JPH09330944A - Wire bonding - Google Patents

Wire bonding

Info

Publication number
JPH09330944A
JPH09330944A JP16843296A JP16843296A JPH09330944A JP H09330944 A JPH09330944 A JP H09330944A JP 16843296 A JP16843296 A JP 16843296A JP 16843296 A JP16843296 A JP 16843296A JP H09330944 A JPH09330944 A JP H09330944A
Authority
JP
Japan
Prior art keywords
wire
capillary
ball
metal
connecting conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16843296A
Other languages
Japanese (ja)
Other versions
JP3233194B2 (en
Inventor
Kazumi Takahata
和美 高畠
Hiroshi Sata
弘 佐多
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP16843296A priority Critical patent/JP3233194B2/en
Publication of JPH09330944A publication Critical patent/JPH09330944A/en
Application granted granted Critical
Publication of JP3233194B2 publication Critical patent/JP3233194B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To enhance easily the bonding rate of a bonded part formed by ball bonding by a method wherein a ball-shaped part is pressed on the surface comprising recessed parts of a metal connection conductor by a capillary to form the ball-bonded part. SOLUTION: The wire pressing surface, that is, point surface of a capillary 4 is formed into a roughened surface (microscopic recessed and projected surfaces comprising a multitufe of recessed parts). For connecting a wire 6 with a first connection conductor 1, first, the wire 6 is fed out from the capillary 4 and the point part of the wire 6 is fused by discharge due to a discharge electrode (electric torch) or the flame of a hydrogen torch and is formed into a ball-shaped part 9. Then, the capillary 4 is moved downward to press the part 9 on the conductor 1 heated at 200 to 350 deg.C, for example, and ultrasonic vibrations are applied to the capillary 4, whereby the part 9 is crushed, a ball- bonded part is formed and the ball-bonded part of the wire 6 is secured to the conductor 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、セラミック基板又は半
導体基板の電極等の金属接続導体に対するワイヤボンデ
ィング方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method for a metal connecting conductor such as an electrode of a ceramic substrate or a semiconductor substrate.

【０００２】[0002]

【従来の技術】半導体装置又は電子回路装置等において
第１の接続導体と第２の接続導体とをワイヤボンディン
グ方法によってワイヤ（金属細線）で接続する際には、
ボールボンディングによってワイヤの一端を接続し、ウ
エッジボンディングによってワイヤの他端を接続する。2. Description of the Related Art In a semiconductor device, an electronic circuit device or the like, when connecting a first connecting conductor and a second connecting conductor with a wire (fine metal wire) by a wire bonding method,
One end of the wire is connected by ball bonding, and the other end of the wire is connected by wedge bonding.

【０００３】[0003]

【発明が解決しようとする課題】ところで、Ａｕ（金）
から成る接続導体に対してＡｕワイヤをボールボンディ
ングすると、Ａｕ−Ａｕ接合となるために合金化層が存
在せず、ボールボンド部分が下地の接続導体から剥離し
易い。これに対して、下地の接続導体がＡｌ（アルミニ
ウム）、ワイヤがＡｕの場合にはＡｕ−Ａｌ合金層が形
成され、ボールボンド部分の剥離が比較的生じ難くな
る。しかし、実際には、ボールボンディング時の接合部
分の加熱温度やボンディング時間の不足等によって合金
層の形成が不十分となり、十分な接合強度が得られない
ことがある。By the way, Au (gold)
When an Au wire is ball-bonded to a connection conductor made of, the alloying layer does not exist because of Au-Au bonding, and the ball bond portion is easily separated from the underlying connection conductor. On the other hand, when the underlying connecting conductor is Al (aluminum) and the wire is Au, an Au—Al alloy layer is formed, and peeling of the ball bond portion is relatively unlikely to occur. However, in practice, the alloy layer may not be sufficiently formed due to insufficient heating temperature of the bonding portion during ball bonding, insufficient bonding time, etc., and sufficient bonding strength may not be obtained.

【０００４】そこで、本発明の目的は、ボールボンディ
ングによるボンド部分の接合強度を容易に向上させるこ
とができるワイヤボンディング方法を提供することにあ
る。Therefore, an object of the present invention is to provide a wire bonding method capable of easily improving the bonding strength of the bond portion by ball bonding.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するため
の本発明は、金属接続導体に対して金属ワイヤをボール
ボンディング法で接続する方法であって、前記金属接続
導体に対してワイヤボンディング装置のキャピラリを当
接させて凹部（好ましくは多数の凹部を有する粗面）を
形成する工程と、前記キャピラリから金属ワイヤを繰り
出し、この金属ワイヤにボール状部分を形成し、前記キ
ャピラリによって前記ボール状部分を前記金属接続導体
の前記凹部を含む表面上に押し当ててボールボンド部を
形成する工程とを有していることを特徴とするワイヤボ
ンディング方法に係わるものである。なお、請求項２に
示すように第１及び第２の金属接続導体間を金属ワイヤ
で接続する場合において、第１の金属接続導体にワイヤ
をウエッジボンディングすると同時に第１の金属接続導
体の表面にキャピラリで凹部を形成し、この凹部の上に
ボールボンド部分を形成することが望ましい。また、請
求項３に示すようにキャピラリの先端面を金属接続導体
の表面より粗い表面即ち粗面とすることが望ましい。The present invention for achieving the above object is a method of connecting a metal wire to a metal connecting conductor by a ball bonding method, and a wire bonding apparatus for the metal connecting conductor. Forming a concave portion (preferably a rough surface having a large number of concave portions) by bringing the capillaries into contact with each other, and feeding a metal wire from the capillary to form a ball-shaped portion on the metal wire, and the ball-shaped portion is formed by the capillary. And a step of pressing a portion of the metal connecting conductor onto the surface of the metal connecting conductor including the recess to form a ball bond portion. When connecting the first and second metal connecting conductors with a metal wire as described in claim 2, the wire is wedge-bonded to the first metal connecting conductor and at the same time the surface of the first metal connecting conductor is bonded. It is desirable to form a concave portion with a capillary and form a ball bond portion on the concave portion. Further, as described in claim 3, it is preferable that the tip end surface of the capillary is rougher than the surface of the metal connecting conductor.

【０００６】[0006]

【発明の作用及び効果】各請求項の発明によれば、キャ
ピラリを使用して形成された接続導体の凹部を含む領域
にワイヤをボールボンディングするので、ボールボンド
部と凹部との噛み合いが生じ、ボールボンド部の接合強
度が大きくなり、ボールボンド部が剥離し難くなる。ま
た、キャピラリを接続導体に押し当てることによって凹
部を形成するので、凹部を形成するための特別な装置を
用意することが不要になる。この結果、コストの上昇及
び作業時間の増大をほとんど伴なわないでワイヤの接合
強度の向上を図ることができる。According to the invention of each claim, since the wire is ball-bonded to the region including the concave portion of the connecting conductor formed by using the capillary, the engagement between the ball bond portion and the concave portion occurs, The bonding strength of the ball bond portion is increased, and the ball bond portion is less likely to peel off. Further, since the recess is formed by pressing the capillary against the connection conductor, it is not necessary to prepare a special device for forming the recess. As a result, the bonding strength of the wire can be improved with almost no increase in cost and working time.

【０００７】[0007]

【実施例】次に、図１〜図８を参照して本発明の実施例
に係わる電子回路装置におけるワイヤボンディング方法
を説明する。この実施例においては、Ａｕ（金）又はＡ
ｇ（銀）等の金属層又は金属板から成る第１及び第２の
接続導体１、２間を３０μｍ〜５０μｍの直径を有する
Ａｕ（金）又はＣｕ（銅）等の金属細線から成るワイヤ
で接続する。なお、電極又は端子としての第１の接続導
体１はセラミック等の絶縁基板３の上に配置されてい
る。第１の接続導体１に対するワイヤの接続を強固にす
るために周知のワイヤボンディング装置のキャピラリ４
のワイヤ押圧面即ち先端面５が粗面（多数の凹部を含む
微小凹凸面）になっている。この先端面５は第１の接続
導体１の表面よりも粗い表面（例えば１μｍ程度の深さ
の凹部及び高さの凸部を多数含む表面）であることが望
ましい。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a wire bonding method in an electronic circuit device according to an embodiment of the present invention will be described with reference to FIGS. In this embodiment, Au (gold) or A
A wire made of a fine metal wire such as Au (gold) or Cu (copper) having a diameter of 30 μm to 50 μm between the first and second connection conductors 1 and 2 made of a metal layer such as g (silver) or a metal plate. Connecting. The first connecting conductor 1 as an electrode or a terminal is arranged on an insulating substrate 3 made of ceramic or the like. A capillary 4 of a known wire bonding device for strengthening the connection of the wire to the first connecting conductor 1.
The wire pressing surface, that is, the front end surface 5 is a rough surface (a minute uneven surface including many concave portions). It is desirable that the tip surface 5 be a surface that is rougher than the surface of the first connection conductor 1 (for example, a surface including a large number of concave portions having a depth of approximately 1 μm and convex portions having a height).

【０００８】キャピラリ４は第１及び第２の接続導体
１、２よりも硬い金属で形成されており、周知のように
中心に金属ワイヤ６を挿通するための貫通孔７を有し、
先細（逆円錐状）に形成されている。また、図７及び図
８から明らかなようにキャピラリ４の先端面５は先細に
なるように貫通孔７に対して傾斜しており、貫通孔７に
近い部分で最も突出している。従って、キャピラリ４の
先端面５の内でワイヤ６を押圧しない部分は接続導体１
に当接する。ワイヤボンディング装置はキャピラリ４を
垂直方向（上下方向）及び水平方向（左右方向）に移動
し且つ加圧し且つ超音波振動するための移動、加圧及び
振動装置８を有する。The capillary 4 is made of a metal harder than the first and second connection conductors 1 and 2, and has a through hole 7 for inserting the metal wire 6 in the center, as is well known.
It is formed in a tapered shape (inverted conical shape). Further, as is apparent from FIGS. 7 and 8, the front end surface 5 of the capillary 4 is inclined with respect to the through hole 7 so as to be tapered, and is most protruded in the portion close to the through hole 7. Therefore, the portion of the tip surface 5 of the capillary 4 that does not press the wire 6 is the connecting conductor 1.
Abut. The wire bonding device has a moving, pressurizing and vibrating device 8 for moving and pressurizing the capillary 4 in the vertical direction (vertical direction) and the horizontal direction (horizontal direction) and ultrasonically vibrating.

【０００９】第１の接続導体１に対してワイヤ６を接続
するためにまずキャピラリ４から繰り出し、ワイヤ６の
先端部分を図示が省略されている周知の放電電極（電気
ト−チ）による放電または水素トーチの火炎で溶融し、
図１に示すようにボール状部分９を形成する。In order to connect the wire 6 to the first connection conductor 1, first, the wire 6 is drawn out from the capillary 4, and the tip portion of the wire 6 is discharged by a known discharge electrode (electric torch) not shown in the drawing or Melted by the flame of a hydrogen torch,
A ball-shaped portion 9 is formed as shown in FIG.

【００１０】次に、キャピラリ４を下方に移動して例え
ば２００℃〜３５０℃に加熱されている第１の接続導体
１に対してボール状部分９を押し当て且つキャピラリ４
に超音波振動を加えることによって、ボール状部分９を
押しつぶして図２に示すようにボールボンド部１０を形
成し、ワイヤ６のボールボンド部１０を第１の接続導体
１に対して固着する。Next, the capillary 4 is moved downward, the ball-shaped portion 9 is pressed against the first connecting conductor 1 heated to, for example, 200 ° C. to 350 ° C., and the capillary 4 is pushed.
By applying ultrasonic vibration to the ball-shaped portion 9, the ball-shaped portion 9 is crushed to form the ball bond portion 10 as shown in FIG. 2, and the ball bond portion 10 of the wire 6 is fixed to the first connection conductor 1.

【００１１】次に、キャピラリ４を第１の接続導体１の
上方から一度離間させ、ワイヤ６を繰り出しながら引き
回すようにして第１の接続導体１のボールボンド部１０
から離れた領域に再びキャピラリ４を降下させ、図３及
び図８に示すようにワイヤ６をキャピラリ４の先端部に
よって径方向に押しつぶしてウエッジボンド部１１を形
成する。この際、キャピラリ４の粗面とされた先端面５
の一部分は第１の接続導体１に当接するので、第１の接
続導体１に粗面１２が形成される。なお、ウエッジボン
ディング時には第１の接続導体１を２００℃〜３５０℃
に加熱すると共にキャピラリ４に超音波振動を加える。
次に、ウエッジボンド部１１を形成した後にワイヤ６を
引き上げることによってウエッジボンド部１１からキャ
ピラリ４内のワイヤ６を切り離す。これにより、第１の
ワイヤ６ａが第１の接続導体１に接続された状態にな
る。この第１のワイヤ６ａは電気的接続には関与してい
ない。この第１のワイヤ６ａはウエッジボンディングに
よって粗面１２を能率的に形成するために生じたもので
ある。従って、第１のボールボンド部１０を設けない
で、ウエッジボンド部１１のみを設け、これにより粗面
１３を形成するように変更することができる。また、ワ
イヤ６のウエッジボンド部１１の形成を省いてキャピラ
リ４を第１の接続導体１の表面に移動及び加圧装置８に
よって押し当てて粗面１２を形成するように変更するこ
ともできる。Next, the capillaries 4 are once separated from above the first connecting conductor 1, and the wire 6 is pulled out while being drawn out.
The capillary 4 is lowered again to a region away from the wire 6, and the wire 6 is radially crushed by the tip of the capillary 4 in the radial direction to form the wedge bond portion 11, as shown in FIGS. At this time, the end surface 5 of the capillary 4 which is a rough surface
Since a part of the above contacts the first connecting conductor 1, a rough surface 12 is formed on the first connecting conductor 1. In addition, at the time of wedge bonding, the first connecting conductor 1 is set to 200 ° C. to 350 ° C.
And ultrasonic vibration is applied to the capillary 4.
Next, the wire 6 in the capillary 4 is separated from the wedge bond portion 11 by pulling up the wire 6 after forming the wedge bond portion 11. As a result, the first wire 6a is connected to the first connecting conductor 1. This first wire 6a is not involved in the electrical connection. The first wire 6a is generated in order to efficiently form the rough surface 12 by wedge bonding. Therefore, the first ball bond portion 10 may not be provided, and only the wedge bond portion 11 may be provided, whereby the rough surface 13 may be formed. Alternatively, the formation of the wedge bond portion 11 of the wire 6 may be omitted, and the capillary 4 may be moved to the surface of the first connecting conductor 1 and pressed by the pressing device 8 to form the rough surface 12.

【００１２】次に、キャピラリ４を第１の接続導体１か
ら上方に離間させ、ワイヤ６をキャピラリ４から繰り出
し、放電電極（電気ト−チ）の放電又は水素トーチの火
炎によってワイヤ６の先端部分に図４に示すようにボー
ル状部分１３を形成する。次に、キャピラリ４を２００
℃〜３５０℃程度に加熱されている第１の接続導体１に
向って降下させてボール状部分１３の少なくとも一部が
粗面１２にかかるようにボール状部分１３をキャピラリ
４で押圧して図５に示すように第２のボールボンド部１
４を形成する。この時にキャピラリ４に超音波振動を加
える。第１の接続導体１に超音波を伴なって熱圧着され
たボールボンド部１４は第１のウエッジボンド部１１に
若干（５０μｍ程度）重なるものの、その大部分は粗面
１２の上に結合される。粗面１２は多数の微小凹凸を有
するので、ボールボンド部１４と粗面１２とは凹凸によ
る噛み合いで強固に結合される。Next, the capillary 4 is separated from the first connecting conductor 1 upward, the wire 6 is drawn out from the capillary 4, and the tip of the wire 6 is discharged by the discharge of the discharge electrode (electric torch) or the flame of the hydrogen torch. As shown in FIG. 4, a ball-shaped portion 13 is formed. Next, set the capillary 4 to 200
The ball-shaped portion 13 is pressed by the capillary 4 so that at least a part of the ball-shaped portion 13 is brought into contact with the rough surface 12 by lowering the ball-shaped portion 13 toward the first connection conductor 1 that is heated to about ℃ to 350 ℃. As shown in FIG. 5, the second ball bond portion 1
4 is formed. At this time, ultrasonic vibration is applied to the capillary 4. The ball bond portion 14 thermocompression bonded to the first connection conductor 1 with ultrasonic waves slightly overlaps the first wedge bond portion 11 (about 50 μm), but most of it is bonded on the rough surface 12. It Since the rough surface 12 has a large number of minute irregularities, the ball bond portion 14 and the rough surface 12 are firmly coupled by meshing due to the irregularities.

【００１３】次に、ワイヤ６を伴なってキャピラリ４を
第１の接続導体１の上方に移動し、しかる後に第２の接
続導体２の上方に移動し、周知のウエッジボンディング
方法に従ってワイヤ６を２００℃〜３５０℃程度に加熱
された第２の接続導体２に対してキャピラリ４で押し当
てることによってワイヤ６を第２の接続導体２に熱圧着
し、図６に示すように第２のウエッジボンド部１５を形
成する。この時、キャピラリ４に超音波振動を加える。
しかる後、ウエッジボンド部１５からワイヤ６を切り離
す。これにより第１及び第２の接続導体１、２間が第２
のワイヤ６ｂで接続される。Next, the capillary 4 along with the wire 6 is moved above the first connecting conductor 1 and then above the second connecting conductor 2, and the wire 6 is moved according to a well-known wedge bonding method. The wire 6 is thermocompression-bonded to the second connecting conductor 2 by pressing it with the capillary 4 against the second connecting conductor 2 heated to about 200 ° C. to 350 ° C. As shown in FIG. The bond part 15 is formed. At this time, ultrasonic vibration is applied to the capillary 4.
Then, the wire 6 is separated from the wedge bond portion 15. As a result, there is a second gap between the first and second connection conductors 1 and 2.
Are connected by a wire 6b.

【００１４】第２のワイヤ６ｂの一端はボールボンド部
１４によって第１の接続導体１の粗面１２に固着されて
いるので、結合強度が比較的大きく、剥離し難い。ま
た、粗面１２は特別な器具を使用して形成されたもので
はなく、キャピラリ４を使用して形成したものである。
従って、電子回路装置の製造コストの上昇を抑えること
ができる。Since one end of the second wire 6b is fixed to the rough surface 12 of the first connecting conductor 1 by the ball bond portion 14, the bonding strength is relatively large and it is difficult to peel it off. The rough surface 12 is not formed by using a special tool, but is formed by using the capillary 4.
Therefore, an increase in the manufacturing cost of the electronic circuit device can be suppressed.

【００１５】[0015]

【変形例】本発明は上述の実施例に限定されるものでな
く、例えば次の変形が可能なものである。 （１） 先端面５を粗面とするための凹凸の深さを第１
の接続導体１の表面よりも粗い範囲（例えば０．５〜２
μｍ）において変えることができる。 （２） セラミック基板３の代りに半導体基板が設けら
れている場合にも本発明を適用することができる。 （３） キャピラリ４の先端面５に特別に粗面が形成さ
れていない場合であっても、キャピラリ４を第１の接続
導体１に押し当てることにより凹部を形成することがで
きる。 （４） 超音波振動を加えないで熱圧着のみでボ−ルボ
ンディング及び／又はウエッジボンディングすることが
できる。 （５） ボ−ルボンディング及び／又はウエッジボンデ
ィングをキャピラリ４を２００℃〜３５０℃程度に加熱
することを伴って行うことができる。また、ボ−ルボン
ディング及び／又はウエッジボンディングを、接続導体
１、２とキャピラリ４とのいずれか一方のみを加熱して
行うことができる。[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) The depth of the unevenness for making the tip surface 5 rough is the first
A rougher range than the surface of the connection conductor 1 (for example, 0.5 to 2)
μm). (2) The present invention can be applied to the case where a semiconductor substrate is provided instead of the ceramic substrate 3. (3) Even when the tip end surface 5 of the capillary 4 is not particularly roughened, the capillary 4 can be pressed against the first connection conductor 1 to form a recess. (4) Ball bonding and / or wedge bonding can be performed only by thermocompression bonding without applying ultrasonic vibration. (5) Ball bonding and / or wedge bonding can be performed by heating the capillary 4 to about 200 ° C to 350 ° C. Further, ball bonding and / or wedge bonding can be performed by heating only one of the connection conductors 1 and 2 and the capillary 4.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例に係わる電子回路装置のワイヤ
ボンディング部分及びワイヤボンダの一部を示す断面図
である。FIG. 1 is a cross-sectional view showing a wire bonding portion and a part of a wire bonder of an electronic circuit device according to an embodiment of the present invention.

【図２】第１のボールボンド部を形成した状態を示す断
面図である。FIG. 2 is a cross-sectional view showing a state in which a first ball bond portion is formed.

【図３】第１のウエッジボンド部を形成した状態を示す
断面図である。FIG. 3 is a cross-sectional view showing a state in which a first wedge bond portion is formed.

【図４】第２のボールボンディングのためのボールを形
成した状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state in which balls for second ball bonding have been formed.

【図５】第２のボールボンド部を形成した状態を示す断
面図である。FIG. 5 is a cross-sectional view showing a state in which a second ball bond portion is formed.

【図６】第２のウエッジボンド部を形成した状態を示す
断面図である。FIG. 6 is a cross-sectional view showing a state in which a second wedge bond portion is formed.

【図７】キャピラリを拡大して示す断面図である。FIG. 7 is an enlarged sectional view showing a capillary.

【図８】図３の一部を拡大して示す断面図である。8 is a sectional view showing a part of FIG. 3 in an enlarged manner.

【符号の説明】[Explanation of symbols]

１、２ 第１及び第２の接続導体 ４ キャピラリ ６ ワイヤ １２ 粗面 １４ ボールボンド部 1, 2 1st and 2nd connection conductor 4 Capillary 6 Wire 12 Rough surface 14 Ball bond part

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 金属接続導体に対して金属ワイヤをボー
ルボンディング法で接続する方法であって、 前記金属接続導体に対してワイヤボンディング装置のキ
ャピラリを当接させて凹部を形成する工程と、 前記キャピラリから金属ワイヤを繰り出し、この金属ワ
イヤにボール状部分を形成し、前記キャピラリによって
前記ボール状部分を前記金属接続導体の前記凹部を含む
表面上に押し当ててボールボンド部を形成する工程とを
有していることを特徴とするワイヤボンディング方法。1. A method of connecting a metal wire to a metal connecting conductor by a ball bonding method, which comprises contacting a capillary of a wire bonding device with the metal connecting conductor to form a recess, A step of paying out a metal wire from the capillary, forming a ball-shaped portion on the metal wire, and pressing the ball-shaped portion onto the surface including the recess of the metal connecting conductor by the capillary to form a ball bond portion. A wire bonding method characterized by having. 【請求項２】 第１の金属接続導体と第２の金属接続導
体とを金属ワイヤで接続する方法であって、 ワイヤボンディング装置のキャピラリから繰り出された
金属ワイヤを前記キャピラリで前記第１の金属接続導体
に押し当てることによって第１のウエッジボンド部を形
成すると同時に前記第１の金属接続導体の表面に前記キ
ャピラリを当接させて凹部を形成する工程と、 前記キャピラリから金属ワイヤを繰り出し、この金属ワ
イヤにボール状部分を形成し、前記キャピラリによって
前記ボール状部分を前記第１の金属接続導体の前記凹部
を含む表面上に押し当ててボールボンド部を形成する工
程と、 前記ボールボンド部に接続されている金属ワイヤを伴な
って前記キャピラリを前記第１の金属接続導体の上から
前記第２の金属接続導体の上に移動して金属ワイヤを前
記キャピラリで前記第２の金属接続導体に押し当てるこ
とによって第２のウエッジボンド部を形成する工程とを
有していることを特徴とするワイヤボンディング方法。2. A method for connecting a first metal connecting conductor and a second metal connecting conductor with a metal wire, wherein a metal wire fed from a capillary of a wire bonding apparatus is used with the first metal by the capillary. Forming a first wedge bond portion by pressing it against the connecting conductor and forming a recess by bringing the capillary into contact with the surface of the first metal connecting conductor; and feeding a metal wire from the capillary. Forming a ball-shaped portion on the metal wire and pressing the ball-shaped portion onto the surface of the first metal connecting conductor including the recess by the capillary to form a ball bond portion; The capillaries with the connected metal wires are placed on the first metal connecting conductor and on the second metal connecting conductor. A step of moving and pressing the metal wire against the second metal connecting conductor with the capillary to form a second wedge bond portion. 【請求項３】 前記キャピラリの先端面は金属ワイヤを
ボールボンディングする前記金属接続導体の表面よりも
粗い表面であることを特徴とする請求項１又は請求項２
記載のワイヤボンディング方法。3. The tip surface of the capillary is a surface that is rougher than the surface of the metal connecting conductor for ball-bonding a metal wire.
The wire bonding method described.
JP16843296A 1996-06-07 1996-06-07 Wire bonding method Expired - Fee Related JP3233194B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16843296A JP3233194B2 (en) 1996-06-07 1996-06-07 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16843296A JP3233194B2 (en) 1996-06-07 1996-06-07 Wire bonding method

Publications (2)

Publication Number Publication Date
JPH09330944A true JPH09330944A (en) 1997-12-22
JP3233194B2 JP3233194B2 (en) 2001-11-26

Family

ID=15868018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16843296A Expired - Fee Related JP3233194B2 (en) 1996-06-07 1996-06-07 Wire bonding method

Country Status (1)

Country Link
JP (1) JP3233194B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007504648A (en) * 2003-08-29 2007-03-01 フリースケール セミコンダクター インコーポレイテッド Capillary used for wire bonding and wire bonding of insulated wires
JP2009540624A (en) * 2006-07-03 2009-11-19 クリック アンド ソッファ インダストリーズ、インク． Bonding tool with improved finish

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007504648A (en) * 2003-08-29 2007-03-01 フリースケール セミコンダクター インコーポレイテッド Capillary used for wire bonding and wire bonding of insulated wires
JP2009540624A (en) * 2006-07-03 2009-11-19 クリック アンド ソッファ インダストリーズ、インク． Bonding tool with improved finish

Also Published As

Publication number Publication date
JP3233194B2 (en) 2001-11-26

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