JPH0945754A - Wafer stage device for semiconductor manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer stage device for a semiconductor manufacturing device by which manufacturing cost is reduced and work for setting requirements of process is easy. SOLUTION: A wafer stage device supporting wafers within a reaction tube of a single wafer processing semiconductor manufacturing device comprises a supporting post 18 standing on a wafer stage base 17, a wafer mount plate 12 being supported by the post and wafers 11 being supported via the wafer mount plate, therefore the supporting position of the wafer mount plate refering to the post can be changed, work for setting requirement of process can be easy and additionally the construction can be simple.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a wafer stage apparatus for a single wafer type semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art A conventional single-wafer type semiconductor manufacturing apparatus will be briefly described with reference to FIG.

Heaters 26 and 27 are arranged around the reaction tube 25, and a boat 28 for supporting the wafers 11 in a plurality of stages (three stages in the figure) is provided inside the reaction tube 25. The wafers 11 are racks 2 formed on the boat 28.
It is placed on the substrate 9 and heated by the heaters 26 and 27 in a state where the reaction gas is introduced into the reaction tube 25, and the required processing is performed.

[0004]

In the above-mentioned conventional single wafer type semiconductor manufacturing apparatus, the wafer 11 is supported by the boat 28, and the boat 28 is integrally molded.
Since it is difficult to manufacture and the processing cost is high, the distance between the wafers 11 cannot be changed. Therefore, in order to obtain the optimum distance between the wafers 11 according to the process, a plurality of boats having different wafer support intervals are required. However, there is a problem in that complicated work is required for condition setting, and that it takes time, such as that it is necessary to prepare 28, and condition setting involves replacing the boat 28.

In view of the above situation, the present invention aims to provide a wafer stage apparatus which is inexpensive to manufacture and which is easy to perform process condition setting.

[0006]

SUMMARY OF THE INVENTION The present invention is a wafer stage apparatus for supporting a wafer inside a reaction tube of a single wafer type semiconductor manufacturing apparatus, in which a column is erected on a wafer stage base and the wafer is mounted on the column. Supporting the mounting plate, according to the wafer stage device of the semiconductor manufacturing apparatus so as to support the wafer through the wafer mounting plate, also standing the column on the wafer stage base, insert the spacer to the column, Penetrate the column to the wafer mounting plate on which the wafer is mounted,
A wafer mounting device of a semiconductor manufacturing apparatus in which a wafer mounting plate is supported via the spacers, and a pillar is erected on a wafer mounting base, and a step is formed on the pillar to mount a wafer on which a wafer is mounted. The present invention relates to a wafer stage apparatus of a semiconductor manufacturing apparatus in which a plate penetrates the pillar and is supported by the step.

Therefore, the vertical distance between the wafers can be easily changed by replacing the spacers having different lengths, and the vertical distance between the wafers can be changed by changing the position of the step of the supporting column. Can be changed easily. Further, the structure is simple and the production is easy.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

An outline of a single wafer type semiconductor manufacturing apparatus equipped with a wafer stage apparatus according to the present invention will be described with reference to FIGS. 1 and 2.

A reaction tube 1 made of quartz, silicon carbide or alumina is in the shape of a cylinder having a flat space in the horizontal direction. A wafer stage device 2 is provided inside the reaction tube 1 and the reaction tube 1 is provided.
A gas introduction flange 3 and a gas introduction flange 4 are airtightly provided at both ends of the above, and a transfer chamber (not shown) is further connected to one gas introduction flange 3 via a gate valve 5. Gas introducing lines 7 and 8 and exhaust lines 9 and 10 are connected to the gas introducing flange 3 and the gas introducing flange 4, respectively, and a heater 6 is provided around the reaction tube 1 so that the inside of the reaction tube 1 is uniform. It is designed to heat up.

The gate valve 5 is opened, and the wafer 11 is loaded from the left side in the drawing by a wafer transfer robot (not shown) and placed on the wafer stage apparatus 2. In this figure, two wafers 11 are placed on the wafer stage device 2.

The wafer transfer robot retracts, the gate valve 5 is closed, reaction gas is introduced into the reaction tube 1 through the gas introduction lines 7 and 8, and the exhaust lines 9 and 1 are introduced.
Exhausted from zero. In order to ensure the uniformity of the treatment, the reaction gas flows diagonally, for example, from the gas introduction line 7 to the exhaust line 10 or from the gas introduction line 8 to the exhaust line 9 for a further required time. The flow direction is changed every time. When the processing of the wafer 11 is completed, the gate valve 5 is opened and the wafer 11
Are unloaded by the wafer transfer robot.

The wafer stage device 2 holds the wafer 1 to be held.
There is one wafer mounting plate 12 for each one.

The wafer mounting plate 12 has a hole 13 having a diameter larger than that of the wafer 11 at the center of a rectangular plate made of quartz, silicon carbide, alumina or the like. A claw 14 is provided so as to project in the center direction on the lower surface of the wafer mounting plate 12 at a position where the circumference 13 is divided into four equal parts. Further, a cutout portion 15 is provided on the wafer mounting plate 12 on the gate valve 5 side, and two relief portions 16 are provided on the opposite side of the cutout portion 15. The cutout portion 15,
The escape portion 16 is provided so as not to interfere when the wafer mounting arm of the wafer transfer robot (not shown) enters and transfers the wafer 11.

The wafer mounting plate 12 is supported by the number of wafers 11 to be processed in the vertical direction at required intervals.

In the present embodiment, the wafer stage device 2 comprises the above-mentioned wafer mounting plates 12 in two upper and lower stages. FIG. 3 is a conceptual diagram of the wafer stage apparatus 2 in this mode, and the wafer stage apparatus 2 will be described below.

A pillar 18 made of a material such as quartz, silicon carbide, or alumina is erected at four corners of the wafer base 17, and a spacer 19 made of a material such as quartz, silicon carbide, or alumina is provided on the pillar 18. And then the lower wafer mounting plate 12 is mounted on the spacer 19 in a state where the lower wafer mounting plate 12 penetrates the support column 18, and the spacer 20 is further inserted, and finally the upper wafer mounting plate 12 is mounted on the support column. 18
It is placed on the spacer 20 in a state of being penetrated through. The spacers 19 and 20 set the distance between the wafers 11 necessary for the process.

The distance between the wafers 11 can be easily changed by changing the lengths of the spacers 19 and 20.

Further, FIG. 4 shows a case where the wafer 11 is supported in three stages. A spacer 21 is further fitted into the wafer stage device shown in FIG.
It is a stack of two.

Further, FIG. 5 shows another embodiment, in which the supporting column 22 for supporting the wafer mounting plate 12 has a stepped shape, and the supporting column 22 is replaceable. Wafer mounting plate 12 that fits into the support 22
Also, the fitting holes for the columns 22 are made smaller from the lower wafer mounting plate 12a to the middle wafer mounting plate 12b to the upper wafer mounting plate 12c. In the case of changing the distance between the wafers in the embodiment, the columns are replaced with columns having different distances. It goes without saying that in this embodiment, only the wafer mounting plate 12a may be provided to form a single-stage wafer stage apparatus.

[0021]

As described above, according to the present invention, the number of welding points of the members constituting the wafer stage apparatus is significantly reduced, the processing cost and man-hours can be reduced, and the wafer mounting plate for supporting the wafer is reduced. The shape and material of the wafer can be easily changed depending on the film type generated on the wafer, the equipment cost can be reduced, and the distance between the wafers can be easily changed to optimize the flow of the reaction gas. It exhibits excellent effects such as.

[Brief description of drawings]

FIG. 1 is a front sectional view showing an embodiment of the present invention.

FIG. 2 is a plan sectional view showing the embodiment.

FIG. 3 is a conceptual diagram showing a main part of the same embodiment.

FIG. 4 is a conceptual diagram showing a main part of another embodiment of the present invention.

FIG. 5 is a conceptual diagram showing a main part of still another embodiment of the present invention.

FIG. 6 is a conceptual diagram showing a main part of a conventional example.

[Explanation of symbols]

 1 Reaction Tube 2 Wafer Stand Device 12 Wafer Mounting Plate 17 Wafer Stand Base 18 Support 19 Spacer 20 Spacer 21 Spacer 22 Support

Claims (3)

[Claims] 1. In a wafer stage apparatus for supporting a wafer inside a reaction tube of a single wafer type semiconductor manufacturing apparatus, a column is erected on a wafer stage base, and the wafer mounting plate is supported by the column, A wafer stage device for a semiconductor manufacturing apparatus, wherein a wafer is supported via a mounting plate. 2. In a wafer stage apparatus for supporting a wafer inside a reaction tube of a single wafer type semiconductor manufacturing apparatus, a column is erected on a wafer platform base, a spacer is fitted into the column, and a wafer is received. A wafer stage device of a semiconductor manufacturing apparatus, wherein the support column is penetrated through the wafer mounting plate, and the wafer mounting plate is supported via the spacer. 3. In a wafer stage apparatus for supporting a wafer inside a reaction tube of a single wafer type semiconductor manufacturing apparatus, a column is erected on a wafer platform base, a step is formed on the column, and a wafer is received. A wafer stage device of a semiconductor manufacturing apparatus, wherein the supporting column is penetrated through a wafer mounting plate according to the present invention and is supported at the step.