JPH09330859A - Semiconductor production system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor production system being employed in the reaction process in which contamination is prevented when a reaction chamber is opened to the atmosphere. SOLUTION: Nitrogen gas is fed to a reaction chamber 34 having a cover part 34a by opening a supply valve 35 and then the reaction chamber 34 is evacuated by means of an exhaust valve 39 and a vacuum pump 40 through external discharge piping 41. A detecting section 37 detects the inner pressure of the reaction chamber 34 and the pressure open to the atmosphere and then a suction means 43 discharges the gas through the external discharge piping 41 from the vacuum piping 38 side.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus used in a reaction step in semiconductor manufacturing. 2. Description of the Related Art In recent years, in the manufacture of semiconductor devices, fine patterning has been advanced, and generally, semiconductor manufacturing devices having high resolution and good controllability of size and shape have been used. In particular, in semiconductor manufacturing equipment such as etching equipment, CVD equipment, and ion implantation (IC) equipment installed in a clean room,
The reaction chamber is opened to the atmosphere to remove chemical pollution and offensive odors.
The jigs inside the reaction chamber are exchanged and the inside of the reaction chamber is cleaned regularly. Therefore, it is necessary to prevent contamination of the clean room by the reaction chamber when the reaction chamber is opened to the atmosphere.

[0002]

2. Description of the Related Art FIG. 8 is a block diagram of a conventional manufacturing apparatus used in a reaction step in semiconductor manufacturing. In FIG. 8, a reaction chamber 12 is installed in a clean room 11, and a gas leak alarm 13 is installed. Further, an external exhaust duct 14 that connects the inside of the clean room 11 to the inside of the clean room 11 is movably installed by a bellows or the like.

An upper portion of the reaction chamber 12 is openable by a lid portion 12a, and a gas supply pipe 16 having a supply valve 15 for supplying nitrogen gas is connected to prepare for opening to the atmosphere after the reaction process. It Also, the reaction chamber 12
A vacuum pipe 18 equipped with an exhaust valve 17 is connected to dilute the gas inside with the nitrogen gas and discharge the diluted gas. Although not shown, an atmospheric pressure sensor for monitoring the atmospheric pressure inside the reaction chamber 12 is provided.

On the other hand, the vacuum pipe 18 has a pump chamber 21.
Is connected to a vacuum pump 22 that is extended to the outside and is driven by a commercial power source, and an exhaust pipe 23 that performs external exhaust is connected to the vacuum pump 22. With the above configuration,
In the normal reaction chamber 12, the supply valve 15 is closed, the exhaust valve 17 is open, and the vacuum pump 22 maintains the operation, so that the vacuum state is maintained in a so-called vacuum state. Further, nitrogen is supplied when the exhaust valve 17 is closed and the supply valve 15 is open. At this time, the internal pressure of the reaction chamber 12 is monitored by the atmospheric pressure sensor, and when the internal pressure reaches the atmospheric pressure, the supply valve 1
5 is closed, and the reaction chamber 12 is at atmospheric pressure.

After the vacuuming and the nitrogen supply are repeated several times, the lid 12a of the reaction chamber 12 is opened to open the atmosphere. Then, while the external exhaust duct 14 is brought close to the reaction chamber to suck in chemical contamination and an offensive odor, the internal jig of the reaction chamber 12 is exchanged and the internal cleaning is performed.

[0006]

However, when the reaction chamber 12 is opened to the atmosphere, the method of reducing the chemical contamination and the offensive odor by repeating the evacuation and the nitrogen supply is sufficient gas supply time and evacuation time. Moreover, since these are repeated several times, there is a problem that a great amount of preparation time is required to reduce the offensive odor.

In addition, an external exhaust duct 14 for sucking in chemical pollution and offensive odors must be installed in the clean room 11 so that its intake port is installed near the reaction chamber 12 and the exhaust port is communicated with the outside. . further,
Even if the evacuation of the reaction chamber 12 and the supply of nitrogen are repeated, only chemical pollution or offensive odor emission from the reaction chamber 12 to the clean room 11 is reduced, which cannot be completely prevented. There is a problem in that the machine 13 may detect the situation, and the production process may have to be interrupted in order to investigate the cause.

Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor manufacturing apparatus for preventing contamination when the reaction chamber is open to the atmosphere.

[0009]

In order to solve the above-mentioned problems, the first aspect of the present invention includes a reaction chamber having an openable lid for performing a predetermined reaction process in semiconductor manufacturing. In a semiconductor manufacturing apparatus having a supply means for supplying a predetermined gas to the chamber and an exhaust means for discharging the gas in the reaction chamber together with the gas, a detection means for detecting the opening of the lid of the reaction chamber and an opening by the detection means. A semiconductor manufacturing apparatus is configured to include a suction unit that sucks the gas in the reaction chamber from the exhaust unit side and discharges the gas to the outside upon detection.

According to a second aspect of the present invention, the exhaust means according to the first aspect includes an exhaust drive section interposed in an exhaust pipe connecting the reaction chamber and an exhaust port, and an exhaust opening / closing section whose opening / closing is controlled by the suction section. However, at least the exhaust opening / closing portion is closed during the operation of the suction means. In the third aspect, the detection means according to the first aspect detects the opening of the lid of the reaction chamber and the pressure in the reaction chamber due to the opening of the lid.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the suction means includes a suction opening / closing portion provided in a suction pipe branching from the exhaust pipe of the exhaust means, and an inside of the reaction chamber. A suction drive unit that sucks gas, and a suction control unit that stops the exhaust of the exhaust unit in response to detection by the detection unit and drives the suction drive unit by opening the suction opening / closing unit. .

According to a fifth aspect of the present invention, in any one of the first to third aspects, the suction means causes the exhaust drive part for exhausting the exhaust means to perform an exhaust operation during exhaust, and the lid of the reaction chamber. And a suction control unit that controls the drive control unit to control the exhaust operation or the suction operation of the exhaust drive unit according to the detection from the detection unit. .

According to a sixth aspect of the present invention, in any one of the first to third aspects, the suction means communicates with the exhaust drive section that branches from the exhaust pipe of the exhaust means to exhaust the exhaust means. A suction opening / closing unit provided in the suction pipe, a suction control unit that drives the suction driving unit by opening the suction opening / closing unit in response to a detection from the detection unit, and a suction control unit provided in the suction pipe, And a flow path throttle unit that makes the exhaust drive unit drivable when the lid of the reaction chamber is opened.

As described above, in the inventions of claims 1 to 3,
A predetermined gas is supplied by a supply means to a reaction chamber having a lid, and the internal gas is exhausted by, for example, an exhaust opening / closing portion and an exhaust driving portion of the exhaust means. The opening of the lid and the internal pressure are detected by the detecting means. Then, the suction means sucks and discharges the gas in the reaction chamber from the exhaust means side in response to the open pressure detection and the pressure detection. As a result, the gas inside the reaction chamber due to opening to the atmosphere in the reaction chamber is exhausted from the suction means, so that the preparation time for opening to the atmosphere can be shortened and external contamination can be prevented.

In the invention of claim 4, the suction means has a suction opening / closing part and a suction driving part in the suction pipe branched from the exhaust pipe, and the suction control part stops the exhaust means by the detection of the detection means and opens / closes the suction means. The part is opened to drive the suction drive part. This makes it possible to prevent pollution when the reaction chamber is open to the atmosphere.

According to the invention of claim 5, the suction means has a drive control section for causing the exhaust drive section of the exhaust means to perform the exhaust operation and the suction operation, and the drive control section responds to the detection of the detection means in the suction control section. Is controlled by an exhaust operation or a suction operation. This makes it possible to prevent pollution when the reaction chamber is open to the atmosphere.

In a sixth aspect of the invention, the suction means has a suction opening / closing section, a suction control section and a channel narrowing section, and the suction control section detects the opening of the reaction chamber to the atmosphere and the suction control section and the channel narrowing section. Suction and discharge are performed by the exhaust drive unit of the exhaust unit along the path. This makes it possible to prevent pollution when the reaction chamber is open to the atmosphere.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a principle diagram of a first embodiment of the present invention. FIG. 1 shows a principle diagram of a semiconductor manufacturing apparatus 31 used for a reaction process such as etching, CVD (chemical vapor deposition), II (ion implantation) in semiconductor manufacturing. Equipment in a clean room 32 is shown in FIG. And the equipment in the pump chamber 33.

A reaction chamber 34 in which a reaction process is carried out is installed in the clean room 32, and a lid portion 34a is provided above the reaction chamber 34 so as to be openable and closable. In this reaction chamber 34,
For example, it is necessary to discharge the processing residue (chemical contamination or offensive odor) generated after the reaction processing in order to replace the internal jig or clean the inside. For example, nitrogen for diluting the processing residue into the reaction chamber 34 is used. A gas supply pipe 36 having a supply valve 35 as a supply means for supplying gas into the room is attached.

The inside or outside of the reaction chamber 34 (the lid 3
4a is also included), an atmosphere open detection unit 37 as detection means is provided. The atmosphere release detection unit 37 includes an atmosphere release sensor that detects that the lid 34a is in an open state and an atmospheric pressure sensor that detects that the inside of the reaction chamber 34 is at atmospheric pressure, as described later.

Further, the reaction chamber 34 is attached with a vacuum pipe 38 which is an exhaust pipe for exhausting the processing residue, and the vacuum pipe 38 is provided with a pump chamber 33 with an exhaust valve 39 which is an exhaust opening / closing portion interposed therebetween. Is connected to a vacuum pump 40 which is an exhaust driving unit, and an external exhaust pipe 41 is attached from the other side of the vacuum pump 40 to communicate with the outside.
The vacuum pump 40 is, for example, a commercial power source (50 Hz / 60
Hz).

On the other hand, the suction pipe 42 branched from the vacuum pipe 38 is connected to the suction means 43 (partly arranged in the clean room 32) in the pump chamber 33, and the other side of the suction means 43 is connected to the external exhaust pipe 41. Communicated. This suction means 4
Reference numeral 3 denotes a predetermined detection signal from the atmosphere open detection unit 37, which appropriately controls the exhaust valve 39 to be in a closed state, sucks the processing residue in the reaction chamber 34, and externally exhausts the exhaust pipe 4
1 is discharged to the outside.

In such a semiconductor manufacturing apparatus 31, a predetermined reaction process is performed in a state where the reaction chamber 34 is closed by the lid 34a, and after the process, the exhaust valve 39 is closed and the supply valve 35 is opened. Nitrogen gas is supplied to the reaction chamber 34. Further, the supply valve 35 is closed, the exhaust valve 39 is opened, and the inside of the reaction chamber 34 is evacuated by the vacuum pump 40 to remove nitrogen gas and processing residues in the reaction chamber 34 by a predetermined amount. To discharge. By performing these a predetermined number of times, the lid 34a of the reaction chamber 34 is opened.

The opening of the lid portion 34a is detected by the atmosphere opening detection portion 37 (the atmospheric pressure in the reaction chamber 34 is also detected), whereby the suction means 43 operates and the reaction chamber is passed through the vacuum pipe 38 and the suction pipe 42. The chemical pollution and the offensive odor in 34 are sucked and discharged to the outside through the external exhaust pipe 41. That is, the vacuum pipe 3
8. The inner jig of the reaction chamber 34 is exchanged and the inner space thereof is cleaned while exhausting air through the suction pipe 42. In this case, the exhaust valve 39 is prevented so that the vacuum pump 40, which requires a long time to start up, does not go into a down state (a state where vacuum operation is not normally performed).
Is closed.

As described above, when the reaction chamber 34 is opened to the atmosphere, chemical pollution and offensive odors are sucked by the suction means 43 into the vacuum pipe 38.
Since the air is sucked and exhausted to the external exhaust pipe 43 through the suction pipe 42, it is possible to prevent the chemical pollution and the release of the offensive odor in the clean room 32. Further, the number of times of supplying nitrogen gas and vacuuming by the vacuum pump 40 in preparation for opening to the atmosphere can be reduced, and the preparation time can be shortened. Further, since it is not necessary to install an external exhaust duct in the clean room 32, and the gas leak alarm or the like is not activated, the production line is not interrupted and no trouble is caused. .

Next, FIG. 2 shows a block diagram of the first embodiment of the present invention. The semiconductor manufacturing apparatus 31 shown in FIG. 2 comprises the suction means 43 shown in FIG. 1 with a suction valve 51 as a suction opening / closing section, a suction fan 52 as a suction driving section, and a suction control section 53. That is, the suction pipe 42 branched from the vacuum pipe 51 is connected to the suction fan 52 through the suction valve 51, and the other side of the suction fan 52 is connected to the external exhaust pipe 41. Further, the suction control unit 53
The suction fan 52 is driven and controlled based on a detection signal from the atmosphere open detection unit 37, and the opening / closing of the suction valve 51 and the exhaust valve 39 is controlled. Other configurations are the same as those in FIG. 1, and the description thereof will be omitted.

When the lid 34a in the reaction chamber 34 is closed, a supply valve 35 for supplying nitrogen gas is provided.
And the opening / closing control of the evacuation valve 39 for evacuation are performed by another control unit (not shown).
Here, FIG. 3 shows a circuit diagram of the atmosphere release detection unit and the suction control unit of FIG. In FIG. 3, the atmosphere release detection unit 37
Is composed of an atmosphere open sensor 61 and an atmospheric pressure sensor 62, and the other circuit configuration constitutes a suction control section 53. The atmosphere open sensor 61 is composed of a light emitting diode LED and a phototransistor PT, and the anode of the light emitting diode is connected to the power supply voltage Vd via a resistor R1,
The cathode is grounded. In addition, the phototransistor PT
Is connected to the power supply voltage Vc via the resistor R2, is connected to the input terminal of the inverter circuit INV1, and the emitter is grounded.

On the other hand, the atmospheric pressure sensor 62, which performs a switching operation, becomes conductive when it detects atmospheric pressure. One terminal of the atmospheric pressure sensor 62 is grounded, and the other terminal is connected to the power supply voltage Vc via the resistor R3 and also connected to the input terminal of the inverter circuit INV2.

The above two inverter circuits INV1 and INV
Each output terminal of V2 is a 2-input AND gate circuit A
The two input terminals of ND1 are respectively connected, and the output terminal of the AND gate circuit AND1 is connected so as to be output to the suction valve 51 and the suction fan 52 as a control signal. The output of the AND gate circuit AND1 is connected as a control signal of an inverter control unit or a throttle valve described later.

The output terminal of the AND gate circuit AND1 is connected to the input terminal of the inverter circuit INV3, and the output terminal of the inverter circuit INV3 is connected to one input terminal of the 2-input AND gate circuit AND2. The other input end of the AND gate circuit AND2 is connected so that an open / close signal of the exhaust valve 39 from the above-mentioned control unit (not shown) is input. And AND gate circuit AND
The output terminal of 2 is connected so as to be output to the exhaust valve 39 as a control signal.

In the above circuit, when the reaction chamber 34 is closed by the lid portion 34a, the atmosphere open sensor 61 is provided.
The light from the light emitting diode LED of is blocked by the phototransistor PT and is not received by the inverter circuit INV.
The output of 1 is "L". In this case, the supply valve 35 is opened, nitrogen gas is supplied into the reaction chamber 34 to reach atmospheric pressure, and even if the output of the inverter circuit INV2 becomes "H" as detected by the atmospheric pressure sensor 62 and the AND gate. The output of the circuit AND1 is “L”, and the drive control signal is not output to the suction valve 51 and the suction fan 52.

Since the output of the AND gate circuit AND1 is "L", the output of the inverter circuit INV3 is "H". Therefore, according to the open / close signal of the exhaust valve 39 input to the AND gate circuit AND2, the open / close control signal is output from the AND gate circuit AND2 to the exhaust valve 39.

On the other hand, when the lid portion 34a of the reaction chamber 34 is opened, the light of the light emitting diode LED of the atmosphere open sensor 61 biases the base of the phototransistor PT to the ON state, so that the output of the inverter circuit INV1 is output. It becomes "H". When the reaction chamber 34 becomes atmospheric pressure by opening the lid 34a, the atmospheric pressure sensor 62 is turned on and the output of the inverter circuit INV2 becomes "H".
Therefore, the output of the AND gate circuit AND1 becomes “H”, the suction valve 51 is opened, and the suction fan 52 is opened.
A control signal is output to drive the.

As a result, the chemical pollution and the offensive odor in the reaction chamber 34 are discharged to the clean room 32 through the external exhaust pipe 41. In this case, since the output of the AND gate circuit AND1 is “H”, the output of the inverter circuit INV3 is “L”, and the output of the AND gate circuit AND2 is the input signal for opening / closing the exhaust valve 39. Regardless, it becomes "L" and the exhaust valve 39
Is closed.

Therefore, FIG. 4 shows an explanatory view of the pressure state in the reaction chamber. Further, FIG. 5 shows an operation timing chart in the pressure state in the reaction chamber. 4 and 5 show a sequence (S1 to S7) of transition of the pressure state of the reaction chamber. In S1 of FIGS. 4 and 5, the exhaust valve 39 is in the open state (FIG. 5 (B)). Sometimes vacuum pump 40
Therefore, the reaction chamber 34 is in a vacuum state. When the exhaust valve 39 is closed from this state (FIG. 5 (B)) and the supply valve 35 is opened to supply nitrogen gas, the atmospheric pressure in the reaction chamber 34 gradually rises (S2, FIG. A)),
The pressure rises to atmospheric pressure and the maintenance state is reached (S3). In this state, the atmospheric pressure sensor 62 shown in FIG. 3 is turned on (FIG. 5 (D)).

At this time, when the lid portion 34a of the reaction chamber 34 is opened, the atmosphere open sensor 61 shown in FIG. 3 is turned on (S4, FIG. 5C). And the suction valve 5
1 is opened (FIG. 5 (E)) and the suction fan 52 is driven to perform the suction operation (S4, FIG. 5).
(F)). That is, the chemical contamination and the offensive odor in the reaction chamber 34 are not emitted into the clean room 32 and are discharged together with the nitrogen gas through the external exhaust pipe 41. In this state, the internal jig exchange and internal cleaning of the reaction chamber 34 are performed. Be seen.

Subsequently, when the exchange of the internal jig in the reaction chamber 34 is completed, the lid 34a is closed and the atmosphere open sensor 61 is turned off (S5, FIG. 5C). In this state, the inside of the reaction chamber 34 is in the atmospheric pressure state, and the atmospheric pressure sensor 62 remains in the ON state (FIG. 5 (D)). And
By closing the exhaust valve 39, evacuation of the reaction chamber 34 by the vacuum pump 40 is started (S6). At this time, the atmospheric pressure sensor 62 is turned off (see FIG. 5).
(D)). Even if the inside of the reaction chamber 34 is in a vacuum state, the exhaust valve 39 is maintained in the open state and the vacuum pump 40 maintains the vacuum state in the reaction chamber 34.

3 shows the case where a transmission type or a reflection type optical sensor is used as the atmosphere open sensor 61, and any type of optical sensor can be used by providing a cover plate on the lid 34a. It can be appropriately enabled. Further, when it is desired to temporarily stop the suction operation when opening to the atmosphere, a manual switch that temporarily shuts off the power supply voltage Vd of the light emitting diode LED of the atmosphere opening sensor 61 may be provided. Further, a filter or the like may be provided on any part of the suction pipe 42, and it is possible to prevent foreign matter from entering due to this. The same applies to the following examples.

Next, FIG. 6 shows a block diagram of a second embodiment of the present invention. In the semiconductor manufacturing apparatus 31 shown in FIG. 6, the suction pipe 42 shown in FIG.
The function of the suction fan 52 is such that the vacuum pump 40 is connected not by the commercial power source but by the inverter control unit 54 that is driven and controlled by the suction control unit 53. The vacuum pump 40
It has been used for both. That is, the suction means 43
The suction pipe 42, the suction valve 51, the suction control unit 53, the inverter control unit 54, and the vacuum pump 40 (also serving as an exhaust unit) are used. The rest of the configuration is similar to that of FIG. 2, and the description is omitted.

The vacuum pump 40 uses, for example, an induction motor as a drive source and is evacuated by driving it with a commercial power source (50 Hz / 60 Hz). However, when the reaction chamber 34 is open to the atmosphere. Neither evacuation nor suction can be performed. Therefore, the inverter control unit 54
Supplies to the vacuum pump 40 a power source having the same frequency as the commercial power source when vacuuming, and supplies a power source having a frequency (for example, 20 to 30 Hz) smaller than the commercial power source frequency when sucking, thereby increasing the rotation speed. It is intended to reduce the number of suction fans instead of suction fans. In this case, the inverter control unit 54 is controlled by the suction control unit 53 such as a frequency instruction according to the detection of the atmosphere open detection unit 37.

As a result, the same operation and effect as in FIG. 2 can be obtained, and the suction fan is not required, and the cost can be reduced. Although the diameter of the suction pipe 42 is set to, for example, half the diameter of the vacuum pipe 38 to reduce the load of the suction operation in the vacuum pump 40, the diameter of the vacuum pipe 38 can be simultaneously evacuated and sucked. By setting the range, the suction valve 51 and the suction pipe 42 can be omitted. In this case, the exhaust valve 3
The suction valve 51 of 9 also serves as a function.

Next, FIG. 7 shows a block diagram of a third embodiment of the present invention. The semiconductor manufacturing apparatus 31 shown in FIG. 7 is provided with a throttle valve 55 as a flow passage throttle unit in the suction pipe 42 shown in FIG. 6 and omits the inverter control unit 54. Other configurations are the same as those in FIG. is there. The throttle valve 55 is, for example, a variable orifice, and is driven by the suction controller 53 when the reaction chamber 34 is open to the atmosphere.

In this case, the vacuum pump 40 is a commercial power source (5
It is driven at 0 Hz / 60 Hz), but when the reaction chamber 34 is opened to the atmosphere, the throttle valve 55 can reduce the load on the vacuum pump to perform suction similar to the suction fan described above. is there. As a result, the same operation and effect as those in FIG. 2 can be obtained, and the suction fan and the inverter control unit are not required, and the cost can be reduced.

[0044]

As described above, according to the inventions of claims 1 to 3, a predetermined gas is supplied to the reaction chamber having a lid by the supply means, and the internal gas is exhausted, for example, an exhaust opening / closing section and an exhaust drive section. The opening of the lid and the internal pressure are detected by the detection means, and the suction means sucks and discharges the gas in the reaction chamber from the exhaust means side according to the open pressure detection and the pressure detection. Since the internal gas of the reaction chamber is exhausted by the suction means when the reaction chamber is opened to the atmosphere, the preparation time for opening to the atmosphere can be shortened and external contamination can be prevented.

According to the invention of claim 4, the suction means has a suction opening / closing part and a suction drive part in the suction pipe branched from the exhaust pipe, and the suction control part stops the exhaust means by detection of the detection means. By opening the suction opening / closing portion and driving the suction driving portion, it is possible to prevent contamination when the reaction chamber is opened to the atmosphere.

According to the fifth aspect of the invention, the suction means has a drive control section for causing the exhaust drive section of the exhaust means to perform the exhaust operation and the suction operation, and the suction control section drives the exhaust drive section in response to the detection by the detection means. By controlling the control unit by the exhaust operation or the suction operation, it is possible to prevent contamination when the reaction chamber is opened to the atmosphere.

According to the sixth aspect of the present invention, the suction means has a suction opening / closing section, a suction control section, and a flow path restricting section, and the suction control section detects the opening of the reaction chamber to the atmosphere and the suction control section and the flow path. It is possible to prevent pollution when the reaction chamber is opened to the atmosphere by causing the exhaust drive unit of the exhaust unit to perform suction and discharge through the path to the throttle unit.

[Brief description of drawings]

FIG. 1 is a principle diagram of a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a first embodiment of the present invention.

FIG. 3 is a circuit diagram of an atmosphere open detection unit and a suction control unit of FIG.

FIG. 4 is an explanatory diagram of a pressure state in the reaction chamber.

FIG. 5 is an operation timing chart in a pressure state in the reaction chamber.

FIG. 6 is a configuration diagram of a second embodiment of the present invention.

FIG. 7 is a configuration diagram of a third embodiment of the present invention.

FIG. 8 is a block diagram of a manufacturing apparatus used in a conventional semiconductor manufacturing reaction process.

[Explanation of symbols]

 31 Semiconductor Manufacturing Equipment 32 Clean Room 33 Pump Room 34 Reaction Chamber 34a Lid 35 Supply Valve 37 Atmosphere Opening Detection Section 38 Vacuum Piping 39 Exhaust Valve 40 Vacuum Pump 41 External Exhaust Piping 42 Suction Piping 43 Suction Means 51 Suction Valve 52 Suction Fan 53 Suction Control unit 54 Inverter control unit 55 Throttle valve 61 Atmosphere opening sensor 62 Atmospheric pressure sensor

Claims (6)

[Claims] 1. A reaction chamber having an openable lid portion for performing a predetermined reaction process in semiconductor manufacturing, a supply means for supplying a predetermined gas to the reaction chamber, and a reaction chamber in the reaction chamber together with the gas. In a semiconductor manufacturing apparatus having an exhaust means for exhausting gas, a detection means for detecting the opening of the lid of the reaction chamber, and the detection of the opening by the detection means sucks the gas in the reaction chamber from the exhaust means side to the outside. A semiconductor manufacturing apparatus, comprising: 2. The exhaust means according to claim 1, further comprising an exhaust drive section interposed in an exhaust pipe connecting the reaction chamber and an exhaust port, and an exhaust opening / closing section controlled to be opened / closed by the suction section. A semiconductor manufacturing apparatus, wherein at least the exhaust opening / closing portion is closed when the suction means operates. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the detecting means detects the opening of the lid of the reaction chamber and the pressure in the reaction chamber due to the opening of the lid. 4. The suction unit according to claim 1, wherein the suction unit is a suction opening / closing unit provided in a suction pipe branched from the exhaust pipe of the exhaust unit, and sucks an internal gas from the reaction chamber. And a suction control unit that stops the exhaust of the exhaust unit according to the detection from the detection unit and drives the suction drive unit by opening the suction opening / closing unit. Semiconductor manufacturing equipment. 5. The suction unit according to claim 1, wherein the suction unit causes the exhaust drive unit that exhausts the exhaust unit to perform an exhaust operation during exhaust, and also when the lid of the reaction chamber is opened. And a suction control unit that controls the drive control unit to control the exhaust operation or the suction operation of the exhaust drive unit according to the detection from the detection unit. Semiconductor manufacturing equipment. 6. The suction pipe according to any one of claims 1 to 3, wherein the suction means is connected to the suction pipe branching from the exhaust pipe of the exhaust means and communicating with the exhaust drive unit for exhausting the exhaust means. A suction opening / closing section provided, a suction control section for driving the suction driving section by opening the suction opening / closing section in response to detection by the detection means, and a suction control section provided in the suction pipe. And a flow path restricting section that makes the exhaust drive section drivable when the lid section of the semiconductor manufacturing apparatus is opened.