JPH0982740A - Height measuring device of bonding wire - Google Patents
Height measuring device of bonding wireInfo
- Publication number
- JPH0982740A JPH0982740A JP7236887A JP23688795A JPH0982740A JP H0982740 A JPH0982740 A JP H0982740A JP 7236887 A JP7236887 A JP 7236887A JP 23688795 A JP23688795 A JP 23688795A JP H0982740 A JPH0982740 A JP H0982740A
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- height
- measuring device
- chip
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＩＣの品質保証を
するためにＩＣチップとリードフレームとの間を結線し
た、ボンディングワイヤの高さを測定する高さ測定装置
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a height measuring device for measuring the height of a bonding wire, which is connected between an IC chip and a lead frame in order to guarantee the quality of the IC.
【０００２】[0002]
【従来の技術】従来この種のものとしては、例えば図３
に示すようにリードフレーム７上に接着剤９で接着され
たＩＣチップ６と、電極外部とを結ぶリードフレーム７
とを結線する、いわゆるワイヤボンディングがある。こ
れは、生産に入る前の試作時点において、生産用のワイ
ヤボンディング装置（図示省略）を使用して実際に何度
もボンディングワイヤ８を結線し、ボンディング状態を
拡大鏡や顕微鏡等を使用して目視検査をしているもので
ある。2. Description of the Related Art Conventionally, as this kind, for example, FIG.
The lead frame 7 connecting the IC chip 6 adhered onto the lead frame 7 with the adhesive 9 and the outside of the electrode as shown in FIG.
There is so-called wire bonding, which connects to and. This is because the bonding wire 8 is actually connected many times using a wire bonding device for production (not shown) at the time of trial production before the production starts, and the bonding state is changed by using a magnifying glass or a microscope. It is a visual inspection.
【０００３】そして、この試作されたボンディングワイ
ヤ８の融着部であるボール８ａの大きさやクレセント８
ｂの形状の適正を確認し、ボンディングワイヤ８の高低
や変形等の欠陥の有無を目視判断して、適正に製作でき
る状態になった時点で、生産に入ることが一般に行なわ
れている。The size of the ball 8a, which is the fusion-bonded portion of the bonding wire 8 thus manufactured, and the crescent 8
It is general to start production after confirming the appropriateness of the shape of b, visually judging the presence or absence of defects such as height and deformation of the bonding wire 8, and when it is in a state where it can be properly manufactured.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、前記ボ
ンディングワイヤ８を結線した後ボンディング状態を目
視検査する方法は平面で見るのが主体で、三次元的にボ
ンディングワイヤ８の高低の良否を数十μｍの単位で目
視検査するのは難しい。そして、結線されたボンディン
グワイヤ８が樹脂封止時に、樹脂封子部から飛び出した
り変形して絡み短絡したりＩＣチップ６と接触したりす
るのが不良の主な原因になっていた。However, the method of visually inspecting the bonding state after connecting the bonding wire 8 is mainly to see it in a plane, and the quality of the bonding wire 8 is three-dimensionally determined by several tens of μm. It is difficult to visually inspect each unit. The main cause of the defect is that the bonded bonding wire 8 jumps out of the resin encapsulation portion or is deformed and entangled to cause a short circuit or contact with the IC chip 6 during resin encapsulation.
【０００５】そして、最終工程の動作試験において不良
が見出されると不良の該当する工程を再検査し原因解析
をする必要がしばしば発生していた。When a defect is found in the operation test of the final process, it is often necessary to reinspect the process corresponding to the defect and analyze the cause.
【０００６】そこで、この発明は、ＩＣチップとリード
フレームとを結ぶボンディングワイヤ高さを測定し適正
高さを確保して、不良の低減を図るボンディングワイヤ
高さ測定装置を提供することを目的にしている。Therefore, an object of the present invention is to provide a bonding wire height measuring device which measures the height of a bonding wire connecting an IC chip and a lead frame to ensure an appropriate height and reduces defects. ing.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するた
め、請求項１に記載の発明は、ＩＣチップ上面に溶着さ
れたボンディングワイヤが、上方へ向かって延び湾曲し
て山なりにリードフレーム面まで下がる構造物におい
て、前記ボンディングワイヤの高さが測れるように、被
測定物である前記ボンディングワイヤの上方の位置にレ
ーザフォーカス機構を有するレーザ光発生装置を設け、
該レーザ光発生装置より出力されたレーザ光は被測定物
であるボンディングワイヤにより反射され、反射された
該レーザ光を受光してボンディングワイヤの高さを算出
することを特徴としている。In order to achieve this object, the invention as set forth in claim 1 is such that the bonding wire welded to the upper surface of the IC chip extends upward and curves to form a ridged lead frame surface. In the structure that goes down to, so that the height of the bonding wire can be measured, a laser light generator having a laser focus mechanism is provided at a position above the bonding wire that is the object to be measured,
The laser beam output from the laser beam generator is reflected by the bonding wire that is the object to be measured, and the reflected laser beam is received to calculate the height of the bonding wire.
【０００８】この請求項１に記載の発明では、ＩＣチッ
プ面からの反射レーザ光を捉えることができるので、Ｉ
Ｃチップ面より上方にあるボンディングワイヤの高さも
間隔も随時測定することができる。According to the first aspect of the invention, since the reflected laser light from the IC chip surface can be captured, I
The height and spacing of the bonding wires above the C-chip surface can be measured at any time.
【０００９】請求項２に記載のボンディングワイヤ高さ
測定装置は、請求項１に記載のボンディングワイヤ高さ
測定装置において、前記レーザ光の反射・受光により、
前記ＩＣチップ上面の角部の少なくとも三箇所を測定し
前記ＩＣチップの仮想平面を算出すると共に、前記レー
ザ光が前記ＩＣチップ外周に沿うように前記Ｘ，Ｙテー
ブルを駆動させることを特徴としている。A bonding wire height measuring device according to a second aspect of the present invention is the bonding wire height measuring device according to the first aspect, in which the laser beam is reflected / received,
At least three corners of the upper surface of the IC chip are measured to calculate a virtual plane of the IC chip, and the X and Y tables are driven so that the laser light is along the outer periphery of the IC chip. .
【００１０】この請求項２に記載された発明では、請求
項１に記載のボンディングワイヤ高さ測定装置におい
て、ＩＣチップ外周部でボンディングワイヤの高さの適
正域を基準化して置くことによって不良発生の低減が図
れる。According to the invention described in claim 2, in the bonding wire height measuring apparatus according to claim 1, a defect is generated by arranging the proper range of the height of the bonding wire at the outer peripheral portion of the IC chip as a standard. Can be reduced.
【００１１】請求項３に記載のボンディングワイヤ高さ
測定装置は、前記Ｘ，Ｙテーブルの動作機能と座標デー
タとを指令する制御装置、レーザフォーカス量によるア
ナログ出力と座標データとを対応させる測定器及び演算
表示機能を有する演算装置を設けたことを特徴としてい
る。A bonding wire height measuring device according to a third aspect of the present invention is a control device for instructing an operating function of the X and Y tables and coordinate data, and a measuring device for making an analog output by a laser focus amount correspond to coordinate data. And an arithmetic unit having an arithmetic display function is provided.
【００１２】この請求項３に記載された発明では、請求
項１又は２に記載のボンディングワイヤ高さ測定装置に
おいて、高さの測定、表示も自動化できると同時に、測
定値のビジュアル表示ができるので結果を把握し易く、
また、判断し易い。さらに、適正高さ域を外れるものは
「除去」の指令判断も出せるので不良の選別が可能とな
る。According to the third aspect of the invention, in the bonding wire height measuring apparatus according to the first or second aspect, the height can be automatically measured and displayed, and at the same time, the measured value can be visually displayed. Easy to understand the result,
Also, it is easy to judge. Further, if the height is out of the proper height range, a command for "removal" can be issued, so that defects can be sorted.
【００１３】[0013]
【発明の実施の形態】本発明の実施の形態を、図１及び
図２に基づいて説明する。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS.
【００１４】図１及び２は、それぞれ実施の形態の構造
及び作用を示すものである。1 and 2 show the structure and operation of the embodiment, respectively.
【００１５】まず構成を説明すると、図１（ａ）におい
て、２１はボンディングワイヤ高さ測定装置、２２はレ
ーザ光発生装置、２３はＩＣチップ、２４はリードフレ
ーム、２５はボンディングワイヤである。このレーザ発
生装置２２からはレーザ光２２ｋが出力されている。First, referring to FIG. 1A, 21 is a bonding wire height measuring device, 22 is a laser beam generator, 23 is an IC chip, 24 is a lead frame, and 25 is a bonding wire. Laser light 22k is output from the laser generator 22.
【００１６】また、図１（ｂ）は、レーザ発生装置２２
より出力されたレーザ光２２ｋの反射・受光により高さ
の測定を行なう測定器２８内を示している。Further, FIG. 1B shows a laser generator 22.
The inside of the measuring device 28 for measuring the height by reflecting and receiving the laser beam 22k outputted from the laser beam is shown.
【００１７】すなわち、２２ａは半導体レーザ、２２
ｂ，２２ｃはハーフミラーＡ，Ｂ、２２ｄは受光素子、
２２ｅはピンホール、２２ｆはコリメートレンズ、２２
ｇは対物レンズ、２２ｈはレーザフォーカス機構で被対
象物の高低に合わせてレーザ光２２ｋのスポット２２ｐ
が上下するように対物レンズ２２ｇを駆動させる、２２
ｎはＣＣＤカメラでスポット２２ｐの反射レーザ光２２
ｋを取り込み演算装置２９に転送する。この機構で測定
器２８を構成している。That is, 22a is a semiconductor laser, and 22 is a semiconductor laser.
b and 22c are half mirrors A and B, 22d is a light receiving element,
22e is a pinhole, 22f is a collimating lens, 22
g is an objective lens, 22h is a laser focus mechanism, and the spot 22p of the laser beam 22k is adjusted according to the height of the object.
The objective lens 22g is driven so that
n is the CCD camera and the reflected laser light 22 of the spot 22p
The k is fetched and transferred to the arithmetic unit 29. This mechanism constitutes the measuring device 28.
【００１８】そして、このレーザ発生装置２２と測定器
２８は図示省略のＸ，Ｙテーブルに一体に装着されお
り、レーザ発生装置２２の下方に治具設置されたボンデ
ィングワイヤ２５上を駆動されるボンディングワイヤ高
さ測定装置２１が構成されている。The laser generator 22 and the measuring device 28 are integrally mounted on an X, Y table (not shown), and the bonding is driven on the bonding wire 25 installed in the jig below the laser generator 22. A wire height measuring device 21 is configured.
【００１９】次に、図２によりボンディングワイヤ高さ
測定装置２１の機能について説明する。Next, the function of the bonding wire height measuring device 21 will be described with reference to FIG.
【００２０】レーザ光発生装置２２と測定器２８とを一
体に装着したＸ，Ｙテーブル２６は制御装置２７により
ＩＣチップ２３周縁部のパス軌道・スピード等が指令駆
動される。このパス軌道はＩＣチップ２３とリードフレ
ーム２４との関係高さ等により、ＩＣチップ２３周縁部
を何回周回しても、曲線パス軌道をしてもよく、いずれ
もＩＣチップ２３の仮想平面からのボンディングワイヤ
２５高さとして捉えればよい。The X, Y table 26, in which the laser beam generator 22 and the measuring device 28 are integrally mounted, is commanded by the controller 27 for the path orbit and speed of the peripheral portion of the IC chip 23. Depending on the height of the relationship between the IC chip 23 and the lead frame 24, this path orbit may be rounded around the periphery of the IC chip 23 or may be a curved path orbit. It can be regarded as the height of the bonding wire 25.
【００２１】また、このＸ，Ｙテーブル２６の駆動にリ
ンクして、レーザ光発生装置２２ａの４出力（レーザＯ
Ｎ，ホールド，オフセット，ピークセット）とレーザフ
ォーカス機構２２ｈ作動によるアナログ出力は測定器２
８に転送され、制御装置２７から転送されてきた座標デ
ータとマッチングさせながら演算装置２９に転送する。Further, linked to the driving of the X and Y table 26, the four outputs of the laser light generator 22a (laser O
(N, hold, offset, peak set) and the analog output by operating the laser focus mechanism 22h is the measuring instrument 2
8 and the coordinate data transferred from the control device 27 is matched and transferred to the arithmetic device 29.
【００２２】そして、処理されたデータは出力表示例２
９ａに示すようにボンディングワイヤ２５の位置や高さ
のピークホールド表示や数値データ表示等を表示する。
また、この演算装置２９からは処理データの一部をフィ
ードバックして、更に測定動作を繰り返す指令を転送す
る。Then, the processed data is output display example 2
As shown in 9a, the peak hold display and numerical data display of the position and height of the bonding wire 25 are displayed.
Further, a part of the processed data is fed back from the arithmetic unit 29, and a command for repeating the measurement operation is further transferred.
【００２３】また、演算装置２９では、入力されている
規格値から測定データの良否判定を行い、不良品の「除
去」指令等も出力できるのは勿論である。In addition, it goes without saying that the arithmetic unit 29 can judge whether the measured data is good or bad from the inputted standard value, and can also output a "removal" command for defective products.
【００２４】ここで、レーザフォーカス機構２２ｈと
は、図１（ｂ）に示すように、半導体レーザ２２ａから
出力されたレーザ光２２ｋのスポット２２ｐが被測定物
であるＩＣチップ２３の表面で反射し受光素子へ戻る
（レーザ光を実線で示している）、次にレーザ光２２ｋ
がボンディングワイヤ２５に当ったスポット２２ｐの位
置はＩＣチップ２３表面よりも高い位置にあり、そのま
まではスポット２２ｐの反射光は受光素子２２ｄへは戻
らないので、対物レンズ２２ｇを駆動させスポット２２
ｐの反射光（レーザ光を破線で示している）がピンホー
ル２２ｅを通過して受光素子へ戻るようにした対物レン
ズ２２ｇの駆動機構を云う。よって、この対物レンズ２
２ｇの駆動量を高さとして測定に使うことができる。Here, as shown in FIG. 1B, the laser focus mechanism 22h means that the spot 22p of the laser beam 22k outputted from the semiconductor laser 22a is reflected on the surface of the IC chip 23 as the object to be measured. Return to the light receiving element (laser light is shown by the solid line), then laser light 22k
The position of the spot 22p hitting the bonding wire 25 is higher than the surface of the IC chip 23. Since the reflected light of the spot 22p does not return to the light receiving element 22d as it is, the objective lens 22g is driven to drive the spot 22p.
This is a drive mechanism of the objective lens 22g in which the reflected light of p (the laser light is shown by a broken line) passes through the pinhole 22e and returns to the light receiving element. Therefore, this objective lens 2
The driving amount of 2 g can be used as the height for the measurement.
【００２５】[0025]
【実施例】更に、以下のような条件で実験した結果、極
めて精度のよい測定値が得られた。EXAMPLES Further, as a result of an experiment under the following conditions, extremely accurate measured values were obtained.
【００２６】レーザ光発生装置関係： ＊レーザスポット径： φ ２．０ μｍ ＊測定範囲： ± ０．３ ｍｍ ＊作動距離： ５ ｍｍ ＊応答時間： ２．２ ｍｓ 測定関係： ＊Ｘ，Ｙテーブル駆動スピード： ３〜５ ｍｍ／ｓ ＊表示＝ピーク、ピークホールド、デジタル・データ 規格値（ボンディングワイヤ高さ：μｍ） ＊ ２００ ±５％Laser light generator-related: * Laser spot diameter: φ 2.0 μm * Measuring range: ± 0.3 mm * Working distance: 5 mm * Response time: 2.2 ms Measuring relationship: * X, Y table Drive speed: 3 to 5 mm / s * Display = peak, peak hold, digital data Standard value (bonding wire height: μm) * 200 ± 5%
【００２７】[0027]
【発明の効果】本発明に係るボンディングワイヤ高さ測
定装置を使用することにより、各ボンディングワイヤ高
さが適正域に入っているか確認ができる。したがって、
良否の選定により不良品を次工程に流出させないと同時
に、過去の不良の解析データと照合でき早急な対策が打
てる。By using the bonding wire height measuring device according to the present invention, it is possible to confirm whether each bonding wire height is within the proper range. Therefore,
By selecting good or bad, defective products can be prevented from leaking to the next process, and at the same time, it can be collated with the analysis data of past defects and immediate measures can be taken.
【図１】（ａ）はワイヤボンディング高さ測定を示す斜
視図である。 （ｂ）はレーザ光による高さ測定を示す説明図である。FIG. 1A is a perspective view showing a wire bonding height measurement. (B) is explanatory drawing which shows the height measurement by a laser beam.
【図２】本発明によるボンディングワイヤ高さ測定装置
のブロック図である。FIG. 2 is a block diagram of a bonding wire height measuring device according to the present invention.
【図３】従来技術によるワイヤボンディング状態を示す
平面図である。FIG. 3 is a plan view showing a wire bonding state according to a conventional technique.
２１…ボンディングワイヤ高さ測定装置 ２２…レーザ光発生装置 ２２ｈ…レーザフォーカス機構 ２２ｋ…レーザ光 ２３…ＩＣチップ ２４…リードフレーム ２５…ボンディングワイヤ ２６…Ｘ，Ｙテーブル ２７…制御装置 ２８…測定器 ２９…演算装置 21 ... Bonding wire height measuring device 22 ... Laser light generating device 22h ... Laser focus mechanism 22k ... Laser light 23 ... IC chip 24 ... Lead frame 25 ... Bonding wire 26 ... X, Y table 27 ... Control device 28 ... Measuring instrument 29 … Arithmetic device
Claims (3)
グワイヤが、上方へ向かって延び湾曲して山なりにリー
ドフレーム面まで下がる構造物において、 前記ボンディングワイヤの高さが測れるように、被測定
物である前記ボンディングワイヤの上方の位置にレーザ
フォーカス機構を有するレーザ光発生装置を設け、該レ
ーザ光発生装置より出力されたレーザ光は被測定物であ
るボンディングワイヤにより反射され、反射された該レ
ーザ光を受光してボンディングワイヤの高さを算出する
ことを特徴とするボンディングワイヤ高さ測定装置。1. In a structure in which a bonding wire welded to the upper surface of an IC chip extends upward, and is curved and ridges down to the lead frame surface, an object to be measured so that the height of the bonding wire can be measured. A laser light generator having a laser focus mechanism is provided above the bonding wire, and the laser light output from the laser light generator is reflected by the bonding wire that is the DUT, and the reflected laser light is reflected. A bonding wire height measuring device, which receives light and calculates the height of the bonding wire.
ＩＣチップ上面の角部の少なくとも三箇所を測定し前記
ＩＣチップの仮想平面を算出すると共に、 前記レーザ光が前記ＩＣチップ外周に沿うように前記
Ｘ，Ｙテーブルを駆動させることを特徴とする請求項１
に記載のボンディングワイヤ高さ測定装置。2. The reflection / reception of the laser light measures at least three corners of the upper surface of the IC chip to calculate a virtual plane of the IC chip, and the laser light is arranged along the outer periphery of the IC chip. 2. The X and Y tables are driven by the table.
Bonding wire height measuring device according to.
ータとを指令する制御装置、レーザフォーカス量による
アナログ出力と座標データとを対応させる測定器及び演
算表示機能を有する演算装置を設けたことを特徴とする
請求項１又は２に記載のボンディングワイヤ高さ測定装
置。3. A control device for instructing an operation function of the X and Y tables and coordinate data, a measuring device for making an analog output according to a laser focus amount correspond to the coordinate data, and a calculation device having a calculation display function. The bonding wire height measuring device according to claim 1 or 2, wherein.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7236887A JPH0982740A (en) | 1995-09-14 | 1995-09-14 | Height measuring device of bonding wire |
| PCT/JP1997/000801 WO1998040695A1 (en) | 1995-09-14 | 1997-03-13 | Apparatus for measuring height of bonding wire |
| TW086103171A TW365037B (en) | 1995-09-14 | 1997-03-14 | Inspection apparatus for connection wiring height |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7236887A JPH0982740A (en) | 1995-09-14 | 1995-09-14 | Height measuring device of bonding wire |
| PCT/JP1997/000801 WO1998040695A1 (en) | 1995-09-14 | 1997-03-13 | Apparatus for measuring height of bonding wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0982740A true JPH0982740A (en) | 1997-03-28 |
Family
ID=26438152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7236887A Pending JPH0982740A (en) | 1995-09-14 | 1995-09-14 | Height measuring device of bonding wire |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0982740A (en) |
| WO (1) | WO1998040695A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010062324A (en) * | 2008-09-03 | 2010-03-18 | Toyota Motor Corp | Inspection device and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794976B2 (en) * | 1990-05-10 | 1995-10-11 | 松下電器産業株式会社 | Method for detecting lead floating in electronic components |
| JP2851151B2 (en) * | 1990-10-12 | 1999-01-27 | 株式会社東芝 | Wire bonding inspection equipment |
| JPH08334317A (en) * | 1995-06-09 | 1996-12-17 | Olympus Optical Co Ltd | Measuring microscope |
-
1995
- 1995-09-14 JP JP7236887A patent/JPH0982740A/en active Pending
-
1997
- 1997-03-13 WO PCT/JP1997/000801 patent/WO1998040695A1/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010062324A (en) * | 2008-09-03 | 2010-03-18 | Toyota Motor Corp | Inspection device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1998040695A1 (en) | 1998-09-17 |
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