JPH10144708A - Resin sealing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing device of a structure, wherein the coating time of a protective resin per chip is long and is greatly influenced also by the chip size. SOLUTION: A resin sealing device of a structure, wherein the gap part between a semiconductor chip mounted on a lead frame and an external ring part formed in a state that it encircles this chip is sealed with a protective resin, is provided with a coating nozzle 3 for applying the protective resin to the gap part between the chip and the ring part and at the same time, the nozzle 3 has a plurality of nozzle needles 3b arranged linearly after at least one side of the chip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a CSP (Chip Scal
The present invention relates to a resin sealing device for sealing a gap between a semiconductor chip and an outer ring portion surrounding the semiconductor chip with a protective resin in the manufacture of a semiconductor package such as an ePackage or a TBGA (Tape Ball Grid Array).

[0002]

2. Description of the Related Art FIG. 8 is a sectional view showing a structural example of a semiconductor package to be sealed with a resin. In the illustrated semiconductor package 80, a film wiring board 83 is attached to the circuit forming surface side (the lower surface side in the figure) of the semiconductor chip 81 via an adhesive layer 82. A plurality of leads 84 extend outward from the periphery of the film wiring board 83,
The tips of these leads 84 are joined to electrode pads (not shown) of the semiconductor chip 81. Further, ball electrodes 85 for external connection are arranged in a grid on the lower surface side of the film wiring board 83, and these ball electrodes 85 and the plurality of leads 84 are electrically connected to each other. Further, outside the semiconductor chip 81, an outer ring portion 86 is provided so as to surround the semiconductor chip 81. A predetermined gap is formed between the outer ring portion 86 and the semiconductor chip 81, and the gap is filled with a protective resin 87 so as to cover the lead joint.

Here, in sealing the gap between the semiconductor chip 81 and the outer ring portion 86 with the protective resin 87 as described above, a resin sealing device as shown in FIG. 9 has conventionally been employed. . This conventional device includes a syringe 92 having a coating nozzle 91 attached to a tip end thereof, and a syringe 9 having the same.
A work holder 94 for supporting the lead frame 88 and a syringe holder 93 for fixing the lead frame 88 is provided. Of these, the application nozzle 91 discharges a protective resin (not shown) filled in the syringe 92 from the nozzle tip, and is detachably attached to the tip of the syringe 92. The syringe 92 has a cylindrical structure, and is fixedly supported on a syringe holder 93 by a tightening screw 95 with its outer peripheral surface as an attachment surface. On the other hand, the work receiving table 94 has a concave cross section, and has a structure in which the lead frame 88 is supported on the bottom surface of the concave portion and the lead frame 88 is positioned by the reference pin 96. The work receiving table 94 is mounted on an XY table 97.
It is supported by a Y table 97 so as to be movable in two horizontal axial directions.

When resin sealing is performed using the conventional device having the above-described structure, as shown in FIG. 9, a lead frame 88 having a plurality of semiconductor chips 81 mounted at predetermined intervals is provided.
Is set on the work receiving table 94. At this time, the reference hole of the lead frame 88 is fitted to the reference pin 96 of the work receiving table 94, and the lead frame 88 is positioned and fixed. Next, the work receiving table 94 is horizontally moved by the XY table 97, whereby the semiconductor chip 81 to be sealed is arranged directly below the application nozzle 91. Next, by lowering the syringe 92 integrally with the syringe holder 93, the tip of the application nozzle 91 is brought closer to the corner of the semiconductor chip 81 as shown in FIG. Subsequently, the XY table 9 is supplied while the protective resin is supplied from the application nozzle 91.
7 drives the work receiving table 94 horizontally. At this time, the application nozzle 91 applies the protective resin sequentially along each side of the semiconductor chip 81. Then, when the application nozzle 91 returns to the initial position (at the start of application), the application of the protective resin is stopped, and at this time, the syringe 92 is retracted upward. Thus, the work of applying the protective resin per chip is completed. Thereafter, the protective resin is applied around each semiconductor chip 81 sequentially while moving the work receiving table 94 in the same procedure.

[0005]

However, the above-mentioned conventional resin sealing device has the following problems. First, since the coating method of the protective resin by the coating nozzle 91 is a so-called drawing method in which the lead frame 88 is horizontally moved together with the work receiving table 94 and applied sequentially along each side of the semiconductor chip 81, The application time per chip is inevitably long.
In addition, the application time per chip is equal to the semiconductor chip 81.
Greatly depends on the external size of the device.

Second, since there is no mechanism for positioning the coating nozzle 91 and the lead frame 88, the coating nozzle 91
When replacing the syringe 92 or the like, the relative position between the application nozzle 91 and the lead frame 88 had to be adjusted visually. Therefore, it takes time to adjust the position when setting up such as nozzle replacement, and the reproducibility of the position has not been sufficiently ensured. Therefore, the relative position accuracy (currently required accuracy is about ± 0.05 mm) of the coating nozzle 91 with respect to the lead frame 88 (semiconductor chip 81) is deviated. As a result, as shown in FIG. Problems such as protection resin 87 getting on the back side of 81 and protection resin 87 wrapping around the outer ring portion 86 as shown in FIG. 11B are caused.

[0007]

According to a first aspect of the present invention, a resin for sealing a gap between a semiconductor chip mounted on a lead frame and an outer ring formed around the semiconductor chip with a protective resin. The sealing device includes an application nozzle for applying a protective resin to a gap between the semiconductor chip and the outer ring portion, and a plurality of the application nozzles are linearly arranged along at least one side of the semiconductor chip. A configuration having a nozzle needle is adopted.

In the resin sealing device having the above-described structure, the nozzle needles of the application nozzle are arranged along each side of the semiconductor chip, and in this state, the nozzle needles are inserted into the gap between the semiconductor chip and the outer ring. By applying the protective resin, each side of the semiconductor chip can be collectively resin-sealed. Further, when the nozzle needles of the application nozzle are linearly arranged along the four sides of the semiconductor chip, it is possible to collectively seal the four sides of the semiconductor chip with resin.

According to a second aspect of the present invention, there is provided a resin sealing device for sealing a gap between a semiconductor chip mounted on a lead frame and an outer ring formed so as to surround the semiconductor chip with a protective resin. An application nozzle for applying a protective resin to a gap between the chip and the outer ring portion,
A nozzle support mechanism for positioning and supporting the application nozzle,
Adopting a configuration including a work receiving table for positioning and supporting the lead frame, and positioning means for performing positioning between the application nozzle supported by the nozzle support mechanism and the lead frame supported by the work receiving table. I have.

[0010] In the resin sealing apparatus having the above-described structure, when the application nozzle is replaced, the setup time between the application nozzle and the lead frame is greatly reduced by performing the positioning between the application nozzle and the lead frame by the positioning means. As a result, the reproducibility of the position can be sufficiently obtained.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view showing one embodiment of the resin sealing device according to the present invention. The illustrated resin sealing device seals a gap between a semiconductor chip 2 mounted on a lead frame 1 and an outer ring portion (not shown) formed so as to surround the semiconductor chip 2 with a protective resin. The apparatus mainly includes an application nozzle 3 for applying the protective resin to the gap, a nozzle support mechanism 4 for supporting the application nozzle 3, and a work receiving table 5 for supporting the lead frame 1. Note that an outer ring portion surrounding the semiconductor chip 2 is formed integrally with the lead frame 1,
The lead frame 1 is divided into individual pieces by cutting off unnecessary parts after resin sealing.

As shown in FIG. 2, the application nozzle 3 is connected to a nozzle body 3a having a hollow structure, a plurality of nozzle needles 3b arranged on the tip end surface of the nozzle body 3a, and a syringe described later. And a connection part 3c.
On the outer peripheral surface of the nozzle body 3a, a pair of notched planes 3d parallel to each other are used for positioning with respect to the nozzle support mechanism 4.
Are formed. A plurality of nozzle needles 3b are arranged in a straight line along the four sides of the semiconductor chip 2 on the tip end surface of the nozzle body 3a. Specifically, for example, assuming that the semiconductor chip 2 to be applied has an L mm square and a gap dimension with respect to the outer ring portion is α mm, each nozzle needle 3b has a square shape with a side length of (L + α). Are arranged in a straight line. Further, the protrusion dimensions of all the nozzle needles 3b with respect to the distal end face of the nozzle body 3a are all set to the same size, and the base end of each nozzle needle 3b communicates with the hollow part of the nozzle body 3a. Fixedly supported.

Incidentally, in the present embodiment, the nozzle needle 3b having an outer diameter of 0.5 mm and an inner diameter of 0.3 mm is employed, and the arrangement pitch is 0.7 to 1 depending on the viscosity of the protective resin used. It was set appropriately within a range of 0.0 mm.

The nozzle support mechanism 4 includes a syringe holder 6 having an L-shaped plate structure, a nozzle holder 7 also having an L-shaped plate structure, and a lifting drive system (not shown) for raising and lowering the entirety. The syringe holder 6 has a circular through-hole 6a corresponding to the outer diameter of the syringe, which will be described later, and further has a slit 6 communicating with the through-hole 6a.
b is provided. A screw 8 is screwed from one side end surface of the syringe holder 6 so as to cross the slit 6b.
It is configured so that the inside diameter of the can be adjusted. In the syringe holder 6 utilizing this configuration, the syringe 9 is vertically fitted into the through hole 6a, and in this state, the screw 8 is turned in the screwing direction to tighten and fix the syringe 9.

The nozzle holder 7 is fixed to another end surface of the syringe holder 6 (the surface opposite to the mounting surface of the screw 8) by a screw (not shown). FIG. 3 shows the nozzle holder 7
(A), as shown in FIG.
A stepped fitting portion 7a corresponding to the outer shape of a) is provided. The fitting portion 7a is arranged coaxially with the through hole 6a of the syringe holder 6. The fitting portion 7a is provided with a through hole 7b for projecting the nozzle needle 3b of the application nozzle 3 downward. For the nozzle holder 7, the application nozzle 3 is attached to the fitting portion 7a.
From above, and the nozzle end face is fitted into the fitting portion 7a.
And fixed to the stepped surface 7c. At this time, the main body portion (3a) of the application nozzle 3 is fitted into the fitting portion 7a, thereby positioning the application nozzle 3 in the horizontal and rotational directions, and at the same time, the nozzle tip surface abuts against the stepped surface 7c. With this, the application nozzle 3 is positioned in the vertical direction.

The application nozzle 3 positioned in the nozzle holder 7 as described above is detachably connected to the distal end of the syringe 9 as shown in FIGS. 1 and 3A and 3B.
Specifically, as shown in FIG. 4, a double thread 9 a is provided on the inner peripheral surface of the distal end of the syringe 9, and a flange 3 e is provided at an end of the connecting portion 3 c of the application nozzle 3. By inserting the connecting portion 3c of the application nozzle 3, the double-threaded screw 9a and the flange portion 3e are brought into pressure contact with each other, thereby connecting the two detachably while preventing resin leakage from the connecting portion.

On the other hand, the work receiving table 5 has a concave cross section, supports the lead frame 1 on the concave bottom surface 5a in a mounted state, and uses a plurality of reference pins 10 rising from the concave bottom surface 5a. The structure is such that the lead frame 1 is positioned. The work receiving table 5 is mounted on an XY table (not shown), and is supported by the XY table so as to be movable in two horizontal axial directions (XY directions).

Here, in the present embodiment, as described above, as positioning means for positioning the coating nozzle 3 supported by the nozzle support mechanism 4 and the lead frame 1 supported by the work receiving table 5, A pair of positioning holes 1 are formed in a nozzle holder 7 which is a component of the nozzle support mechanism 4.
1 and the work receiving table 5 is provided with the positioning holes 1.
A configuration is provided in which a pair of positioning pins 12 that can be fitted into the pin 1 are provided.

The pair of positioning holes 11 are formed near the fitting portion 7a after ensuring the positional accuracy with respect to the fitting portion 7a into which the application nozzle 3 is fitted. On the other hand, the pair of positioning pins 12 are provided in an upright state on one edge of the work receiving table 5 after ensuring the positional accuracy with respect to the reference 10 rising from the concave bottom surface 5a. Also, the positioning hole 1 on the nozzle holder 7
The pitches of the positioning pins 1 and 11 are set to be equal to the pitch of the positioning pins 12 and 12 on the work receiving table 5. Further, the distal end portion of each positioning pin 12 is formed in a tapered shape so that the fitting with the positioning hole 11 becomes smooth.

When resin sealing is performed using the resin sealing apparatus having the above configuration, as shown in FIG. 1, a lead frame 1 on which a plurality of semiconductor chips 2 are mounted at predetermined intervals is provided.
Is set on the work cradle 5. At this time, the lead frame 1 is positioned and mounted on the concave bottom surface 5a while the reference holes of the lead frame 1 are fitted into the reference pins 10 of the work receiving table 5. Next, the work receiving table 5 is horizontally moved by an XY table (not shown), and thereby the semiconductor chip 2 to be sealed is disposed immediately below the application nozzle 3. Next, the entire nozzle support mechanism 4 is moved down by an elevation drive system (not shown) to bring the nozzle needle 3 b at the tip of the application nozzle 3 close to the semiconductor chip 2. At this time, each nozzle needle 3b
Are arranged along the four sides of the semiconductor chip 2, and the tip ends thereof face the gap between the semiconductor chip 2 and the outer ring portion.

Subsequently, a predetermined pressure is applied to the protective resin filled in the syringe 9 and the coating nozzle 3, thereby simultaneously protecting the nozzles 3b of the coating nozzle 3 from the nozzle needles 3b as shown in FIG. The resin 13 is discharged. At this time,
The protective resin 13 discharged from each nozzle needle 3b is connected to the semiconductor chip 2 facing the nozzle needle 3b and the outer ring portion 1
4 is applied to the gap. Here, the protective resin 13 immediately after the application becomes independent from the nozzle needle 3b at an equal pitch as shown in FIG. 5 (a). Finally, they are connected to each other as shown in FIG. After the application of the protective resin 13 from the application nozzle 3 in this manner, the entire nozzle support mechanism 4 is raised, whereby the application nozzle 3 is retracted upward.

As described above, the protective resin 13 per chip
Is completed, and thereafter, the protective resin 13 is applied to the periphery of each semiconductor chip 2 (the gap between the semiconductor chip 2 and the outer ring portion 14) while moving the work receiving table 5 in the same procedure. . In this way, the gap between each semiconductor chip 2 and the outer ring portion 14 on the lead frame 1 is divided into a plurality of nozzle needles 3
With b, resin sealing can be performed at once. Further, even when the external dimensions of the semiconductor chip 2 to be handled are changed, the application time is influenced by the chip size as in the related art by applying the protective resin 13 with the nozzle needles 3b arranged in accordance with the change. Is also gone.

Further, in a setup operation such as replacement of the coating nozzle 3 and the syringe 9, the positioning hole 11 of the nozzle holder 7 is simply fitted to the positioning pin 12 of the work receiving table 5, and the nozzle support mechanism 4 and the work Since the relative position with respect to the cradle 5 can be accurately reproduced, the setup time is greatly reduced as compared with the conventional visual position adjustment, and the reproducibility of the position is significantly improved. As a result, in the actual application operation, problems such as the protection resin 13 getting on the back surface side of the semiconductor chip 2 and the protection resin 13 wrapping around the outer ring portion 14 are not caused.

In the above embodiment, a positioning hole 11 is provided in the nozzle support mechanism 4 as a means for positioning the coating nozzle 3 and the lead frame 1, and a positioning pin 12 fitted to the hole is provided on the work receiving table 5. Although provided, on the contrary, a positioning pin may be provided on the nozzle support mechanism 4 side, and a positioning hole fitted to the positioning pin may be provided on the work receiving table 5 side.

FIG. 6 is a view for explaining another embodiment of the positioning means in the present invention. First, in FIG. 6A, a pair of positioning pins 15 are provided on the nozzle holder 7 that supports the application nozzle 3. These positioning pins 15 are provided at equal pitches with the left and right reference holes 1a drilled in the lead frame 1 and at equal distances from the center axis of the fitting portion 7a into which the application nozzle 3 is fitted. Installed. Further, the outer diameter of each positioning pin 15 is set to be smaller than the diameter of the reference hole 1a of the lead frame 1 by about several tens of μm, whereby the positioning pin 15 can be fitted into the reference hole 1a of the lead frame 1. I have. Furthermore, each positioning pin 15
Is formed in a tapered shape so that the fitting with the reference hole 1a becomes smooth. In addition, projecting portions 7d are provided on both sides of the nozzle holder 7 for positioning in the vertical direction.
Are integrally formed. The protrusion dimension of the protrusion 7b is
In applying the protective resin, the setting is appropriately set in consideration of the step of the work receiving table 5 and the like so that the application nozzle 3 is positioned at a specified height.

On the other hand, in the work receiving table 5 having a concave cross section, through holes 5b are formed at the same pitch as the reference holes 1a of the lead frame 1. As can be seen from FIG. 1, a plurality of reference holes 1a of the lead frame 1 are provided on both edges of the frame in the longitudinal direction of the frame. 5b
Is provided. These through holes 5 b are for avoiding positional interference between the positioning pins 15 and the work receiving table 5 when the positioning pins 15 are fitted into the reference holes 1 a of the lead frame 1. The vertical and horizontal dimensions of the concave bottom surface 5a of the work receiving table 5 are such that the lead frame 1 placed thereon moves by a predetermined distance (for example, about 0.1 to 0.3 mm) in the XY directions (see FIG. 1). So that you can
It is set slightly larger than the external dimensions of the lead frame 1.

In the positioning means having the above configuration, the nozzle holder 7 is lowered while the lead frame 1 is placed on the bottom surface 5a of the concave portion of the work receiving table 5. At this time, even if the position of the lead frame 1 on the work receiving table 5 is slightly shifted with respect to the positioning pin 15 on the nozzle holder 7 side, the distal end of the positioning pin 15 is positioned at the reference hole 1a.
As the position of the lead frame 1 is corrected, the positioning pin 15 can be fitted into the reference hole 1a of the lead frame 1 without any trouble.
Thus, as shown in FIG. 6B, the pair of positioning pins 15 are fitted into the reference holes 1a of the lead frame 1, and the protruding portions 7d of the nozzle holder 7 are brought into contact with the upper end of the work receiving table 5. Thus, the application nozzle 3 is arranged at a specified height, and the application nozzle 3 is directly positioned on the lead frame 1. Therefore, by supplying the protective resin from the application nozzle 3 in this state, it is possible to apply the protective resin around the semiconductor chip 2 on the lead frame 1 with high positional accuracy.

Incidentally, in order to more accurately align the coating nozzle 3 and the lead frame 1, it is necessary to strictly set the fitting tolerance between the positioning pin 15 and the reference hole 1a. However, if the fitting tolerance between the two is set strictly, the reference hole 1a of the lead frame 1 is raised when the nozzle holder 7 is raised after the protective resin is applied.
There is a concern that the positioning pin 15 may be caught on the lead frame 1 and the lead frame 1 may be lifted. Therefore, as a countermeasure against this, the bottom surface 5a of the concave portion
It is preferable to adopt a configuration in which an appropriate number of vacuum holes (not shown) are provided, and the lead frame 1 is sucked to the concave bottom surface 5a through the vacuum holes. According to this configuration, by appropriately setting the suction force from the vacuum hole, it is possible to reliably prevent the lead frame 1 from being lifted after application while allowing the movement of the lead frame 1 on the concave bottom surface 5a. Become.

In the positioning means shown in FIG. 6, a positioning pin 15 which can be fitted in the reference hole 1a of the lead frame 1 is provided on the nozzle holder 7, but a modified example thereof is shown in FIG. Such a configuration is also conceivable.
That is, in FIG. 7, the positioning pin 15 on the nozzle support mechanism 4 side is not provided on the nozzle holder 7 as described above, but an independent pin mounting plate 16 is attached to the coating nozzle 3.
To the pin mounting plate 16 and the positioning pin 1
5 is attached. Also in this configuration,
Since the application nozzle 3 is directly positioned with respect to the lead frame 1 supported by the work receiving table 5, the same effect as described above can be obtained.

[0030]

As described above, according to the resin sealing apparatus of the present invention, a plurality of nozzle needles are provided in the application nozzle, and the nozzle needles are linearly arranged along at least one side of the semiconductor chip. With this configuration, it is possible to collectively seal each side of the semiconductor chip with resin. Also, if the plurality of nozzle needles described above are arranged in a straight line following the four sides of the semiconductor chip,
It is also possible to collectively seal the four sides of the semiconductor chip with resin. As a result, the application time per chip can be significantly reduced without being affected by the chip size.

Further, according to the resin sealing device of the present invention, a configuration is provided in which positioning means for positioning the application nozzle supported by the nozzle support mechanism and the lead frame supported by the work receiving table is provided. As a result, the setup time required for nozzle replacement and the like can be greatly reduced, and the reproducibility of the position can be sufficiently obtained. As a result, even during setup work such as nozzle replacement, the relative positional accuracy of the coating nozzle with respect to the lead frame does not change, so that the protective resin is always applied to the gap between the semiconductor chip and the outer ring portion with high positional accuracy. It is possible to do.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a resin sealing device according to the present invention.

FIG. 2 is a diagram illustrating a structure of a coating nozzle according to the embodiment.

FIG. 3 is a view showing a mounting state of a coating nozzle.

FIG. 4 is a diagram showing a connection structure between an application nozzle and a syringe.

FIG. 5 is a diagram illustrating an application state of a protective resin in the embodiment.

FIG. 6 is a view showing another embodiment of the positioning means in the present invention.

FIG. 7 is a diagram illustrating a modification of the positioning means.

FIG. 8 is a cross-sectional view illustrating a structural example of a semiconductor package to be sealed with a resin.

FIG. 9 is a perspective view showing a conventional resin sealing device.

FIG. 10 is a diagram illustrating a conventional coating method.

FIG. 11 is a diagram illustrating a conventional problem.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Lead frame 2 Semiconductor chip 3 Application nozzle 3b Nozzle needle 4 Nozzle support mechanism 5 Work pedestal 11 Positioning hole 12,15 Positioning pin 1
3 Protective resin 14 External ring

Claims (5)

[Claims] 1. A resin sealing device for sealing a gap between a semiconductor chip mounted on a lead frame and an outer ring formed so as to surround the semiconductor chip with a protective resin. A coating nozzle for applying the protective resin to a gap between the outer ring portion and the coating nozzle is provided, and the coating nozzle has a plurality of nozzle needles arranged linearly along at least one side of the semiconductor chip. Characteristic resin sealing device. 2. The resin sealing device according to claim 1, wherein the plurality of nozzle needles are linearly arranged along four sides of the semiconductor chip. 3. A resin sealing device for sealing a gap between a semiconductor chip mounted on a lead frame and an outer ring formed so as to surround the semiconductor chip with a protective resin. An application nozzle for applying the protective resin to a gap between the external ring portion, a nozzle support mechanism for positioning and supporting the application nozzle, a work receiving table for positioning and supporting the lead frame, and a support for the nozzle support mechanism A resin-sealing device comprising: a positioning unit for performing positioning between the applied coating nozzle and the lead frame supported by the work receiving table. 4. The positioning means is provided with a positioning hole provided in one of the nozzle support mechanism and the work receiving table, and a positioning hole provided in one of the other and fitted in the positioning hole. 4. The resin sealing device according to claim 3, comprising a pin. 5. The positioning device according to claim 3, wherein said positioning means comprises a positioning pin provided on said nozzle support mechanism and capable of being fitted into a reference hole of said lead frame.
The resin sealing device as described in the above.