JPH10107092A - Tape with bonding agent for tab, tab tape and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of the shift of the pitch between first and second mold-release films constituting a TAB tape due to the warpage and undulations of the TAB tape by a method wherein the regain of a tape with a bonding agent for TAB use in a thermal laminating process of the tape with a bonding agent for TAB use with a copper foil is specified. SOLUTION: A bonding agent-resin mixed solution is applied and dried on a first mold-release film, a second mold-release film is laminated to the first mold-release film according to the need and the integrally formed film is slit in a target width. The first or second mold-release film is peeled off from this slit flexible insulating film 1, such as a polyimide film, to laminate a bonding agent surface 2 to the film 1. The regain of the formed tape with a bonding agent for TAB is adjusted at 0.4 to 0.8%, preferably in the extent of 0.6 to 0.7%, and after that, a TAB tape is formed via a TAB tape production process. Thereby, the generation of problems of the shift of the pitch between the first and second mold-release films or the like at the time of mounting of the TAB tape due to the warpage and undulations of the TAB tape is eliminated in a processing process of the TAB tape and the TAB tape can be manufactured at a high yield.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a TAB (tape / tape).
The present invention relates to a tape with an adhesive, a TAB tape, and a semiconductor device used for a tape for mounting a semiconductor integrated circuit (hereinafter, abbreviated as a TAB tape) referred to as an automated bonding method.

[0002]

2. Description of the Related Art In general, TAB tape is formed on a flexible organic insulating film such as a polyimide film.
It has a three-layer structure in which a polyester film having releasability is laminated as an adhesive layer and a protective film layer.

[0003] TAB tapes include (1) perforation of sprockets and device holes, (2) thermal lamination with copper foil, (3) adhesive curing, and (4) pattern formation (resist coating, etching, resist removal). (5) Processed into a TAB tape (pattern tape) through processing steps such as tin or gold plating. FIG. 1 shows the shape of the pattern tape. FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device. The inner lead portion 6 of the pattern tape is thermocompression bonded to the gold bump 10 of the semiconductor integrated circuit 8 (inner lead bonding).
Then, a semiconductor integrated circuit is mounted. Next, a semiconductor device is manufactured through a resin sealing step using a sealing resin 9. In addition, a method in which a conductor of a pattern tape and a gold bump of a semiconductor integrated circuit are connected by wire bonding without using an inner lead portion is also adopted. Such a semiconductor device is called a tape carrier package (TCP) type semiconductor device. The TCP type semiconductor device is connected to a circuit board or the like on which other components are mounted via outer leads 7 (outer lead bonding), and is mounted on an electronic device.

On the other hand, as electronic devices have become smaller and lighter in recent years, a semiconductor package has a QFP (quad flat flat) in which conventional connection terminals (outer leads) are arranged on the side of the package for the purpose of high-density mounting. Package), S
Instead of an OP (Small Outline Package), a BGA (Ball Grid Array), in which connection terminals are arranged on the back surface of the package, and a CSP (Chip Scale Package) have been partially used. BGA,
The point that the CSP is structurally most different from the QFP and the SOP is that the former requires a substrate called an interposer, whereas the latter does not necessarily require a substrate by using a metal lead frame. On the point. As the interposer referred to here, one obtained by bonding a copper foil to an organic insulating film such as a glass epoxy substrate or polyimide is generally used. Therefore, these BGA,
The tape with an adhesive for TAB of the present invention can be used for a semiconductor device such as a CSP, and the obtained BGA, CS
P is also included in the semiconductor device of the present invention. 3 and 4 are cross-sectional views of one embodiment of the semiconductor device (BGA, CSP) of the present invention.

In the above package form, TAB
Since the tape remains inside the high-density package, it is required to have insulation, heat resistance, adhesion to copper foil, dimensional stability, and flatness.

In recent years, with the miniaturization, high performance, and high density of electronic devices, semiconductor devices mounted on them have become more sophisticated, highly integrated, and slimmer. For this reason, the miniaturization of the pitch of the electrodes and the TAB leads of the semiconductor device is rapidly progressing. Accordingly, the dimensional stability of the TAB tape, that is, the flatness of the TAB tape has become more important than ever.

[0007] Fine pitch of TAB lead and T
The slimming of the AB makes it difficult to form a circuit (pattern) of the TAB itself, and from the viewpoint of reliability, the difficulty of mounting the IC on an IC or an electronic device increases. In other words, the TAB tape is warped or undulated in the heat laminating step with the copper foil or the adhesive heating and curing step, thereby making it difficult to form a circuit. This warpage or undulation is likely to occur when mounting on an electronic device such as an outer lead. A pitch shift resulted in a decrease in yield.

As a method for improving flatness such as warpage and undulation, a polyimide film having a linear expansion coefficient equal to or less than that of a copper foil is used, and the polyimide film and the copper film are heated at a temperature higher than the copper foil temperature. A method of laminating with a foil (JP-A-8-58020),
A method of regulating the film tension and the temperature of the film-side heating roll by using the heat-treated polyimide film (Japanese Patent Publication No.
No.-35106) has been proposed.

[0009]

However, although the above-mentioned method has some improvement effects, it is not enough to cope with the rapid progress of miniaturization of TAB leads in recent years as electronic devices become lighter and thinner. .

Therefore, in the present invention, in order to improve defects such as pitch deviation due to warpage or undulation of the TAB tape, the water content of the tape with the TAB adhesive in the heat laminating step with the copper foil is specified. TA suitable for miniaturization that prevents pitch shift during IC mounting and mounting on electronic equipment
An object of the present invention is to provide a tape with an adhesive for B, a TAB tape obtained therefrom, and a semiconductor device.

[0011]

SUMMARY OF THE INVENTION An object of the present invention is to provide a tape with an adhesive for TAB having at least an adhesive layer laminated on an insulating film, wherein the tape has a water content of 0.4 to less.
This is achieved by a TAB adhesive tape, and a TAB tape and a semiconductor device obtained therefrom, which are characterized in the range of 0.8%.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The adhesive tape for TAB of the present invention has a basic structure in which an adhesive layer is laminated on an insulating film.

As the insulating film used in the present invention, a so-called heat-resistant film such as polyimide, polyetherimide, or aromatic polyamide, or a composite material such as flexible epoxy / glass cloth can be used. Among them, a polyimide film is particularly preferable from the viewpoint of thermal dimensional stability. Usually, a flexible film can be used as the insulating film.

The adhesive layer used in the present invention is preferably a thermosetting type and a semi-cured adhesive. For example, it contains a polyamide resin, a phenol resin and the like. Preferably, it further contains an epoxy resin, a curing agent and the like. Fine particles such as silica and alumina may be added as long as the properties of the adhesive are not deteriorated.

The polyamide resin, which is a component of the adhesive layer,
Any one obtained by thermally polymerizing a mixture of an acid and a diamine, which can be dissolved in a mixed solvent containing an alcohol such as methanol as a main component, can be used. In particular, as a raw material of the polyamide resin, a resin containing a dicarboxylic acid having 36 carbon atoms (so-called “dimer acid”) as a main component (commonly called “dimer acid polyamide”) is preferable. The polyamide resin generally has a high water absorption and thus tends to have a low insulation resistance. However, the use of dimer acid makes it possible to reduce the water absorption and increase the electrical insulation.

The dimer acid polyamide can be obtained by thermally polymerizing an equimolar mixture of dimer acid and diamine. As the dicarboxylic acid component, not only dimer acid but also other dicarboxylic acids such as azelaic acid and sebacic acid may be contained as copolymer components. At this time, the dimer acid content is more preferably 70 mol% or more in the acid component. Among the dimer acid polyamides,
Those having a high degree of polymerization are preferred because they have a relatively low water absorption rate and tend to have high electrical insulation even in a high humidity atmosphere.

As the diamine component, hexamethylenediamine, ethylenediamine, piperazine, bis (4-aminocyclohexyl) methane, bis (4-amino-1,1
Examples thereof include 2-dimethylcyclohexyl) methane, and particularly preferred is hexamethylenediamine. A dimer acid-based polyamide containing hexamethylenediamine as a main component is particularly preferable because it exhibits excellent characteristics in overall performance. Further, not only one kind of diamine component but also a mixture of two or more kinds can be used.

As the epoxy resin which is a component of the adhesive layer, known epoxy resins such as bisphenol type, novolak type, cresol novolak type and polyfunctional type can be used.

The phenolic resin, which is a component of the adhesive layer,
Known phenolic resins such as polyparavinylphenol, including various types such as novolak type, resol type and cresol novolak type can be used.

As a curing agent which is a component of the adhesive layer, a general curing agent for epoxy resin can be used. For example, diamines, acid anhydrides, Lewis acid type epoxy curing agents, and the like.

The respective component ratios in the adhesive layer are as follows: when the polyamide resin is 100 parts by weight, the epoxy resin is 3 parts by weight.
0-80 parts by weight, phenolic resin 20-70
It is selected from the range of parts by weight. The curing agent is 0.1 to
It is preferably used in a range of 10 parts by weight.

By dissolving each of the above components in a solvent, an adhesive resin mixed solution is obtained. Solvents for dissolving each component of the adhesive include aromatic solvents such as toluene, xylene, chlorobenzene, and benzyl alcohol, and alcohol solvents such as methanol, ethanol, isopropyl alcohol, and butyl alcohol. Can be used as a mixed solvent.

In the present invention, a protective film is usually laminated on an adhesive. This protective film is used for the purpose of dust prevention or handling. In the present invention, as the protective film, polyethylene terephthalate,
Polyphenylene sulfide, polyethylene, polypropylene and the like can be used. Among them, polyethylene terephthalate and polyphenylene sulfide are
Tensile modulus and tensile elongation are suitable for punching,
It is particularly preferable because a sharp hole cross section can be formed. The thickness of the protective film may be from 10 to 100 μm, but is preferably from 20 to 40 μm.

A tape with an adhesive for TAB is usually produced by any of the following methods.

First, an adhesive resin mixed solution is applied to a first release film, dried, and a second release film is attached to the first release film if necessary. Next, slitting is performed to a target width. The first or second release film is peeled off from a flexible insulating film made of polyimide or the like which has been slit to a desired width in advance, and the adhesive surface is adhered.
As another method, a flexible insulating film is directly
An adhesive resin mixed solution may be applied to a predetermined width, dried, and a release film (protective film) may be attached.

Usually, the width of the adhesive of the tape produced by the above method is set to be narrower than that of the flexible insulating film as the base material so as not to cover the portion where the sprocket holes are to be formed.

The TAB adhesive tape according to the present invention has a moisture content of 0.4 to 0.8%, preferably 0.5 to 0.8%.
After adjusting to 0.7%, more preferably 0.6 to 0.7%, a TAB tape is produced through the above TAB tape manufacturing process. TAB with water content less than 0.4%
When a tape with an adhesive for use is used, the TAB tape undulates due to a difference in expansion coefficient from the copper foil, and pitch shift occurs during mounting, which is not preferable. It is not preferable to use a tape with an adhesive for TAB having a water content of more than 0.8%, since the TAB tape will be warped, causing a pitch shift during mounting and defects such as peeling of the conductor. The method for adjusting the moisture content is not particularly limited, but is adjusted, for example, by adjusting the atmospheric humidity of the TAB tape. That is, it is adjusted by humidification or drying as needed.

[0028] The water content refers to at least a tape with an adhesive for TAB in which an adhesive layer is laminated on an insulating film. The measurement of the moisture content is performed as follows. That is, the weight of about 1m of TAB adhesive tape
(A) is measured, this tape is left in a vacuum dryer for 2 days, and then the weight (B) is measured, and the moisture content is calculated by the formula (1). (A−B) / B × 100 = moisture percentage (%) ‥‥‥‥‥‥‥ (1)

The TAB tape for mounting the IC is the above-mentioned TAB tape.
An IC is mounted on the TAB tape obtained through the following steps using a tape with an adhesive.

(1) Punching process for sprocket holes, device holes, etc. (2) Removal of protective film, copper foil laminating process (3) Adhesive heating curing process (4) Photoresist coating, pattern exposure, developing process (5) Copper Foil pattern etching process (6) Photoresist stripping process (7) (Solder resist coating process if necessary) (8) Plating process (tin, solder, gold, etc.)

[0031]

EXAMPLES The contents of the present invention will be described in detail below with reference to examples.

Each test in this example was performed as follows.

[Moisture Retention Measuring Method] The weight (A) of about 1 m of the tape with an adhesive for TAB was measured. The tape was left in a vacuum dryer for 2 days, after which the weight (B) was measured. The moisture percentage was calculated by the equation (1). (A−B) / B × 100 = moisture percentage (%) ‥‥‥‥‥‥‥ (1)

[Warpage Inspection Method] Using a tape with an adhesive for TAB, a punching step, removal of a protective film, a copper foil laminating step, and an adhesive heating curing step were carried out in a conventional manner. Then, a test piece having a width of 35 mm and a length of 120 mm of the tape was prepared, and the warpage of the central portion and the diagonal portion was measured.
The average value of each was defined as the amount of warpage.

[Waviness Inspection Method] Using a tape with an adhesive for TAB, a punching step, removal of a protective film, a copper foil laminating step, and an adhesive heating curing step were carried out in a conventional manner. Then, a test piece having a width of 35 mm and a length of 120 mm of the tape was prepared, and the presence or absence of wavy undulation at the end was observed.

Example 1 The following adhesive composition was dissolved in a mixed solution of methanol / monochlorobenzene so as to have a solid concentration of 20% by weight, and then subjected to a release treatment to form a 25 μm-thick polyethylene terephthalate film on a dry film. Apply to a thickness of 18 μm and use an air oven at 100 ° C. for 1 minute, 15
Dry at 0 ° C. for 2 minutes. The adhesive surface of the film has a thickness of 75μ.
m polyimide film ("UPILEX" 75S manufactured by Ube Industries, Ltd.) at 120 ° C. by roll lamination.
To produce a tape with an adhesive for TAB.

<Adhesive composition> Polyamide resin: 100 parts by weight (Nylon "MACROMELT" 690 manufactured by Henkel)
1) Thermosetting alkylphenol resin: 75 parts by weight (TD-2625 manufactured by Dainippon Ink and Chemicals, Inc.)

The tape with an adhesive for TAB obtained above was allowed to stand at 23 ° C. and 55% RH for 2 days to obtain a water content of 0.67.
% Of TAB tape was obtained. Table 1 shows the measurement results of the water content, warpage, and waviness of the obtained tape with an adhesive for TAB.

The obtained tape with an adhesive for TAB is 18
A μm electrolytic copper foil was laminated under the conditions of 140 ° C. and 0.1 MPa. Subsequently, in an air oven, heat treatment was sequentially performed at 80 ° C., 3 hours, 100 ° C., 5 hours, 150 ° C., and 5 hours to prepare a TAB tape with a copper foil. A photoresist film was formed, etched, and stripped of the resist on the copper foil surface of the TAB tape with copper foil by a conventional method to form a conductor circuit for connecting a semiconductor integrated circuit, and the pattern tape shown in FIG. 1 was obtained. .

Further, using this pattern tape, 45
Inner lead bonding was performed at 0 ° C. for 1 minute to connect a semiconductor integrated circuit. After that, an epoxy-based liquid sealant ("Hitariku Paint Co., Ltd." Chipcoat "1
320-617), resin sealing was performed to obtain a semiconductor device. FIG. 2 shows a cross section of the obtained semiconductor device.

Example 2 TAB adhesive tape was left at 23 ° C. and 40%
A tape with a TAB adhesive having a water content of 0.59% was obtained in the same manner as in Example 1 except that the treatment was carried out at RH for 2 days. Table 1 shows the measurement results of the water content, warpage, and waviness of the obtained tape with an adhesive for TAB.

Comparative Example 1 A TAB adhesive tape having a water content of 0.14% was obtained in the same manner as in Example 1, except that the TAB adhesive tape was left under vacuum drying for 12 hours. . Table 1 shows the measurement results of the water content, warpage, and waviness of the obtained tape with an adhesive for TAB.

COMPARATIVE EXAMPLE 2 A tape with an adhesive for TAB was left at 23 ° C. and 90%
A tape with a TAB adhesive having a water content of 1.21% was obtained in exactly the same manner as in Example 1 except that the RH was changed to 2 days. Table 1 shows the measurement results of the water content, warpage, and waviness of the obtained tape with an adhesive for TAB.

[0044]

[Table 1]

[0045]

According to the present invention, the TAB tape can be manufactured at a high yield without any problem such as a pitch shift at the time of mounting due to warpage or undulation in a processing step of the TAB tape and without a problem of a decrease in the yield of the TAB tape. It is possible to obtain a high-performance and good-quality TAB tape.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a pattern tape before mounting a semiconductor integrated circuit, obtained by processing a tape with an adhesive for TAB of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device using the tape with an adhesive for TAB of the present invention.

FIG. 3 is a cross-sectional view of one embodiment of a semiconductor device (BGA) using a tape with an adhesive for TAB of the present invention.

FIG. 4 is a cross-sectional view of one embodiment of a semiconductor device (CSP) using a tape with an adhesive for TAB of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating film which has flexibility 2,13,21 Adhesive 3 Sprocket hole 4 Device hole 5,14,22 Conductor for connecting a semiconductor integrated circuit 6 Inner lead part 7 Outer lead part 8,15,23 Semiconductor integrated circuit 9, 16, 24 sealing resin 10, 17, 25. Gold bump 11 Protective film 18, 26 Solder ball 19 Reinforcement plate 27 Solder resist

Claims (6)

[Claims] 1. An adhesive tape for TAB having an adhesive layer laminated on at least an insulating film, wherein the water content of the tape is in the range of 0.4 to 0.8%. Tape with agent. 2. The tape with an adhesive for TAB according to claim 1, wherein the insulating film is a polyimide film. 3. The TA according to claim 1, wherein the adhesive layer contains a polyamide resin and a phenol resin.
Tape with adhesive for B. 4. A polyamide resin containing a dicarboxylic acid having 36 carbon atoms as a constituent component.
The adhesive tape for TAB according to the above. 5. A TAB tape using the tape with an adhesive for TAB according to claim 1. 6. A semiconductor device using the tape with an adhesive for TAB according to claim 1.