂発
泡体と木粉から成る断熱材(3b)またはフェノール樹
脂発泡体と木材削片と木粉とから成る断熱材(3c)の
いずれかを用いる。フランジ(5)には製材品や集成材
を用いる。ウエブ(6)には製材品や集成材、合板、木
質系ボードなどを使用する。表面材(1b)には製材品
や集成材、合板、木質系ボードなどを使用する。
3. FIG. 2 is a perspective view of a pillar-shaped lightweight wood-based material according to the fourth aspect. This lightweight wood-based material is an I-shaped frame (2) composed of a flange (5) and a web (6).
b), a heat insulating material filled in the concave portion (4) of the frame material (2b), and a surface material (1b) put on the concave portion (4). The heat insulating material is made of a heat insulating material (3a) made of phenol resin foam and wood chips, a heat insulating material (3b) made of phenol resin foam and wood flour, or a heat insulating material of phenol resin foam, wood chips and wood flour. The heat insulating material (3c) is used. For the flange (5), a lumber product or a laminated wood is used. For the web (6), lumber, laminated wood, plywood, wood-based boards, etc. are used. As the surface material (1b), a lumber product, a laminated wood, a plywood, a wooden board or the like is used.

【0024】4、 図3は請求項5記載に係る柱状の軽
量木質系材料の一部切開斜視図である。表面材(1c)
と枠材(2c)でボックス状の外枠を作り、その中にフ
ェノール樹脂発泡体と木材削片とから成る断熱材(3
a)、フェノール樹脂発泡体と木粉から成る断熱材(3
b)またはフェノール樹脂発泡体と木材削片と木粉とか
ら成る断熱材(3c)を充填してある。(7)はスチフ
ナであり座屈を防ぐために必要に応じて挿着する。表面
材(1c)には製材品、集成材、合板、木質ボードなど
を使用する。枠材(2c)及びスチフナ(7)には製材
品、集成材などを使用する。
4. FIG. 3 is a partially cutaway perspective view of the columnar lightweight wood-based material according to the fifth aspect. Surface material (1c)
And a frame material (2c) to form a box-shaped outer frame, in which a heat insulating material (3) made of a phenol resin foam and wood chips.
a), a heat insulating material composed of phenol resin foam and wood flour (3)
b) or a heat insulating material (3c) composed of phenolic resin foam, wood chips and wood flour. (7) is a stiffener, which is inserted as needed to prevent buckling. As the surface material (1c), a lumber product, a laminated wood, a plywood, a wooden board, or the like is used. For the frame material (2c) and the stiffener (7), lumber products, glued lumber, and the like are used.

【0025】5、 本発明に係る軽量木質系材料に使用
される断熱材、すなわちフェノール樹脂発泡体と木材削
片とから成る断熱材(3a)、フェノール樹脂発泡体と
木粉から成る断熱材(3b)、フェノール樹脂発泡体と
木材削片と木粉とから成る断熱材(3c)は高周波全体
加熱法により製造する。この場合断熱材(3a)、(3
b)、(3c)それのみを製造することも、製品内部で
断熱材(3a)、(3b)、(3c)を形成することも
可能である。ここに木材削片や木粉は製材工場あるいは
集成材製造工場で多量に排出されるプレーナ屑やおが屑
あるいはチップ、ストランド状に加工された木材等あら
ゆる形状の木材を使用することができる。
5. A heat insulating material used for the lightweight wood-based material according to the present invention, that is, a heat insulating material (3a) composed of a phenol resin foam and wood chips, and a heat insulating material composed of a phenol resin foam and wood flour ( 3b) A heat insulating material (3c) comprising a phenolic resin foam, wood chips and wood flour is produced by a high-frequency whole heating method. In this case, the heat insulating materials (3a), (3
b), (3c) It is possible to manufacture only it, or to form heat insulators (3a), (3b), (3c) inside the product. Here, as the wood chips and wood flour, any shapes of wood such as planer chips and sawdust, chips, and wood processed into strands, which are discharged in large quantities at a sawmill or a glued wood manufacturing factory, can be used.

【0026】具体的には断熱材(3a)、(3b)、
(3c)のみを製造する場合には容器内に発泡性のフェ
ノール樹脂と、木材削片あるいは木粉またはその双方と
を均一に混合して充填する。充填後高周波全体加熱法で
加熱する。するとフェノール樹脂が発泡して木材削片や
木粉間を充填し、断熱材が得られる。得られた断熱材
(3a)、(3b)、(3c)を所定の寸法に加工して
枠材の中にはめ込み軽量木質系材料を形成するのであ
る。
Specifically, the heat insulating materials (3a), (3b),
When only (3c) is manufactured, the foamable phenol resin and the wood chips and / or the wood powder are uniformly mixed and filled in the container. After filling, it is heated by a high-frequency whole heating method. Then, the phenol resin foams and fills the space between the wood chips and wood flour, thereby obtaining a heat insulating material. The heat insulating materials (3a), (3b), and (3c) obtained are processed into predetermined dimensions and fitted into a frame material to form a lightweight wood-based material.

【0027】また、製品内部で断熱材(3a)、(3
b)、(3c)を形成する場合には枠材と表面材で囲ま
れた空間にフェノール樹脂と、木材削片あるいは木粉ま
たはその双方とを均一に混合して充填する。その上で高
周波全体加熱法で加熱する。するとフェノール樹脂が発
泡して断熱材(3a)、(3b)、(3c)が軽量木質
系材料内に形成されるのである。
Further, heat insulating materials (3a), (3
In the case of forming b) and (3c), a space surrounded by the frame material and the surface material is uniformly mixed and filled with the phenol resin and wood chips or wood flour or both. Then, it is heated by a high-frequency whole heating method. Then, the phenol resin foams and the heat insulating materials (3a), (3b), and (3c) are formed in the lightweight wood-based material.

【0028】以上のようにして断熱材(3a)、(3
b)、(3c)を形成するのであるが木材削片や木粉と
フェノール樹脂発泡体との混合割合を変化させることで
圧縮強度や曲げ強度といった機械的性質や難燃性や吸放
湿性といった性質を変化させることができる。すなわち
圧縮強度や曲げ強度及び吸放湿性を高めたい場合には木
材削片や木粉の比率を増せばよく、一方難燃性や断熱性
を高めたい場合にはフェノール樹脂の比率を高めればよ
い。
As described above, the heat insulating materials (3a), (3
b) and (3c) are formed, but the mechanical properties such as compressive strength and bending strength, and the flame retardancy and moisture absorption / release properties are changed by changing the mixing ratio of wood chips or wood flour and phenol resin foam. Properties can be changed. That is, if it is desired to increase the compressive strength, bending strength and moisture absorption / release properties, the ratio of wood chips and wood powder may be increased, while if it is desired to increase the flame retardancy or heat insulation, the ratio of the phenol resin may be increased. .

【0029】[0029]

【発明の効果】本発明の軽量木質系材料は、以上のよう
に難燃性に優れ、また吸放湿性に優れていることから燃
えにくく、かつ、パネル内部や壁内で結露が生じない。
As described above, the lightweight wood-based material of the present invention has excellent flame retardancy and excellent moisture absorption / desorption properties, so that it does not easily burn and does not cause dew condensation inside the panel or inside the wall.

【0030】また、パネル状であるため施行が容易であ
り、かつ、内部に断熱材が充填されているため現在行わ
れているような現場での断熱材の充填作業が必要ない。
そのため、工期が短くなり建築費用が節減できる。
Further, since the panel is formed in a panel shape, the operation is easy, and since the inside is filled with the heat insulating material, the work of filling the heat insulating material on site, which is currently performed, is unnecessary.
Therefore, the construction period can be shortened and the construction cost can be reduced.

【0031】また、柱材や梁材といった、構造用の軽量
木質系材料は従来の木質系構造用材料に比較して軽く、
そのためこの材料を使用すると建築物が軽くなり地震時
の安全性が向上すると共に材料の接合方法には従来より
簡単な方法を使用することができる。
Lightweight wooden materials for structures, such as columns and beams, are lighter than conventional wooden structural materials.
Therefore, when this material is used, the building becomes lighter, the safety in the event of an earthquake is improved, and a simpler method can be used for joining the materials.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 請求項1記載に係るパネル状の軽量木質系材
料の斜視図。
FIG. 1 is a perspective view of a panel-shaped lightweight wood-based material according to claim 1.

【図2】 請求項4記載に係る柱状の軽量木質系材料の
斜視図。
FIG. 2 is a perspective view of the columnar lightweight wood-based material according to claim 4.

【図3】 請求項5記載に係る柱状の軽量木質系材料の
一部切開斜視図。
FIG. 3 is a partially cutaway perspective view of the columnar lightweight wooden material according to claim 5.

【符号の説明】[Explanation of symbols]

1a、1b、1c・・表面材 2a、2b、2c・
・枠材 3a、3b、3c・・断熱材 4・・凹部 5・・フランジ 6・・ウエブ 7・・スチフナ
1a, 1b, 1c ··· Surface material 2a, 2b, 2c ·
・ Frame material 3a, 3b, 3c ・ ・ Insulation material 4 ・ ・ Recess 5 ・ ・ Flange 6 ・ ・ Web 7 ・ ・ Stiffener

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 表面材(1a)と枠材(2a)とから成
るパネルの内部に、フェノール樹脂発泡体と木材削片と
から成る断熱材(3a)、フェノール樹脂発泡体と木粉
から成る断熱材(3b)またはフェノール樹脂発泡体と
木材削片と木粉とから成る断熱材(3c)を充填したパ
ネル状の軽量木質系材料。
1. Inside a panel consisting of a surface material (1a) and a frame material (2a), a heat insulating material (3a) consisting of a phenol resin foam and wood chips, and a phenol resin foam and wood flour. Panel-like lightweight wood-based material filled with a heat insulating material (3b) or a heat insulating material (3c) composed of phenolic resin foam, wood chips and wood flour.
【請求項2】 フェノール樹脂発泡体と木材削片とから
成る断熱材(3a)、フェノール樹脂発泡体と木粉から
成る断熱材(3b)またはフェノール樹脂発泡体と木材
削片と木粉とから成る断熱材(3c)の表面に表面材
(1a)を接着したパネル状の軽量木質系材料。
2. A heat insulating material (3a) comprising a phenolic resin foam and wood chips, a heat insulating material (3b) comprising a phenolic resin foam and wood flour, or a heat insulating material (3b) comprising a phenol resin foam, wood chips and wood flour. Panel-shaped lightweight wood-based material in which a surface material (1a) is adhered to the surface of a heat insulating material (3c) made of the same.
【請求項3】 リン化合物、ホウ素化合物、ハロゲン化
合物、窒素化合物、ケイ素化合物、アルミニウム化合
物、アンチモン化合物中のいずれか1種類もしくは複数
の化合物で難燃化処理を行った合板または石膏ボードで
表面材(1a)を形成したことを特徴とする請求項1ま
たは請求項2記載に係るパネル状の軽量木質系材料。
3. A surface material made of plywood or gypsum board which has been subjected to a flame-retarding treatment with one or more of a phosphorus compound, a boron compound, a halogen compound, a nitrogen compound, a silicon compound, an aluminum compound and an antimony compound. The panel-like lightweight wood-based material according to claim 1 or 2, wherein (1a) is formed.
【請求項4】 フェノール樹脂発泡体と木材削片とから
成る断熱材(3a)、フェノール樹脂発泡体と木粉から
成る断熱材(3b)またはフェノール樹脂発泡体と木材
削片と木粉とから成る断熱材(3c)を、枠材(2b)
をI型に形成したI型梁の両側の凹部(4)に充填し、
更にその凹部(4)上に表面材(1b)を接着したこと
を特徴とする柱状の軽量木質系材料。
4. A heat insulating material (3a) comprising a phenolic resin foam and wood chips, a heat insulating material (3b) comprising a phenol resin foam and wood flour, or a phenol resin foam, wood chips and wood flour. Heat insulating material (3c) made of a frame material (2b)
Is filled in the recesses (4) on both sides of the I-shaped beam formed into an I-shape,
Further, a columnar lightweight wood-based material characterized in that a surface material (1b) is adhered to the concave portion (4).
【請求項5】 枠材(2b)と表面材(1b)とで側面
を形成したボックス型梁の内部にフェノール樹脂発泡体
と木材削片とから成る断熱材(3a)、フェノール樹脂
発泡体と木粉から成る断熱材(3b)またはフェノール
樹脂発泡体と木材削片と木粉とから成る断熱材(3c)
を充填したことを特徴とする柱状の軽量木質系材料。
5. A heat insulating material (3a) comprising a phenol resin foam and wood chips inside a box-shaped beam having side surfaces formed by a frame material (2b) and a surface material (1b), and a phenol resin foam. Thermal insulation made of wood flour (3b) or thermal insulation made of phenolic resin foam, wood chips and wood flour (3c)
A columnar lightweight wood-based material, characterized by being filled with.
【請求項6】 フェノール樹脂発泡体と木材削片とから
成る断熱材(3a)、フェノール樹脂発泡体と木粉から
成る断熱材(3b)、フェノール樹脂発泡体と木材削片
と木粉とから成る断熱材(3c)に使用されている木材
削片、木粉またはその双方にリン化合物、ホウ素化合
物、ハロゲン化合物、窒素化合物、ケイ素化合物、アル
ミニウム化合物、アンチモン化合物中のいずれか1種類
もしくは複数の化合物で難燃化処理を行ったことを特徴
とする請求項1、請求項2、請求項3、請求項4または
請求項5記載に係る軽量木質系材料。
6. A heat insulating material (3a) comprising a phenol resin foam and wood chips, a heat insulating material (3b) comprising a phenol resin foam and wood flour, a phenol resin foam, wood chips and wood flour. Wood chips, wood flour or both used in the heat insulating material (3c) made of any one or more of phosphorus compounds, boron compounds, halogen compounds, nitrogen compounds, silicon compounds, aluminum compounds and antimony compounds The lightweight wood-based material according to claim 1, wherein the compound is subjected to a flame retarding treatment.
JP32656596A 1996-12-06 1996-12-06 Lightweight woody material Pending JPH10169082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32656596A JPH10169082A (en) 1996-12-06 1996-12-06 Lightweight woody material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32656596A JPH10169082A (en) 1996-12-06 1996-12-06 Lightweight woody material

Publications (1)

Publication Number Publication Date
JPH10169082A true JPH10169082A (en) 1998-06-23

Family

ID=18189251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32656596A Pending JPH10169082A (en) 1996-12-06 1996-12-06 Lightweight woody material

Country Status (1)

Country Link
JP (1) JPH10169082A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100300019B1 (en) * 1999-06-26 2001-09-22 이영제 Sound Absorbing Material and its Preparing Method
KR20020063084A (en) * 2001-01-26 2002-08-01 주식회사 에이치엔씨 Condensation-Proof Panel for Concrete Slab Corners
KR100643592B1 (en) * 2002-02-21 2006-11-10 (주)청원씨엠에스 Method for constructing compounded insulation panel of concrete wall for condensation proof
KR100792472B1 (en) 2003-08-05 2008-01-08 김태홍 Uninflammable foamed construction interior material containing woodflour and manufacturing method thereof
JP2010280209A (en) * 2009-05-01 2010-12-16 Yumi Ishino Bamboo board material
GB2490304A (en) * 2011-03-18 2012-10-31 Ian De Haan Structural beam with insulation located in a cavity within the beam.
KR101438457B1 (en) * 2014-05-28 2014-09-12 유수용 The water soluble fire retardant for woden and its apply method
US20230151605A1 (en) * 2019-07-12 2023-05-18 Shizuka Co., Ltd. Incombustible sound absorption panel

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100300019B1 (en) * 1999-06-26 2001-09-22 이영제 Sound Absorbing Material and its Preparing Method
KR20020063084A (en) * 2001-01-26 2002-08-01 주식회사 에이치엔씨 Condensation-Proof Panel for Concrete Slab Corners
KR100643592B1 (en) * 2002-02-21 2006-11-10 (주)청원씨엠에스 Method for constructing compounded insulation panel of concrete wall for condensation proof
KR100792472B1 (en) 2003-08-05 2008-01-08 김태홍 Uninflammable foamed construction interior material containing woodflour and manufacturing method thereof
JP2010280209A (en) * 2009-05-01 2010-12-16 Yumi Ishino Bamboo board material
GB2490304A (en) * 2011-03-18 2012-10-31 Ian De Haan Structural beam with insulation located in a cavity within the beam.
GB2490304B (en) * 2011-03-18 2016-12-28 De Haan Ian Structual beams and methods of forming a structure
KR101438457B1 (en) * 2014-05-28 2014-09-12 유수용 The water soluble fire retardant for woden and its apply method
WO2015182920A1 (en) * 2014-05-28 2015-12-03 유수용 Water-soluble flame-retardant composition for wood and method for flame-retardant treatment
US20230151605A1 (en) * 2019-07-12 2023-05-18 Shizuka Co., Ltd. Incombustible sound absorption panel
US11866931B2 (en) * 2019-07-12 2024-01-09 Shizuka Co., Ltd. Incombustible sound absorption panel

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