JPH09331144A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH09331144A JPH09331144A JP8124605A JP12460596A JPH09331144A JP H09331144 A JPH09331144 A JP H09331144A JP 8124605 A JP8124605 A JP 8124605A JP 12460596 A JP12460596 A JP 12460596A JP H09331144 A JPH09331144 A JP H09331144A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pkg
- component
- diameter
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims abstract description 5
- 230000037431 insertion Effects 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、通信機器やコンピ
ュータ等を構成するプリント基板(PKGと略称する)
に関するもので、特にPKGのスルホールおよびランド
の構造に係わる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board (abbreviated as PKG) constituting a communication device, a computer or the like.
The structure of through holes and lands of PKG.
【0002】[0002]
【従来の技術】通信機器やコンピュータ等の装置は、電
気部品を実装した複数枚のPKGの集合体ということが
できる。近年、これらの装置は小型化とともに多機能化
が求められているため、装置の中枢をなすPKGへの電
機部品の実装も一層高密度化が図られている。こうした
事情にともない実装される電気部品自体も小型化、高性
能化が図られている。また、これらの電気部品は、装置
毎に独自に開発されることが多く、しかも1部品に多機
能が集約される傾向が顕著である。したがって、インタ
ーフェイス用入出力端子も増大している。そして、これ
らの電気部品はPKGに実装され、このPKGを介して
他の電気部品と接続することにより回路が形成される。2. Description of the Related Art A device such as a communication device or a computer can be said to be an assembly of a plurality of PKGs on which electric parts are mounted. In recent years, these devices are required to be downsized and to have multiple functions, so that mounting of electric parts on the PKG, which is the center of the devices, is further increased in density. Under these circumstances, the electric components themselves to be mounted have been made smaller and have higher performance. Further, these electric components are often developed independently for each device, and there is a marked tendency that multiple functions are integrated in one component. Therefore, the number of interface input / output terminals is also increasing. Then, these electric components are mounted on the PKG, and a circuit is formed by connecting to other electric components via the PKG.
【0003】図3、図4は、前記従来技術を詳細に説明
するための斜視図および断面図である。このうち図3は
電気部品の一例を示したもので、本体10に他の電気部
品とのインターフェイスをとるインターフェイス用入出
力端子(リードと略称する)11が設けられている。前
記リード11は、PKGに形成された後述するスルーホ
ール(部品孔)に入れられ、半田で固着される。この部
品孔に使用されるスルーホールは、無電解銅メッキによ
り導電性を与えられており、スルーホールに接続されて
いるパターン線によって他の電気部品と接続されるので
ある。3 and 4 are a perspective view and a sectional view for explaining the above-mentioned prior art in detail. Of these, FIG. 3 shows an example of an electrical component, and the main body 10 is provided with an interface input / output terminal (abbreviated as a lead) 11 for interfacing with other electrical components. The lead 11 is put into a through hole (component hole) described later, which is formed in the PKG, and is fixed by soldering. The through hole used for this component hole is made conductive by electroless copper plating, and is connected to other electric components by the pattern line connected to the through hole.
【0004】図4は、PKGの一部断面を示したもの
で、基板本体12の一方の面は部品実装面12aであ
り、他方の面は半田面12bである。そして、基板本体
12には円筒状内壁のスルーホール13が形成されてい
る。このスルーホール13の孔径xは、個々の電気部品
のリード11外形に応じて適宜形成されている。FIG. 4 shows a partial cross-section of the PKG. One surface of the substrate body 12 is a component mounting surface 12a and the other surface is a solder surface 12b. A through hole 13 having a cylindrical inner wall is formed in the substrate body 12. The hole diameter x of the through hole 13 is appropriately formed according to the outer shape of the lead 11 of each electric component.
【0005】[0005]
【発明が解決しようとする課題】ところで、PKGに実
装される電気部品は、装置の用途によって独自に開発さ
れ、その大きさ、リード数、リード間の間隔寸法等は、
他部品と異なる場合が多い。一方、円筒状内壁のスルー
ホール13は、多くのリード11を有する電気部品を実
装する場合、リード11の1本1本がスルーホール13
内の所定位置に合っていなければならない。しかし、電
気部品のリード11が多くなるに伴い、スルーホール1
3の所定位置との寸法精度が保てず位置が合わなくな
り、リード11を入れる時間がかかり作業性が悪いとい
う不具合があった。By the way, the electric parts mounted on the PKG are originally developed according to the use of the device, and the size, the number of leads, the distance between the leads, etc. are as follows.
Often different from other parts. On the other hand, in the case of mounting an electrical component having many leads 11, each of the leads 11 has a through hole 13 formed in the cylindrical inner wall.
Must fit in place within. However, as the number of leads 11 of electrical parts increases, the through hole 1
There was a problem that the dimensional accuracy with the predetermined position of No. 3 could not be maintained and the positions were not aligned, it took time to insert the lead 11, and the workability was poor.
【0006】この不具合を解決する方法として、スルー
ホール13の口径を広くするという方法が考えられる
が、スルーホール13の口径を広くすると、リード11
との間隔がその分だけ広がってしまう。すると、スルー
ホール13内でリード11がいわゆる遊んでしまう状態
となり、電気部品の実装位置がずれてしまう。さらに、
電気部品が周辺部品と接触してしまったり、同一PKG
でありながら極端に外観が異なり均一な品質維持ができ
なくなるという不具合があった。As a method for solving this problem, a method of widening the diameter of the through hole 13 can be considered.
The distance between and will increase accordingly. Then, the lead 11 is in a so-called idle state in the through hole 13, and the mounting position of the electric component is displaced. further,
Electric parts may come into contact with peripheral parts, or the same PKG
However, there was a problem that the appearance was extremely different and uniform quality could not be maintained.
【0007】本発明は前記不具合を解決すべく、電気部
品のリード11をスルーホール13に容易に入れること
ができるとともに電気部品の実装位置のずれを最小限と
することができるプリント基板を提供することを目的と
したものである。In order to solve the above-mentioned problems, the present invention provides a printed circuit board which can easily insert the lead 11 of the electric component into the through hole 13 and can minimize the displacement of the mounting position of the electric component. This is the purpose.
【0008】[0008]
【課題を解決するための手段】本発明は前記目的を達成
すべく、基板本体の一方の面から他方の面にかけて電気
部品のインターフェイス用入出力端子を挿入固着するス
ルーホールを形成し、このスルーホールの近傍にランド
が形成したプリント基板において、前記インターフェイ
ス用入出力端子挿入口を漏斗状に開口するとともに、前
記漏斗状開口に連続する孔は必要最小限の口径にスルー
ホールを形成した。In order to achieve the above object, the present invention forms a through hole for inserting and fixing an interface input / output terminal of an electric component from one surface to the other surface of a substrate body, and this through hole is formed. In the printed circuit board in which the land was formed near the hole, the interface input / output terminal insertion port was opened in a funnel shape, and the hole continuous to the funnel shaped opening was formed as a through hole with a minimum necessary diameter.
【0009】[0009]
【発明の実施の形態】以下、図面を参照しながら、本発
明の実施の形態を詳細に説明していく。図1はPKGの
一部断面図であり、一方の面を部品実装面1aとし、他
方の面を半田面1bとしている。そして、PKG本体1
に皿モミ(ざぐり孔)加工したスルーホール2を形成し
ている。図示のようにスルーホール2を形成するにあた
り、半田面1bからPKG本体肉厚α分は口径xの円筒
状内壁2bとしているが、そこから部品実装面1aまで
は次第にθ°に開いていくように形成(漏斗状に開口)
している。DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a partial cross-sectional view of the PKG. One surface is a component mounting surface 1a and the other surface is a solder surface 1b. And PKG body 1
A through hole 2 which is machined with a countersink is formed in the. In forming the through-hole 2 as shown in the figure, the PKG body thickness α from the solder surface 1b is the cylindrical inner wall 2b with a diameter x, but it gradually opens to θ ° from there to the component mounting surface 1a. Formed (opened like a funnel)
doing.
【0010】このようにスルーホール2を形成すること
により、スルーホール2の孔径を実質的に大きくするこ
となく、電気部品のリードを大きく外側に開いた開口2
aから挿入するようにしたので内部に導き入れやすくな
る。また、電気部品のリードが多くなってもスルーホー
ル2との位置合わせが困難になることはない。さらに一
旦挿入されると、リードは半田面1bからPKG本体肉
厚α分により規制され、電気部品の実装位置ずれを最小
限とすることができる。つまり、口径xの円筒状内壁2
bのみで形成されるスルーホール2と同様の実装位置ず
れに抑えることができる。By forming the through hole 2 as described above, the opening 2 in which the lead of the electric component is largely opened to the outside without substantially increasing the hole diameter of the through hole 2.
Since it is inserted from a, it can be easily introduced into the inside. Further, even if the number of leads of the electric component increases, the alignment with the through hole 2 does not become difficult. Further, once inserted, the lead is regulated by the thickness α of the PKG body from the solder surface 1b, and the mounting position deviation of the electric component can be minimized. That is, the cylindrical inner wall 2 having the diameter x
It is possible to suppress the mounting position deviation similar to the through hole 2 formed by only b.
【0011】図2は、皿モミ(ざぐり孔)加工したスル
ーホール2の平面図である。図示のようにスルーホール
2が他の電気部品と接続するためのパターン線3を挟ん
で2箇所にわたり形成され、それぞれのスルーホール2
を囲むように部品実装面1a側のランド4が平面方向縦
長に形成されている。ここで、部品実装面1a側のラン
ド4を説明すると、スルーホール2を皿モミスルーホー
ルとすることにより部品実装面1a側の開口が大きくな
り、本来は破線表示4aのようなランド4になってしま
う。すると、パターン線3をスルーホール2間に介在さ
せることができなくなるので、ランド4をパターン線3
を回避するように面方向縦長に形成し、パターン線3の
線引き効率の低下をきたさないようにしている。FIG. 2 is a plan view of a through hole 2 which has been machined with countersinks (counterbores). As shown in the figure, through holes 2 are formed in two places with a pattern line 3 for connecting with other electric parts interposed therebetween.
The land 4 on the component mounting surface 1a side is formed to be vertically long so as to surround the. Here, the land 4 on the component mounting surface 1a side will be described. By forming the through hole 2 as a countersunk through hole, the opening on the component mounting surface 1a side becomes large, and the land 4 originally looks like a broken line display 4a. Will end up. Then, since the pattern line 3 cannot be interposed between the through holes 2, the land 4 is not connected to the pattern line 3.
In order to avoid the above, it is formed in a longitudinal direction in the plane direction so that the drawing efficiency of the pattern line 3 is not deteriorated.
【0012】[0012]
【発明の効果】以上のごとく本発明によれば、インター
フェイス用入出力端子挿入口を漏斗状に開口するととも
に、漏斗状開口に連続する孔は必要最小限の口径にスル
ーホールを形成し、スルーホールの孔径を実質的に大き
くすることなく、電気部品のリードを大きく外側に開い
た開口から挿入するようにしたので内部に導き入れやす
くなる。また、電気部品のリードが多くなってもスルー
ホールとの位置合わせが困難になることはなく、作業性
の低下を招くことはない。さらに一旦挿入されると、リ
ードは円筒状内壁により規制され、電気部品の実装位置
ずれを最小限とすることができる。また、電気部品の実
装位置ずれを抑えることによりPKGの品質の均一化を
維持できる。As described above, according to the present invention, the interface input / output terminal insertion port is opened in a funnel shape, and the hole continuous to the funnel-shaped opening forms a through hole with a minimum necessary diameter. Since the lead of the electric component is inserted from a large opening to the outside without substantially increasing the hole diameter of the hole, it can be easily introduced into the inside. Further, even if the number of leads of the electric component increases, the alignment with the through hole does not become difficult, and the workability does not deteriorate. Further, once inserted, the lead is regulated by the cylindrical inner wall, and the mounting position deviation of the electric component can be minimized. Further, it is possible to maintain uniform PKG quality by suppressing the mounting position deviation of the electrical components.
【図1】PKGの一部断面図である。FIG. 1 is a partial cross-sectional view of a PKG.
【図2】皿モミ加工したスルーホールの平面図である。FIG. 2 is a plan view of a through hole that has been machined with a plate fir.
【図3】電気部品の一例を示した斜視図である。FIG. 3 is a perspective view showing an example of an electric component.
【図4】従来例に係るPKGの一部断面図である。FIG. 4 is a partial cross-sectional view of a PKG according to a conventional example.
1 PKG本体 1a 部品実装面 1b 半田面 2 スルーホール 2a 開口 2b 円筒状内壁 1 PKG body 1a Component mounting surface 1b Solder surface 2 Through hole 2a Opening 2b Cylindrical inner wall
Claims (1)
て電気部品のインターフェイス用入出力端子を挿入固着
するスルーホールを形成し、このスルーホールの近傍に
ランドが形成したプリント基板において、 前記インターフェイス用入出力端子挿入口を漏斗状に開
口するとともに、前記漏斗状開口に連続する孔は必要最
小限の口径にスルーホールを形成したことを特徴とする
プリント基板。1. A printed circuit board in which a through hole for inserting and fixing an interface input / output terminal of an electric component is formed from one surface of the substrate body to the other surface, and a land is formed in the vicinity of the through hole. The printed circuit board is characterized in that the input / output terminal insertion port is opened in a funnel shape, and a through hole is formed in the hole continuous to the funnel-shaped opening with a minimum necessary diameter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8124605A JPH09331144A (en) | 1996-05-20 | 1996-05-20 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8124605A JPH09331144A (en) | 1996-05-20 | 1996-05-20 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09331144A true JPH09331144A (en) | 1997-12-22 |
Family
ID=14889583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8124605A Pending JPH09331144A (en) | 1996-05-20 | 1996-05-20 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09331144A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100659509B1 (en) * | 2006-01-12 | 2006-12-20 | 삼성전기주식회사 | Pcb terminal |
JP2014239800A (en) * | 2013-06-12 | 2014-12-25 | 株式会社ソフイア | Game machine |
-
1996
- 1996-05-20 JP JP8124605A patent/JPH09331144A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100659509B1 (en) * | 2006-01-12 | 2006-12-20 | 삼성전기주식회사 | Pcb terminal |
JP2014239800A (en) * | 2013-06-12 | 2014-12-25 | 株式会社ソフイア | Game machine |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4787853A (en) | Printed circuit board with through-hole connection | |
US4856184A (en) | Method of fabricating a circuit board | |
US6175077B1 (en) | Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same | |
US7563104B2 (en) | Printed circuit board having connectors | |
JPS6016701A (en) | Microwave printed board circuit | |
JPH09331144A (en) | Printed board | |
US20030100287A1 (en) | Radiocommunication module in the form of an electronic macro-component , corresponding interface structure and transfer method onto a motherboard | |
JPH10126025A (en) | Through hole structure for printed wiring board | |
JPH02301182A (en) | Printed circuit board for flat mounting structure | |
JPH04322498A (en) | High-frequency apparatus | |
KR100594454B1 (en) | An Apparatus of printed circuit board for mobile terminal | |
JPH03257990A (en) | Mounting method for hybrid integrated circuit board | |
US7291912B2 (en) | Circuit board | |
JP2000277892A (en) | Printed circuit board and electronic component mounting board | |
JPS63283051A (en) | Substrate for hybrid integrated circuit device | |
JPH05327272A (en) | Electronic circuit apparatus | |
JPH0590440A (en) | Leadless package case for double-sided mounting board | |
JP2002185100A (en) | Lead structure of circuit board mounting component and structure for bonding lead of component to circuit board | |
JPH06350216A (en) | Printed board | |
JPH1197816A (en) | Printed wiring board | |
JPH04306901A (en) | High frequency circuit | |
JPH11330662A (en) | Printed board device | |
JP2010121163A (en) | Method of plating connector shell | |
JPS6017915Y2 (en) | Mounting jig for multi-terminal electrical elements | |
JP2002368350A (en) | Structure of printed board |