JPH10132524A - Substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive device which has a high degree of freedom for selection and set of an inspection item or the like, and can perform a quick highly precise inspection by setting a reference standard value determined by measuring the standard position of a printed board to an information processing means. SOLUTION: In order to determine a standard land pad height t1, measuring part points (a) and (c) are set to optional points on laser scanning lines on both sides of the measuring part point (b) of a standard land pad, and each relative height dimension a1, b1, c1 is measured by an optical head according to a preprogram in which the measurement executing procedure of a personal computer is set. The thus-measured height t1 of the standard land pad is taken as a typical standard height (reference standard) in measurement of each lead wire of QFP (Quad Flat Package), whereby it is not required to measure the height of the land pad several times, and the inspection of a lead wire can be precisely and efficiently performed. When a lead is soldered in the state bent upward by any cause, its incomplete soldering can be detected by measuring the total dimension.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection apparatus for inspecting the dimensions of a member mounted on a printed board with a board using a laser beam.

[0002]

2. Description of the Related Art Mini-mold packages and QFP (Quad Flat Pa) for increasing the mounting density of electronic parts on printed circuit boards
Board inspection where optical leads are automatically / manually inspected to determine whether soldering has been performed properly on boards to which the leads of miniaturized semiconductor surface mount components such as ckage) have been soldered. Various systems have been put to practical use.

[0003] In these, a state in which a QFP or the like is well mounted on a substrate is defined as a standard state, and this standard pattern and a pattern to be inspected of a work newly soldered in a production process are output via a video camera. A / D (Analog-Digital) conversion of the video signal based on the video signal
The two video signals are compared by storage of a microcomputer in which necessary conditions are programmed and pattern recognition by calculation, and a pass / fail judgment is made based on a degree of deviation of a relative position between a lead wire and a land pad of the substrate. There is a pattern recognition inspection device.

[0004] In addition, the focus is controlled, and simultaneous irradiation or combined irradiation with time is performed by using a plurality of laser beams for changing irradiation angles, and an output signal such as a position / shape of a shadow generated around the lead wire is previously registered in a memory. Is compared with the signal
There is a laser beam type inspection device or the like for determining whether or not the relative position between the lead wire and the land pad of the substrate is good.

[0005]

However, it is difficult for any of these methods to always meet 100% of the demands of many users. In the pattern recognition inspection apparatus, the lead wires are inspected in the direction of the land pad substrate surface. Although it is possible, it takes a long time to adjust the focus of the lens of the video camera to inspect the direction perpendicular to the substrate surface, and it is difficult to inspect in a short time.

Further, the laser beam type inspection apparatus is a dedicated apparatus for the lead wire position inspection, and the degree of freedom in selecting and setting inspection items and inspection limits is small, and the apparatus is expensive. Accordingly, the present invention provides a printed circuit board inspection apparatus which has a high degree of freedom to enable selective setting of inspection items, inspection limit values, etc., allows easy and quick inspection, enables high inspection accuracy, and has an inexpensive apparatus. Realization is the task.

[0007]

SUMMARY OF THE INVENTION The present invention is directed to a measuring means for irradiating a laser beam from above a component mounting surface of a printed circuit board to measure the height of a predetermined portion of the member and outputting measurement data, A scanning unit that scans the laser beam along the component mounting surface, an information processing unit that performs information processing of measurement data from the measurement unit, and a display unit that displays an information processing result of the information processing unit. In the board inspection apparatus having the above, before the measurement of the printed circuit board, the reference portion provided on the printed circuit board is irradiated with the laser light to measure the reference portion, and the measurement is performed according to the measurement result measured by the reference measurement portion. A reference value setting unit that outputs measurement data to the information processing unit as a reference reference value for the information processing.

The measuring means measures the measuring range for each predetermined scanning distance of the laser beam, and the information processing means measures measurement data at both measuring points near both ends of the measuring range. And correction inclination means for calculating inclination correction data representing the inclination of the printed circuit board component mounting surface from the distance between the measurement points at both ends, and correcting the measurement data.

Further, the scanning means scans the laser beam at a constant speed, and the inclination correcting means calculates a distance between the measurement points at both ends from a difference in measurement time at the measurement points at both ends. It is characterized by doing. When the height of the member deviates from a predetermined non-defective range as a result of the information processing performed by the information processing unit, a defect display unit that displays a defect of the printed circuit board on the display unit, and the non-defective range is set. Non-defective range setting means.

The same-shape detecting means for detecting a part having the same shape based on the measurement data; a counting means for counting the number of the same-shape parts detected by the same-shape detecting means; A defect display means for displaying a defect of the printed circuit board when the determined number does not match a predetermined reference number, and a reference number setting means for setting the reference number.

The measurement data from the measuring means is
In the case where the data indicates data having a height equal to or less than a predetermined height, an interpolation processing means for interpolating the measurement data with the measurement data before or after the measurement data is provided. Also,
When the measurement data from the measurement unit is continuously equal to or higher than a predetermined height for a predetermined period or less, an interpolation processing unit that interpolates the measurement data with measurement data before or after the measurement data is provided. I do.

Further, the measurement data from the measuring means is
A defect display means for displaying a defect in the printed circuit board when the height is continuously higher than a predetermined height for a predetermined period or less. A defect display unit that displays a defect of the printed circuit board on the display unit when the width of the predetermined portion of the member deviates from a predetermined non-defective range as a result of the information processing by the information processing unit; And a non-defective range setting means for setting

Further, as a result of the information processing by the information processing means, when a defect of the printed circuit board is detected, the display means is provided with a defective position display means for displaying a defective position on the printed circuit board. And In addition, a marking means for marking a defective position on the printed circuit board when a defect on the printed circuit board is detected as a result of the information processing by the information processing means.

[0014]

Next, a first embodiment of the present invention will be described. FIG. 1 is a configuration diagram showing the configuration of an embodiment of the present invention, and shows the entire system of a board inspection apparatus using main components for measuring the dimensions of members mounted on a printed board.

FIG. 2 shows a printed circuit board (work) on which a QFP (Quad Flat Package) is mounted. An optical head 1 is a semiconductor laser light emitting element, a light projecting lens, a light receiving lens, and a light position detecting element (PDS: Positio).
n Sensitive Device), and the unit is arranged to face the upper surface of the XYZ table 4 and
It is held on a fixed portion of the YZ table 4 via a holding base.

Then, a laser beam having an optimum luminous intensity is projected from the semiconductor laser light emitting element to the object to be measured via the light projecting lens by a laser control signal input from the laser control unit 5, and the laser light from the object to be measured is The laser beam reaches the portion of the PDS corresponding to the displacement position where the object to be measured is displaced by the reflected light with respect to the PDS via the light receiving lens, and a displacement signal is output to the laser control unit 5 from the PDS. As an optical displacement meter.

Such a configuration is a triangulation type laser displacement meter as one of the optical displacement meters, and is described, for example, in "Advanced Laser Technology" edited by Laser Society of Japan (Nikkei Technical Books Co., Ltd.). In addition, as the optical displacement meter, for example, an astigmatism method, a knife edge method, or the like other than the above method can be used.

Reference numeral 2 denotes an object to be measured, which is a typical example of a QFP of a semiconductor package for surface mounting, in which lead wires drawn from four sides of the QFP are soldered to respective land pads of the printed circuit board 3. It is. Reference numeral 3 denotes a printed board, which is a mass-produced board on which the measured object 2 is mounted. The printed board 3 is temporarily attached to the XYZ table 4 by a leaf spring clip or the like so as to be easily detached.

Reference numeral 4 denotes an XYZ table, which is a plane movable table on which a work (printed circuit board 3) is mounted and which is driven by a stepping motor by a preprogram and is defined in the XY plane direction and, if necessary, in the vertical Z direction. The configuration is such that the distance is accurately moved. When the XYZ table 4 is moved, the printed circuit board 3 and the optical head 1 are relatively moved, and scanning and measurement of the laser beam are performed simultaneously.

The direction, distance, moving speed, etc. of the relative movement (scanning of a laser beam, etc.) are controlled by a table control signal input from the personal computer 7.
The XY directions are referred to as horizontal directions for explanation. Reference numeral 5 denotes a laser control unit. The laser beam emitted by the semiconductor laser element in the optical head 1 becomes reflected light from the object to be measured, and the displacement signal of the object to be measured input from the PDS is accurate with little dark noise or the like. The semiconductor laser device and the PDS are configured to be manually / automatically controlled by the laser control unit 5 so that accurate measurement is performed.

Reference numeral 6 denotes an A / D (Analog to Digital) converter, which is composed of an A / D converter of an integral type or the like and its peripheral circuit, and converts an analog signal such as the displacement signal input from the laser controller 5. It is converted into a digital signal and output to the personal computer 7. Reference numeral 7 denotes a personal computer (abbreviation for a personal computer), which includes hardware such as a RAM and a ROM, a high-speed processing circuit, an input / output circuit / input keyboard, and external devices (an XYZ table 4, a laser control unit 5, an A / D conversion unit). 6) and a communication line for communicating and processing the scanning mode of the laser beam (the number of times of measurement, the scanning range, the scanning speed, etc.) and the measurement information (measurement data), and the software thereof. The measurement data acquired in step (1) is processed by the personal computer 7, and a signal such as a necessary determination result is output to the display 8 as a graphic control signal.

The software is configured so that a user can pre-operate a keyboard to designate necessary display items and the like from among a laser scanning range, a measurement resolution, and a measurement result by using a pre-program. . Reference numeral 8 denotes a display, which is composed of a CRT or a liquid crystal plate and its peripheral circuits, and the like, and a graphic control signal input from the personal computer 7 is converted into a video signal or the like and displayed on the display 8.

FIG. 2A shows a printed circuit board on which a QFP is mounted, and FIG. 2A shows a printed circuit board as a work, on which a reference land pad described later is provided. FIG. 5 is a diagram showing the dimensional relationships between the arrangement of the lead wires of the QFP and the QFP as a CC section. The operation of the above configuration will be described.

The first object is to obtain a Q from the surface of the printed circuit board.
By determining the dimension (height) of the FP up to the upper surface of each lead wire soldered to the board, that is, the thickness t1 of the reference land pad from the surface of the substrate of the printed board shown in FIG. Then, the thickness t2 of the lead wire and the thickness of the solder (not shown) (the thickness of the solder adhering between the solder land and the lead and the upper surface of the lead) are above the thickness t1.
Is measured and displayed.

In order to achieve the above object, in this embodiment, in the printed circuit board shown in FIG. 2A, the reference land pad is set near the lead wire of the QFP, and the position of the reference land pad and its periphery are included. The user performs a pre-program on the part to be measured by the user in the personal computer 7, so that the scanning of the measurement of the laser beam is performed in the directions indicated by arrows a to c, and the height of the reference land pad is measured as follows. Is done.

FIG. 3 shows a section taken along the line D--D shown in FIG. 2. In order to determine the reference land pad height t1, the measurement site points a and c are arbitrary on the laser scanning line on both sides of the measurement site point b of the reference land pad. The relative height dimensions a1, b1, and c1 are measured by the optical head 1 according to a preprogram in which the measurement execution procedure of the personal computer 7 is set as a point. These measurement sections are generally short sections in which the substrate is inclined. Since the warpage of the substrate can be ignored, linear approximation is used, and the dimension (b1 + t1) is calculated from the dimensions a1 and c1 by (distance ab).
The gradient of b1 + t1 for the distance and c1 for the distance bc
The reference land pad height t1 is calculated by the personal computer 7, and is output and displayed on the display 8.

As described above, according to this embodiment, the height t1 of the reference land pad is measured, and this is set as a representative reference height (reference reference) when each lead wire of the QFP is measured. It is not necessary to measure the height of the lead wire many times, and efficient and accurate inspection of the lead wire is possible.
This also makes it possible to detect incomplete soldering by measuring the total dimension when the lead is soldered in a bent state for any reason.

Next, second and third embodiments of the present invention will be described. Hereinafter, the configuration of the inspection apparatus of each embodiment is the same as the configuration shown in FIG. 1, and the same reference numerals are given and the detailed description is omitted. FIG. 4 is a diagram showing a measurement signal waveform (data taken into the personal computer 7) due to a general inclination of a work (printed circuit board 3) in a prescribed scanning section scanned by a laser beam.

This is a QFP mounted on the printed circuit board 3.
2 shows the height relationship between the lead upper surface and the substrate base material surface as a data signal waveform measured by the optical head 1, and this output data is input to the A / D converter and temporarily stored in the personal computer 7. . FIG. 5 is a diagram showing the scanning speed of the laser beam and its positional relationship on the object to be measured (printed circuit board). The reference numeral in FIG. 4 and FIG. Yes, it is.

As shown in FIG. 4 and FIG. 5, the scanning of the laser beam starts from a on the time axis and proceeds to e, but the microcomputer performs scanning at a constant speed from point b to point c on the time axis. 7 pre-programs are set and configured. In this constant-speed scanning, the scanning distance with respect to the scanning time is linear, so that it is possible to simplify the calculation processing of the measurement data in the personal computer 7 and to speed up the measurement.

The product of the scanning time of the laser beam and the scanning speed between two points from point b to point c on the printed circuit board 3 is the horizontal distance between these two points, that is, on the printed circuit board 3. This is a horizontal projection distance projected on a horizontal plane between two points b and c, and the value of the difference between the measured values of the substrate height at each of the two points is divided by this horizontal projection distance value. As a result, the printed circuit board 3 is
The gradient placed on the table surface is measured.

The measurement of the height at each of the two points is not limited to the two points, and the average of the values measured at a plurality of points close to each of the two points is used as the measurement value at each of the two points. It is also possible. As described above, according to the present embodiment, the scanning speed of the laser beam at the constant speed is linear with respect to the scanning time, so that it is possible to simplify the arithmetic processing of the measurement data in the personal computer 7 and to increase the speed of the measurement.

The printed board 3 is an XYZ table 4
Since the gradient is not always zero when it is temporarily attached to the computer, it is necessary to correct the gradient of the measurement data so as to make the gradient zero and obtain an accurate measurement value. It becomes possible by addition. Next, a fourth embodiment of the present invention will be described.

FIG. 6 is a view showing a correction result of the inclination and an example of a prescribed value of the lead height when the printed circuit board 3 is mounted on the XYZ table with an inclination. The measurement data measured in a state where the upper surface of the lead of the QFP 2 and the upper surface of the printed circuit board 3 are inclined are calculated in the personal computer 7 using the gradient determined in the same manner as in the second and third embodiments. Is converted into a value equivalent to a measured value measured in a horizontal state, the inclination is corrected, and a correct measured value and a measured waveform are displayed on the display 8 as necessary.

With respect to the measurement value thus corrected for inclination,
The user sets a pre-program in the personal computer 7 with respect to the inspection limit value that defines the inspection limit of the lead height of the QFP 2, and the personal computer 7 determines the quality of the lead height of the QFP 2 based on the inspection limit value. The quality of the measurement result is output and displayed on the display 8. According to the present embodiment,
Since not only the upper limit value but also the lower limit value of the inspection limit value can be set, for example, a lead portion less than the lower limit value is detected in a missing member such as a broken lead of a QFP.
Such a defect of the missing lead can be detected, and the inspection accuracy can be improved.

Next, a fifth embodiment of the present invention will be described.
FIG. 7 is a diagram showing an example of a measurement signal waveform (data taken into the personal computer 7) obtained by measuring the height of the lead of the QFP 2 in a prescribed scanning section by scanning with a laser beam.
This figure shows a waveform in a state where there is no fifth lead (dotted line) among the eight leads to be input in a periodic waveform.

Assuming that the leads are missing or bent extremely upwards for some reason, the number of leads is counted and the pre-program of the pre-program is executed by the personal computer 7 so as to detect whether or not the number of leads is the predetermined number. The setting is performed by the user, and the display of the quality of the inspection result is displayed on the display 8. As described above, according to the present embodiment, by setting the upper limit value of the inspection limit value and the detection value of the number of leads in the personal computer 7, it is possible to detect not only the floating of the lead but also the defect of the missing lead, thereby improving the inspection accuracy. can do.

Next, a sixth embodiment of the present invention will be described.
FIG. 8 shows partial measurement data obtained by measuring the height of the lead of the QFP 2 in a specified scanning section by scanning with a laser beam.
FIG. In this figure, although there is ordinary slight small wave-like noise (mainly due to uneven reflection and scattering of the laser beam on the top surface of the lead), it is not a measurement signal waveform which should indicate the height of the substantially flat top surface of the lead, but the lead signal. This shows a state in which a data missing portion D has occurred on the upper surface.

The main cause of the missing portion D is that the reflection of the laser beam is small due to the adhesion of washable flux particles or the like to the leads, and this is one example to be judged as a non-defective product. As a method for compensating for the missing measurement data on the upper surface of one lead as described above, substitute interpolation is performed using the measurement data of the portion closest to the missing portion at the leading edge (FP) and the trailing edge (BP) of the missing data portion. As described above, the user sets the pre-program in the personal computer 7, and the display of the quality of the inspection result is displayed on the display 8.

According to the present embodiment, since the substitute interpolation of the missing data is set in the personal computer 7 in addition to the inspection limit value, it is possible to find out that the defect exceeds the inspection limit value in spite of good quality. Can be prevented, and the inspection accuracy can be improved. Next, seventh and eighth embodiments of the present invention will be described. FIG. 9 shows partial measurement data obtained by measuring the height of the lead of the QFP 2 in a specified scanning section by scanning with a laser beam, and the signal portion S1 from two leads.
FIG. 8 is a diagram showing an example of a measurement signal waveform (data taken into the personal computer 7) with S3 and an abnormal width signal portion S2 therebetween.

The abnormal width signal portion S2 shown in FIG.
Is smaller than the limit width W (good within W) and the height is substantially the same as the upper surface of the lead. In such a case, the main cause of the occurrence of the abnormal width signal portion S2 is separately investigated in advance, and the result is not a foreign substance such as metal, and there is no possibility that the two leads are electrically short-circuited. In this case, the user sets a pre-program in the personal computer 7 so as not to use the measurement data of the abnormal width signal section S2, that is, to determine the non-defective product. 8 is displayed.

The abnormal width signal portion S2 of (b) has a signal width W1.
Is smaller than the limit width W (good within W) and the height is larger than the upper surface of the lead. In such a case, the main cause of the occurrence of the abnormal width signal portion S2 is separately investigated in advance, and if the result is a metal foreign substance such as a solder particle, the two leads may be electrically short-circuited. The measurement data of the abnormal width signal section S2 is adopted, that is, the user sets the pre-program for the limit width W and the height limit value to be higher than the heights S1 and S2 in the personal computer 7 as the condition of the defective product. The inspection is performed, and a defect display of the inspection result is displayed on the display 8.

As described above, according to the present embodiment, the inspection limit values for the height and width of the inspection of the measurement data are set in the personal computer 7, so that the defect is inevitably detected as exceeding the inspection limit value despite being a good product. Pre-programming is set in the personal computer 7 as appropriate by the user, for example, when there is a possibility that a problem may occur due to a change in diameter, etc. Since the pass / fail indication is displayed on the display 8, the inspection accuracy can be efficiently improved.

Next, a ninth embodiment of the present invention will be described. When the height on the printed circuit board 3 is measured, sampling measurement is performed at a certain number of times during the scanning period. For example, the measurement that requires 91 mSec is repeated until the 128th measurement starts from the 1st measurement, and the memory is configured so that the first 1st sampling signal is automatically canceled when the 129th sampling signal is input. Have been.

Then, the inspection limit value is set and the inspection is executed. When a large number of sampling measurements are performed, even if only one sampling measurement value exceeds the upper limit of the inspection limit value, Is set by the user to determine that the inspection limit has been exceeded, and a display of a defect in the inspection result is displayed on the display 8.

As described above, according to the present embodiment, the inspection limit value is set in the personal computer 7 in units of sampling measurement so as to increase the resolution of the inspection dimension, so that the inspection accuracy can be improved. Next, a tenth embodiment of the present invention will be described.
When the dimensions on the printed circuit board 3 are measured, the XYZ table 4 is moved with respect to the optical head 1 by the setting of the above-mentioned pre-program, and the laser beam is scanned by this. The measurement data is taken into the personal computer 7, measurement information processing is performed, and the measurement result is output and displayed on the display 8.

When a series of predetermined measurements are completed, the XYZ table 4 prepares to start measuring a new work (printed circuit board 3), for example, the origin, for example, the reference land pad. The user sets the pre-program so that the origin is determined at the position and the XYZ table 4 is moved to the origin to perform the origin return.

According to the present embodiment, since the home return pre-program is set in the personal computer 7, it is possible to eliminate the waste of the measurement preparation time and to improve the efficiency of the measurement time. Next, eleventh, twelfth, and thirteenth embodiments of the present invention will be described. When the dimensions on the printed circuit board 3 are measured, the movement of the XYZ table 4 with respect to the optical lid 1 is automatically performed as a series of measurement operations by the setting of the pre-program described above. The measurement data is taken into the personal computer 7, the measurement information processing is performed, and the measurement result is displayed on the display 8.
Is displayed on the screen and the origin is returned.

As described above, in addition to the automatic measurement operation, a pre-program for manual operation in which the measurement operation is manually performed is added, so that the measurement position can be arbitrarily selected. In addition, the measurement result is output and displayed on the display 8, and in the case of a failure, based on the memory of the personal computer 7,
The above-described pre-program setting is performed so that which part of the measured object is defective is displayed on the display 8 by the XY coordinates of the printed circuit board or the figure of the member.

As described above, by adding the pre-program so that the defective part of the measured object is automatically displayed on the display, it is possible to efficiently proceed to the next action. In addition, the measurement result is output and displayed on the display 8. In response to this defect, as another operation, a marking brush (not shown) held by a SCARA robot arm or the like is provided on a fixed portion of the XYZ table 4, and the XYZ table is provided. The pre-program is set in the personal computer 7 so that the marking 4 is performed directly with the marking brush on the malfunctioning part of the measured object in cooperation with the SCARA robot arm 4 when the malfunction is detected.

As described above, according to the present embodiment, the defective portion of the measured object is displayed on the display, and the measured object is directly marked with a marking brush, so that quality control and quick and accurate processing of the defective product are performed. It becomes possible.

[0052]

As described in detail above, according to the present invention, an operation program with a high degree of freedom can be set, so that a wide range of selection items such as various inspection items and inspection limit values can be set, and quick inspection can be performed. A highly accurate and inexpensive printed circuit board inspection apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a configuration of an embodiment of the present invention.

FIG. 2 is a diagram illustrating an example of a printed circuit board on which a QFP is mounted.

FIG. 3 is an explanatory diagram of measurement of a height t1 of a reference land pad.

FIG. 4 is a diagram showing a measurement signal waveform due to a tilt of a substrate in a scanning section.

FIG. 5 is a diagram showing a positional relationship between a scanning speed and an object to be measured.

FIG. 6 shows an example of a result of correcting a tilt of a substrate and a prescribed value of a lead height.

FIG. 7 is a diagram showing a measurement signal waveform in a state where leads are missing.

FIG. 8 is a view showing a partial lack of measurement data.

FIG. 9 is a diagram showing an abnormal width of measurement data.

[Explanation of symbols]

 1 Optical head 2 Measurement object (QFP) 3 Printed circuit board 4 XYZ table 5 Laser control unit 6 · A / D converter 7 · · · · PC 8 · · · display

Claims (11)

[Claims] 1. A measuring means for irradiating a laser beam from above a component mounting surface of a printed circuit board, measuring a height of a predetermined portion of the member, and outputting measurement data, and measuring the height along a component mounting surface of the printed circuit board. A substrate inspecting apparatus comprising: a scanning unit that scans a laser beam; an information processing unit that performs information processing of measurement data from the measuring unit; and a display unit that displays an information processing result of the information processing unit. A reference measurement unit configured to irradiate the laser beam onto a reference portion provided on the printed circuit board before measurement of the substrate, and measure the measurement data according to the measurement result measured by the reference measurement unit for the information processing. And a reference value setting unit that outputs the reference reference value to the information processing unit. 2. The method according to claim 1, wherein the measuring unit measures a measurement range for each predetermined scanning distance of the laser beam, and the information processing unit measures measurement data at both end measurement points near both ends of the measurement range. 2. The board inspection apparatus according to claim 1, further comprising: a slope correction unit that calculates tilt correction data representing the tilt of the printed circuit board component mounting surface from the distance between the two measurement points and corrects the measurement data. 3. The scanning means scans the laser beam at a constant speed, and the inclination correction means calculates a distance between the measurement points at both ends from a difference in measurement time at the measurement points at both ends. The substrate inspection apparatus according to claim 2, wherein the inspection is performed. 4. A defect display means for displaying a defect of the printed circuit board on the display means when a height of the member deviates from a predetermined non-defective range as a result of the information processing by the information processing means. 4. The substrate inspection apparatus according to claim 1, further comprising a non-defective range setting means for setting a range. 5. An identical shape detecting means for detecting a part having the same shape based on the measurement data; a counting means for counting the number of identical shaped parts detected by the same shape detecting means; 2. The apparatus according to claim 1, further comprising: a failure display unit configured to display a failure of the printed circuit board when the determined number does not match a predetermined reference number; and a reference number setting unit configured to set the reference number. The substrate inspection device according to claim 2 or 3. 6. An interpolating means for interpolating the measured data with the measured data before or after the measured data, when the measured data from the measuring means is data indicating data of a predetermined height or less. The substrate inspection apparatus according to claim 1, 2, 3, or 4, wherein 7. Interpolation processing means for interpolating the measurement data with the measurement data before or after the measurement data when the measurement data from the measurement means is continuously at a predetermined height or less for a predetermined scanning distance or less. 5. The board inspection apparatus according to claim 1, wherein the board inspection apparatus comprises: 8. A failure display means for displaying a failure of the printed circuit board when the measurement data from the measurement means is continuously at a predetermined height or less for a predetermined scanning distance or less. The substrate inspection apparatus according to claim 1, 2, 3, or 4. 9. A failure display means for displaying a failure of the printed circuit board on the display means when a result of information processing by the information processing means indicates that a width of a predetermined portion of the member deviates from a predetermined acceptable range. 4. The substrate inspection apparatus according to claim 1, further comprising: a non-defective range setting unit configured to set the non-defective range. 10. When the information processing by the information processing means detects a defect on the printed circuit board, the display means includes a defective position display means for displaying a defective position on the printed circuit board. Claim 1
The substrate inspection apparatus according to claim 9. 11. A marking means for marking a defective position on the printed circuit board when a defect on the printed circuit board is detected as a result of the information processing by the information processing means. The substrate inspection apparatus according to claim 9.