JPH0964076A - Sealing board of ic chip and sealing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the sealing board of an IC chip, the method of sealing and a sealing device with high productivity by providing a sealing material sucking hole through which the sealing material applied around the IC chip mounted on a mounting position is sucked and filling the gap between the IC chip and the sealing board with the sucked sealing material. SOLUTION: A sealing material applying means 14, which moves in the direction of X, Y and Z relatively to a sealing stage 13, applies sealing material 15 around an IC chip 11 mounted on a sealing board 12. The sealing material sucking means 16 sucks the sealing material 15 applied to the IC chip 11 through a sealing material sucking through hole 12a and sealing material sucking hole 13b, and fills the gap between the IC chip 11 and the sealing board 12 with the sucked sealing material 15 by force. Therefore, the productivity is improved drastically compared with the case before of flowing the sealing material into the gap between the IC chip and the board with the help of the inclination of the sealing board for a long time of 10 minutes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of sealing an IC chip in a flip chip mounting process and its substrate.

[0002]

2. Description of the Related Art MCM using flip-chip mounting process or flip-chip mounting, which has recently been in the limelight
In the (multi-chip module) mounting process, as a sealing method performed after mounting the IC chip, a method shown in FIG. 5 has been generally used.

In FIG. 5, in the conventional sealing method, an IC chip 2 is mounted on a block 1 which is heated to a predetermined temperature, for example 60 ° C., and is inclined at a predetermined angle θ, for example 15 ° with respect to a horizontal plane. The fixed substrate 3 is adsorbed and fixed, and the sealing material (epoxyphenol resin) 5 is attached to the IC by the dispenser 4.
The sealing material 5 is applied to the upper side portion 2a of the chip 2, and the sealing material 5 flows between the IC chip 2 and the substrate 3 at an inclination of 15 ° for sealing.

[0004]

However, in the configuration of the above-mentioned conventional example, since the sealing is performed by the flow of the sealing material due to the inclination, the sealing time is long and it takes about 10 minutes to seal one IC chip. There is a problem that productivity is low. In order to increase the production amount, it is necessary to increase the number of stages for the sealing work, which leads to a problem of high equipment cost.

An object of the present invention is to solve the above problems and provide a highly productive IC chip sealing substrate, a sealing method and a sealing device.

[0006]

In order to solve the above problems, an IC chip sealing substrate according to the first invention of the present application is mounted at the IC chip mounting position of the sealing substrate on which the IC chip is flip-chip mounted. A sealing material suction hole for sucking the sealing material applied to the periphery of the IC chip mounted at a position and filling the gap between the IC chip and the sealing substrate with the sucked sealing material is provided. And

The IC chip sealing substrate of the second invention of the present application is
In order to solve the above-mentioned problems, a sealing material that seals the IC chip mounted at the mounting position is provided at the IC chip mounting position of the sealing substrate on which the IC chip is flip-chip mounted.
A sealing material injection hole for injecting into the gap between the C chip and the sealing substrate is provided.

An IC chip sealing method according to the third invention of the present application is as follows:
In order to solve the above problems, a sealing material suction hole is provided at an IC chip mounting position of a sealing substrate on which an IC chip is flip-chip mounted, the IC chip is mounted at the mounting position, and a peripheral edge of the mounted IC chip Apply the sealing material to the IC
The applied sealing material is sucked from the sealing material suction hole on the back side of the sealing substrate surface on which the chip is mounted, and the gap between the IC chip and the sealing substrate is filled with the sucked sealing material. It is characterized by

An IC chip sealing method according to the fourth invention of the present application is
In order to solve the above problems, a sealing material injection hole is provided at an IC chip mounting position of a sealing substrate on which an IC chip is flip-chip mounted, the IC chip is mounted at the mounting position, and a seal on which the IC chip is mounted is sealed. A sealing material is injected through the sealing material injection hole on the back side of the stop substrate surface, and the gap between the IC chip and the sealing substrate is filled with the injected sealing material.

An IC chip sealing device according to the fifth invention of the present application is
In order to solve the above-mentioned problems, a holding means for holding a sealing substrate on which an IC chip is flip-chip mounted and a sealing material suction provided in accordance with a sealing material suction hole at the IC chip mounting position of the sealing substrate. A sealing stage having a through hole, a sealing material applying means for applying a sealing material to the periphery of the IC chip mounted on the sealing substrate, the sealing material suction through hole and the sealing material suction hole And a sealing material suction means for sucking the sealing material applied to the peripheral edge of the IC chip through the above and filling the gap between the IC chip and the sealing substrate with the sucked sealing material. And

The IC chip sealing apparatus according to the sixth aspect of the present invention is
In order to solve the above problems, a holding means for holding a sealing substrate on which an IC chip is flip-chip mounted and a sealing material injection provided in conformity with a sealing material injection hole at the IC chip mounting position of the sealing substrate. A sealing stage having a through hole; a sealing material is injected through the sealing material injection through hole and the sealing material injection hole; and the gap between the IC chip and the sealing substrate is injected by the sealing. And a sealing material injecting means for filling with a material.

[0012]

The sealing substrate for the IC chip of the first invention of the present application, the method of sealing the IC chip of the third invention of the present application, and the I of the fifth invention of the present application
The C-chip sealing device includes a sealing substrate having a sealing material suction hole at a position where an IC chip is to be flip-chip mounted, and a sealing stage that holds the sealing substrate and the sealing unit. A sealing material suction through hole provided in accordance with the sealing material suction hole at the IC chip mounting position of the stop substrate, and the sealing material applying means is provided on the periphery of the IC chip mounted on the sealing substrate. A sealing material is applied, and a sealing material suction means sucks the sealing material applied to the peripheral edge of the IC chip through the sealing material suction through hole and the sealing material suction hole to suck the IC chip and the IC chip. Since the gap between the sealing substrates is forcibly filled with the sucked sealing material, in the conventional example, the inclination of the sealing substrate is used and the sealing material is used for a long time of about 10 minutes. Compared with pouring into the gap between the sealing substrate and the sealing substrate, the productivity is greatly improved.

An IC chip sealing substrate according to the second invention of the present application,
According to the IC chip sealing method of the fourth invention of the present application and the IC chip sealing device of the sixth invention of the present application, the sealing substrate has a sealing material injection hole at a position where the IC chip is to be flip-chip mounted. A sealing stage having a holding means for holding the sealing substrate and a sealing material injection through hole provided in accordance with a sealing material injection hole at an IC chip mounting position of the sealing substrate, Since the material injecting means injects the encapsulating material through the encapsulating material injecting through hole and the encapsulating material injecting hole, the gap between the IC chip and the encapsulating substrate is forcibly filled with the encapsulating material. In the conventional example, the productivity is significantly improved as compared with the case where the inclination of the sealing substrate is used and the sealing material is poured into the gap between the IC chip and the substrate for a long time of about 10 minutes.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of an IC chip sealing device using the IC chip sealing substrate and the IC chip sealing method of the present invention will be described with reference to FIGS.

In FIGS. 1 and 2, an IC chip 11 is flip-chip mounted on a sealing substrate 12. The sealing substrate 12 has a sealing material suction hole 12a at a position where the IC chip 11 is to be flip-chip mounted, and the sealing stage 13 is
An adsorption groove 13a for adsorbing and holding a substrate on which an IC chip is to be flip-chip mounted and a sealing material suction through hole 13b provided so as to match the sealing material suction hole 12a at the IC chip mounting position of the sealing substrate 12 are provided. The encapsulant applying means 14 having the encapsulating stage 13 and capable of moving relative to the encapsulation stage 13 in the XYZ directions applies the encapsulant 15 to the peripheral edge of the IC chip 11 mounted on the encapsulation substrate 12 and sucks the encapsulant Means 16 pass through the sealing material suction through hole 12a and the sealing material suction hole 13b to the IC
Since the sealing material 15 applied to the chip 11 is sucked and the gap between the IC chip 11 and the sealing substrate 12 is forcibly filled with the sucked sealing material 15, the conventional sealing substrate is used. The productivity is greatly improved as compared with the case where the sealing material is poured into the gap between the IC chip and the substrate by taking advantage of the inclination of 10 for a long time of about 10 minutes.

In this case, the sealing material 15 is applied to the entire IC chip 11 in FIG. 2, but as described above, the sealing material 1 is applied to the periphery of the IC chip 11, that is, each side of the IC chip 11.
If 5 is applied, by the suction of the sealing material suction means 16,
It is possible to forcibly fill the gap between the IC chip 11 and the sealing substrate 12 with the sealing material 15.

Further, in the present embodiment, one IC chip is mounted and sealed in the sealing substrate 12, but the number is not limited to one and, of course, a plurality of IC chips may be used.

A second IC chip sealing device using the IC chip sealing substrate and the IC chip sealing method of the present invention.
An embodiment will be described with reference to FIGS.

In FIGS. 3 and 4, the IC chip 21 is flip-chip mounted on the sealing substrate 22. And
The IC chip 21 is suction-held by the IC suction tool 26. The sealing substrate 22 has a sealing material injection hole 22a at a position where the IC chip 21 is to be flip-chip mounted,
The sealing stage 23 sucks and holds the sealing substrate 22 on which the IC chip 21 is to be flip-chip mounted by suction.
a and a sealing material injection through hole 23 provided in accordance with the sealing material injection hole 22a at the IC chip mounting position of the sealing substrate 22.
b, the sealing material injecting means 24 injects the encapsulating material 25 through the encapsulating material injecting through hole 23b and the encapsulating material injecting hole 22a so that the space between the IC chip 21 and the encapsulating substrate 22 is increased. Since the above gap is forcibly filled with the injected sealing material 25, in the conventional example, the inclination of the sealing substrate is used and the sealing material is sealed with the IC chip for a long time of about 10 minutes. Productivity is significantly improved compared to pouring into the gap between the substrates.

In this case, if the viscosity is properly adjusted by controlling the temperature of the encapsulating material, it is possible to perform sealing in parallel during flip-chip mounting.

If the vertical relationship between the IC suction tool 26 and the sealing material injecting means 24 shown in FIG. 4 is reversed, gravity acts in the injecting direction to facilitate the injection.

[0022]

The IC chip sealing substrate of the first invention, the IC chip sealing method of the third invention, and the fifth invention of the present application.
The IC chip sealing device of the invention is a device for sucking a sealing material,
Since the sealing material applied to the periphery of the IC chip is sucked and the gap between the IC chip and the sealing substrate is forcibly filled with the sucked sealing material, in the conventional example, the inclination of the sealing substrate is used, 10
Compared with pouring the encapsulant into the gap between the IC chip and the encapsulation substrate over a long quantile time, there is an effect that the productivity is significantly improved.

An IC chip sealing substrate according to the second invention of the present application,
In the IC chip sealing method of the fourth invention of the present application and the IC chip sealing device of the sixth invention of the present application, the sealing material injecting means injects the sealing material to form a gap between the IC chip and the sealing substrate. Since the injected sealing material is forcibly filled, the inclination of the sealing substrate is used in the conventional example, and the sealing material is filled with I for a long time of about 10 minutes.
Compared to pouring into the gap between the C chip and the sealing substrate,
This has the effect of significantly improving productivity.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of an IC chip sealing device using an IC chip sealing substrate and an IC chip sealing method of the present invention.

FIG. 2 is a cross-sectional view of a first embodiment of an IC chip sealing device using the IC chip sealing substrate and the IC chip sealing method of the present invention.

FIG. 3 is a perspective view of a second embodiment of an IC chip sealing device using the IC chip sealing substrate and the IC chip sealing method of the present invention.

FIG. 4 is a cross-sectional view of a second embodiment of an IC chip sealing device using the IC chip sealing substrate and the IC chip sealing method of the present invention.

FIG. 5 is a perspective view of an IC chip encapsulation device using a conventional IC chip encapsulation substrate and an IC chip encapsulation method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 IC chip 12 Encapsulation substrate 12a Encapsulation material suction hole 13 Encapsulation stage 13a Adsorption groove 13b Encapsulation material suction through hole 14 Encapsulation material applying means 15 Encapsulation material 16 Encapsulation material suction means 21 IC chip 22 Encapsulation substrate 22a Encapsulation material injection hole 23 Encapsulation stage 23a Adsorption groove 23b Encapsulation material injection through hole 24 Encapsulation material injection means 15 Encapsulation material 16 IC adsorption tool

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kohei Enji 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (6)

[Claims] 1. At the IC chip mounting position of a sealing substrate for flip-chip mounting an IC chip, the sealing material applied to the periphery of the IC chip mounted at the mounting position is sucked to suck the IC.
An IC having a sealing material suction hole for filling a gap between a chip and the sealing substrate with the suctioned sealing material.
Chip sealing substrate. 2. An IC chip mounting position of an encapsulation substrate on which an IC chip is flip-chip mounted, and an encapsulating material encapsulating the IC chip mounted at the mounting position in a gap between the IC chip and the encapsulation substrate. A sealing substrate for an IC chip, comprising a sealing material injection hole for injection. 3. A sealing material suction hole is provided at an IC chip mounting position of an encapsulation substrate on which an IC chip is flip-chip mounted, the IC chip is mounted at the mounting position, and a sealing material is provided around the mounted IC chip. Is applied, and the applied sealing material is sucked through the sealing material suction hole on the back side of the surface of the sealing substrate on which the IC chip is mounted, and the gap between the IC chip and the sealing substrate is sucked. A method for sealing an IC chip, which comprises filling with a sealing material. 4. A sealing material injection hole is provided at an IC chip mounting position of a sealing substrate on which an IC chip is flip-chip mounted, the IC chip is mounted at the mounting position, and a sealing substrate surface on which the IC chip is mounted is mounted. A method for sealing an IC chip, comprising injecting a sealing material from the sealing material injection hole on the back side and filling a gap between the IC chip and the sealing substrate with the injected sealing material. 5. A holding means for holding a sealing substrate on which an IC chip is flip-chip mounted, and a sealing material suction through hole provided in accordance with a sealing material suction hole at the IC chip mounting position of the sealing substrate. The encapsulating stage having the encapsulating material, the encapsulating material applying means for applying the encapsulating material to the periphery of the IC chip mounted on the encapsulating substrate, the encapsulating material suction through hole, and the encapsulating material suction hole. An IC chip, comprising: a sealing material suction means for sucking the sealing material applied to the periphery of the chip and filling the gap between the IC chip and the sealing substrate with the sucked sealing material. Sealing device. 6. A holding means for holding a sealing substrate for flip-chip mounting an IC chip, and a sealing material injecting through hole provided in accordance with an encapsulating material injecting hole at an IC chip mounting position of the sealing substrate. The sealing material is injected through the sealing stage having the sealing material injection through hole and the sealing material injection hole, and the gap between the IC chip and the sealing substrate is filled with the injected sealing material. An IC chip sealing device comprising: a sealing material injecting means.