JPH0963843A - Multilayer structure for integrated magnetic sensor - Google Patents
Multilayer structure for integrated magnetic sensorInfo
- Publication number
- JPH0963843A JPH0963843A JP7213872A JP21387295A JPH0963843A JP H0963843 A JPH0963843 A JP H0963843A JP 7213872 A JP7213872 A JP 7213872A JP 21387295 A JP21387295 A JP 21387295A JP H0963843 A JPH0963843 A JP H0963843A
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- Prior art keywords
- thin film
- magnetoresistive element
- magnetic field
- magnetic sensor
- curve
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は磁気センサの積層膜
構造に関し、特に異方性磁気抵抗効果を有する磁気抵抗
効果素子薄膜とＩＣ（集積回路）とをシリコンウエハ上
に集積した形態を有する磁気センサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated film structure of a magnetic sensor, and more particularly to a magnetic film having a magnetoresistive effect element thin film having an anisotropic magnetoresistive effect and an IC (integrated circuit) integrated on a silicon wafer. Regarding sensors.
【０００２】[0002]
【従来の技術】従来、この種の磁気センサを形成する磁
電変換素子、つまり磁気抵抗素子としては、連続的な折
返し構造を持つ強磁性体薄膜を接合部で直列に接続して
形成されるものがある。この磁電変換素子については、
特公昭５４−４１３３５号公報に詳述されている。2. Description of the Related Art Conventionally, a magnetoelectric conversion element forming a magnetic sensor of this type, that is, a magnetoresistive element, is formed by connecting ferromagnetic thin films having a continuous folded structure in series at a junction. There is. About this magnetoelectric conversion element,
It is described in detail in JP-B-54-41335.
【０００３】上記の磁気抵抗素子に対して、例えば磁気
記録媒体からその磁気抵抗素子を飽和させるに十分な、
しかもその素子面内で回転するような磁界が発生する場
合、磁気抵抗素子が磁気記録媒体から有限の距離を隔て
て配置されると、磁気抵抗素子からは磁気記録媒体の磁
気信号によって接続部より電気信号が出力される。Sufficient to saturate the magnetoresistive element with respect to the magnetoresistive element described above, for example from a magnetic recording medium,
In addition, when a magnetic field that rotates in the element plane is generated, if the magnetoresistive element is arranged at a finite distance from the magnetic recording medium, the magnetoresistive element is connected to the connecting portion by the magnetic signal of the magnetic recording medium. An electric signal is output.
【０００４】上記の磁気抵抗素子を製造する場合、９１
〜３８重量％のニッケル（Ｎｉ）と９〜６２重量％のコ
バルト（Ｃｏ）とからなる合金薄膜を、ある蒸着基板の
温度や膜厚、及び熱処理温度等で成膜する方法がある。
この方法については、特開昭５８−１３５６８８号公報
に詳述されている。When manufacturing the above magnetoresistive element, 91
There is a method of forming an alloy thin film composed of nickel (Ni) of 38% by weight and cobalt (Co) of 9 to 62% by weight at a certain vapor deposition substrate temperature, film thickness, heat treatment temperature and the like.
This method is described in detail in JP-A-58-135688.
【０００５】[0005]
【発明が解決しようとする課題】上述した従来の磁気セ
ンサでは、磁気抵抗素子薄膜が持つ磁歪特性が全く考慮
されておらず、磁気抵抗素子薄膜上に形成されるパッシ
ベーションが与える応力、あるいは通常パッケージング
で用いられるモールド成形の際に加わる圧縮や引張り等
の外的応力が全く考慮されていない。In the above-mentioned conventional magnetic sensor, the magnetostrictive characteristic of the magnetoresistive element thin film is not taken into consideration at all, and the stress given by the passivation formed on the magnetoresistive element thin film or the normal package is used. External stresses such as compression and tension applied during molding used in molding are not considered at all.
【０００６】そのため、それらの応力によって影響を受
ける磁気抵抗素子薄膜の磁歪特性が、最終的に磁電変換
処理やパルス信号への変換後の出力信号に影響を与える
こととなる。Therefore, the magnetostrictive characteristics of the magnetoresistive element thin film, which are affected by those stresses, finally affect the output signal after magnetoelectric conversion processing or conversion into pulse signals.
【０００７】すなわち、磁歪という特性を有する磁気抵
抗素子薄膜に対して外的な応力が加わることで、異方性
あるいは飽和磁界等の対磁気特性が影響を受け、それら
が応力によって歪められるので、理想状態とは異なる磁
気抵抗素子の出力波形によって最終的にＩＣ部分から出
力される信号に影響がでる。具体的には気体や液体等の
流量を計測するための回転マグネットの回転数検出の際
にデューティのアンバランス等の現象として現れること
が多い。That is, when an external stress is applied to a magnetoresistive element thin film having a characteristic called magnetostriction, magnetic characteristics such as anisotropy or a saturation magnetic field are affected and they are distorted by the stress. The output waveform of the magnetoresistive element different from the ideal state finally affects the signal output from the IC portion. Specifically, it often appears as a phenomenon such as duty imbalance when detecting the rotation speed of a rotating magnet for measuring the flow rate of gas or liquid.
【０００８】そこで、本発明の目的は上記の問題点を解
消し、最終的にＩＣ部分から出力される信号の波形を任
意に制御することができる磁気センサの積層膜構造を提
供することにある。Therefore, an object of the present invention is to solve the above problems and provide a laminated film structure of a magnetic sensor capable of arbitrarily controlling the waveform of a signal finally output from the IC portion. .
【０００９】[0009]
【課題を解決するための手段】本発明による磁気センサ
の積層膜構造は、チップ上に異方性磁気抵抗効果を有す
る磁気抵抗効果素子薄膜を形成してなる磁気センサの積
層膜構造であって、前記チップ上にパッシベーションと
して形成されかつ前記磁気抵抗効果素子薄膜の出力特性
に応じて前記磁気抵抗効果素子薄膜に圧縮応力を付与す
る工法及び前記磁気抵抗効果素子薄膜に引張り応力を付
与する工法のうちのいずれかの工法で形成される保護膜
を備えている。A laminated film structure of a magnetic sensor according to the present invention is a laminated film structure of a magnetic sensor formed by forming a magnetoresistive element thin film having an anisotropic magnetoresistive effect on a chip. A method of applying compressive stress to the magnetoresistive effect element thin film according to the output characteristics of the magnetoresistive effect element thin film formed as passivation on the chip, and a method of applying tensile stress to the magnetoresistive effect element thin film It has a protective film formed by one of these methods.
【００１０】[0010]
【発明の実施の形態】まず、本発明の作用について以下
に述べる。First, the operation of the present invention will be described below.
【００１１】磁気抵抗素子薄膜の元来の外部磁界（Ｒ−
Ｈ）特性と磁気発生媒体との組合せとなるアプリケーシ
ョンにおいて望まれるパルス波形あるいは最適なパルス
波形を得るために、集積化磁気センサの積層膜の最終形
成膜であるパッシベーション膜の形成工法をスパッタリ
ング工法及び常圧ＣＶＤのうちから選択する。The original external magnetic field (R-
H) In order to obtain a desired pulse waveform or an optimum pulse waveform in an application that is a combination of the characteristics and the magnetic generation medium, the formation method of the passivation film, which is the final formation film of the laminated film of the integrated magnetic sensor, is used as a sputtering method and Select from atmospheric pressure CVD.
【００１２】これによって、強磁性体薄膜で生成される
磁気抵抗素子薄膜自体の成膜及び加工工程が終了した後
でも、最終製品形態の集積化磁気センサとしての外部交
番磁界、例えば羽根車状の磁気媒体が作り出す回転磁界
検出におけるＩＣ部分からの出力パルス波形（例えば、
デューティ比）を任意に制御可能となる。As a result, even after the film forming and processing steps of the magnetoresistive element thin film itself formed of the ferromagnetic thin film are completed, an external alternating magnetic field as an integrated magnetic sensor in the final product form, for example, an impeller-like magnetic field is formed. Output pulse waveform from the IC part in detecting the rotating magnetic field generated by the magnetic medium (for example,
The duty ratio) can be controlled arbitrarily.
【００１３】次に、本発明の一実施例について図面を参
照して説明する。図１は本発明の一実施例の断面図であ
る。図において、本発明の一実施例による集積化磁気セ
ンサは拡散層１上にアルミニウム（Ａｌ）電極２と、ス
ピンオングラス（ＳＯＧ）３と、絶縁層４と、磁気抵抗
素子薄膜５と、導体膜６と、パッシベーション膜７とを
積層して構成されている。ここで、スピンオングラス３
は急峻な段差部を解消するために用いられている。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of an embodiment of the present invention. In the figure, an integrated magnetic sensor according to an embodiment of the present invention shows an aluminum (Al) electrode 2, a spin-on-glass (SOG) 3, an insulating layer 4, a magnetoresistive element thin film 5, and a conductor film on a diffusion layer 1. 6 and a passivation film 7 are laminated. Where spin on glass 3
Is used to eliminate a steep step.
【００１４】磁気抵抗素子薄膜５はアルミニウム電極２
との間でオーミックコンタクト（Ｏｈｍｉｃ ｃｏｎｔ
ａｃｔ：オーム接触）が形成されている。磁気抵抗素子
薄膜５はＮｉ85Ｆｅ15の場合に磁歪定数として約−８×
１０-6程度の数値を、またＮｉ82Ｆｅ12Ｃｏ6 の場合に
磁歪定数として約＋１．８×１０-6程度の数値を夫々示
す。The magnetoresistive element thin film 5 is an aluminum electrode 2
Ohmic contact with
(act: ohmic contact) is formed. In the case of Ni85Fe15, the magnetoresistive element thin film 5 has a magnetostriction constant of about −8 ×.
Numerical values of about 10 −6 and, in the case of Ni 82 Fe 12 Co 6 , a magnetostriction constant of about + 1.8 × 10 −6 are shown.
【００１５】パッシベーション膜７は、通常、ＳｉＯ2
等の無機質の薄膜が用いられ、磁気抵抗素子薄膜５や導
体膜６の上に積層される。パッシベーション膜７の形成
方法としてスパッタリング工法を用いた場合には磁気抵
抗素子薄膜５に圧縮応力が付加される。The passivation film 7 is usually SiO2.
An inorganic thin film such as is used and is laminated on the magnetoresistive element thin film 5 and the conductor film 6. When the sputtering method is used as the method of forming the passivation film 7, compressive stress is applied to the magnetoresistive element thin film 5.
【００１６】磁気抵抗素子薄膜５が正の磁歪定数を有す
るＮｉ82Ｆｅ12Ｃｏ6 の場合にスパッタリング工法を用
いると、逆磁歪効果によって素子面法線方向に異方性が
分散され、その結果として外部磁界と抵抗値との関係を
示すＲ−Ｈ曲線において飽和電界が大きな方向に変化
し、特に低磁界側におけるＲ−Ｈ曲線がなだらかとな
る。つまり、磁界強度の変化に対応する抵抗値変化の割
合ΔＲ／ΔＨが小さい方向に変化する。If the sputtering method is used when the magnetoresistive element thin film 5 is Ni82Fe12Co6 having a positive magnetostriction constant, the anisotropy is dispersed in the direction normal to the element surface by the inverse magnetostriction effect, and as a result, the external magnetic field and the resistance value are obtained. In the R-H curve showing the relationship with, the saturation electric field changes in a large direction, and the R-H curve becomes gentle especially on the low magnetic field side. That is, the rate of change in resistance value ΔR / ΔH corresponding to the change in magnetic field strength changes in the smaller direction.
【００１７】一方、パッシベーション膜７の形成方法と
して常圧ＣＶＤ（ＣｈｅｍｉｃａｌＶａｐｏｒ Ｄｅｐ
ｏｓｉｔｉｏｎ：化学気相成長法）を用いた場合には磁
気抵抗素子薄膜５に引張り応力が付加される。この場合
には素子面内にて異方性が分散されるので、その結果と
して外部磁界と抵抗値との関係を示すＲ−Ｈ曲線におい
て磁界強度の変化に対応する抵抗値変化の割合ΔＲ／Δ
Ｈが若干大きな方向に変化する。On the other hand, as a method for forming the passivation film 7, atmospheric pressure CVD (Chemical Vapor Dep) is used.
position: chemical vapor deposition method), tensile stress is applied to the magnetoresistive element thin film 5. In this case, since the anisotropy is dispersed in the element plane, the rate of change in resistance value corresponding to the change in magnetic field strength ΔR / Δ
H changes in a slightly larger direction.
【００１８】磁気抵抗素子薄膜５が負の磁歪定数を有す
るＮｉ85Ｆｅ15の場合には上記の関係が全く正反対の特
性を示すことになる。In the case where the magnetoresistive element thin film 5 is Ni85Fe15 having a negative magnetostriction constant, the above-mentioned relationship shows the opposite characteristics.
【００１９】図２は図１の磁気抵抗素子薄膜５の出力変
動に及ぼす組成材料とパッシベーション膜７の形成工法
との組合せの対応関係を示す図である。図において、矢
印は磁界強度の変化に対応する抵抗値変化の割合ΔＲ／
ΔＨが変動する方向を示している。FIG. 2 is a diagram showing a correspondence relationship of a combination of a composition material and a forming method of the passivation film 7 which affects the output fluctuation of the magnetoresistive element thin film 5 of FIG. In the figure, the arrow indicates the rate of change in resistance value corresponding to the change in magnetic field strength ΔR /
The direction in which ΔH fluctuates is shown.
【００２０】すなわち、Ｎｉ85Ｆｅ15の場合にはスパッ
タリング工法を用いると抵抗値変化の割合ΔＲ／ΔＨは
やや上方に変動するが、常圧ＣＶＤを用いると抵抗値変
化の割合ΔＲ／ΔＨは大きく下方に変動する。That is, in the case of Ni85Fe15, the resistance change rate ΔR / ΔH fluctuates slightly upward when the sputtering method is used, but the resistance change rate ΔR / ΔH fluctuates greatly downward when the atmospheric pressure CVD is used. To do.
【００２１】また、Ｎｉ82Ｆｅ12Ｃｏ6 の場合にはスパ
ッタリング工法を用いると抵抗値変化の割合ΔＲ／ΔＨ
はやや下方に変動し、常圧ＣＶＤを用いると抵抗値変化
の割合ΔＲ／ΔＨはやや上方に変動する。In the case of Ni82Fe12Co6, the rate of change in resistance value ΔR / ΔH is obtained by using the sputtering method.
It changes slightly downward, and when atmospheric pressure CVD is used, the rate of change in resistance value ΔR / ΔH changes slightly upward.
【００２２】図３及び図４は図１の磁気抵抗素子薄膜５
の磁界と抵抗値との関係を示すＲ−Ｈ曲線に対する入力
交番磁界と出力信号との関係を示す図である。図３は磁
気抵抗素子薄膜５がＮｉ82Ｆｅ12Ｃｏ6 の場合のＲ−Ｈ
曲線に対する入力交番磁界と出力信号との関係を示し、
図４は磁気抵抗素子薄膜５がＮｉ85Ｆｅ15の場合のＲ−
Ｈ曲線に対する入力交番磁界と出力信号との関係を示し
ている。3 and 4 show the magnetoresistive element thin film 5 of FIG.
FIG. 5 is a diagram showing a relationship between an input alternating magnetic field and an output signal with respect to an RH curve showing a relationship between the magnetic field and the resistance value of FIG. FIG. 3 shows RH when the magnetoresistive element thin film 5 is Ni82Fe12Co6.
Shows the relationship between the input alternating magnetic field and the output signal for the curve,
Fig. 4 shows R- when the magnetoresistive element thin film 5 is Ni85Fe15.
The relationship between the input alternating magnetic field and the output signal for the H curve is shown.
【００２３】図３において、ＡはＮｉ82Ｆｅ12Ｃｏ6 に
対してスパッタリング工法によってパッシベーション膜
７を形成した時のＲ−Ｈ曲線を示し、ＢはＮｉ82Ｆｅ12
Ｃｏ6 に対して常圧ＣＶＤによってパッシベーション膜
７を形成した時のＲ−Ｈ曲線を示している。これらＲ−
Ｈ曲線ＡとＲ−Ｈ曲線Ｂとの差は大きい箇所において数
十％程度となる。In FIG. 3, A shows the RH curve when the passivation film 7 is formed on Ni82Fe12Co6 by the sputtering method, and B shows Ni82Fe12.
The RH curve is shown when the passivation film 7 is formed on Co6 by atmospheric pressure CVD. These R-
The difference between the H curve A and the RH curve B is about several tens of percent at a large portion.
【００２４】また、Ｐは磁界Ｈが０〜３０［Ｏｅ］の範
囲の交番磁界の入力波形を示し、ａ，ｂは夫々Ｒ−Ｈ曲
線Ａ及びＲ−Ｈ曲線Ｂに対応する磁気抵抗素子からの出
力波形を示している。ここで、出力波形ａは出力波形ｂ
に対して２０〜３０％程度出力が小さい。Further, P indicates the input waveform of the alternating magnetic field in which the magnetic field H is in the range of 0 to 30 [Oe], and a and b are the magnetoresistive elements corresponding to the RH curve A and the RH curve B, respectively. The output waveform of is shown. Here, the output waveform a is the output waveform b
However, the output is small by about 20 to 30%.
【００２５】Ｏは磁界Ｈが０〜１０［Ｏｅ］の範囲、つ
まり低磁界側の交番磁界の入力波形を示し、ａ′，ｂ′
は夫々Ｒ−Ｈ曲線Ａ及びＲ−Ｈ曲線Ｂに対応する磁気抵
抗素子からの出力波形を示している。O represents the input waveform of the alternating magnetic field on the low magnetic field side, that is, a ', b', where the magnetic field H is in the range of 0 to 10 [Oe].
Shows the output waveforms from the magnetoresistive element corresponding to the RH curve A and the RH curve B, respectively.
【００２６】磁気抵抗素子のＲ−Ｈ曲線が変化すると、
磁気抵抗素子の出力波形に変化が生ずることは上記のＲ
−Ｈ曲線Ａ及びＲ−Ｈ曲線Ｂ各々に対応する磁気抵抗素
子からの出力波形の違いからも明らかであるが、そのＲ
−Ｈ曲線の変化によってコンパレータ［ヒステリシス付
きオペアンプ（ｏｐ−ａｍｐ）］からの出力波形の形
状、いわゆるデューティ比が変動する原因となる。When the RH curve of the magnetoresistive element changes,
The change in the output waveform of the magnetoresistive element is caused by the above R
It is clear from the difference in the output waveforms from the magnetoresistive elements corresponding to the −H curve A and the RH curve B, respectively.
The change in the −H curve causes a change in the shape of the output waveform from the comparator [opamp with hysteresis (op-amp)], that is, the so-called duty ratio.
【００２７】図４において、ＣはＮｉ85Ｆｅ15に対して
スパッタリング工法によってパッシベーション膜７を形
成した時のＲ−Ｈ曲線を示し、ＤはＮｉ85Ｆｅ15に対し
て常圧ＣＶＤによってパッシベーション膜７を形成した
時のＲ−Ｈ曲線を示している。In FIG. 4, C shows an RH curve when the passivation film 7 is formed on Ni85Fe15 by the sputtering method, and D is R when the passivation film 7 is formed on Ni85Fe15 by atmospheric pressure CVD. -H curve is shown.
【００２８】これらＲ−Ｈ曲線Ｃ及びＲ−Ｈ曲線ＤはＲ
−Ｈ曲線Ａ及びＲ−Ｈ曲線Ｂに比べて磁界強度の変化に
対応する抵抗値変化の割合ΔＲ／ΔＨが緩やかであるの
は材料特性そのものの違いによるものであり、一般的に
Ｎｉ82Ｆｅ12Ｃｏ6 の出力はＮｉ85Ｆｅ15の出力に比べ
て数十％程度大きいとされている。但し、この一般的な
説には外部応力による逆磁歪効果等は考慮されていな
い。These R-H curve C and R-H curve D are R
The reason why the ratio ΔR / ΔH of the resistance change corresponding to the change of the magnetic field strength is gentler than that of the −H curve A and the RH curve B is due to the difference in the material characteristics itself, and in general, the output of Ni82Fe12Co6 Is about several tens of percent higher than the output of Ni85Fe15. However, this general theory does not consider the inverse magnetostriction effect due to external stress.
【００２９】Ｑは磁界Ｈが０〜３０［Ｏｅ］の範囲の交
番磁界の入力波形を示し、ｃ，ｄは夫々Ｒ−Ｈ曲線Ｃ及
びＲ−Ｈ曲線Ｄに対応する磁気抵抗素子からの出力波形
を示している。Q represents an input waveform of an alternating magnetic field in which the magnetic field H is in the range of 0 to 30 [Oe], and c and d are outputs from the magnetoresistive element corresponding to the RH curve C and the RH curve D, respectively. The waveform is shown.
【００３０】図５は本発明の一実施例による集積化磁気
センサの回路構成例を示す図である。図５（ａ）は磁気
抵抗素子のみによるブリッジ回路の構成例を示し、図５
（ｂ）及び図５（ｃ）は磁気抵抗素子とトランジスタと
を組合せた回路の構成例を示している。FIG. 5 is a diagram showing a circuit configuration example of an integrated magnetic sensor according to an embodiment of the present invention. FIG. 5A shows a configuration example of a bridge circuit including only magnetoresistive elements.
5B and FIG. 5C show a configuration example of a circuit in which a magnetoresistive element and a transistor are combined.
【００３１】図５（ａ）において、１１は入力端子を、
１２はグランド端子を、１３〜１６は磁気抵抗素子を、
１７はオペアンプ（ｏｐ−ａｍｐ）を、１８は拡散抵抗
あるいはイオン注入抵抗によるヒステリシス形成用帰還
抵抗を、１９はＩＣ部の出力端子を、１０ａ，１０ｂは
磁気抵抗素子ブリッジの出力端子を夫々示している。In FIG. 5A, 11 is an input terminal,
12 is a ground terminal, 13 to 16 are magnetoresistive elements,
Reference numeral 17 is an operational amplifier (op-amp), 18 is a feedback resistor for forming hysteresis by diffusion resistance or ion implantation resistance, 19 is an output terminal of the IC section, and 10a and 10b are output terminals of a magnetoresistive element bridge. There is.
【００３２】図５（ｂ）において、２１は入力端子を、
２２はグランド端子を、２３，２４は磁気抵抗素子を、
２５〜２７はトランジスタを夫々示している。図５
（ｃ）において、３１は入力端子を、３２はグランド端
子を、３３〜３６は磁気抵抗素子を、３７〜３９はトラ
ンジスタを夫々示している。In FIG. 5 (b), 21 is an input terminal,
22 is a ground terminal, 23 and 24 are magnetoresistive elements,
Reference numerals 25 to 27 denote transistors, respectively. FIG.
In (c), 31 is an input terminal, 32 is a ground terminal, 33 to 36 are magnetoresistive elements, and 37 to 39 are transistors.
【００３３】上記のように、磁気抵抗素子１３〜１６の
みによるブリッジ回路［図５（ａ）参照］でも、また磁
気抵抗素子２３，２４，３３〜３６にトランジスタ２５
〜２７，３７〜３９を組合せた回路［図５（ｂ）及び図
５（ｃ）参照］でも、同様の機能を持つ回路を構成する
ことが可能となる。As described above, even in the bridge circuit [see FIG. 5 (a)] including only the magnetoresistive elements 13 to 16, the magnetoresistive elements 23, 24, 33 to 36 have the transistor 25.
It is also possible to configure a circuit having a similar function by a circuit combining [-27, 37-39] [see FIGS. 5 (b) and 5 (c)].
【００３４】図６〜図９は本発明の一実施例による集積
化磁気センサの回転磁界に対する出力例を示す図であ
る。図６（ａ）はＮｉ85Ｆｅ15に対して常圧ＣＶＤによ
ってパッシベーション膜７を形成した場合に、モールド
パッケージされた集積化磁気センサ４１が羽根車状の磁
気媒体４０による交番磁界を検出する状態を示し、図６
（ｂ）は（ａ）の検出状態における集積化磁気センサ４
１の回転磁界に対する出力パルス波形４２を示してい
る。6 to 9 are diagrams showing examples of output with respect to the rotating magnetic field of the integrated magnetic sensor according to one embodiment of the present invention. FIG. 6A shows a state in which the integrated magnetic sensor 41 in the mold package detects an alternating magnetic field by the impeller-shaped magnetic medium 40 when the passivation film 7 is formed on Ni85Fe15 by atmospheric pressure CVD. Figure 6
(B) is the integrated magnetic sensor 4 in the detection state of (a)
The output pulse waveform 42 for one rotating magnetic field is shown.
【００３５】尚、羽根車状の磁気媒体４０は、例えば気
体や液体等の流体の流量を検出するための検知に用いら
れており、集積化磁気センサ４１は羽根車状の磁気媒体
４０による交番磁界を検出することで羽根車状の磁気媒
体４０の回転数を計数するために用いられている。The impeller-shaped magnetic medium 40 is used for detection for detecting the flow rate of a fluid such as gas or liquid, and the integrated magnetic sensor 41 is alternated with the impeller-shaped magnetic medium 40. It is used to count the number of rotations of the impeller-shaped magnetic medium 40 by detecting the magnetic field.
【００３６】図７（ａ）はＮｉ85Ｆｅ15に対して常圧Ｃ
ＶＤによってパッシベーション膜７を形成し、ギャップ
を離した時の集積化磁気センサ４３が羽根車状の磁気媒
体４０による交番磁界を検出する状態を示し、図７
（ｂ）は（ａ）の検出状態における集積化磁気センサ４
３の回転磁界に対する出力パルス波形４４を示してい
る。FIG. 7 (a) shows Ni85Fe15 at normal pressure C.
7 shows a state in which the passivation film 7 is formed by VD and the integrated magnetic sensor 43 detects the alternating magnetic field by the impeller-shaped magnetic medium 40 when the gap is separated.
(B) is the integrated magnetic sensor 4 in the detection state of (a)
The output pulse waveform 44 for the rotating magnetic field of No. 3 is shown.
【００３７】図８（ａ）はＮｉ82Ｆｅ12Ｃｏ6 に対して
常圧ＣＶＤによってパッシベーション膜７を形成した時
の集積化磁気センサ４５が羽根車状の磁気媒体４０によ
る交番磁界を検出する状態を示し、図８（ｂ）は（ａ）
の検出状態における集積化磁気センサ４５の回転磁界に
対する出力パルス波形４６を示している。FIG. 8A shows a state in which the integrated magnetic sensor 45 detects the alternating magnetic field of the impeller-shaped magnetic medium 40 when the passivation film 7 is formed on Ni82Fe12Co6 by atmospheric pressure CVD. (B) is (a)
The output pulse waveform 46 with respect to the rotating magnetic field of the integrated magnetic sensor 45 in the detection state is shown.
【００３８】図９（ａ）はＮｉ82Ｆｅ12Ｃｏ6 に対して
常圧ＣＶＤによってパッシベーション膜７を形成し、ギ
ャップを離した時の集積化磁気センサ４７が羽根車状の
磁気媒体４０による交番磁界を検出する状態を示し、図
９（ｂ）は（ａ）の検出状態における集積化磁気センサ
４７の回転磁界に対する出力パルス波形４８を示してい
る。FIG. 9A shows a state in which the passivation film 7 is formed on Ni82Fe12Co6 by atmospheric pressure CVD and the integrated magnetic sensor 47 detects the alternating magnetic field by the impeller-shaped magnetic medium 40 when the gap is separated. 9B shows an output pulse waveform 48 with respect to the rotating magnetic field of the integrated magnetic sensor 47 in the detection state of FIG. 9A.
【００３９】このように、磁気抵抗素子薄膜５の元来の
外部磁界（Ｒ−Ｈ）特性と磁気発生媒体との組合せとな
るアプリケーションにおいて望まれるパルス波形あるい
は最適なパルス波形を得るために、集積化磁気センサ４
１，４３，４５，４７の積層膜の最終形成膜であるパッ
シベーション膜７の形成工法をスパッタリング工法及び
常圧ＣＶＤのうちから選択することによって、強磁性体
薄膜で生成される磁気抵抗素子薄膜５自体の成膜及び加
工工程が終了した後でも、最終製品形態の集積化磁気セ
ンサとしての外部交番磁界、例えば羽根車状の磁気媒体
４０が作り出す回転磁界検出におけるＩＣ部分からの出
力パルス波形（例えば、デューティ比）を任意に制御す
ることが可能となる。As described above, in order to obtain a desired pulse waveform or an optimum pulse waveform in an application that is a combination of the original external magnetic field (RH) characteristic of the magnetoresistive element thin film 5 and the magnetic generation medium, the integration is performed. Magnetic sensor 4
The magnetoresistive element thin film 5 formed of a ferromagnetic thin film is selected by selecting the forming method of the passivation film 7 which is the final formed film of the laminated film of 1, 43, 45 and 47 from the sputtering method and the atmospheric pressure CVD. Even after the film forming and processing steps of itself are completed, an external alternating magnetic field as an integrated magnetic sensor of the final product form, for example, an output pulse waveform from the IC portion in the rotating magnetic field detection generated by the impeller-shaped magnetic medium 40 (for example, , Duty ratio) can be arbitrarily controlled.
【００４０】[0040]
【発明の効果】以上説明したように本発明によれば、チ
ップ上に異方性磁気抵抗効果を有する磁気抵抗効果素子
薄膜を形成してなる磁気センサの積層膜構造において、
チップ上にパッシベーションとして形成されかつ磁気抵
抗効果素子薄膜の出力特性に応じて磁気抵抗効果素子薄
膜に圧縮応力を付与する工法及び磁気抵抗効果素子薄膜
に引張り応力を付与する工法のうちのいずれかの工法で
形成される保護膜を備えることによって、最終的にＩＣ
部分から出力される信号の波形を任意に制御することが
できるという効果がある。As described above, according to the present invention, in the laminated film structure of the magnetic sensor in which the magnetoresistive effect element thin film having the anisotropic magnetoresistive effect is formed on the chip,
One of the method of applying compressive stress to the magnetoresistive element thin film and the method of applying tensile stress to the magnetoresistive element thin film formed on the chip as passivation and according to the output characteristics of the magnetoresistive effect element thin film. By providing a protective film formed by the method, finally the IC
There is an effect that the waveform of the signal output from the part can be controlled arbitrarily.
【図１】本発明の一実施例の断面図である。FIG. 1 is a sectional view of one embodiment of the present invention.
【図２】図１の磁気抵抗素子薄膜の出力変動に及ぼす組
成材料とパッシベーション膜の形成工法との組合せの対
応関係を示す図である。FIG. 2 is a diagram showing a correspondence relationship of a combination of a composition material and a passivation film forming method which influences an output variation of the magnetoresistive element thin film of FIG.
【図３】図１の磁気抵抗素子薄膜がＮｉ82Ｆｅ12Ｃｏ6
の場合のＲ−Ｈ曲線に対する入力交番磁界と出力信号と
の関係を示す図である。FIG. 3 is a magnetoresistive element thin film of FIG. 1 made of Ni82Fe12Co6.
It is a figure which shows the relationship between an input alternating magnetic field and an output signal with respect to the RH curve in the case of.
【図４】図１の磁気抵抗素子薄膜がＮｉ85Ｆｅ15の場合
のＲ−Ｈ曲線に対する入力交番磁界と出力信号との関係
を示す図である。4 is a diagram showing a relationship between an input alternating magnetic field and an output signal with respect to an RH curve when the magnetoresistive element thin film of FIG. 1 is Ni85Fe15.
【図５】（ａ）は磁気抵抗素子のみによるブリッジ回路
の構成例を示す図、（ｂ）及び（ｃ）は磁気抵抗素子と
トランジスタとを組合せた回路の構成例を示す図であ
る。5A is a diagram showing a configuration example of a bridge circuit using only a magnetoresistive element, and FIGS. 5B and 5C are diagrams showing a configuration example of a circuit in which a magnetoresistive element and a transistor are combined.
【図６】（ａ）は本発明の一実施例による集積化磁気セ
ンサが羽根車状の磁気媒体による交番磁界を検出する状
態を示す図、（ｂ）は（ａ）の検出状態における集積化
磁気センサの回転磁界に対する出力パルス波形を示す図
である。FIG. 6A is a diagram showing a state in which an integrated magnetic sensor according to an embodiment of the present invention detects an alternating magnetic field by an impeller-shaped magnetic medium, and FIG. 6B is an integrated state in the detection state of FIG. It is a figure which shows the output pulse waveform with respect to the rotating magnetic field of a magnetic sensor.
【図７】（ａ）は本発明の一実施例による集積化磁気セ
ンサが羽根車状の磁気媒体による交番磁界を検出する状
態を示す図、（ｂ）は（ａ）の検出状態における集積化
磁気センサの回転磁界に対する出力パルス波形を示す図
である。FIG. 7A is a diagram showing a state in which an integrated magnetic sensor according to an embodiment of the present invention detects an alternating magnetic field by an impeller-shaped magnetic medium, and FIG. 7B is an integrated state in the detection state of FIG. 7A. It is a figure which shows the output pulse waveform with respect to the rotating magnetic field of a magnetic sensor.
【図８】（ａ）は本発明の一実施例による集積化磁気セ
ンサが羽根車状の磁気媒体による交番磁界を検出する状
態を示す図、（ｂ）は（ａ）の検出状態における集積化
磁気センサの回転磁界に対する出力パルス波形を示す図
である。8A is a diagram showing a state in which an integrated magnetic sensor according to an embodiment of the present invention detects an alternating magnetic field generated by an impeller-shaped magnetic medium, and FIG. 8B is a diagram showing integration in the detection state shown in FIG. 8A. It is a figure which shows the output pulse waveform with respect to the rotating magnetic field of a magnetic sensor.
【図９】（ａ）は本発明の一実施例による集積化磁気セ
ンサが羽根車状の磁気媒体による交番磁界を検出する状
態を示す図、（ｂ）は（ａ）の検出状態における集積化
磁気センサの回転磁界に対する出力パルス波形を示す図
である。FIG. 9A is a diagram showing a state in which an integrated magnetic sensor according to an embodiment of the present invention detects an alternating magnetic field by an impeller-shaped magnetic medium, and FIG. 9B is a diagram showing integration in the detection state of FIG. 9A. It is a figure which shows the output pulse waveform with respect to the rotating magnetic field of a magnetic sensor.
１ 拡散層 ２ アルミニウム電極 ３ スピンオングラス ４ 絶縁膜 ５ 磁気抵抗素子薄膜 ６ 導体層 ７ パッシベーション層 1 Diffusion layer 2 Aluminum electrode 3 Spin-on-glass 4 Insulating film 5 Magnetoresistive element thin film 6 Conductor layer 7 Passivation layer
Claims (4)
磁気抵抗効果素子薄膜を形成してなる磁気センサの積層
膜構造であって、前記チップ上にパッシベーションとし
て形成されかつ前記磁気抵抗効果素子薄膜の出力特性に
応じて前記磁気抵抗効果素子薄膜に圧縮応力を付与する
工法及び前記磁気抵抗効果素子薄膜に引張り応力を付与
する工法のうちのいずれかの工法で形成される保護膜を
有することを特徴とする積層膜構造。1. A laminated film structure of a magnetic sensor comprising a magnetoresistive effect element thin film having an anisotropic magnetoresistive effect formed on a chip, the magnetoresistive effect element formed on the chip as passivation. Having a protective film formed by any one of a method of applying a compressive stress to the magnetoresistive effect element thin film and a method of applying a tensile stress to the magnetoresistive effect element thin film according to the output characteristics of the thin film. A laminated film structure characterized by:
ング工法で圧縮応力を付与し、前記磁気抵抗効果素子薄
膜に常圧化学気相成長法で引張り応力を付与するよう構
成したことを特徴とする請求項１記載の積層膜構造。2. The structure is characterized in that the magnetoresistive effect element thin film is applied with a compressive stress by a sputtering method, and the magnetoresistive effect element thin film is applied with a tensile stress by an atmospheric pressure chemical vapor deposition method. Item 1. The laminated film structure according to item 1.
定数及び負の磁歪定数のいずれかを有する組成物質から
なることを特徴とする請求項１または請求項２記載の積
層膜構造。3. The laminated film structure according to claim 1 or 2, wherein the magnetoresistive effect element thin film is made of a composition material having either a positive magnetostriction constant or a negative magnetostriction constant.
てＮｉＦｅを用い、前記負の磁歪定数を有する組成物質
としてＮｉＦｅＣｏを用いることを特徴とする請求項３
記載の積層膜構造。4. The composition material having a positive magnetostriction constant is NiFe, and the composition material having a negative magnetostriction constant is NiFeCo.
The laminated film structure described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7213872A JP2776314B2 (en) | 1995-08-23 | 1995-08-23 | Stacked film structure of integrated magnetic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7213872A JP2776314B2 (en) | 1995-08-23 | 1995-08-23 | Stacked film structure of integrated magnetic sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0963843A true JPH0963843A (en) | 1997-03-07 |
| JP2776314B2 JP2776314B2 (en) | 1998-07-16 |
Family
ID=16646421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7213872A Expired - Lifetime JP2776314B2 (en) | 1995-08-23 | 1995-08-23 | Stacked film structure of integrated magnetic sensor |
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| Country | Link |
|---|---|
| JP (1) | JP2776314B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7417269B2 (en) | 2002-11-21 | 2008-08-26 | Denso Corporation | Magnetic impedance device, sensor apparatus using the same and method for manufacturing the same |
| US7830143B2 (en) | 2006-03-10 | 2010-11-09 | Nec Corporation | Magnetic sensor, method of manufacturing the same, and electronic device |
| US9417296B2 (en) | 2011-02-23 | 2016-08-16 | Murata Manufacturing Co., Ltd. | Magnetic sensor and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6064484A (en) * | 1983-09-19 | 1985-04-13 | Hitachi Ltd | Ferromagnetic magnetoresistance effect alloy film |
| JPS63246806A (en) * | 1987-04-02 | 1988-10-13 | Mitsubishi Electric Corp | Thin film device |
| JPH06310327A (en) * | 1993-04-21 | 1994-11-04 | Nec Corp | Integrated magnetoresistance effect sensor |
-
1995
- 1995-08-23 JP JP7213872A patent/JP2776314B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6064484A (en) * | 1983-09-19 | 1985-04-13 | Hitachi Ltd | Ferromagnetic magnetoresistance effect alloy film |
| JPS63246806A (en) * | 1987-04-02 | 1988-10-13 | Mitsubishi Electric Corp | Thin film device |
| JPH06310327A (en) * | 1993-04-21 | 1994-11-04 | Nec Corp | Integrated magnetoresistance effect sensor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7417269B2 (en) | 2002-11-21 | 2008-08-26 | Denso Corporation | Magnetic impedance device, sensor apparatus using the same and method for manufacturing the same |
| US7582489B2 (en) | 2002-11-21 | 2009-09-01 | Denso Corporation | Method for manufacturing magnetic sensor apparatus |
| US7830143B2 (en) | 2006-03-10 | 2010-11-09 | Nec Corporation | Magnetic sensor, method of manufacturing the same, and electronic device |
| US9417296B2 (en) | 2011-02-23 | 2016-08-16 | Murata Manufacturing Co., Ltd. | Magnetic sensor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2776314B2 (en) | 1998-07-16 |
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