JPH0972939A - Board measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to measure electric performances stably even under the condition, wherein vibration is applied on a board, by inserting the tip part of a probe pin into a through-hole provided in a printed wiring board, and bringing the tip part into contact electrically. SOLUTION: A board 50 to be measured is positioned and fixed at a lower board holder 40, which is fixed to a shaker. Then, an upper pin holder 20 is mounted and positioned on the board holder 40. The pin holder 20 is screwed and fixed to the board holder 40 by a fixing screw 45. Then, the board holder 40 is vibrated with a shaker, the board 50 is conducted under the condition, wherein the specified vibration is applied on the board 50, and the electric performances are measured. Thus, a tapered part 32 of a tip 32 of a probe pin 30 is inserted into a through hole 53 at the measuring point, and the tapered part 32 is compressed to the outer surface of the through hole 53 under the line contact condition. Therefore, even if the electric measurement is taken under the condition wherein the vibration is applied on the board 50, the stable measurement can be taken without the disengagement of the contact state at the measuring point. Thus, the efficiency of the measuring work can be achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for measuring electric characteristics of a printed wiring board, and more particularly to a device for measuring a board suitable for measurement in a state where vibration is applied to the board.

[0002]

2. Description of the Related Art Conventional board measuring devices include, for example, board or product measuring devices used for acceleration sensors mounted on automobiles. The measuring device needs to measure the electrical characteristics of the substrate or the product in use. Therefore, measurement is performed with a predetermined vibration or shock applied to the substrate or the product, and adjustment work is performed as necessary. A conventional substrate measuring device will be described below with reference to FIG.

FIG. 3 is a diagram of a substrate measuring device, (a) is a top view showing the structure of the substrate measuring device, and (b) is a side view. The board holder 80 holds a board 90 or a product, and is a connector 82 for connecting to the output terminal of the board 90 or the product.
And the screws 8 for mounting the substrate 90 or the product
A screw hole 81 into which 5 is screwed, a mounting hole (not shown) to the vibrator, and the like are formed. The substrate holder 80 is made of metal such as aluminum and is formed by a milling machine or the like.

A lead wire (for example, a vinyl electric wire) 95 is electrically connected to the substrate 90 or an output terminal of the product, and the substrate 9
0 or product measurement information is transmitted to the measuring device. The board 90 is a board to be measured on which electronic components (not shown) and the like are mounted, and a circuit is formed on the board 90 by a conductor (eg, copper). Further, the surface of the substrate 90 is provided with a surface protective film (for example, over glass) or the like. The substrate 90 is fixed to the chassis 91.

Next, the measurement of the substrate will be described. First, the substrate 90 to be measured is positioned and fixed to the substrate holder 80 fixed to the vibrator. Next, the substrate holder 80 is vibrated by a shaker, and the substrate 90 is energized in a state where a predetermined vibration is applied to the substrate 90 to measure the electrical performance. Then, adjustment is made as necessary.

[0006]

However, in the above-mentioned board measurement, since the electrical performance measurement and the adjustment work are performed one by one, the overall work efficiency becomes poor. In order to improve the efficiency of these measurement and adjustment work, the substrate 9
It is possible to form a test pattern in the middle of the pattern formed on the surface of No. 0, press the probe pin of the electric conductor into pressure contact with the test pattern, and perform the electrical performance measurement and adjustment work in a state where the substrate 90 is bound into a plurality of sheets. Conceivable. However, when measuring electrical performance in a state where vibration is applied to a large number of printed wiring boards, the tip of the probe pin elastically pressed against the test pattern on the board surface makes point contact, so When vibration is applied, the tip of the probe pin may come off from the test pattern and the measurement may become unstable.

Therefore, the present invention solves the above-mentioned problems, and an object of the present invention is to provide a substrate measuring apparatus capable of performing stable electrical performance measurement even in a state where vibration is applied to a printed wiring board with a large number of sheets. And

[0008]

SUMMARY OF THE INVENTION The present invention achieves the above-mentioned object, and a substrate measuring device for measuring the electrical characteristics of a printed wiring board by pressing a probe pin against the test pattern and measuring the electrical characteristics of the board. In, there is an urging means for elastically urging the probe pin in the contact direction, and the tip end portion of the probe pin is inserted into a test pattern made of a through hole provided in the printed wiring board to elastically It is characterized by being brought into contact with.

Further, the probe pin is elastically abutted from both sides of the through hole.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a sectional view of an essential part of a substrate measuring apparatus showing a first embodiment of the present invention. 10 is a substrate 5 on which electronic components and the like are mounted
This is a substrate measuring device that electrically measures 0, and includes an upper pin holder 20, a probe pin 30, a lower substrate holder 40, a vibrator (not shown), a measuring device (not shown), and the like.

The upper pin holder 20 is for mounting the probe pin 30, and is provided on the upper portion of the substrate 50, and is located at a position facing the through hole (electrical measurement point) 53 of the substrate 50 positioned and fixed to the lower substrate holder 40. A hole 21 into which the sleeve 33 of the probe pin 30 is press-fitted, a hole 22 into which a mounting screw 45 to the lower substrate holder 40 is inserted, and the like are formed. The upper pin holder 20 is made of a metal such as aluminum and is formed by a milling machine or the like.

The probe pin 30 is a pin for coming into pressure contact with the through hole 53 of the substrate 50 to take out an electrical signal (current, voltage), and is composed of a pin 31, a sleeve 33, a spring 34, etc. It is inserted into the inner diameter of the sleeve 33 and is elastically held by the spring 34.
The outer shape of the pin 31 is larger than the hole diameter of the through hole of the substrate 50, and the tip portion 32 is formed in a needle shape so as to be inserted into the through hole. The tip portion 32 is hardened and used to prevent abrasion. A conductive steel material or the like is used for the material of the pin 31.

The sleeve 33 is cylindrical and has an inner diameter such that the pin 31 is inserted therethrough and slides, and a screw portion 00 for screwing and fixing a spring 34 is formed at an outer peripheral end portion (upper part of the drawing). Has been done. An insulating resin material is used as the material of the sleeve 33. If the other member into which the sleeve 33 is press-fitted is electrically insulating, a conductive material such as brass may be used.

The lower substrate holder 40 holds the substrate 50. The positioning portion 41 of the substrate 50 and the upper pin holder 2 are provided.
A screw hole 42 into which a screw 45 for mounting 0 is screwed, a mounting hole (not shown) to the vibrator, and the like are formed. Further, an insulating plate (for example, a resin plate) is provided on the contact surface with the lower surface of the substrate 50.
43 is fixed. The lower substrate holder 40 is made of a metal such as aluminum and is formed by a milling machine or the like.

A lead wire (for example, a vinyl electric wire) 35 is electrically connected to the upper end of the pin 31 of the probe pin 30 and transmits the measurement information of the substrate 50 to the measuring instrument. Board 50
Is a substrate to be measured on which electronic parts (not shown) etc. are mounted,
A circuit is formed by a conductor (for example, copper) 51 on the substrate 50, and a through hole 53 for measuring electrical performance is formed at a main part of the circuit. Also, the substrate 50
A surface protective film (for example, over glass) or the like is applied to the surface excluding the through holes 53.

Next, the measurement of the substrate will be described. First, the substrate 50 to be measured is positioned and fixed to the lower substrate holder 40 fixed to the vibrator. Next, the upper pin holder 2
0 is placed on the lower substrate holder 40 and positioned, and the upper pin holder 20 is fixed by the fixing screw 45.
And fix it with screws. Next, the lower substrate holder 40 is vibrated by a vibration exciter, and the substrate 50 is energized while a predetermined vibration is applied to measure the electrical performance. Then, adjustment is made as necessary.

As described above, according to this embodiment,
The tip taper portion 32 of the pin 31 of the probe pin 30 is inserted into the through hole 53 at the measurement point, and the tip taper portion 32 of the pin 31 is press-contacted to the outer periphery of the through hole 53 in a line contact state. Even if electrical measurement is performed in a state where vibration is applied to the substrate 50, stable measurement can be performed without the contact state of the measurement point being deviated. Therefore, it is possible to measure without splitting a large number of substrates,
The efficiency of measurement work can be improved.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a sectional view of an essential part of a substrate measuring apparatus showing a second embodiment of the present invention. The second embodiment is a modification of the lower substrate holder of the first embodiment. Since the other parts are substantially the same as those of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted.

Reference numeral 60 denotes a lower pin holder for mounting the probe pin 30 which comes into pressure contact with the through hole 53 from the lower side of the substrate 50, and is located at a position facing the through hole 53 of the substrate 50 positioned by the positioning portion 62 of the substrate 50. A hole 61 into which the sleeve 33 of the probe pin 30 is press-fitted, a screw hole 63 into which the screw 45 for mounting the upper pin holder 20 is screwed, and a mounting hole (not shown) to the vibrator are formed. The lower pin holder 60 is made of metal such as aluminum and is formed by a milling machine or the like.

Next, the measurement of the substrate will be described. First, the substrate 50 to be measured is placed on the positioning portion 62 of the lower pin holder 60 fixed to the vibrator. Next, the upper pin holder 20 is placed on the lower pin holder 60, the positioned substrate 50 is sandwiched, and the upper pin holder 20 is screwed and fixed to the lower pin holder 60 by the fixing screw 45. Next, the lower pin holder 60 is vibrated by a shaker, and the substrate 5
With a predetermined vibration applied to 0, the substrate 50 is energized and the electrical performance is measured. Then, adjustment is made as necessary.

As described above, also in the second embodiment, it is possible to perform efficient and stable electrical measurement as in the first embodiment. Moreover, since the measurement can be performed with the probe pin 30 pressed against the upper and lower surfaces of the through hole 53 at the measurement point, the stability of the measurement is further enhanced.

[0022]

As described above, according to the present invention, it is possible to stably measure the electrical performance even in a state where vibration is applied to a multi-sheet board. Therefore, the efficiency of the electrical performance measurement work can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part of a substrate measuring device showing a first embodiment of the present invention.

FIG. 2 is a sectional view of an essential part of a substrate measuring apparatus showing a second embodiment of the present invention.

3A and 3B are views of a conventional substrate measuring device, FIG. 3A is a top view showing the configuration of the substrate measuring device, and FIG. 3B is a side view.

[Explanation of symbols]

 10, 70 ... Board measurement device 20 ... Upper pin holder 30 ... Probe pin 31 ... Pin 32 ... Pin tip taper portion 33 ... Sleeve 34 ...・ ・ ・ Spring 35 ・ ・ ・ ・ ・ Lead wire 40 ・ ・ ・ Lower board holder 41 ・ ・ ・ Board positioning part 400 ・ ・ ・ ・ Insulator 50 ・ ・ ・ Board 51 ・ ・ ・..Conductor 53..through hole 60..lower pin holder 62..board positioning fixing part

Claims (2)

[Claims] 1. A substrate measuring device for measuring the electrical characteristics of a substrate by press-contacting the probe pin with a test pattern provided on a printed wiring board, wherein the probe pin is elastically biased in the contact direction. A substrate measuring device having a biasing means, wherein a tip portion of the probe pin is inserted into a test pattern formed of a through hole provided on the printed wiring board and elastically brought into contact therewith. 2. The substrate measuring device according to claim 1, wherein the probe pin is elastically brought into contact with both sides of the through hole.