JPH10144768A - Wafer transfer jig and manufacture of semiconductor thereby - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a wafer transfer jig which is capable of preventing foreign objects from adhering to a wafer and causing less damage to the wafer. SOLUTION: A jig 2 is composed of wafer guide paths 2a which are correspondent to the wafer partitioning section 3b of a wafer carrier 3 and the wafer partitioning section of a half carrier 4 respectively, the opposed walls 2b, the opposed wall supports 2c which link the walls 2b, and a recess and a projection which position the jig 2 to the wafer carrier 3 and the half carrier 4. When a semiconductor wafer 1 is transferred from the wafer carrier 3 to the half carrier 4 and vice versa by the jig 2, the jig 2 is provided adjacent to and between the wafer carrier 3 and the half carrier 4 as positioned by the recess and the projection to the carriers 3 and 4 so as to guide a semiconductor wafer 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technique, and more particularly to a wafer transfer jig for reducing damage to a semiconductor wafer when transferring a semiconductor wafer in a cleaning process, and a semiconductor manufacturing method using the same.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

[0003] A wafer carrier (semiconductor wafer storage case) used in a semiconductor wafer manufacturing process has a carrier that covers the entire semiconductor wafer and a carrier that covers about half of the semiconductor wafer (the exposed portion of the semiconductor wafer is increased). There is a carrier (hereinafter, referred to as a half carrier).

Here, in the semiconductor wafer cleaning step, if the wafer carrier covers the entire semiconductor wafer, foreign substances are likely to adhere to the semiconductor wafer during cleaning (or the adhered foreign substances are difficult to remove). In many cases, the half carrier in which the exposed portion of the semiconductor wafer is increased is used.

Further, when a semiconductor wafer is cleaned by using the half carrier, a predetermined process such as epitaxial growth is completed, and a half carrier for cleaning is removed from a wafer carrier (in this case, also referred to as a crystal case) accommodating the semiconductor wafer. Then, the semiconductor wafer is transferred and the entire half carrier is cleaned.

The wafer carrier used in the cleaning step and the like is disclosed in, for example, Japanese Patent Application Laid-Open No. 7-17589.

[0007]

However, in the above technique, when the semiconductor wafer is transferred from the wafer carrier to the cleaning half carrier, if the semiconductor wafer has many exposed portions, that is, if the distance of the wafer partitioning portion is short, the semiconductor wafer cannot be removed. Becomes unstable, and it becomes difficult for each semiconductor wafer to move horizontally.

As a result, there arises a problem that the semiconductor wafers are brought into contact with each other during the movement and the semiconductor wafers are damaged, or foreign substances adhere to the semiconductor wafers.

Further, when an automatic wafer transfer device is used to move a semiconductor wafer, the cost is high and the size of the wafer transfer device is large, so that the space cannot be effectively used. Also occurs.

SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer transfer jig which reduces the attachment of foreign substances and the damage thereof during the movement of a semiconductor wafer, and a semiconductor manufacturing method using the same.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0012]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the wafer transfer jig of the present invention has a wall portion having a wafer guide passage portion corresponding to a wafer partition portion of the first and second storage cases for storing semiconductor wafers, and a wall portion facing each other. A wall support unit that connects the wall units and opposes each other; and a positioning unit that positions the first and second storage cases, and moves the semiconductor wafer between the first and second storage cases. In this case, the semiconductor wafer is guided adjacent to the first and second storage cases and positioned by the positioning means with the first and second storage cases.

Thus, the semiconductor wafer is moved while the semiconductor wafer is guided by the wafer guide passage portion of the wafer transfer jig while the positioning of the first and second storage cases is performed by the positioning means of the wafer transfer jig. be able to.

As a result, each semiconductor wafer can be moved in a state where it is maintained substantially horizontal without displacement, and contact between the semiconductor wafers during movement can be prevented.

Therefore, it is possible to prevent the semiconductor wafer from being damaged during the movement, thereby reducing damage to the semiconductor wafer.

Further, in the wafer transfer jig of the present invention, the positioning means is a projection or a recess fitted to a depression or a projection provided at an opening end of the first and second storage cases. And wherein the positioning means is formed by the wall and the wall support so as to face in opposite directions.
It is provided at the end of one jig opening.

Further, the semiconductor manufacturing method of the present invention uses the wafer transfer jig, and prepares a first accommodation case accommodating the semiconductor wafer, and performs a predetermined process on the semiconductor wafer. A second housing the semiconductor wafer
A housing case is prepared, and a wall guide portion having a wafer guide passage portion corresponding to a wafer partition portion of the first and second storage cases, and a wall portion facing the wall portion, and a wall support portion connecting the wall portions and facing each other. Preparing the wafer transfer jig having the following, disposing the wafer transfer jig adjacent to between the first and second storage cases, and positioning the first and second storage cases and the wafer by the positioning means. In addition to positioning the transfer jig, the semiconductor wafer is guided by the wafer transfer jig and moved from the first storage case to the second storage case.

Further, in the semiconductor manufacturing method according to the present invention, after the semiconductor wafer is housed in the second housing case guided by the wafer transfer jig, the wafer transfer jig is moved from the second housing case. The semiconductor wafer is removed and the semiconductor wafer is cleaned together with the second storage case.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an example of an embodiment of the structure of a wafer transfer jig according to the present invention, and FIG. 2 is a diagram showing an embodiment of a semiconductor wafer transfer state using the wafer transfer jig of the present invention. FIG. 3 is a perspective view showing an example of an embodiment of a transfer state of a semiconductor wafer using a wafer transfer jig of the present invention, and FIG. It is a side view which shows an example of embodiment of the state of transfer of the semiconductor wafer using the wafer transfer jig, which is partially cut away.

Wafer transfer jig 2 in the present embodiment
When the semiconductor wafer 1 is transferred between the storage cases, the two storage cases are relayed and the movement of the semiconductor wafer 1 is guided.

In the present embodiment, the wafer carrier 3 that covers the entire semiconductor wafer 1 when the first of the two housing cases houses the semiconductor wafer 1.
The case where the second storage case is the half carrier 4 that covers about half of the semiconductor wafer 1 when it is stored will be described.

That is, the wafer carrier 3 (first storage case) is formed so as to have a depth such that the wafer storage portion 3a covers the entire semiconductor wafer 1 and the half carrier 4 (second storage case). ) Is formed in such a depth that the wafer accommodating portion 4 a covers about half of the semiconductor wafer 1.

Therefore, in the present embodiment, the wafer accommodating portion 4a of the half carrier 4 is formed shallower than the wafer accommodating portion 3a of the wafer carrier 3.

The configuration of the wafer transfer jig 2 in the present embodiment has a wafer carrier 3 accommodating the semiconductor wafer 1 and a wafer guide passage 2a corresponding to the wafer partitions 3b, 4b of the half carrier 4, respectively. An opposing wall 2b; an opposing wall support 2c connecting the wall 2b and opposing; a wafer carrier 3 and a half carrier 4;
When the semiconductor wafer 1 is moved between the wafer carrier 3 and the half carrier 4, the wafer carrier 3 and the half carrier 4 are disposed adjacent to each other. The semiconductor wafer 1 is guided by being positioned with the half carrier 4.

That is, as shown in FIG. 1, the wafer transfer jig 2 is a box-shaped one having two wall portions 2b and two wall support portions 2c. A plurality of wafer guide passages 2a for guiding the movement of the wafer 1 (see FIG. 2) are provided.

In the present embodiment, the positioning means is provided with the concave portion 3d and the convex portion 3e provided at the opening end 3c of the wafer carrier 3, or the concave portion 4d provided at the opening end 4c of the half carrier 4. The projection 2e and the recess 2d fit into the projection 4e.

Further, the projection 2e as the positioning means is provided.
Jig opening ends 2 formed by the wall 2b and the wall support 2c in opposite directions.
f, and in the present embodiment, as shown in FIG. 1, two convex portions 2e and two concave portions 2d are provided at each corner of two (both sides) jig opening ends 2f. Is provided.

In this embodiment, the half carrier 4
Since the wafer accommodating portion 4a is formed shallower than the wafer accommodating portion 3a of the wafer carrier 3, when the semiconductor wafer 1 is moved, the wafer carrier 4a of the half carrier 4 having the shallower wafer accommodating portion 4a is formed. The wafer transfer jig 2 is detachably attached to the opening end 4c.

Here, the wafer transfer jig 2 is formed of a material having high chemical resistance, for example, a fluorine-based resin such as PTFE (polytetrafluoroethylene).

Further, in the wafer transfer jig 2, a plurality of wafer guide passages 2a provided on both sides facing each other, that is, inside each of two opposed walls 2b.
Is a groove having a width slightly larger than the thickness of the semiconductor wafer 1, and guides the movement of each semiconductor wafer 1.

The wafer carrier 3 and the half carrier 4 accommodate a plurality of semiconductor wafers 1 at a time when the semiconductor wafers 1 are transported or washed in a semiconductor manufacturing process. Similarly, it is formed of a material having high chemical resistance, for example, a fluorine-based resin such as PTFE.

Next, the semiconductor manufacturing method according to the present embodiment will be described.

The semiconductor manufacturing method uses the wafer transfer jig 2, and in this embodiment,
A description will be given of a case where the semiconductor wafer 1 after the epitaxial growth is transferred from the wafer carrier 3 to the half carrier 4 using the wafer transfer jig 2, the semiconductor wafer 1 is cleaned together with the half carrier 4, and then the semiconductor wafer 1 is transferred to the wafer carrier 3 again. I do.

Further, in the present embodiment, the semiconductor wafer 1 is placed between the wafer carrier 3 and the half carrier 4.
The case where the semiconductor wafer 1 is moved using the wafer transfer device 5 shown in FIG.

Here, the wafer transfer device 5 includes a plate-shaped transfer table 5a having a horizontal transfer surface 5b and on which the semiconductor wafer 1 is moved, and a pusher 5c as pressing means for pressing the semiconductor wafer 1. It consists of

Note that at least the contact portion of the pusher 5c with the semiconductor wafer 1 is formed of a fluorine resin such as PTFE.

In this embodiment, a case where the semiconductor wafer 1 is manually pushed using the pusher 5c will be described.

That is, the wafer transfer device 5 of the present embodiment is for manually moving the semiconductor wafer 1.

However, the wafer transfer device 5 may be of an automatic type, or may be of a type that moves the semiconductor wafer 1 by automatically operating the pusher 5c.

The procedure for moving the semiconductor wafer 1 will be described. First, a wafer transfer device 5 is prepared, and a plurality of semiconductor wafers 1 having undergone the epitaxial growth step are housed in a wafer carrier 3 as a first housing case.

That is, a wafer carrier 3 containing a plurality of semiconductor wafers 1 is prepared.

Subsequently, a half carrier 4 as a second housing case for housing the semiconductor wafer 1 is prepared.

Further, a wall guide 2a corresponding to the wafer partition 3b of the wafer carrier 3 and the wafer partition 4b of the half carrier 4, respectively, is provided. A wafer transfer jig 2 having a wall supporting portion 2c to be prepared is prepared.

Since the wafer carrier 3 and the half carrier 4 have a shallower wafer accommodating portion 4a in the half carrier 4, the wafer transfer jig 2 can be detachably attached to the open end 4c of the half carrier 4. Attach to

At this time, the convex portion 2e and the concave portion 2d provided at the corner of the jig opening end 2f of the wafer transfer jig 2 are replaced with the concave portion provided at the corner of the opening end 4c of the half carrier 4. 4d and the protrusion 4e are fitted respectively.

Thus, the wafer guide passage 2a of the wafer transfer jig 2 and the wafer partition 4b of the half carrier 4
And the wafer transfer jig 2 can be removably attached to the half carrier 4.

Subsequently, the wafer carrier 3 accommodating the semiconductor wafer 1 and the half carrier 4 to which the wafer transfer jig 2 is attached are positioned respectively on the transfer surface 5b of the transfer table 5a of the wafer transfer device 5. Place on.

At this time, in the wafer transfer jig 2, the jig opening end 2 f opposite to the jig opening end 2 f fitted with the half carrier 4 is opposed to the opening end 3 c of the wafer carrier 3. Deploy.

Thereafter, on the transfer surface 5b, the convex portion 2e and the concave portion 2d provided at the corner of the jig opening end 2f opposite to the jig opening end 2f fitted with the half carrier 4 are formed. ,
The concave portions 3d and the convex portions 3e provided at the corners of the opening end 3c of the wafer carrier 3 are fitted respectively.

Thus, on the transfer surface 5b of the transfer table 5a, the wafer transfer jigs 2 are positioned between the wafer carrier 3 and the half carrier 4 and are arranged adjacent to each other.

Thereafter, the guide groove 5 formed in the transfer table 5a
The pusher 5c is manually operated along d.

That is, the pusher 5 extends along the guide groove 5d.
By moving c, the pusher 5 c is brought into contact with the plurality of semiconductor wafers 1 housed in the wafer carrier 3.

Further, by moving the pusher 5c, a plurality of semiconductor wafers 1 are simultaneously moved as shown in FIG. 3, and are transferred from the wafer carrier 3 to the half carrier 4.

When the semiconductor wafer 1 moves and passes through the wafer transfer jig 2, the semiconductor wafer 1 is guided by the wafer guide passage 2a.

Thereafter, the pusher 5c is pushed until all the semiconductor wafers 1 are securely accommodated in the wafer accommodating portion 4a of the half carrier 4.

As a result, the semiconductor wafer 1 can be transferred to the half carrier 4 while guiding the semiconductor wafer 1 by the wafer transfer jig 2.

Subsequently, after the movement of the semiconductor wafer 1 is completed, the pusher 5c is returned to the original predetermined position, the half carrier 4 containing the semiconductor wafer 1 is removed from the transfer surface 5b, and then the wafer is transferred from the half carrier 4. The mounting jig 2 is detached.

Further, the half carrier 4 containing the semiconductor wafer 1 is transported to a predetermined cleaning device, and the semiconductor wafer 1 is cleaned together with the half carrier 4 by the cleaning device.

After the cleaning is completed, the wafer transfer jig 2 is attached again to the half carrier 4 containing the semiconductor wafer 1 and, as shown in FIG. The semiconductor wafer 1 is transferred to a wafer carrier 3.

The method of transferring the semiconductor wafer 1 at this time is the same as the method of transferring the semiconductor wafer 1 when the semiconductor wafer 1 is moved from the wafer carrier 3 to the half carrier 4.

As a result, the semiconductor wafer 1 after the cleaning is completed.
Can be transferred to the wafer carrier 3.

Subsequently, the wafer carrier 3 containing the cleaned semiconductor wafer 1 is transported to a place where a predetermined process (the next step) is performed.

According to the wafer transfer jig and the semiconductor manufacturing method of the present embodiment, the following operational effects can be obtained.

That is, the wafer transfer jig 2 moves the wafer carrier 3 and the
4a, and a concave portion 2d and a convex portion 2e as positioning means for positioning the wafer carrier 3 and the half carrier 4 with the wafer carrier 3 and the half carrier 4. 4, the semiconductor wafer 1 can be moved between the wafer carrier 3 and the half carrier 4 while guiding the semiconductor wafer 1 by the wafer guide passage 2a.

As a result, each semiconductor wafer 1 can be moved in a state where it is maintained substantially horizontal without displacement, and contact between the semiconductor wafers 1 during movement can be prevented.

Therefore, it is possible to prevent the semiconductor wafer 1 from being damaged during the movement, so that damage to the semiconductor wafer 1 can be reduced.

As a result, the yield of semiconductor wafer 1 can be improved.

The positioning means is a concave part 2d and a convex part 2e, and the positioning means is provided at two jig opening ends 2f formed in opposite directions of the wafer transfer jig 2. Accordingly, the wafer carrier 3, the half carrier 4, and the wafer transfer jig 2 can be easily and accurately positioned.

Further, in the wafer carrier 3 and the half carrier 4, the wafer transfer jig 2 is detachably attached to the opening end 4c of the half carrier 4 in which the wafer accommodating portion 4a is formed shallowly, and guides the semiconductor wafer 1. Thereby, the exposed portion of the semiconductor wafer 1 during movement can be reduced.

As a result, the semiconductor wafer 1 can be prevented from coming into contact with other members during the movement, and the adhesion of foreign matter to the semiconductor wafer 1 can be reduced.

Further, the opening end 4c of the half carrier 4
The wafer transfer jig 2 is detachably attached to the semiconductor wafer 1 to guide the semiconductor wafer 1, so that even when the semiconductor wafer 1 is cleaned together with the half carrier 4, the wafer transfer jig 2 is moved from the half carrier 4 after the movement. Can be easily removed.

Further, the semiconductor wafer 1 is provided between the wafer carrier 3 and the half carrier 4 via the wafer transfer jig 2 by using the wafer transfer device 5 having the transfer table 5a and the pusher 5c as the pressing means. By moving the semiconductor wafer 1 manually and by the pusher 5c, the structure of the wafer transfer device 5 can be simplified.

As a result, the cost of the wafer transfer device 5 can be greatly reduced, and the size of the wafer transfer device 5 can be reduced, so that the space can be effectively used.

Although the invention made by the present inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the present invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the above-described embodiment, a case where two concave portions 2d and two convex portions 2e are provided as positioning means at the jig opening ends 2f on both sides of the wafer transfer jig 2, respectively. As described above, the positioning means includes the concave portions 3 d and 4 d of the wafer carrier 3 and the half carrier 4.
Alternatively, all the concave portions 2d or all the convex portions 2e may be used according to the convex portions 3e and 4e.

In the above embodiment, the case where the first storage case is the wafer carrier 3 and the second storage case is the half carrier 4 has been described.
The storage case may be a wafer carrier 3.

That is, the wafer transfer jig 2 is arranged adjacent to the two wafer carriers 3, and relays and guides the semiconductor wafer 1 when transferring the semiconductor wafer 1 from one wafer carrier 3 to the other wafer carrier 3. You may.

Further, in the above-described embodiment, the case where the semiconductor wafer 1 after the epitaxial growth is moved from the wafer carrier 3 to the half carrier 4 in the semiconductor manufacturing process, and then the semiconductor wafer 1 together with the half carrier 4 is washed has been described. However, the epitaxial growth and cleaning may be another process in the semiconductor manufacturing process.

That is, in any process in the semiconductor manufacturing process, when transferring the semiconductor wafer 1 from the wafer carrier 3 to the half carrier 4 or when transferring the semiconductor wafer 1 between the wafer carriers 3, The wafer transfer jig 2 can be used.

The wafer transfer jig 2 may be made of any material other than the fluorine-based resin as long as the material has chemical resistance to a cleaning liquid or the like and does not adversely affect the semiconductor wafer 1. Good.

[0083]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1). Using a wafer transfer jig having a wafer guide passage portion corresponding to the wafer partitioning portion of the first and second storage cases and a positioning means for positioning the first and second storage cases, the semiconductor wafer is moved to the second position. By moving the semiconductor wafer between the first and second storage cases, each semiconductor wafer can be moved in a state where it is maintained substantially horizontal without shifting, and contact between the semiconductor wafers during movement can be prevented.

(2). According to (1), it is possible to prevent the semiconductor wafer from being damaged during the movement, so that damage to the semiconductor wafer can be reduced. As a result, the yield of the semiconductor wafer can be improved.

(3). The positioning means is a concave portion or a convex portion, and the positioning means is provided at two jig opening ends formed so as to face in opposite directions of the wafer transfer jig. The two housing cases and the wafer transfer jig can be easily and accurately positioned.

(4). When a semiconductor wafer is moved between a first housing case and a second housing case via a wafer transfer jig using a wafer transfer device having a transfer table and a pressing unit, a manual wafer By using the transfer device, the structure of the wafer transfer device can be simplified.
Accordingly, the cost of the wafer transfer device can be significantly reduced, and the size of the wafer transfer device can be reduced, so that the space can be effectively used.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of the structure of a wafer transfer jig according to the present invention.

FIG. 2 is a side view, partially broken away, showing an example of an embodiment of a semiconductor wafer transfer state using the wafer transfer jig of the present invention.

FIG. 3 is a perspective view showing an example of an embodiment of a semiconductor wafer transfer state using the wafer transfer jig of the present invention.

FIG. 4 is a partially cutaway side view showing an example of an embodiment of a semiconductor wafer transfer state using the wafer transfer jig of the present invention.

[Explanation of symbols]

 Reference Signs List 1 semiconductor wafer 2 wafer transfer jig 2a wafer guide passage 2b wall 2c wall support 2d concave (positioning means) 2e convex (positioning means) 2f jig opening end 3 wafer carrier (first storage case) 3a Wafer accommodating section 3b Wafer partitioning section 3c Open end 3d Concave section 3e Convex section 4 Half carrier (second accommodating case) 4a Wafer accommodating section 4b Wafer partition section 4c Open end 4d concave section 4e Convex section 5 Wafer transfer device 5a Transfer Table 5b Transfer surface 5c Pusher (pressing means) 5d Guide groove

Claims (8)

[Claims] 1. A wafer transfer jig for guiding a semiconductor wafer when moving the semiconductor wafer, comprising: A first wall and a second wall that are respectively provided and opposed to each other; a wall support that connects the walls and faces each other; and a positioning unit that positions the first and second housing cases. When the semiconductor wafer is moved between the two storage cases, the semiconductor wafer is disposed adjacent to the first and second storage cases and positioned by the positioning means with the first and second storage cases. A wafer transfer jig characterized by being guided. 2. The wafer transfer jig according to claim 1, wherein said positioning means fits into a concave portion or a convex portion provided at an opening end of said first and second storage cases. A concave portion, and the positioning means is provided at two jig opening ends formed in opposite directions by the wall portion and the wall portion supporting portion. Utensils. 3. The wafer transfer jig according to claim 1, wherein the first and second storage cases have a shallower wafer storage portion when the two wafer storage portions have different depths. A wafer transfer jig, which is detachably attached to the open end of the storage case and guides the semiconductor wafer. 4. A semiconductor manufacturing method using the wafer transfer jig according to claim 1, wherein a first housing case housing the semiconductor wafer is prepared, and a predetermined process is performed on the semiconductor wafer. When performing, a second storage case for storing the semiconductor wafer is prepared, and a wall portion having a wafer guide passage portion corresponding to a wafer partition portion of each of the first and second storage cases and facing the wall; Preparing a wafer transfer jig having a wall connecting portion and an opposed wall support portion, arranging the wafer transfer jig adjacent to between the first and second storage cases, and The first and second storage cases and the wafer transfer jig are positioned, and the semiconductor wafer is guided by the wafer transfer jig to transfer the semiconductor wafer from the first storage case to the second storage case. Semiconductor manufacturing method characterized by be. 5. The semiconductor manufacturing method according to claim 4, wherein a depth of the wafer storage portion of the second storage case is smaller than a depth of the wafer storage portion of the first storage case. The wafer transfer jig is detachably attached to the open end of the second storage case, and the wafer transfer jig is arranged adjacent to the first and second storage cases to guide the semiconductor wafer. A semiconductor manufacturing method. 6. The semiconductor manufacturing method according to claim 4, wherein said second wafer is guided by said wafer transfer jig.
After storing the semiconductor wafer in the storage case, the second
The wafer transfer jig is detached from the storage case, and the second
A method for manufacturing a semiconductor, comprising: cleaning the semiconductor wafer together with the accommodation case. 7. The semiconductor manufacturing method according to claim 4, 5 or 6, further comprising preparing a wafer transfer device having a transfer table on which the semiconductor wafer is moved and pressing means for pressing the semiconductor wafer. After positioning and placing the first storage case, the second storage case, and the wafer transfer jig adjacent to each other on the transfer table, the first storage case and the second storage case are stored in the first storage case. Pressing the semiconductor wafer by the pressing means, guiding the semiconductor wafer by the wafer transfer jig, and moving the semiconductor wafer from the first storage case to the second storage case. Semiconductor manufacturing method. 8. The semiconductor manufacturing method according to claim 7, wherein the semiconductor wafer is manually pressed by using the pressing means.