JP3233194B2 - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JP3233194B2
JP3233194B2 JP16843296A JP16843296A JP3233194B2 JP 3233194 B2 JP3233194 B2 JP 3233194B2 JP 16843296 A JP16843296 A JP 16843296A JP 16843296 A JP16843296 A JP 16843296A JP 3233194 B2 JP3233194 B2 JP 3233194B2
Authority
JP
Japan
Prior art keywords
capillary
wire
connection conductor
ball
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP16843296A
Other languages
Japanese (ja)
Other versions
JPH09330944A (en
Inventor
和美 高畠
弘 佐多
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP16843296A priority Critical patent/JP3233194B2/en
Publication of JPH09330944A publication Critical patent/JPH09330944A/en
Application granted granted Critical
Publication of JP3233194B2 publication Critical patent/JP3233194B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、セラミック基板又は半
導体基板の電極等の金属接続導体に対するワイヤボンデ
ィング方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method for a metal connecting conductor such as an electrode of a ceramic substrate or a semiconductor substrate.

【０００２】[0002]

【従来の技術】半導体装置又は電子回路装置等において
第１の接続導体と第２の接続導体とをワイヤボンディン
グ方法によってワイヤ（金属細線）で接続する際には、
ボールボンディングによってワイヤの一端を接続し、ウ
エッジボンディングによってワイヤの他端を接続する。2. Description of the Related Art In a semiconductor device or an electronic circuit device, when connecting a first connection conductor and a second connection conductor by a wire (metal thin wire) by a wire bonding method,
One end of the wire is connected by ball bonding, and the other end of the wire is connected by wedge bonding.

【０００３】[0003]

【発明が解決しようとする課題】ところで、Ａｕ（金）
から成る接続導体に対してＡｕワイヤをボールボンディ
ングすると、Ａｕ−Ａｕ接合となるために合金化層が存
在せず、ボールボンド部分が下地の接続導体から剥離し
易い。これに対して、下地の接続導体がＡｌ（アルミニ
ウム）、ワイヤがＡｕの場合にはＡｕ−Ａｌ合金層が形
成され、ボールボンド部分の剥離が比較的生じ難くな
る。しかし、実際には、ボールボンディング時の接合部
分の加熱温度やボンディング時間の不足等によって合金
層の形成が不十分となり、十分な接合強度が得られない
ことがある。By the way, Au (gold)
When an Au wire is ball-bonded to a connection conductor made of Au, there is no alloying layer due to Au-Au bonding, and the ball-bonded portion is easily peeled from the underlying connection conductor. On the other hand, when the underlying connection conductor is Al (aluminum) and the wire is Au, an Au-Al alloy layer is formed, and the ball bond portion is relatively unlikely to peel. However, in practice, the formation of the alloy layer becomes insufficient due to the shortage of the heating temperature or the bonding time of the bonding portion during the ball bonding, and a sufficient bonding strength may not be obtained.

【０００４】そこで、本発明の目的は、ボールボンディ
ングによるボンド部分の接合強度を容易に向上させるこ
とができるワイヤボンディング方法を提供することにあ
る。An object of the present invention is to provide a wire bonding method capable of easily improving the bonding strength of a bonded portion by ball bonding.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するため
の本発明は、金属接続導体に対して金属ワイヤをボール
ボンディング法で接続する方法であって、前記金属接続
導体に対してワイヤボンディング装置のキャピラリを当
接させて凹部（好ましくは多数の凹部を有する粗面）を
形成する工程と、前記キャピラリから金属ワイヤを繰り
出し、この金属ワイヤにボール状部分を形成し、前記キ
ャピラリによって前記ボール状部分を前記金属接続導体
の前記凹部を含む表面上に押し当ててボールボンド部を
形成する工程とを有していることを特徴とするワイヤボ
ンディング方法に係わるものである。なお、請求項２に
示すように第１及び第２の金属接続導体間を金属ワイヤ
で接続する場合において、第１の金属接続導体にワイヤ
をウエッジボンディングすると同時に第１の金属接続導
体の表面にキャピラリで凹部を形成し、この凹部の上に
ボールボンド部分を形成することが望ましい。また、請
求項３に示すようにキャピラリの先端面を金属接続導体
の表面より粗い表面即ち粗面とすることが望ましい。According to the present invention, there is provided a method for connecting a metal wire to a metal connecting conductor by a ball bonding method, comprising the steps of: Forming a concave portion (preferably a rough surface having a large number of concave portions) by bringing the capillary into contact with the capillary, feeding a metal wire from the capillary, forming a ball-shaped portion on the metal wire, and forming the ball-shaped portion by the capillary. Pressing a portion on the surface of the metal connection conductor including the concave portion to form a ball bond portion. In the case where the first and second metal connection conductors are connected by a metal wire, the wire is wedge-bonded to the first metal connection conductor, and at the same time, the surface of the first metal connection conductor is connected to the first metal connection conductor. It is desirable to form a concave portion with a capillary and form a ball bond portion on the concave portion. Further, it is desirable that the tip end surface of the capillary be a surface rougher than the surface of the metal connection conductor, that is, a rough surface.

【０００６】[0006]

【発明の作用及び効果】各請求項の発明によれば、キャ
ピラリを使用して形成された接続導体の凹部を含む領域
にワイヤをボールボンディングするので、ボールボンド
部と凹部との噛み合いが生じ、ボールボンド部の接合強
度が大きくなり、ボールボンド部が剥離し難くなる。ま
た、キャピラリを接続導体に押し当てることによって凹
部を形成するので、凹部を形成するための特別な装置を
用意することが不要になる。この結果、コストの上昇及
び作業時間の増大をほとんど伴なわないでワイヤの接合
強度の向上を図ることができる。According to the invention of each claim, the wire is ball-bonded to the region including the concave portion of the connection conductor formed using the capillary, so that the ball bond portion and the concave portion are engaged with each other. The bonding strength of the ball bond part is increased, and the ball bond part is hardly peeled. Further, since the concave portion is formed by pressing the capillary against the connection conductor, it is not necessary to prepare a special device for forming the concave portion. As a result, it is possible to improve the bonding strength of the wire with almost no increase in cost and working time.

【０００７】[0007]

【実施例】次に、図１〜図８を参照して本発明の実施例
に係わる電子回路装置におけるワイヤボンディング方法
を説明する。この実施例においては、Ａｕ（金）又はＡ
ｇ（銀）等の金属層又は金属板から成る第１及び第２の
接続導体１、２間を３０μｍ〜５０μｍの直径を有する
Ａｕ（金）又はＣｕ（銅）等の金属細線から成るワイヤ
で接続する。なお、電極又は端子としての第１の接続導
体１はセラミック等の絶縁基板３の上に配置されてい
る。第１の接続導体１に対するワイヤの接続を強固にす
るために周知のワイヤボンディング装置のキャピラリ４
のワイヤ押圧面即ち先端面５が粗面（多数の凹部を含む
微小凹凸面）になっている。この先端面５は第１の接続
導体１の表面よりも粗い表面（例えば１μｍ程度の深さ
の凹部及び高さの凸部を多数含む表面）であることが望
ましい。Next, a wire bonding method in an electronic circuit device according to an embodiment of the present invention will be described with reference to FIGS. In this embodiment, Au (gold) or A
A wire made of a thin metal wire such as Au (gold) or Cu (copper) having a diameter of 30 μm to 50 μm between the first and second connection conductors 1 and 2 made of a metal layer or a metal plate such as g (silver). Connecting. The first connection conductor 1 as an electrode or a terminal is disposed on an insulating substrate 3 such as a ceramic. In order to strengthen the connection of the wire to the first connection conductor 1, a capillary 4 of a known wire bonding apparatus is used.
Is a rough surface (a fine uneven surface including a large number of concave portions). It is desirable that the front end surface 5 be a surface rougher than the surface of the first connection conductor 1 (for example, a surface including many concave portions having a depth of about 1 μm and many convex portions having a height).

【０００８】キャピラリ４は第１及び第２の接続導体
１、２よりも硬い金属で形成されており、周知のように
中心に金属ワイヤ６を挿通するための貫通孔７を有し、
先細（逆円錐状）に形成されている。また、図７及び図
８から明らかなようにキャピラリ４の先端面５は先細に
なるように貫通孔７に対して傾斜しており、貫通孔７に
近い部分で最も突出している。従って、キャピラリ４の
先端面５の内でワイヤ６を押圧しない部分は接続導体１
に当接する。ワイヤボンディング装置はキャピラリ４を
垂直方向（上下方向）及び水平方向（左右方向）に移動
し且つ加圧し且つ超音波振動するための移動、加圧及び
振動装置８を有する。The capillary 4 is formed of a metal harder than the first and second connection conductors 1 and 2, and has a through hole 7 for inserting a metal wire 6 at the center as is well known,
It is formed in a tapered (inverted conical shape). 7 and 8, the tip end surface 5 of the capillary 4 is inclined with respect to the through hole 7 so as to be tapered, and projects most at a portion near the through hole 7. Therefore, the portion of the distal end surface 5 of the capillary 4 that does not press the wire 6 is
Abut. The wire bonding apparatus has a moving, pressurizing and vibrating device 8 for moving the capillary 4 in the vertical direction (vertical direction) and the horizontal direction (horizontal direction), pressurizing, and ultrasonically vibrating.

【０００９】第１の接続導体１に対してワイヤ６を接続
するためにまずキャピラリ４から繰り出し、ワイヤ６の
先端部分を図示が省略されている周知の放電電極（電気
ト−チ）による放電または水素トーチの火炎で溶融し、
図１に示すようにボール状部分９を形成する。In order to connect the wire 6 to the first connection conductor 1, the wire 6 is first drawn out from the capillary 4, and the tip of the wire 6 is discharged by a well-known discharge electrode (electric torch) (not shown). Melted by the flame of a hydrogen torch,
A ball-shaped portion 9 is formed as shown in FIG.

【００１０】次に、キャピラリ４を下方に移動して例え
ば２００℃〜３５０℃に加熱されている第１の接続導体
１に対してボール状部分９を押し当て且つキャピラリ４
に超音波振動を加えることによって、ボール状部分９を
押しつぶして図２に示すようにボールボンド部１０を形
成し、ワイヤ６のボールボンド部１０を第１の接続導体
１に対して固着する。Next, the capillary 4 is moved downward to press the ball-shaped portion 9 against the first connection conductor 1 heated to, for example, 200.degree.
By applying ultrasonic vibration to the ball, the ball-shaped portion 9 is crushed to form a ball bond portion 10 as shown in FIG. 2, and the ball bond portion 10 of the wire 6 is fixed to the first connection conductor 1.

【００１１】次に、キャピラリ４を第１の接続導体１の
上方から一度離間させ、ワイヤ６を繰り出しながら引き
回すようにして第１の接続導体１のボールボンド部１０
から離れた領域に再びキャピラリ４を降下させ、図３及
び図８に示すようにワイヤ６をキャピラリ４の先端部に
よって径方向に押しつぶしてウエッジボンド部１１を形
成する。この際、キャピラリ４の粗面とされた先端面５
の一部分は第１の接続導体１に当接するので、第１の接
続導体１に粗面１２が形成される。なお、ウエッジボン
ディング時には第１の接続導体１を２００℃〜３５０℃
に加熱すると共にキャピラリ４に超音波振動を加える。
次に、ウエッジボンド部１１を形成した後にワイヤ６を
引き上げることによってウエッジボンド部１１からキャ
ピラリ４内のワイヤ６を切り離す。これにより、第１の
ワイヤ６ａが第１の接続導体１に接続された状態にな
る。この第１のワイヤ６ａは電気的接続には関与してい
ない。この第１のワイヤ６ａはウエッジボンディングに
よって粗面１２を能率的に形成するために生じたもので
ある。従って、第１のボールボンド部１０を設けない
で、ウエッジボンド部１１のみを設け、これにより粗面
１３を形成するように変更することができる。また、ワ
イヤ６のウエッジボンド部１１の形成を省いてキャピラ
リ４を第１の接続導体１の表面に移動及び加圧装置８に
よって押し当てて粗面１２を形成するように変更するこ
ともできる。Next, the capillary 4 is once separated from above the first connection conductor 1, and the wire 6 is drawn out while being drawn out, so that the ball bonding portion 10 of the first connection conductor 1 is drawn.
The capillary 4 is again lowered to a region away from the capillary 4, and the wire 6 is crushed in the radial direction by the tip of the capillary 4 to form the wedge bond portion 11 as shown in FIGS. 3 and 8. At this time, the roughened tip surface 5 of the capillary 4
Is in contact with the first connection conductor 1, so that the rough surface 12 is formed on the first connection conductor 1. At the time of wedge bonding, the first connection conductor 1 is kept at 200 ° C. to 350 ° C.
And ultrasonic vibration is applied to the capillary 4.
Next, the wire 6 in the capillary 4 is separated from the wedge bond portion 11 by pulling up the wire 6 after forming the wedge bond portion 11. Thereby, the first wire 6a is connected to the first connection conductor 1. This first wire 6a does not participate in the electrical connection. The first wire 6a is generated for efficiently forming the rough surface 12 by wedge bonding. Therefore, the first ball bond portion 10 is not provided, and only the wedge bond portion 11 is provided, whereby the rough surface 13 can be changed. Alternatively, the formation of the wedge bond portion 11 of the wire 6 may be omitted, and the capillary 4 may be moved to the surface of the first connection conductor 1 and pressed by the pressing device 8 to form the rough surface 12.

【００１２】次に、キャピラリ４を第１の接続導体１か
ら上方に離間させ、ワイヤ６をキャピラリ４から繰り出
し、放電電極（電気ト−チ）の放電又は水素トーチの火
炎によってワイヤ６の先端部分に図４に示すようにボー
ル状部分１３を形成する。次に、キャピラリ４を２００
℃〜３５０℃程度に加熱されている第１の接続導体１に
向って降下させてボール状部分１３の少なくとも一部が
粗面１２にかかるようにボール状部分１３をキャピラリ
４で押圧して図５に示すように第２のボールボンド部１
４を形成する。この時にキャピラリ４に超音波振動を加
える。第１の接続導体１に超音波を伴なって熱圧着され
たボールボンド部１４は第１のウエッジボンド部１１に
若干（５０μｍ程度）重なるものの、その大部分は粗面
１２の上に結合される。粗面１２は多数の微小凹凸を有
するので、ボールボンド部１４と粗面１２とは凹凸によ
る噛み合いで強固に結合される。Next, the capillary 4 is separated upward from the first connection conductor 1, and the wire 6 is paid out from the capillary 4, and the tip of the wire 6 is discharged by discharge of a discharge electrode (electric torch) or flame of a hydrogen torch. Then, a ball-shaped portion 13 is formed as shown in FIG. Next, the capillary 4 is set to 200
The ball-shaped portion 13 is pressed down by the capillary 4 so that at least a portion of the ball-shaped portion 13 falls on the rough surface 12 by being lowered toward the first connection conductor 1 which is heated to about 350 ° C. to 350 ° C. As shown in FIG. 5, the second ball bond portion 1
4 is formed. At this time, ultrasonic vibration is applied to the capillary 4. Although the ball bonding portion 14 thermocompression-bonded to the first connection conductor 1 with ultrasonic waves slightly overlaps the first wedge bonding portion 11 (about 50 μm), most of the ball bonding portion 14 is bonded to the rough surface 12. You. Since the rough surface 12 has a large number of minute irregularities, the ball bond portion 14 and the rough surface 12 are firmly joined by the engagement of the irregularities.

【００１３】次に、ワイヤ６を伴なってキャピラリ４を
第１の接続導体１の上方に移動し、しかる後に第２の接
続導体２の上方に移動し、周知のウエッジボンディング
方法に従ってワイヤ６を２００℃〜３５０℃程度に加熱
された第２の接続導体２に対してキャピラリ４で押し当
てることによってワイヤ６を第２の接続導体２に熱圧着
し、図６に示すように第２のウエッジボンド部１５を形
成する。この時、キャピラリ４に超音波振動を加える。
しかる後、ウエッジボンド部１５からワイヤ６を切り離
す。これにより第１及び第２の接続導体１、２間が第２
のワイヤ６ｂで接続される。Next, the capillary 4 is moved with the wire 6 above the first connecting conductor 1 and then moved with the wire 6 above the second connecting conductor 2, and the wire 6 is moved according to a well-known wedge bonding method. The wire 6 is thermocompressed to the second connection conductor 2 by pressing the second connection conductor 2 heated to about 200 ° C. to 350 ° C. with the capillary 4, and the second wedge is formed as shown in FIG. The bonding part 15 is formed. At this time, ultrasonic vibration is applied to the capillary 4.
After that, the wire 6 is cut off from the wedge bond portion 15. As a result, the space between the first and second connection conductors 1 and 2 becomes
Are connected by the wire 6b.

【００１４】第２のワイヤ６ｂの一端はボールボンド部
１４によって第１の接続導体１の粗面１２に固着されて
いるので、結合強度が比較的大きく、剥離し難い。ま
た、粗面１２は特別な器具を使用して形成されたもので
はなく、キャピラリ４を使用して形成したものである。
従って、電子回路装置の製造コストの上昇を抑えること
ができる。Since one end of the second wire 6b is fixed to the rough surface 12 of the first connection conductor 1 by the ball bond portion 14, the bonding strength is relatively large and the second wire 6b is not easily peeled. The rough surface 12 is not formed by using a special instrument, but is formed by using the capillary 4.
Therefore, an increase in the manufacturing cost of the electronic circuit device can be suppressed.

【００１５】[0015]

【変形例】本発明は上述の実施例に限定されるものでな
く、例えば次の変形が可能なものである。 （１） 先端面５を粗面とするための凹凸の深さを第１
の接続導体１の表面よりも粗い範囲（例えば０．５〜２
μｍ）において変えることができる。 （２） セラミック基板３の代りに半導体基板が設けら
れている場合にも本発明を適用することができる。 （３） キャピラリ４の先端面５に特別に粗面が形成さ
れていない場合であっても、キャピラリ４を第１の接続
導体１に押し当てることにより凹部を形成することがで
きる。 （４） 超音波振動を加えないで熱圧着のみでボ−ルボ
ンディング及び／又はウエッジボンディングすることが
できる。 （５） ボ−ルボンディング及び／又はウエッジボンデ
ィングをキャピラリ４を２００℃〜３５０℃程度に加熱
することを伴って行うことができる。また、ボ−ルボン
ディング及び／又はウエッジボンディングを、接続導体
１、２とキャピラリ４とのいずれか一方のみを加熱して
行うことができる。[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) The depth of the unevenness for making the tip end surface 5 rough is the first
(For example, 0.5 to 2)
μm). (2) The present invention can be applied to a case where a semiconductor substrate is provided instead of the ceramic substrate 3. (3) Even when the tip surface 5 of the capillary 4 does not have a particularly rough surface, the concave portion can be formed by pressing the capillary 4 against the first connection conductor 1. (4) Ball bonding and / or wedge bonding can be performed only by thermocompression bonding without applying ultrasonic vibration. (5) Ball bonding and / or wedge bonding can be performed while heating the capillary 4 to about 200 ° C. to 350 ° C. Further, ball bonding and / or wedge bonding can be performed by heating only one of the connection conductors 1 and 2 and the capillary 4.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施例に係わる電子回路装置のワイヤ
ボンディング部分及びワイヤボンダの一部を示す断面図
である。FIG. 1 is a cross-sectional view showing a wire bonding portion and a part of a wire bonder of an electronic circuit device according to an embodiment of the present invention.

【図２】第１のボールボンド部を形成した状態を示す断
面図である。FIG. 2 is a cross-sectional view showing a state where a first ball bond portion is formed.

【図３】第１のウエッジボンド部を形成した状態を示す
断面図である。FIG. 3 is a sectional view showing a state where a first wedge bond portion is formed.

【図４】第２のボールボンディングのためのボールを形
成した状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state where balls for second ball bonding are formed.

【図５】第２のボールボンド部を形成した状態を示す断
面図である。FIG. 5 is a sectional view showing a state where a second ball bond portion is formed.

【図６】第２のウエッジボンド部を形成した状態を示す
断面図である。FIG. 6 is a cross-sectional view showing a state where a second wedge bond portion is formed.

【図７】キャピラリを拡大して示す断面図である。FIG. 7 is an enlarged sectional view showing a capillary.

【図８】図３の一部を拡大して示す断面図である。FIG. 8 is an enlarged sectional view showing a part of FIG. 3;

【符号の説明】[Explanation of symbols]

１、２ 第１及び第２の接続導体 ４ キャピラリ ６ ワイヤ １２ 粗面 １４ ボールボンド部 1, 2 First and second connection conductors 4 Capillary 6 Wire 12 Rough surface 14 Ball bond portion

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭56−105644（ＪＰ，Ａ) 特開 平３−183139（ＪＰ，Ａ) 特開 平５−283461（ＪＰ，Ａ) 実開 平６−86339（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-56-105644 (JP, A) JP-A-3-183139 (JP, A) JP-A-5-283461 (JP, A) 86339 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) H01L 21/60

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 金属接続導体に対して金属ワイヤをボー
ルボンディング法で接続する方法であって、 前記金属接続導体に対してワイヤボンディング装置のキ
ャピラリを当接させて凹部を形成する工程と、 前記キャピラリから金属ワイヤを繰り出し、この金属ワ
イヤにボール状部分を形成し、前記キャピラリによって
前記ボール状部分を前記金属接続導体の前記凹部を含む
表面上に押し当ててボールボンド部を形成する工程とを
有していることを特徴とするワイヤボンディング方法。1. A method of connecting a metal wire to a metal connection conductor by a ball bonding method, wherein a step of contacting a capillary of a wire bonding apparatus with the metal connection conductor to form a concave portion, Paying out a metal wire from a capillary, forming a ball-shaped portion on the metal wire, and pressing the ball-shaped portion on the surface including the concave portion of the metal connection conductor by the capillary to form a ball bond portion. A wire bonding method, comprising: 【請求項２】 第１の金属接続導体と第２の金属接続導
体とを金属ワイヤで接続する方法であって、 ワイヤボンディング装置のキャピラリから繰り出された
金属ワイヤを前記キャピラリで前記第１の金属接続導体
に押し当てることによって第１のウエッジボンド部を形
成すると同時に前記第１の金属接続導体の表面に前記キ
ャピラリを当接させて凹部を形成する工程と、 前記キャピラリから金属ワイヤを繰り出し、この金属ワ
イヤにボール状部分を形成し、前記キャピラリによって
前記ボール状部分を前記第１の金属接続導体の前記凹部
を含む表面上に押し当ててボールボンド部を形成する工
程と、 前記ボールボンド部に接続されている金属ワイヤを伴な
って前記キャピラリを前記第１の金属接続導体の上から
前記第２の金属接続導体の上に移動して金属ワイヤを前
記キャピラリで前記第２の金属接続導体に押し当てるこ
とによって第２のウエッジボンド部を形成する工程とを
有していることを特徴とするワイヤボンディング方法。2. A method of connecting a first metal connection conductor and a second metal connection conductor with a metal wire, wherein the metal wire fed from a capillary of a wire bonding apparatus is connected to the first metal connection conductor by the capillary. Forming a recess by pressing the capillary against the surface of the first metal connection conductor at the same time as forming the first wedge bond by pressing against the connection conductor; and feeding out a metal wire from the capillary. Forming a ball-shaped portion on a metal wire, and pressing the ball-shaped portion on the surface of the first metal connection conductor including the concave portion by the capillary to form a ball-bonded portion; The capillary is connected with the connected metal wire from above the first metal connection conductor to above the second metal connection conductor. Moving the metal wire against the second metal connection conductor with the capillary to form a second wedge bond portion. 【請求項３】 前記キャピラリの先端面は金属ワイヤを
ボールボンディングする前記金属接続導体の表面よりも
粗い表面であることを特徴とする請求項１又は請求項２
記載のワイヤボンディング方法。3. The capillary according to claim 1, wherein a tip end surface of the capillary is rougher than a surface of the metal connection conductor for ball-bonding a metal wire.
The wire bonding method as described.
JP16843296A 1996-06-07 1996-06-07 Wire bonding method Expired - Fee Related JP3233194B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16843296A JP3233194B2 (en) 1996-06-07 1996-06-07 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16843296A JP3233194B2 (en) 1996-06-07 1996-06-07 Wire bonding method

Publications (2)

Publication Number Publication Date
JPH09330944A JPH09330944A (en) 1997-12-22
JP3233194B2 true JP3233194B2 (en) 2001-11-26

Family

ID=15868018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16843296A Expired - Fee Related JP3233194B2 (en) 1996-06-07 1996-06-07 Wire bonding method

Country Status (1)

Country Link
JP (1) JP3233194B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7261230B2 (en) * 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
CH700833B1 (en) * 2006-07-03 2010-10-29 Kulicke & Soffa Ind Inc Bonding tool with improved surface finish.

Also Published As

Publication number Publication date
JPH09330944A (en) 1997-12-22

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