JPH10104297A - High frequency characteristic measuring jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a microstrip substrate in pallel with a loading face without causing air bubbles which cause sticking out of solder and dielectric loss in the loading face and a connector when high frequency characteristics of an electronic device are measured. SOLUTION: A through hole 7 and a solder flow passage groove 6 which is derived from this through hole 7 radially are provided on a soldering face of a pedestal of a microstrip substrate 1. Here, melted solder on the soldering face flows from the flow passage groove 6 through the through hole 7 due to pressing force of the microstrip substrate 1, air which exists between the microstrip substrate 1 and the soldering face is pushed out through the through hole 7, and soldering is done in a condition in which the microstrip substrate 1 comes into contact with a projection part between the flow passage grooves 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for measuring high-frequency characteristics in an electronic device.

[0002]

2. Description of the Related Art Usually, this kind of jig for measuring high-frequency characteristics includes:
The electronic device includes a mount on which an electronic device to be measured is mounted, and a microstrip substrate attached to the mount and used as an input / output circuit of the electronic device.

Conventionally, when mounting the microstrip substrate on a gantry, a groove into which the microstrip substrate enters is formed on the surface of the gantry in order to obtain the best high frequency characteristics.
A microstrip substrate was placed in the groove via a piece of solder, and the solder was melted and bonded by heating.

[0004]

However, even if the solder strip is placed in the groove into which the microstrip substrate enters and reflowed to adhere the microstrip substrate to the gantry, air is trapped between the microstrip substrate and the bottom of the groove.
As a result, there is a problem that bubbles are generated between the substrate and the groove bottom, causing dielectric loss, and making it impossible to accurately measure high-frequency characteristics.

As a method for solving this problem, a method of applying a thick solder paste to the groove bottom, reflowing and bonding is considered, but in this method, the molten solder protrudes and short-circuits with the connector mounted on the mounting base. Or run out and contaminate the mounting surface of the electronic device. Even if the protruding solder is removed, a great deal of work is wasted. In addition, the thickness of the solder tends to be uneven, making it difficult to mount it in parallel with the mounting surface. This causes poor contact between the input / output terminals of the electronic device and the microstrip line during measurement, making accurate measurement impossible. there were.

Accordingly, it is an object of the present invention to provide a high-frequency characteristic measuring jig which can be mounted in parallel with a mounting surface of an electronic device without protruding solder to another place and has no dielectric loss. .

[0007]

A feature of the present invention is that a mounting surface for mounting an electronic device and a microstrip substrate provided adjacent to the mounting surface and connected to input / output terminals of the electronic device are provided. In a high-frequency characteristic measuring jig provided with a mount having a soldering surface to be soldered, a through hole through which the solder flows down when the solder is melted, and a flow channel groove of the solder radially derived from the through hole are formed. It is a high-frequency characteristic measuring jig provided with a gantry having the soldering surface. In addition, it is preferable that all the heights of the protrusions between the adjacent flow channel grooves are the same, and that a plane including the tip of the protrusion is parallel to the placement surface.

[0008]

Next, the present invention will be described with reference to the drawings.

FIGS. 1A to 1C are perspective views of a high-frequency characteristic measuring jig for explaining a high-frequency characteristic measuring jig according to an embodiment of the present invention. FIG. Plan view (b) and AA sectional view (c)
It is. As shown in FIG. 1A, this high-frequency characteristic measuring jig includes a mount 2 made of a copper material having a mounting surface 3 on which an electronic device is mounted in the center, and a mounting surface 3 A microstrip substrate 1 is provided on both sides, on which a microstrip line 4 of a conductive material is formed on a dielectric plate such as Teflon resin, and a connector 5 connected to the microstrip line 4 and attached to the gantry 2. .

Therefore, according to the present invention, when mounting the microstrip substrate 1 in this jig for measuring high-frequency characteristics, as shown in FIG. 1B, a through hole is formed at the bottom of the groove 8 where the microstrip substrate 1 is to be mounted. 7 is formed, and a flow channel 6 radially derived from the through hole 7 is formed. Of course, since the convex portions of the flow grooves 6 determine the flatness of the microstrip substrate 1 as described later, after the flow grooves 6 are formed, the heights of the convex portions of all the flow grooves 6 are the same. It is necessary to process to become.

Then, as shown in FIG. 1C, the solder pieces placed in advance are melted until the convex portions of the flow channel 6 are hidden. Next, the microstrip substrate 1 is placed so as to be inserted into the groove 8, and a weight is placed on the microstrip substrate 1. The molten solder is discharged through the through-hole 7 through the channel groove 6 and out of the gantry 2. Is done. As a result, the microstrip substrate 1 descends and the back surface comes into contact with the convex portion of the flow channel groove 6 and becomes parallel to the mounting surface 3. At the same time, the air existing at the bottom of the microstrip substrate 1 and the groove 8 passes through the through hole 7. Solder bonding is completed without air bubbles. In order to more reliably remove bubbles, it is desirable to reduce the pressure inside the through-hole 7 with a vacuum pump or the like.

As described above, if the through-hole and the groove radially derived from the through-hole are provided on the adherend surface, the solder flows smoothly into the flow channel groove, and unnecessary solder is discharged through the through-hole. There is no solder that overflows into the mounting surface 3 or flows into the connector 5.

[0013]

As described above, the present invention provides a through hole and a solder flow channel radially derived from the through hole in the soldering surface of the gantry of the microstrip substrate, thereby providing a molten solder on the soldering surface. Flows through the through hole from the channel groove due to the pressing force of the microstrip substrate, the air interposed between the microstrip substrate and the soldering surface is pushed out through the through hole and the microstrip substrate is projected between the channel grooves. Since the microstrip substrate is soldered in contact with the portion, the microstrip substrate can be mounted in parallel with the mounting surface of the electronic device without generating bubbles or protruding the solder to other places. This has the effect of eliminating dielectric loss and the like and allowing accurate measurement.

[Brief description of the drawings]

FIG. 1 is a perspective view of a high-frequency characteristic measuring jig for explaining a high-frequency characteristic measuring jig according to an embodiment of the present invention, FIG. 1A is a partial plan view excluding a microstrip substrate, and FIG. It is a view (c).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Microstrip board 2 Stand 3 Mounting surface 4 Microstrip line 5 Connector 6 Channel groove 7 Through hole 8 Groove

Claims (2)

[Claims] 1. A gantry having a mounting surface on which an electronic device is mounted and a soldering surface provided adjacent to the mounting surface and soldering a microstrip substrate connected to input / output terminals of the electronic device. A jig having a through hole through which the solder flows down when the solder is melted, and a soldering surface on which a solder flow path groove radially derived from the through hole is formed. A jig for measuring high frequency characteristics. 2. The height of all the protrusions between the adjacent flow channel grooves is the same, and a plane including the tip of the protrusion is parallel to the mounting surface. The high-frequency characteristic measurement jig described.