JPH10120466A5 - - Google Patents

Info

Publication number
JPH10120466A5
JPH10120466A5 JP1997244582A JP24458297A JPH10120466A5 JP H10120466 A5 JPH10120466 A5 JP H10120466A5 JP 1997244582 A JP1997244582 A JP 1997244582A JP 24458297 A JP24458297 A JP 24458297A JP H10120466 A5 JPH10120466 A5 JP H10120466A5
Authority
JP
Japan
Prior art keywords
ppm
less
content
silicon carbide
plasma etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997244582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10120466A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP24458297A priority Critical patent/JPH10120466A/ja
Priority claimed from JP24458297A external-priority patent/JPH10120466A/ja
Publication of JPH10120466A publication Critical patent/JPH10120466A/ja
Publication of JPH10120466A5 publication Critical patent/JPH10120466A5/ja
Pending legal-status Critical Current

Links

JP24458297A 1996-08-27 1997-08-26 高耐食性炭化ケイ素質部材及びその用途 Pending JPH10120466A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24458297A JPH10120466A (ja) 1996-08-27 1997-08-26 高耐食性炭化ケイ素質部材及びその用途

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-244128 1996-08-27
JP24412896 1996-08-27
JP24458297A JPH10120466A (ja) 1996-08-27 1997-08-26 高耐食性炭化ケイ素質部材及びその用途

Publications (2)

Publication Number Publication Date
JPH10120466A JPH10120466A (ja) 1998-05-12
JPH10120466A5 true JPH10120466A5 (https=) 2005-05-19

Family

ID=26536584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24458297A Pending JPH10120466A (ja) 1996-08-27 1997-08-26 高耐食性炭化ケイ素質部材及びその用途

Country Status (1)

Country Link
JP (1) JPH10120466A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685365B2 (ja) * 1999-03-30 2005-08-17 東芝セラミックス株式会社 半導体装置部材用の精製炭化珪素粉末とその精製方法、及び該粉末から得られる半導体装置部材用焼結体の製造方法
JP4545330B2 (ja) * 2001-02-22 2010-09-15 イビデン株式会社 プラズマエッチング装置のガス噴出し板
US10280121B2 (en) 2015-03-31 2019-05-07 Hokuriku Seikei Industrial Co., Ltd. Silicon carbide member for plasma processing apparatus
US11264214B2 (en) 2016-09-27 2022-03-01 Hokuriku Seikei Industrial Co., Ltd. Silicon carbide member for plasma processing apparatus, and production method therefor

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