JPH10135172A - Substrate treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently restrain contamination of a surface on the linking mechanism side of a substrate. SOLUTION: This substrate treatment device is provided with the following: at least three substrate holding members 10 which hold at least three positions of the outer periphery of a substrate W, a link mechanism 20 which operates the holding and the releasing of the substrate W by the holding members 10, and substrate rotating means 1-4 which rotate the substrate held in the horizontal attitude by the holding members 10 around the vertical axis. The substrate W is held by the holding members 10, rotated around a rotation center axis J1, and suitably treated. A blocking member 6 having a surface 6a facing the surface on the link mechanism 20 side of the substrate W is disposed in the space between the surface (lower surface) on the link mechanism 20 side of the substrate W, held in the horizontal attitude by the holding members 10 and the linking mechanism 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for holding a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk by rotating the substrate about a vertical axis. The present invention relates to a substrate processing apparatus that performs appropriate processing on a substrate.

[0002]

2. Description of the Related Art As a conventional substrate processing apparatus of this type, for example, there is one as shown in FIGS. FIG.
(A) is a longitudinal sectional view showing a configuration of a substrate processing apparatus according to a conventional example, and (b) is a plan view thereof, FIG.
Is a plan view of a main part showing a state where the substrate is held, and FIG. 2B is a plan view of a main part showing a state where the holding of the substrate is released.

[0003] This conventional device is configured as follows. A cylindrical rotating shaft 1 operatively connected to a motor (not shown) and rotatably mounted around a rotation center axis J1 of the substrate.
A spin base 102 is provided at an upper end of the base 01, and the spin base 102 is configured to be rotatable around an axis J1. The spin base 102 has three or more arms 103
Are provided radially, and a substrate holding member 110 is provided at the tip of each arm 103.

[0004] The substrate holding member 110 has a columnar substrate mounting portion 111 rotatably provided on the arm portion 103 about a vertical axis J2, and a notch with a stepped upper surface of the substrate mounting portion 111. Are formed integrally with the holding portion 112.

As shown in FIGS. 20 (b) and 21 (a), the substrate holding member 110 is urged to rotate counterclockwise in FIG.
The substrate W on which the lower surface of the outer peripheral end is mounted on the substrate mounting portion 111
Is pressed against the holding portion 112 to hold the substrate W. On the other hand, when the substrate holding member 110 is rotated clockwise about the axis J2 as a rotation center axis against the urging of the substrate holding member 110 counterclockwise as described later, FIG. As shown in ()), the holding portion 112 is separated from the outer peripheral edge of the substrate W, and the holding of the substrate W is released.

The operation of holding and releasing the substrate W by the substrate holding member 110 is performed by a link mechanism 120.
The link mechanism 120 includes a swing member 121, a link member 122, and the like. The swinging member 121 extends to the side of the substrate holding member 110 and is swingable about the rotation axis J2 of the substrate placing portion 111 as a swing fulcrum.
1 is provided. On the tip end side of the swing member 121,
The distal end side of the link member 122 is rotatably connected, and the base end side of the link member 122 is rotatably connected to the upper end of the drive shaft 130.

The drive shaft 130 is penetrated through the hollow portion of the rotary shaft 101 so as to be rotatable relative to the rotary shaft 101 around the axis J1. Then, the drive shaft 130 is rotationally biased clockwise (in the direction of the arrow indicated by the solid line in FIG. 20B) with respect to the rotary shaft 101 around the axis J1 by a biasing member such as a coil spring (not shown). It is supposed to be. Due to the rotational bias of the drive shaft 130, the swing member 121 is swing-biased via the link member 122 in a direction in which the tip end side of the swing member 121 moves away from the axis J <b> 1, and the substrate holding member 110 is accordingly rotated. The rotation is urged counterclockwise in the figure with J2 as the rotation center axis, and the holding portion 112 presses and urges the outer peripheral edge of the substrate W to hold the substrate W as described above.

Further, the drive shaft 130 is rotated against the rotation shaft 10 against the clockwise rotation bias of the drive shaft 130 by the biasing member.
There is also provided a release mechanism (not shown) for rotating counterclockwise with respect to the axis 1 in the counterclockwise direction in the figure (in the direction of the arrow indicated by the two-dot chain line in FIG. 20B) with the axis J1 as the rotation center axis. By the clockwise rotation of the drive shaft 130 by the release mechanism, the distal end side of the swing member 121 is moved to the axis J via the link member 122.
The swing member 121 is swung in the direction of being pulled back to the first side,
Accordingly, the substrate holding member 110 is rotated clockwise about the axis J2 as the rotation center axis, and the holding portion 112 is separated from the outer peripheral edge of the substrate W as described above, and the holding of the substrate W is released.

Above the held substrate W, a nozzle 140 for supplying a processing liquid to the upper surface (usually the surface) of the substrate W is arranged.

Then, by rotating the spin base 102 about the axis J1, the held substrate W is rotated about the axis J1, and a processing solution such as a resist solution, a cleaning solution, a developing solution is applied to the upper surface of the substrate W from a nozzle 140. Is supplied, and an appropriate process such as a resist coating process, a cleaning process, and a developing process is performed on the substrate W.

When the substrate W is rotated about the axis J1 by the above-described conventional apparatus, the spin base 102, the arm 103, the link mechanism 120, and the substrate holding member 110 are also rotated about the axis J1 together with the rotating shaft 101 and the substrate W. Is done. The rotation around the axis J1 of the spin base 102, the arm 103, and the like causes the atmosphere around the apparatus to change the substrate W
From the lower surface (the surface on the side of the link mechanism 120). Since the mist of the processing liquid floats around the apparatus, a large amount of the mist of the processing liquid adheres to the lower surface of the substrate W due to the entrainment of the atmosphere, thereby contaminating the lower surface of the substrate W. I was

Therefore, as shown in FIG. 22, conventionally, the spin base 102 is formed in a disk shape, and the lower surface of the substrate W and the external atmosphere are cut off and held by the disk-shaped spin base 102. When the substrate W is rotated around the axis J1, there is also a configuration in which an external atmosphere is prevented from being involved from the lower surface side of the substrate W.

[0013]

According to the conventional apparatus shown in FIG. 22, the external atmosphere is involved from the lower surface (the surface on the side of the link mechanism 120) of the substrate W held by the disk-shaped spin base 102. Although contamination of the lower surface of the substrate W has been reduced to some extent, contamination of the lower surface of the substrate W still occurs.

The present invention has been made in view of such circumstances, and has as its object to provide a substrate processing apparatus capable of sufficiently suppressing contamination of a surface of a substrate on a link mechanism side.

[0015]

The present inventors have investigated the causes of the above-mentioned inconveniences, and as a result, have found out the following factors.

That is, when rotating the held substrate W around the axis J1, the disk-shaped spin base 102 and the substrate W are rotated.
In the space 150 (see FIG. 22A) between the swing member 121 of the link mechanism 120 and the link member 1
Since the space 22 is rotated around the axis J1, this space 150
The air flow in the inside is disturbed, and the disc-shaped spin base 102 and the substrate W
The surface of the substrate W on the side of the link mechanism 120 is contaminated by entraining the external atmosphere containing the mist of the processing liquid into the space 150 from the gap 151 (see FIG. 22A) between the outer periphery and the outer periphery. it is conceivable that.

Further, since the link mechanism 120 is disposed in the space 150 between the disc-shaped spin base 102 and the lower surface of the substrate W, the disc-shaped spin base 102 and the substrate W
22 (see FIG. 22A) cannot be reduced to a certain value or more, and therefore, the space of the gap 151 between the disc-shaped spin base 102 and the outer peripheral end of the substrate W Is increased, and the outside atmosphere easily flows from the gap 151, which is considered to be one of the causes of contamination of the surface of the substrate W on the link mechanism 120 side.

The inventors of the present invention have made the following inventions based on the results of the above investigation. That is, the invention according to claim 1 is provided on three or more substrate holding members for holding the outer peripheral end of the substrate at three or more positions, and on the front side or the back side of the substrate held by the substrate holding member. A link mechanism for operating the holding and release of the substrate by the substrate holding member, substrate rotating means for rotating the substrate held by the substrate holding member around a vertical axis, and a link of the substrate held by the substrate holding member A blocking member having a facing surface facing the link mechanism side surface of the substrate is provided in a space between the mechanism side surface and the link mechanism.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, a cover member for covering the periphery of the link mechanism is provided.

According to a third aspect of the present invention, at least three substrate holding members for holding the outer peripheral edge of the substrate at three or more locations, and opposing opposing surfaces or back surfaces of the substrate held by the substrate holding members are provided. And a link mechanism for operating the holding and release of the substrate by the substrate holding member, and substrate rotating means for rotating the substrate held by the substrate holding member around a vertical axis. Is what you do.

[0021]

According to the first aspect of the present invention, in the space between the link mechanism-side surface of the substrate held by the substrate holding member and the link mechanism, the opposing surface opposing the link mechanism-side surface of the substrate. Is provided, the entrapment of the external atmosphere from the surface of the substrate on the link mechanism side is blocked by the blocking member. And since the link mechanism does not exist in the space between the link mechanism side surface of the substrate and the blocking member,
The airflow in this space is not disturbed by the rotation of the link mechanism. Further, since the link mechanism is not provided in the space, the opposing surface of the blocking member can be close to the surface of the substrate on the link mechanism side, and the gap between the blocking member and the outer peripheral end of the substrate can be sufficiently increased. Can be narrow.

According to the second aspect of the present invention, since the cover member that covers the periphery of the link mechanism is provided, the turbulence of the air flow due to the rotation of the link mechanism does not affect the outside by the cover member. The airflow in the external space, that is, the space around the device can be prevented from being disturbed. Further, contamination of the link mechanism can be prevented by the cover member.

According to the third aspect of the present invention, the link mechanism for operating the holding and releasing of the substrate by the substrate holding member has a facing surface facing the front surface or the back surface of the substrate held by the substrate holding member. Therefore, the opposing surface of the link mechanism acts in the same manner as the opposing surface of the blocking member according to the first aspect of the present invention, without providing the blocking member.
Entanglement of the external atmosphere from the surface of the substrate on the link mechanism side can be blocked. The link mechanism has an opposing surface facing the front surface or the back surface of the substrate held by the substrate holding member. Therefore, even when the link mechanism is rotated, the surface of the substrate on the link mechanism side and the opposing surface of the link mechanism are not rotated. The airflow in the space between them is not disturbed. Also, since the opposing surface of the link mechanism can be made closer to the surface of the substrate on the link mechanism side, the gap between the opposing surface of the link mechanism and the outer peripheral end of the substrate can be made sufficiently small.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a configuration of a substrate processing apparatus according to a first embodiment of the present invention, and FIG.
FIG. 3 is a plan view in which the blocking member is not shown, and FIG. 4 is a partially omitted plan view showing the configurations of the urging mechanism and the release mechanism of the first embodiment.

In the first embodiment and the following embodiments, an apparatus for cleaning and drying a substrate is taken as an example. However, various types of substrate processing apparatuses such as a resist coating apparatus and a developing apparatus are also used. The invention is equally applicable. In the first embodiment and each of the following embodiments, an apparatus for cleaning and drying a semiconductor wafer is taken as an example. However, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and an optical disk The present invention can be similarly applied to an apparatus that performs appropriate processing on various substrates such as a substrate.

The apparatus of the first embodiment is configured as follows. The cylindrical rotary shaft 1 is operatively connected to a motor 3 by a belt transmission mechanism 2 to rotate the substrate rotation center axis J.
It stands up so as to be able to rotate around one turn. A ring-shaped spin base 4 is provided at the upper end of the rotating shaft 1, and the spin base 4 is configured to be rotatable around the axis J1. The rotating shaft 1, the belt transmission mechanism 2, the motor 3, and the spin base 4 correspond to a substrate rotating unit in the present invention.

Near the periphery of the spin base 4, a substrate W
Are provided at three or more locations. Similar to the substrate holding member 110 of the conventional apparatus, the substrate holding member 10 has a columnar substrate mounting portion 11 provided on the spin base 4 so as to be rotatable around a vertical axis J2, and an upper surface of the substrate mounting portion 11. And a holding portion 12 provided in a notch shape with a stepped portion are integrally formed.

The substrate holding member 10 has a shaft J as described later.
As shown in FIG. 21 (a), the outer peripheral edge of the substrate W on which the lower surface of the outer peripheral edge is mounted on the substrate mounting portion 11 by being rotationally urged counterclockwise in FIG. Edge is holding part 12
To hold the substrate W (solid line in FIG. 2). On the other hand, the substrate holding member 10 is rotated clockwise about the axis J2 as a rotation center axis against the urging of the substrate holding member 10 in the counterclockwise direction, as described later, so that FIG.
Similarly to (b), the holding unit 12 is separated from the outer peripheral edge of the substrate W, and the holding of the substrate W is released (two-dot chain line in FIG. 2).

The operation of holding and releasing the substrate W by the substrate holding member 10 is performed by the link mechanism 20. The link mechanism 20 includes a swing member 21, a link member 22, and the like. The swing member 21 is connected to the substrate holding member 10.
And is swingably provided on the substrate mounting portion 11 with the rotation axis J2 of the substrate mounting portion 11 as a swing fulcrum. The distal end of the swing member 21 is rotatably connected to the distal end of the link member 22, and the base end of the link member 22 is rotatably connected to the upper end of the drive shaft 30.

The drive shaft 30 has a shaft J1
It is penetrated so as to be able to rotate relative to the rotating shaft 1. The rotary shaft 1 is provided with a ring-shaped flange portion 31, and the drive shaft 30 is also provided with a ring-shaped flange portion 32 so as to face the flange portion 31. Each flange 3
The pins 1 and 32 are provided with pins 33 and 34, respectively, and a coil spring 35 is hung around the pins 33 and 34. The coil spring 35 urges the drive shaft 30 to rotate clockwise (in the direction of the arrow indicated by the solid line in FIG. 3) with respect to the rotation shaft 1 with the axis J1 as the rotation center axis. The rotational bias of the drive shaft 30 causes the link member 22 to rotate.
The swinging member 21 is urged to swing in a direction in which the tip end side of the swinging member 21 is separated from the axis J1 via the shaft, and accordingly, the substrate holding member 10 rotates counterclockwise in the figure around the axis J2 as the rotation center axis. The substrate W is urged, and the holding portion 12 presses and urges the outer peripheral edge of the substrate W as described above, thereby holding the substrate W.

The stopper 36 is for stopping the rotation bias of the drive shaft 30 by the coil spring 35 at an appropriate position. When the substrate W is not present, the rocking member 21 is rocked more than necessary by the coil spring 35. I try to prevent it. The stopper 36 allows the drive shaft 3
By detecting that the rotation of 0 is stopped by an appropriate sensor (not shown), it is possible to detect that the substrate W is not placed on the substrate placing portion 11.

The air cylinder 3 is located near the flange 32.
7 are provided. The rod 3 of this air cylinder 37
7a is extended, and the member 3 provided on the flange portion 32 is extended.
8 against the rotational bias of the drive shaft 30 clockwise by the coil spring 35, the drive shaft 30 is rotated counterclockwise with respect to the rotation shaft 1 with the axis J1 as the rotation center axis (FIG. 3). (In the direction indicated by the two-dot chain line). The clockwise rotation of the drive shaft 30 by the air cylinder 37 causes the swing member 21 to swing in a direction in which the tip end side of the swing member 21 is pulled back to the shaft J1 side via the link member 22, and the substrate The holding member 10 is rotated clockwise about the axis J2 as the rotation center axis, and the holding portion 12 is separated from the outer peripheral edge of the substrate W as described above, and the holding of the substrate W is released.

Above the link mechanism 20, a blocking member 6 connected to the spin base 4 by a connecting member 5 is provided. The upper surface 6a of the blocking member 6 is a flat surface, and the upper surface 6a is a facing surface facing the lower surface (the surface on the link mechanism 20 side) of the held substrate W. Further, each of the substrate holding members 10 is rotatably penetrated by the blocking member 6, and the stepped portion of the substrate mounting portion 11, which is the distal end of each of the substrate holding members 10, and the holding portion 12 are separated from each other by the blocking member 6.
The substrate W is projected from the upper surface 6a of the substrate W and can hold the substrate W above the blocking member 6.

Above the held substrate W, a nozzle 40 for supplying a cleaning liquid such as a chemical solution or pure water to the upper surface (usually, the surface) of the substrate W is disposed, and the upper surface of the substrate W can be cleaned. It has become.

Further, a nozzle 41 for supplying a gas such as an inert gas (eg, nitrogen gas) or dry air to the upper surface of the substrate W is provided to promote a drying process after the cleaning process. ing.

In this embodiment, the held substrate W
The cleaning liquid is supplied to the lower surface of the substrate W so that the lower surface of the held substrate W can be subjected to the cleaning process. That is, the drive shaft 30 is formed in a cylindrical shape, and the cleaning liquid supply pipe 42 is erected in a hollow portion of the drive shaft 30, and the upper end of the cleaning liquid supply pipe 42 is used as the cleaning liquid ejection section 43. The cleaning liquid is ejected toward the lower surface of the held substrate W.

An outer peripheral tube 44 is provided in the hollow portion of the drive shaft 30 so as to cover the outer periphery of the cleaning liquid supply tube 42. The space 45 between the inner peripheral surface of the outer peripheral tube 44 and the outer peripheral surface of the cleaning liquid supply tube 42 is used as a gas supply path, and the upper end thereof is used as a gas ejection port 46, so that the lower surface of the held substrate W, that is, A gas is supplied to the space 7 between the lower surface of the substrate W and the upper surface 6a of the blocking member 6 to accelerate the drying process after the cleaning process. The drive shaft 30
And the rotating shaft 1 is rotatable with respect to the outer peripheral tube 44.

If necessary, a rotation position detecting mechanism and a clamp device which will be described in a third embodiment described later are also provided in the first embodiment, and the rotation of the substrate W is stopped at a predetermined stop position. It may be configured to stop at.

The cleaning processing by the apparatus of the first embodiment having the above structure is performed as follows. Rod 3 of air cylinder 37
The transfer arm (not shown) places the substrate W on the stepped portion of the substrate placing portion 11 in a state where the holding of the substrate W is released by extending the 7a. Next, the rod 37 of the air cylinder 37
is contracted, the outer peripheral edge of the substrate W is pressed and urged by the holding portion 12 by the urging force of the coil spring 35, and the substrate W is held in a horizontal posture.

Then, the motor 3 is driven to rotate the rotating shaft 1
Is rotated about the axis J1, and the held substrate W is rotated about the axis J1. The cleaning liquid is supplied to the upper and lower surfaces of the substrate W from the nozzle 40 and the cleaning liquid ejection part 43, and the substrate W
The cleaning process is performed on both sides.

When a predetermined cleaning time has elapsed, the supply of the cleaning liquid from the nozzle 40 and the cleaning liquid jetting section 43 is stopped, and the rotation of the substrate W is continued to wash off the cleaning liquid adhering to the substrate W to dry it. At the time of this drying process, the gas is supplied from the nozzle 41 and the gas ejection port 46, thereby promoting the drying process.

When the predetermined drying time has elapsed, the supply of gas from the nozzle 41 and the gas ejection port 46 is stopped.
The driving of the motor 3 is stopped to stop the rotation of the substrate W. Then, the rod 37a of the air cylinder 37 is extended to release the holding of the substrate W. The substrate W released from the holding is carried out by a transfer arm (not shown), the next substrate W is placed on the substrate placement unit 11, and the cleaning and drying processing is performed on the next substrate W by the above-described operation. Thereafter, similarly, the cleaning and drying processes of the substrate W are sequentially performed.

According to the apparatus of the first embodiment, the substrate W is held in the space between the lower surface (the surface on the link mechanism 20 side) of the substrate W held in the horizontal posture by the substrate holding member 10 and the link mechanism 20. Since the blocking member 6 having the facing surface 6a facing the lower surface of the substrate W is provided, the entrapment of the external atmosphere from the lower surface side of the substrate W is blocked by the blocking member 6 as in the conventional device shown in FIG. You.

The rotation axis 1, the spin base 4, the substrate W
The link mechanism 20 is also rotated along the axis J1 with the rotation of the
Although it is rotated around, according to the configuration of the first embodiment,
The link mechanism 20 is disposed below the blocking member 6, and the substrate W
Does not exist in the space 7 between the lower surface of the
The airflow in the space 7 is not disturbed by the rotation of the link mechanism 20, and the external atmosphere is less likely to be caught in the space 7 between the lower surface of the substrate W and the blocking member 6. Further, the link mechanism 2 is provided in the space 7 between the lower surface of the substrate W and the blocking member 6.
Since no 0 is provided, the opposing surface 6a of the blocking member 6 can be disposed close to the lower surface of the substrate W, and the interval of the gap 8 between the blocking member 6 and the outer peripheral end of the substrate W can be sufficiently reduced. It is difficult for the external atmosphere to flow into the space 7 from the gap 8. Accordingly, contamination of the surface of the substrate W on the link mechanism 20 side can be sufficiently suppressed.

Next, the structure of the second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a longitudinal sectional view showing a configuration of a main part of the second embodiment of the present invention.

In the device of the second embodiment, a side wall 50 covering the gap between the peripheral portion of the spin base 4 and the peripheral portion of the blocking member 6 of the device of the first embodiment is provided along the entire periphery. 50, the spin base 4, and the blocking member 6 are formed as a cover member 9 so as to cover the periphery of the link mechanism 20.

In this configuration, the spin base 4 and the blocking member 6 may be connected by the connecting member 5, but the spin base 4 and the blocking member 6 are connected by the side wall 50 without providing the connecting member 5. May be configured.

By covering the periphery of the link mechanism 20 with the cover member 9 as described above, the turbulence of the air flow due to the rotation of the link mechanism 20 around the axis J1 is blocked by the cover member 9 and does not affect the outside. The outer space of the cover member 9,
That is, the airflow in the space around the apparatus can be prevented from being disturbed, and the turbulence of the airflow due to the rotation of the link mechanism 20 disturbs the external atmosphere, causing the mist of the cleaning liquid to flow to the substrate W side and contaminate the substrate W. Various inconveniences can be suppressed. In addition, since the link mechanism 20 is shielded from the external atmosphere by the cover member 9, contamination of the link mechanism 20 can be prevented.

Next, the structure of a device according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a longitudinal sectional view showing the configuration of the third embodiment of the present invention, and FIG.
FIG. 8 is a plan view in which illustration of the spin base is omitted, FIG. 9 is a partially omitted view showing the configuration of the urging mechanism and the release mechanism of the third embodiment, and FIG. FIG. 10B is a main part plan view showing a state in which the substrate is held, and FIG. 10B is a main part plan view showing a state in which the holding of the substrate is released.

The device of the third embodiment is characterized in that the spin base 4 constituting the substrate rotating means is configured as a blocking member.

That is, a spin base 4 is provided at the upper end of the rotating shaft 1, and a link mechanism 6 is provided below the spin base 4.
0 is arranged. The upper surface 4a of the spin base 4 is a flat surface, and the upper surface 4a is a facing surface facing the lower surface (the surface on the link mechanism 60 side) of the substrate W held by the substrate holding member 10.

The substrate holding member 10 comprises a substrate mounting portion 11 and a holding portion 12 similarly to the substrate holding member 10 of the first embodiment, but in the third embodiment, the substrate mounting portion 1
1 penetrates the spin base 4, and its lower end protrudes below the spin base 4.

The link mechanism 60 includes a swing member 61 and a link member 62. The swinging member 61 extends below the spin base 4 to the side of the substrate holding member 10 and swingably around the rotation axis J2 of the substrate placing portion 11 as a swing fulcrum. At the lower end. A pin 61 a is provided on the tip end side of the swing member 61.

The link member 62 is attached to the spin base 4 so as to be rotatable around the axis J1 with respect to the spin base 4. The link member 62 is provided with the same number of arms 62a as the substrate holding member 10 in a radial pattern, and the pins 61a of the swing member 61 are connected to the cutouts 62b at the distal ends of the arms 62a. Have been.

Each arm 62a of the link member 62 has
A columnar operation member 63 is fixedly provided. Each operation member 6
3 is provided with a pin 63a protruding laterally.
A torsion spring 64 having one end fixed to the spin base 4 and the other end fixed to the pin 63 a of the operation member 63.
Is fitted into each operation member 63. Thereby, as shown in FIG. 9, the link member 62 is urged to rotate clockwise in the figure with the axis J1 as the rotation center axis with respect to the spin base 4. Due to the clockwise rotation of the link member 62, as shown in FIG.
2 is oscillated counterclockwise in the figure with the swing fulcrum, and accordingly, the substrate mounting portion 11 is urged to rotate counterclockwise in FIG. Is the substrate W
The substrate W is held by pressing and pressing the outer peripheral edge of the substrate W.

Although not shown, a stopper for stopping the clockwise rotation of the link member 62 at an appropriate position is also provided.

An air cylinder 6 is provided below the spin base 4.
5 are provided. The rod 6 of this air cylinder 65
The distal end of 5a is locked and connected to a long hole 66a of the distal end of the swinging member 66. The base end of the swing member 66 is fixed to a rotating shaft 67 that is rotated around a horizontal axis J3.
Is configured to be swingable with a swinging fulcrum. The base end of the lever member 68 is also fixed to the rotating shaft 67. In the above configuration, the rod 65 of the air cylinder 65
When the lever member 68 is extended, the lever member 68 is tilted from the solid line in the drawing to the state shown by the two-dot chain line via the swing member 66 and the rotating shaft 67, and during the tilting operation of the lever member 68, the lever member 68 is tilted. Pushes out the pin 63a of the operation member 63. As a result, the link member 62 resists the rotation of the torsion spring 64 in the clockwise direction, and the axis J
It is rotated counterclockwise in the figure with 1 as the rotation center axis. By the counterclockwise rotation of the link member 62, FIG.
As shown in (b), the swing member 61 is swung clockwise in the figure around the axis J2 as a swing fulcrum, and accordingly, the substrate mounting portion 11 is rotated around the axis J2 as a rotation center axis. The substrate W is rotated around, the holding unit 12 is separated from the outer peripheral edge of the substrate W, and the holding of the substrate W is released.

The air cylinder 65, the swing member 66,
The release mechanism including the rotating member 67 and the lever member 68 is fixed, while the operation member 63 is rotated around the axis J1 together with the rotating shaft 1, the spin base 4, the link mechanism 60, and the substrate W. Therefore, after the rotation of the rotary shaft 1 and the like is stopped after the washing / drying process, the rotation position is set in this third embodiment so that the lever member 68 can operate the pin 63a of the appropriate operation member 63. It has a detection mechanism and a clamp device.

The rotating position detecting mechanism is provided with a disk 71 fixed to the rotating shaft 1 and having a notch for detecting a clamp position of the rotating shaft 1, a photoelectric sensor 72 for detecting the notch of the disk 71, and It is composed of The clamp device includes a plunge portion 73 fixed to the rotating shaft 1 and an air cylinder 7 provided corresponding to the flange portion 73.
4. The rotation position detecting mechanism detects the clamp position, stops the rotation of the rotation shaft 1 at the clamp position, fits the tip of the rod 74a of the air cylinder 74 into the recess 73a of the flange 73, and fixes the rotation shaft 1 as appropriate. It is designed to clamp at the position.

The third embodiment has a drive shaft 30
Is not provided, the outer peripheral tube 44 is provided in the hollow portion of the rotating shaft 1, and the rotating shaft 1 is rotatable with respect to the outer peripheral tube 44.

Since the other construction is the same as that of the first embodiment, the common parts are denoted by the same reference numerals as in FIGS. 1 to 4 and their detailed description is omitted.

According to the device of the third embodiment, the spin base 4 above the link mechanism 60 has the same effect as the shut-off member 6 of the device of the first embodiment. Can be obtained.

Next, the structure of a device according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 11 is a longitudinal sectional view showing the configuration of the main part of the fourth embodiment of the present invention.

The device of the fourth embodiment has a cover 80 which covers the lower part and the side of the link mechanism 60 of the device of the third embodiment.
And the cover 80 and the spin base 4 are used as the cover member 9 so as to cover the periphery of the link mechanism 60.

According to the device of the fourth embodiment, the same effects as in the device of the second embodiment can be obtained.

In the first to fourth embodiments, the holding portion 12 of the substrate holding member 10 extends to the side of the substrate holding portion 11 as shown in FIG.
It may be configured to be provided on a swing member 13 provided on the substrate mounting portion 11 so as to be able to swing with one rotation axis J2 as a swing fulcrum. Even with such a configuration, as shown in FIG. 12B, the holding portion 12 presses the outer peripheral edge of the substrate W by the substrate mounting portion 11 being urged to rotate counterclockwise in the drawing. The substrate W is held by being urged, and as shown in FIG. 12C, the substrate mounting portion 11 is rotated clockwise in FIG. The holding unit 12 is separated from the outer peripheral edge of the substrate W, and the holding of the substrate W is released. FIG.
(A) is a perspective view showing a configuration of a modification of the substrate holding member, (b) is a plan view of a main part showing a state where the substrate is held by the substrate holding member, and (c) is a view showing the same. FIG. 10 is a plan view of relevant parts showing a state where the holding of the substrate is released by the substrate holding member.

In the first embodiment, the spin base 4 is formed in a ring shape. However, the spin base 4 of the first embodiment is formed by radially providing arms in the same manner as in the conventional apparatus shown in FIG. Alternatively, the substrate holding member 10 may be provided on these arms.

Further, as shown in FIGS. 13 and 14, the link mechanism of the first or second embodiment may be constituted by the link mechanism 60 of the third or fourth embodiment. At this time, FIG.
As shown in FIG. 3, the link member 62 is attached to the upper end of the drive shaft 30, and the link member 6 attached to the drive shaft 30.
2 is configured to be rotatable around the axis J1 with respect to the spin base 4 attached to the rotating shaft 1, and the link member 62 is rotated by the urging mechanism of the first or second embodiment.
, The substrate W is held by being rotated clockwise about the axis J1 as the rotation center axis, and the link member 62 is pressed against the clockwise rotation by the release mechanism of the first or second embodiment. Then, the rotation of the spin base 4 with respect to the axis J1 as the rotation center axis may be rotated counterclockwise to release the holding of the substrate W, or as shown in FIG. The holding and release of the substrate W may be performed by a biasing mechanism and a release mechanism. FIG. 13 (a), FIG.
(A) shows the link mechanism of the device of the first and second embodiments as the third,
FIG. 13 is a longitudinal sectional view of a main part of a modification example constituted by the link mechanism of the fourth embodiment, and FIGS. 13 (b) and 14 (b) are plan views in which a blocking member is not shown.

In the third and fourth embodiments, the link member 62 is provided with the arm portion 62a.
As shown in FIG. 7, the link member 62 may be formed in a ring shape. This modification and the modifications shown in FIGS. 16 to 18 described below are the first and second modifications described with reference to FIGS.
The same can be applied to a modification of the embodiment. FIG. 15 is a plan view showing a configuration of a modification of the third and fourth embodiments, in which a spin base is not shown.

Further, as shown in FIG. 16, the diameter of the ring-shaped link member 62 is made larger than that of FIG.
Instead of the cutout portion 62b, a groove 62c for engaging with the pin 61a of the swing member 61 may be provided on the lower surface of the link member 62, and the swing member 61 may be disposed below the link member 62. Good. FIG. 16A is a plan view showing a configuration of a modification of the third and fourth embodiments, in which the illustration of the spin base is omitted, and FIG. 16B is a longitudinal sectional view of a main part.

Further, as shown in FIGS. 17 and 18, the diameter of the plate-like link member 62 may be made larger than that of FIG. In this case, when the link member 62 is urged to rotate clockwise with the axis J1 as the rotation center axis with respect to the spin base 4 or counterclockwise rotated against the rotation, interference with the substrate holding member 10 is prevented. In order to avoid this, a notch 62d (FIG. 17) and a long hole 6
2e (FIG. 18). FIGS. 17 and 18 are plan views showing the configuration of a modification of the third and fourth embodiments, with the spin base not shown.

In the first and second embodiments, as shown in FIG. 19, the diameter of the spin base 4 is made larger than that of the first and second embodiments, and the substrate holding member 10 is
The flange portion 1 is provided outside the outer peripheral edge of the substrate W to be held, and the flange portion 14 is provided on the upper surface of the substrate mounting portion 11.
The lower surface of the outer peripheral end of the substrate W is placed on the upper surface of the substrate 4, the holding portion 12 is provided on the upper surface of the flange portion 14, and the link mechanism is constituted by the link mechanism 60 of the third and fourth embodiments. The member 62 may be configured similarly to FIG. FIG. 19A is a plan view showing a configuration of a modification of the first and second embodiments, in which a blocking member is not shown, and FIG. 19B is a diagram in which a substrate is held by a substrate holding member. FIG. 3C is a plan view of a main part showing a state, and FIG. 3C is a plan view of the main part showing a state where the holding of the substrate is released by the substrate holding member, and FIG.

In the configuration shown in FIGS. 16 to 19, the upper surface of the link member 62 is the facing surface facing the lower surface of the held substrate W. Therefore, the link mechanism 60 shown in FIGS. 16 to 19 is provided above the spin base 4, and the blocking member 6 is provided.
The link member 62 shown in FIGS.
Even if the structure is configured to hold the substrate W above the first,
The same effects as in the third embodiment can be obtained. At this time, since there is no particular obstacle,
The upper surface of the link member 62, which is a facing surface facing the surface of the held substrate W on the side of the link mechanism 60, can be brought closer to the surface of the substrate W on the side of the link mechanism 60. The external atmosphere can be made hard to flow into the space between the upper surface (opposing surface) of the link member 62.

Further, in each of the above embodiments and the modifications thereof, the apparatus for holding the substrate W above the link mechanisms 20 and 60 and the spin base 4 is shown, but the substrate W is held below the link mechanism and the spin base. The present invention can be similarly applied to an apparatus configured to perform the above operation.

[0075]

As is apparent from the above description, according to the first aspect of the present invention, the board is held in the space between the link mechanism side surface of the board held by the board holding member and the link mechanism. Is provided with an opposing surface opposing the surface on the side of the link mechanism, so that entrainment of the external atmosphere from the side of the substrate on the side of the link mechanism can be blocked by the intercepting member. And since the link mechanism does not exist in the space between the surface of the board on the link mechanism side and the blocking member, the airflow in this space is not disturbed by the rotation of the link mechanism,
The external atmosphere is less likely to be caught in the space between the surface of the substrate on the link mechanism side and the blocking member. Further, since the link mechanism is not provided in the space between the link mechanism-side surface of the board and the blocking member, the opposing surface of the blocking member can be made closer to the link mechanism-side surface of the board, and the blocking member and the board can be closed. The space between the gap and the outer peripheral end can be made sufficiently small, so that the external atmosphere does not easily flow into the space between the surface of the substrate on the link mechanism side and the blocking member. Therefore, contamination of the surface of the substrate on the link mechanism side can be sufficiently suppressed.

According to the second aspect of the present invention, since the cover member that covers the periphery of the link mechanism is provided, the turbulence of the air flow due to the rotation of the link mechanism does not affect the outside by the cover member. Can be prevented from disturbing the airflow in the external space, that is, the space around the apparatus, and the contamination of the substrate due to the disturbance of the external atmosphere due to the disturbance of the airflow due to the rotation of the link mechanism can be suppressed. Further, since the cover member covers the periphery of the link mechanism, contamination of the link mechanism can be prevented.

According to the third aspect of the present invention, the link mechanism for operating the holding and releasing of the substrate by the substrate holding member has a facing surface facing the front surface or the back surface of the substrate held by the substrate holding member. Therefore, the opposing surface of the link mechanism acts in the same manner as the opposing surface of the blocking member according to the first aspect of the present invention, without providing the blocking member.
Entanglement of the external atmosphere from the surface of the substrate on the link mechanism side can be blocked. The link mechanism has an opposing surface facing the front surface or the back surface of the substrate held by the substrate holding member. Therefore, even when the link mechanism is rotated, the surface of the substrate on the link mechanism side and the opposing surface of the link mechanism are not rotated. The airflow in the space between them is not disturbed, and the external atmosphere is less likely to be caught in the space between the surface of the substrate on the link mechanism side and the opposing surface of the link mechanism. Further, since the opposing surface of the link mechanism can be made closer to the surface of the substrate on the link mechanism side, the gap between the opposing surface of the link mechanism and the outer peripheral end of the substrate can be sufficiently reduced, and The external atmosphere hardly flows into the space between the link mechanism side surface and the link mechanism. Therefore,
Similarly to the first aspect of the present invention, it is possible to sufficiently suppress the contamination of the surface of the substrate on the link mechanism side.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view showing a configuration of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the configuration of the first embodiment device.

FIG. 3 is a plan view showing the configuration of the first embodiment, in which a blocking member is not shown.

FIG. 4 is a partially omitted plan view showing a configuration of an urging mechanism and a release mechanism of the first embodiment.

FIG. 5 is a longitudinal sectional view showing a configuration of a main part of a device according to a second embodiment of the present invention.

FIG. 6 is a longitudinal sectional view showing a configuration of an apparatus according to a third embodiment of the present invention.

FIG. 7 is a plan view illustrating a configuration of a device according to a third embodiment.

FIG. 8 is a plan view showing the configuration of the device of the third embodiment, in which a spin base is not shown.

FIG. 9 is a partially omitted view showing a configuration of an urging mechanism and a release mechanism of the third embodiment.

FIG. 10 is a plan view of a main part showing a state where the substrate is held by the apparatus of the third embodiment and a state where the holding of the substrate is released.

FIG. 11 is a longitudinal sectional view showing a configuration of a main part of an apparatus according to a fourth embodiment of the present invention.

FIG. 12 is a perspective view showing a configuration of a modification of the substrate holding member.
FIG. 4 is a plan view of relevant parts showing a state where the substrate is held by the substrate holding member and a state where the holding of the substrate is released.

FIG. 13 shows a link mechanism of the device of the first and second embodiments,
It is the principal part longitudinal section of the modification comprised by the link mechanism of 4th Example apparatus, and the top view which omitted illustration of the blocking member.

FIG. 14 shows the link mechanism of the device of the first and second embodiments being a third link mechanism.
It is the principal part longitudinal section of another modification comprised by the link mechanism of 4th Example apparatus, and the top view which omitted illustration of the blocking member.

FIG. 15 is a plan view showing a configuration of a modification of the third and fourth embodiments, in which a spin base is not shown.

FIG. 16 is a plan view showing a configuration of another modification of the third and fourth embodiments, in which a spin base is not shown, and a longitudinal sectional view of a main part.

FIG. 17 is a plan view showing a configuration of still another modified example of the third and fourth embodiments, in which a spin base is not shown.

FIG. 18 is a plan view showing the configuration of still another modification of the third and fourth embodiments, with the spin base omitted from illustration.

FIG. 19 is a plan view showing a configuration of a modification of the first and second embodiments, in which a blocking member is not shown, a state in which the substrate is held by the substrate holding member of the modification, and release of the substrate. It is the principal part top view which shows the state performed, and the longitudinal cross-sectional view of the principal part of the modification.

FIG. 20 is a longitudinal sectional view and a plan view showing a configuration of a substrate processing apparatus according to a conventional example.

FIG. 21 is a plan view of a main part showing a state where the substrate is held by the conventional device and a state where the holding is released.

FIG. 22 is a longitudinal sectional view and a plan view showing a configuration of a substrate processing apparatus according to another conventional example.

[Explanation of symbols]

1: rotating shaft 2: belt transmission mechanism 3: motor 4: spin base 4a, 6a: opposing surface opposing the surface of the held substrate on the link mechanism side 6: blocking member 9: cover member 10: substrate holding member 20, 60: Link mechanism 21, 61: Swing member 22, 62: Link member 50: Side wall 80: Cover W substrate J1: Rotation center axis of substrate

Claims (3)

[Claims] A substrate holding member that holds an outer peripheral end of the substrate at three or more locations; and a substrate holding member provided on the front side or the back side of the substrate held by the substrate holding member. A link mechanism for operating the holding and release of the substrate; a substrate rotating means for rotating the substrate held by the substrate holding member around a vertical axis; and a link mechanism-side surface of the substrate held by the substrate holding member; A substrate processing apparatus, comprising: a blocking member having a facing surface facing a surface of the substrate on the link mechanism in a space between the substrate and the link mechanism. 2. The substrate processing apparatus according to claim 1, further comprising a cover member that covers a periphery of the link mechanism. 3. A substrate having three or more substrate holding members for holding an outer peripheral end of the substrate at three or more locations, and a facing surface facing the front or back surface of the substrate held by the substrate holding member. A substrate processing apparatus comprising: a link mechanism for operating holding and release of a substrate by a holding member; and substrate rotating means for rotating the substrate held by the substrate holding member around a vertical axis.