JPH10112467A - Shield package method for electronic component making use of resin injection into metallic shield, and product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stable and highly reliable product for an optical transmission and reception facility, which is relatively good in quality and is easy of production and which has good noise immunity power, by enabling itself to be put into practice without installing an expensive manufacture facility, and by making a metallic shield into one with a junction or without a junction, using a little proper mold, or by introducing a precise punching press mold and sealing it with a packing material. SOLUTION: As this method, in the first step, a required device, for example, a chip, a light emitting diode, a plurality of connector terminals, etc., are coupled with the top of a substrate, using conductive material. In the second step, resin is injected into a metallic shield. In the third step, the substrate where the required device is bonded is put in a metallic shield. In the fourth step, the resin within the metallic shield is dried.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a product for shielding a digital component, which is applied to a printed wiring board or a lead frame, using resin injection into a metal shield. A method for providing a product having an effect of preventing electromagnetic interference by sealing with a resin for a package injected into a metal shield therein, and a product manufactured by the method, wherein the spatial layout of the device is relatively small. It has the effect that it can be performed freely, it can be easily implemented in the process, the manufacturing cost is low, and the product can be used in the transmission and reception direction of optical measurement equipment to provide stability and high reliability. It relates to valuable methods and products.

[0002]

2. Description of the Related Art In U.S. Pat. No. 5,350,943, a mold package system for a lead frame is adopted as a noise isolation technique, and a metal material is folded in four directions one by one to form a U-shaped package material. Filled and manufactured parts were applied to televisions and optical receivers to prevent electrical interference at metal isolation surfaces. In such a structure, the four sides of the lead frame are susceptible to electromagnetic interference, and the manufacturing process is complicated, so that it is necessary to purchase and manufacture expensive automation equipment.
For example, in the manufacture of IC molds, the lead frame is U-shaped by an automatic bending machine, the lead frame bent by an automatic resin filling machine is filled with resin, the mold is cut out, and the lead frame is separated by a cutting machine. I was

FIG. 1 shows a manufacturing process of a known product. It involves the following steps: Step 1 is a step of applying a wax on a substrate. Step 2 is a step of placing a chip resistor, a capacitor and an IC chip on a substrate. Step 3 is a step of drying the wax in a high-temperature furnace. And bonding the parts of step 2 onto the substrate, step 4
Inserting a light emitting diode and a terminal, step 5
A step of performing wire bonding by an automatic wire bonding machine; and a step of attaching a metal shield, grounding, and then covering with a metal lid.

FIG. 2 shows an embodiment of the product assembly according to FIG. Among them, the packaged IC1, the light emitting diode 2, the chip component 11, and the terminal 3 are connected to the substrate 10 using the conductive material 5 (see A), and then the substrate 10 is placed in the metal shield 6 (see B). Then, the metal lid 13 and the metal shield 6 were joined to form a finished product.

The known methods shown in FIGS. 1 and 2 require less capital investment, but are more costly to manufacture and have a larger product volume, thus reducing the size, price and quality of the market. Could not respond to demand.

FIG. 3 shows US Pat. No. 5,350,943, in which a casing is grounded and shielded by a casing, a folded metal casing is provided on the outer periphery, and the sealing effect is provided. Although it is defective and can prevent electromagnetic interference,
Product capabilities were limited. For example, for a light emitter, the wavelength was about 800 nm to 1100 nm. Further, this structure does not have a seal port, and there is no special point to be described in the manufacturing process.

FIG. 4 shows one manufacturing process of a well-known shield package electronic component product. The manufacturing steps are as follows. 1) selecting an appropriate component, placing it on a substrate, and bonding it to the substrate (or lead frame) using a conductive material, 2) wire bonding an IC and a light emitting diode, 3) packaging with a molding machine 4) a step of separating the product obtained in the above 3 into a single solid by a punching press; and 5) a step of covering the formed body with a metal shield to obtain a finished product.

FIG. 5 is a view showing an embodiment of assembling a shield package electronic component product by the method of FIG.
Devices such as C1 and light-emitting diode 2 are adhered to the substrate 10 using a conductive material (see A), and wire bonding proceeds (see B). Then, the molded body is put into the metal shield 6 (C). (See D) and products (see D).

FIG. 6 shows a manufacturing process of another known shield package electronic component product, and the manufacturing process includes the following steps. 1. 1. Select appropriate parts and glue them on the printed wiring board. 2. Wire bonding to IC and light emitting diode. 3. Inject resin as a package material above the IC and the light emitting diode and heat them. 4. Attach and bond other components such as resistors and capacitors. The semi-finished product after the work of the above 4 is put in a metal shield and a metal lid to make a finished product.

FIG. 7 is an assembly display diagram of the shield package electronic component product according to the method of FIG.
First, devices such as the IC 1 and the light emitting diode 2 are adhered to the substrate 10 using the conductive material 5 and the wire bonding 4 proceeds (see A). The resin of the package material is injected and heated to be solidified (see B), and the chip component 11, the electrolytic capacitor 12, and the terminal 3 are adhered to the substrate 10 using the conductive material 5 (see C), and further, the metal shield is provided. 6 and a metal lid 13 (D), thereby completing the finished product (E).

[0011]

SUMMARY OF THE INVENTION The object of the present invention is to implement without expensive manufacturing equipment and to use a slightly suitable mold to have a metal shield with or without a joint, Alternatively, by introducing a precision punching press mold and sealing with a packing material, a relatively high quality product can be obtained, production is easy, the product has good noise immunity, and optical transmission and reception equipment It is an object of the present invention to provide a method and an apparatus for shielding packages of electronic components using resin injection into a kind of metal shield, which can provide a stable and highly reliable product.

[0012]

According to the first aspect of the present invention, there is provided a method for connecting a necessary device, for example, a chip, a light emitting diode, a plurality of connection terminals, etc., to a substrate using a conductive material. Step 2 is a step of injecting a resin into the metal shield; Step 3 is a step of placing the substrate to which the necessary devices are adhered in the metal shield; Step 4 is a step of thermally drying the resin in the metal shield A method for shielding packages of electronic components utilizing resin injection into a metal shield, comprising the above steps.

According to a second aspect of the present invention, the necessary device is
The electronic component using resin injection into the metal shield according to claim 1, wherein the electronic component is a combination of a C, a light emitting diode, a plurality of terminals or other elements, or at least one chip connected to a substrate. Shield package method.

According to a third aspect of the present invention, the necessary devices are connected to the substrate by a surface mounting method or a non-surface mounting method.
According to a first aspect of the present invention, there is provided a shield package method for an electronic component using resin injection into a metal shield.

The invention according to claim 4 utilizes resin injection into the metal shield according to claim 1, wherein the connection of the necessary device to the substrate is performed by a wire bonding method or another method having an equivalent effect. The method uses a shield package method for electronic components.

According to a fifth aspect of the present invention, there is provided a shield package product of an electronic component including a metal shield, a ground terminal, a substrate, and a window of the metal shield, utilizing resin injection into the metal shield.

According to a sixth aspect of the present invention, there is provided the electronic component utilizing resin injection into the metal shield according to the fifth aspect, wherein the metal shield for preventing electromagnetic interference has no seam or has a seam. It is a shield package product.

According to a seventh aspect of the present invention, there is provided an electronic device utilizing resin injection into the metal shield according to the fifth aspect, wherein the metal shield for preventing electromagnetic interference has or does not have a ground terminal. It is a shield package product for parts.

According to the invention of claim 8, the substrate is a support type, a frame type, or a printed wiring board type.
According to a fifth aspect of the present invention, there is provided a shield package product of an electronic component using resin injection into a metal shield.

According to a ninth aspect of the present invention, the metal shield has one or a plurality of reception windows, or no reception window is provided, or one reception window and one transmission window are separately provided. Or, as a shield package product of an electronic component using resin injection into a metal shield according to claim 5, wherein the reception window and the transmission window are jointly provided as one window, and each window is sealed with a sealing material. I have.

According to a tenth aspect of the present invention, there is provided an electronic component utilizing resin injection into the metal shield according to the fifth aspect, wherein the material of the metal shield is aluminum, tin, iron, steel, stainless steel, or another alloy. Shield package products.

According to the eleventh aspect of the present invention, the window of the metal shield is sealed with a high temperature prevention paper tape, a non-high temperature prevention paper tape, a plastic or a sealing material having the same effect as the metal shield. This is a shield package product for electronic components that uses resin injection.

According to a twelfth aspect of the present invention, there is provided step 1,
Injecting resin into the metal shield, Step 2
Connecting necessary devices, for example, a chip, a light emitting diode, a plurality of connection terminals, etc., to the substrate using a conductive material. Step 3 is to place the substrate on which the necessary devices are bonded in a metal shield. Step 4, Step 4 is a step of thermally drying the resin in the metal shield, and the above-mentioned step is included in a method of shielding packages of electronic components utilizing resin injection into the metal shield.

[0024]

DETAILED DESCRIPTION OF THE INVENTION The present invention has features different from the conventional method. That is, the feature is that a resin, which is a package material, is injected into a metal shield with or without seams, and a thinned substrate, such as an IC, a light emitting diode, or a chip component, is attached to the metal shield. By placing it in the space inside the metal shield with an integral molding method, it is possible to prevent external interference electromagnetic waves with the metal shield, that is, the magnitude of the signal amplitude by passing the interference radio waves through the metal cover It is an object of the present invention to provide a shield package electronic component product capable of reducing the noise. And one T / R window, that is, a transmission or reception window, is formed on the metal shield toward the receiver or the transmitter,
This window is used for emitting and receiving signals. In the processing step, in order to prevent the window from being sealed with the package material, the window is sealed with a non-adhesive plastic tape, and after processing, the plastic tape is removed. In the present invention, the printed wiring board method is used, whereby the distance between the connection terminal and the connection terminal piece can be determined relatively freely, and the VDD power supply,
The arrangement of the ground terminal, input / output terminal, etc. can be changed.

In the present invention, a chip-type printed wiring board is employed, and traditional ICs and light-emitting diodes, transistors, chips, diodes, field-effect transistors and respective main circuits are miniaturized first. The area occupied by each device is small, and the volume of the product according to the present invention is relatively small. The defect rate is relatively reduced. Injection of the packaging material in the method of the present invention can be performed without expensive manufacturing equipment, use a slightly suitable mold to make the metal shield jointed or unsealed, and introduce precise punching press technology. If
A relatively good quality product can be obtained, production is easy, the product has good noise immunity, and a stable and reliable product can be provided for the optical transmitting and receiving equipment.
It has a clear effect. The features of the present invention are the sealing of necessary devices by injecting a packing material into a metal shield with or without a seam, the use of a precision punching press mold in thinning a micro component, and the sealing with a packing material. In the stop.

[0026]

FIG. 8 shows a manufacturing process of a product according to the method of the present invention. The manufacturing process of the present invention includes the following steps. Step 1, in which necessary devices, for example, a chip, a light emitting diode, a plurality of connection terminals, etc. are bonded on a substrate using a conductive material. Step 2, in which a resin is injected into a metal shield. Step 3 is to put the substrate on which the necessary devices are already adhered into the metal shield, and Step 4 is to heat dry the resin in the metal shield.

FIG. 9 shows an embodiment of the method of FIG. First,
Necessary devices such as the IC 1, the light emitting diode 2, and the connection terminal 3 are bonded on the substrate 10 using the conductive material 5 (see A). Thereafter, a sealing member 7 is attached to the transmission / reception window 8 of the metal shield 6, and a resin as a package material is injected into the metal shield 6 (see B). Subsequently, the substrate 10 is placed in the metal shield 6, the sealing member 7 is removed through heating, and a finished product is obtained (see C).

The technique of the present invention has a structure which is achieved by using a sealing port with or without a seam. The practice of the present invention includes a metal shield molding part leaving machine, an automatic terminal inserting machine, an automatic solidifying machine, an automatic bonding machine, Equipment equipped with a printed wiring board mold, an automatic resin injection machine, and the like is used.
During the manufacturing process, a chip-type printed wiring board is used, which is covered with a metal shield. The feature is that there is no seam at the package opening because it is wrapped with a drip-type metal shield, and therefore the immunity against electromagnetic interference and the electromagnetic wave shielding effect are high. In addition, the product is lighter and smaller, can be wrapped around a tape, and can be applied by a customer for automatic insertion.

In the above-described steps of the manufacturing process of the present invention,
Step 1 and Step 2 are performed while being coordinated with each other.

The necessary devices used in the present invention are IC,
A light emitting diode, a plurality of terminals, or the like may be arbitrarily combined, or a single chip may be attached to a substrate.

The connection of the necessary devices of the present invention to the substrate is performed by a surface mounting method or a non-surface mounting method.

The necessary devices (ICs, light emitting diodes) of the present invention are electrically connected by a wire bonding method or another method having an equivalent effect.

The electromagnetic interference free metal shield formed by the present invention is seamless or seamed.

The metal shield having no electromagnetic interference formed according to the present invention may or may not be provided with a ground terminal.

The substrate used in the present invention is a frame or a support type, or a printed wiring board type.

The metal shield of the present invention is provided with one or a plurality of reception windows, no reception window, one reception window and one transmission window separately, Alternatively, they are jointly provided as one window, and each window is sealed with a sealing material.

The material of the metal shield of the present invention is aluminum, tin, iron, steel, stainless steel, or another alloy.

The above features of the method of the present invention do not exist in the known art shown in FIGS. 1 to 7, and therefore provide a product having novelty and high reliability and stability. be able to.

[0039]

The present invention can be practiced without expensive manufacturing equipment and uses a slightly suitable mold to provide a metal shield with or without a joint or a precision punching press. By introducing the mold and sealing with packing material, it is possible to obtain a relatively high quality product, easy to produce, the product has good noise immunity, and stable reliability for optical transmitting and receiving equipment We can provide high quality products.

[Brief description of the drawings]

FIG. 1 is a known manufacturing flowchart.

FIG. 2 is an assembly display diagram according to the method of FIG. 1;

FIG. 3 is a structural view of US Pat. No. 5,350,943.

FIG. 4 is another known manufacturing flowchart.

FIG. 5 is an assembly display diagram according to the method of FIG. 4;

FIG. 6 is another well-known manufacturing flowchart.

FIG. 7 is an assembly display diagram according to the method of FIG. 6;

FIG. 8 is a manufacturing flowchart of the present invention.

FIG. 9 is an assembly view according to the method of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 IC 2 Light emitting diode 3 Terminal 4 Wire bonding 5 Conductive material 6 Metal shield 7 Sealing material 8 Window 9 Packing material 10 Substrate (support or frame or printed wiring board) 11 Chip component 12 Electrolytic capacitor 13 Metal cover

Claims (12)

[Claims] Step 1 is a step of connecting necessary devices such as a chip, a light emitting diode, a plurality of connection terminals and the like to a substrate using a conductive material. Step 2 is a step of placing a resin in a metal shield. Injecting, Step 3, placing the substrate on which the necessary devices are adhered in the metal shield, Step 4, Heat drying the resin in the metal shield, and comprising the above steps. A shield package method for electronic components using resin injection into the shield. 2. The metal shield according to claim 1, wherein the required device is an IC, a light emitting diode, a combination of a plurality of terminals or other elements, or at least one chip connected to the substrate. Shield package method for electronic components using resin injection into the package. 3. The method of claim 1, wherein the connection of the required device to the substrate is performed by a surface mounting method or a non-surface mounting method. 4. The shield package of an electronic component using resin injection into a metal shield according to claim 1, wherein the connection of the necessary device to the substrate is performed by a wire bonding method or another method having an equivalent effect. Method. 5. A shield package product of an electronic component using resin injection into a metal shield, including a metal shield, a ground terminal, a substrate, and a window of the metal shield. 6. The shield package product for an electronic component using resin injection into the metal shield according to claim 5, wherein the metal shield for preventing electromagnetic interference has no seam or has a seam. 7. The shield package product for an electronic component using resin injection into the metal shield according to claim 5, wherein the metal shield for preventing electromagnetic interference has or does not have a ground terminal. . 8. The shield package product for electronic components using resin injection into a metal shield according to claim 5, wherein the substrate is of a support type, a frame type, or a printed wiring board type. 9. The method according to claim 1, wherein the metal shield has one or more reception windows, or has no reception window.
Alternatively, one receiving window and one transmitting window are separately provided, or the receiving window and the transmitting window are jointly provided as one window, and each window is sealed with a sealing material,
A shield package product of an electronic component using resin injection into the metal shield according to claim 5. 10. The shield package product for electronic parts using resin injection into the metal shield according to claim 5, wherein the material of the metal shield is aluminum, tin, iron, steel, stainless steel, or other alloy. 11. The method according to claim 5, wherein the window of the metal shield is sealed with a heat-proof paper tape, a non-heat-proof paper tape, a plastic or a sealing material having an equivalent effect. Shield package products for electronic components. 12. Step 1 is a step of injecting a resin into the metal shield. Step 2 is a step of forming a necessary device such as a chip.
Connecting a light emitting diode, a plurality of connection terminals, and the like to the substrate using a conductive material; step 3; placing the substrate on which a necessary device is adhered in a metal shield; and step 4; A method of shielding packages of electronic components using resin injection into a metal shield, comprising the steps of thermally drying a resin and the above steps.