JPH10166289A - Semiconductor device carrier device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect storage abnormality such as double setting abnormality and internal rib striking abnormality of a semiconductor device by providing a vacuum adsorption nozzle height abnormality detection sensor detecting whether a height for the head of a vacuum adsorption nozzle exceeds a normal height or not. SOLUTION: When abnormality exists, a vacuum adsorption nozzle 7 hits a semiconductor device 10 before it reaches a prescribed low and then receives load. Therefore, whether storage abnormality is generated or not can be decided by depending on whether the vacuum adsorption nozzle 7 receives load or not. An overload sensor 14 holds the slightly upper side of the upper end part of the vacuum adsorption nozzle 7, a light emitting part 12 and a light receiving part 13 are opposed and the upper end part of the vacuum adsorption nozzle 7 shields space between the parts 12 and 13 at the time of overload. Deviation of a positional relation from a sensor 14 of the vacuum adsorption nozzle 7 of only about 0.5mm due to overload is also detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device transfer device, and more particularly to a semiconductor device transfer device, in particular, a vacuum suction nozzle attached to a robot head, which carries the semiconductor device in a vacuum state, and conveys the robot device by multi-axis movement. The present invention relates to a semiconductor device transport apparatus that sequentially repeats an operation of releasing a vacuum suction state by a nozzle and placing it there.

[0002]

2. Description of the Related Art When a semiconductor device has been assembled, and inspection and determination of electrical characteristics have been completed, it must be stored in a storage tray, packed and shipped. Therefore, it is essential to determine the electrical characteristics and store the finished semiconductor device in a storage tray, which is automatically performed by the semiconductor device transport device. 2 and 3 show one conventional example of such a semiconductor device transport device. FIG. 2 is a perspective view showing the entire semiconductor device transport device.
FIG. 3 is an enlarged perspective view showing a chuck unit of the semiconductor device carrier.

In the drawings, reference numeral 1 denotes an IC supply unit and 2 denotes an IC
The storage unit 3 is a 4-axis control robot, 4 is a chuck unit forming the head thereof, and 5 is a contactor unit. The electrical characteristics of the semiconductor device are measured and sorted by the contact unit 5. The chuck unit 4 is shown enlarged in FIG. The chuck unit 4 is moved by being controlled by four axes by the four-axis control robot 3.
Reference numeral 6 denotes a connection portion with the robot 3. Reference numeral 7 denotes a vacuum suction nozzle, which vacuum-sucks the semiconductor device from the IC supply unit 1 to the contact unit unit 5 and carries the semiconductor device so that the electrical characteristics can be determined there. Carry on the second storage tray. Numeral 8 denotes a positioning claw driving mechanism, which drives positioning claws 9, 9, 9, 9 (only one appears in FIG. 3) for positioning the semiconductor device vacuum-sucked by the vacuum suction nozzle 4 from all sides.

FIGS. 4A to 4E are operation explanatory diagrams sequentially showing the operation of a vacuum suction nozzle and the like. The semiconductor device 10 whose electrical characteristics have been determined by the contact unit 5
A vacuum suction nozzle 7 for vacuum-sucking and positioning claws 9 for positioning the vacuum-sucked semiconductor device 10 are integrated by the action of the robot 3 as shown in FIG.
It reaches above the storage tray 11 of the storage section 2.

Next, as shown in FIG. 4B, the positioning claws 9, 9, 9, 9 are opened. Next, as shown in FIG. 4C, even if the vacuum suction nozzle 7 drops the semiconductor device 10, the vacuum suction nozzle 7 is lowered to a level where normal accommodation is possible. Then, the semiconductor device 10 sucked by the vacuum breakage of the vacuum suction nozzle 7 is dropped into the storage position of the tray 11. Thereafter, the vacuum suction nozzle 7 is evacuated to check whether or not the semiconductor device 10 remains in the nozzle 7, and then the vacuum suction nozzle 7 is raised as shown in FIG.

Thereafter, the vacuum suction nozzle 7 moves onto the IC supply section 2 together with the positioning claws 9, 9, 9, 9 and the like. , 9, 9, and 9 and transported to the contact unit 5, where characteristics are measured, and then the same operations as those described above are performed.

[0007]

In the transfer operation by the semiconductor device transfer device, as shown in FIG. 5A, two semiconductor devices 10 and 10 are superimposed on one storage location of the storage tray 11. The two-place abnormality of being placed or the rib 1 of the storage tray 11 as shown in FIG.
In some cases, an abnormality may occur in which the semiconductor device 10 (for example, a lead) rides on the second and is stored in an inclined state. The two-place abnormality causes the semiconductor device to be sandwiched between the storage trays, and the inner rib riding abnormality causes the semiconductor device to be displaced and lead to deformation due to the misalignment.

[0008] Therefore, it is not preferable that such an abnormality is overlooked. However, in the related art, there is no means for detecting such an abnormality, and the next operation is continued even if a storage abnormality occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and a semiconductor device is vacuum-sucked by a vacuum suction nozzle attached to a robot head and transported by multi-axis movement of the robot head to store the semiconductor device. In the semiconductor device transfer device that releases the vacuum suction state by the vacuum suction nozzle above the unit and puts it there, it detects storage abnormalities such as abnormal placement of two semiconductor devices and abnormal mounting of inner ribs, and detects between storage trays. An object of the present invention is to prevent occurrence of a state in which a semiconductor device is pinched in a semiconductor device, misalignment of the semiconductor device due to an abnormality in riding on an inner rib, and occurrence of lead deformation based on the misalignment.

[0010]

According to a first aspect of the present invention, there is provided a semiconductor device transport apparatus, wherein a robot head has a vacuum suction nozzle height error detecting whether or not the height of the vacuum suction nozzle with respect to the head exceeds a normal height. A detection sensor is provided.

Therefore, according to the semiconductor device transport apparatus of the first aspect, when a storage error such as an error in placing two semiconductor devices or an error in climbing the inner rib occurs, the height of the vacuum suction nozzle is higher than when the height is normal. The height is detected by a vacuum suction nozzle height abnormality detection sensor, and a storage abnormality is detected.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

FIG. 1 is a front view showing a vacuum suction nozzle and a vacuum suction nozzle height abnormality detection sensor which are essential parts of the semiconductor device transport apparatus of the present invention. In the drawing, 7 is a vacuum suction nozzle, 10 is a semiconductor device, 11 is a storage tray, 12 is a light emitting unit, 13 is a light receiving unit that receives light from the light emitting unit 12, and is formed by the light emitting unit 12 and the light receiving unit 13. A vacuum suction nozzle height abnormality detection sensor 13 is configured.

Such a vacuum suction nozzle height abnormality detection sensor 13 is provided in the portion shown in FIG. 3A of the semiconductor device transport apparatus shown in FIGS. The present semiconductor device transfer apparatus is different from the conventional semiconductor device transfer apparatus only in having a vacuum suction nozzle height abnormality detection sensor 14.

Next, the operation of the overload sensor 14 will be described. The semiconductor device 10 supplied to the IC supply unit 1
Vacuum suction is performed by the vacuum suction nozzle 7 of the robot chuck unit 4, the positioning is performed by the positioning claws 9, 9, 9, 9, and the robot is conveyed onto the contact unit 5, where the electrical characteristics are determined. The semiconductor device 10 thus sucked is vacuum-sucked again by the vacuum suction nozzle 7, positioned by the positioning claws 9, 9, 9, 9, and transported above the storage tray 11 of the IC storage section 2 in that state. Then, the chuck unit 4 is lowered by the action of the cylinder, and the vacuum suction nozzle 7 causes vacuum breakage, so that the semiconductor device 10 is stored in the storage tray 1.
Put on 1 Up to this point, there is no particular difference from the conventional case.

However, after the semiconductor device 10 is placed, the chuck unit 4 is further lowered. However, when there is no abnormality in the semiconductor device 10 on which the vacuum suction nozzle 7 is placed, it does not correspond thereto. This is because when there is no abnormality, the descending amount of the chuck unit 4 is set so that the chuck unit 4 does not hit even if it is lowered.

However, if there is an abnormality, the vacuum suction nozzle 7 is moved to the semiconductor device 10 before reaching the predetermined low level.
And then receive the load. Therefore, whether or not the storage abnormality has occurred can be determined based on whether or not the vacuum suction nozzle 7 receives a load.

The overload sensor 14 is provided between the light emitting unit 12 and the light receiving unit 13 with a position slightly above the upper end of the vacuum suction nozzle 7 interposed therebetween.
When an overload occurs, the upper end of the vacuum suction nozzle 7 blocks the gap. A deviation of the positional relationship of the vacuum suction nozzle 7 with respect to the sensor 14 of only about 0.5 mm due to an overload is also detected. Therefore, it is possible to reliably detect a storage abnormality that causes a height abnormality as shown in FIGS.

[0019]

According to the semiconductor device transport apparatus of the first aspect, when a storage abnormality such as an abnormality in placing two semiconductor devices or an abnormal rise in the inner rib occurs, the vacuum suction nozzle hits the semiconductor device and its height is normal. Is higher than the normal case, which is detected by the vacuum suction nozzle height abnormality detection sensor, and thus, the storage abnormality is detected.

[Brief description of the drawings]

FIG. 1 is a front view showing a vacuum suction nozzle and a vacuum suction nozzle height abnormality detection sensor which are essential parts of a semiconductor device transport apparatus of the present invention.

FIG. 2 is a perspective view showing the entire semiconductor device transport apparatus.

FIG. 3 is an enlarged perspective view showing a chuck unit of the semiconductor device transport apparatus.

FIGS. 4A to 4E are operation explanatory diagrams sequentially showing operations of a vacuum suction nozzle and the like.

FIGS. 5A and 5B are diagrams showing different storage abnormalities.

[Explanation of symbols]

4 ... Robot head (chuck unit), 7 ...
・ Vacuum suction nozzle, 10 ・ ・ ・ Semiconductor device, 14 ・ ・ ・
Vacuum suction nozzle height abnormality detection sensor.

Claims (1)

[Claims] 1. A semiconductor device is vacuum-sucked by a vacuum suction nozzle attached to a robot head, conveyed by multi-axis movement of the robot head, and the vacuum suction state by the vacuum suction nozzle is released above the semiconductor device storage unit and is released there. In the semiconductor device transfer device performing the placing operation, the robot head is provided with a vacuum suction nozzle height abnormality detection sensor that detects whether the height of the vacuum suction nozzle with respect to the head exceeds a normal height. Semiconductor device transport device.