JPH09330132A - Semiconductor pressure sensor module with valve, pressure controller using the same, and standard pressure generating device and sphygmomanometer using the same pressure controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the semiconductor pressure sensor module with the valve which is small-sized and easily assembled, and has high reliability. SOLUTION: On the top surface of a substrate 10, a semiconductor pressure sensor 11 and a semiconductor valve 12 are mounted, and a case 13 is mounted on the substrate top surface while covering the both. Measurement gas can be supplied into a case through a connecting pipe 13a and the case inside constitute a pressure chamber 20. A semiconductor valve 12 is brought under opening/ closure control by heating and thermally expanding pressurized liquid 18 and curving a diaphragm 15a, and opening and closing a through hole 17a with a valve body 15b, allowing the gas in the pressure chamber to leak. The semiconductor valve 12 is installed in the pressure chamber, so only one case 13 is needed to cover them, and the need for piping connecting the both 11 and 12 is eliminated, so the size is reducible. There is no leak in a connection part because of no piping and the reliability is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pressure sensor module with a valve, a pressure control device using the same, a standard pressure generating device using the pressure control device, and a sphygmomanometer.

[0002]

2. Description of the Related Art An example of a conventional pressure control device is shown in FIG. As shown in the figure, a semiconductor pressure sensor 1 and a pressure valve (electromagnetic valve) 2 are connected to two ends of a T-shaped silicon tube 3, and the remaining T-shaped end is pressurized. There is a structure with a pump connected. Then, the control device (not shown) controls the opening and closing of the valve of the pressure valve 2 according to the detection signal of the semiconductor pressure sensor 1.

That is, a pressure pump is operated, and a part of the fluid pressurized by the pressure pump flows into the silicon tube 3. At this time, the semiconductor pressure sensor 1 detects the pressure in the silicon tube 3. Measure and detect the pressure of the fluid. If the detected pressure is higher than a predetermined value, the valve of the pressure valve 2 is opened to reduce the pressure. Conversely, if the detected pressure is lower than the predetermined value, the valve of the pressure valve 2 is opened. By closing and increasing the pressure, a constant pressure can be maintained.

Further, when the target pressure as the comparison reference is gradually changed, the pressure of the fluid changes accordingly. Therefore, for example, when the pressure of the air supplied to the cuff such as a sphygmomanometer is once increased to a predetermined value and then gradually reduced, the pressure can be controlled by using the above device. .

[0005]

However, the above-mentioned conventional apparatus has various problems as described below. That is, since the pressure valve 2 controls opening and closing of the valve by an electromagnet, there is a limit to downsizing thereof.
Furthermore, since the semiconductor pressure sensor 1 and the pressure valve 2 are retrofitted to each other by using the T-shaped silicon tube 3, the assembly process becomes complicated. Moreover, since there are many connecting portions, there is a possibility that leakage may occur at the connecting portions. As a result, it is necessary to perform an inspection and a test with high accuracy after the manufacturing for such leakage, and the processing required for the inspection becomes complicated.

The inventor of the present invention considers miniaturization by replacing the pressure valve with a conventionally used electromagnetic valve and using the semiconductor valve described in the embodiment (see FIG. 2B). It was Then, as the size and shape of the pressure valve are reduced, the size of the entire device can be reduced to some extent. However, a step of connecting the sensor and the valve with a tube by piping is required, and various problems other than the above-mentioned miniaturization such as leakage at the connecting portion still remain.

Furthermore, the pressure sensor 1 is handled in a modularized state by mounting the sensor 1 in a predetermined package P as shown in the figure. Similarly, a semiconductor valve is also constructed by housing the valve in some package. Considering modularization, mount the pressure sensor housed in the package and the pressure valve housed in another package on the board, and cover them in another case. become. Therefore, the height (thickness) of the case
Becomes larger than the occupied volume of the package P accommodating the pressure sensor 1 and the pipe (tube) connecting the sensor and the valve, so that there is still a limit to miniaturization.

The present invention has been made in view of the above background, and an object of the present invention is to solve the above-mentioned problems, to be small in size, easy to assemble, highly reliable and inexpensive. A semiconductor pressure sensor module with a valve, a pressure control device using the same, a standard pressure generator using the pressure control device, and a sphygmomanometer.

[0009]

In order to achieve the above-mentioned object, in a semiconductor pressure sensor module with a valve according to the present invention, a semiconductor valve is also housed in a pressure chamber housing a semiconductor pressure sensor, and the semiconductor valve is interposed. The fluid in the pressure chamber can be discharged to the outside (claim 1).

Preferably, the semiconductor pressure sensor and the semiconductor valve are mounted on the same substrate (claim 2). Further, a pressure guiding tube capable of supplying a fluid to be measured into the pressure chamber may be integrally formed on a wall surface forming the pressure chamber excluding the substrate (claim 3). Further, the valve-equipped semiconductor pressure sensor module according to claim 2 may be used, and a control circuit for controlling the semiconductor valve based on the output of the semiconductor pressure sensor may be mounted on the substrate (claim). 4).

Further, in the standard pressure generating device according to the present invention, it is possible to acquire a fluid generating means for outputting a fluid having a predetermined pressure and all or a part of the fluid outputted from the fluid generating means. The semiconductor pressure sensor module with a valve according to any one of claims 1 to 3 and a control circuit for controlling the semiconductor valve based on the output of the semiconductor pressure sensor (claim 5).

Further, in the blood pressure monitor according to the present invention, a cuff,
4. A valve-equipped semiconductor pressure sensor module according to any one of claims 1 to 3, wherein means for supplying a gas having a predetermined pressure to the cuff, and all or part of the gas supplied to the cuff can be acquired. , A control circuit for controlling the semiconductor valve based on the output of the semiconductor pressure sensor, and a blood pressure measuring means for measuring at least blood pressure based on the pressure of the gas supplied to the cuff, of the gas supplied to the cuff The pressure can be controlled by a semiconductor pressure sensor module with a valve (claim 6). And preferably, the component other than the cuff described in claim 6 is configured to be integrally attached to the cuff (claim 7).

According to the present invention, since the semiconductor pressure sensor and the semiconductor valve are housed in the same pressure chamber, a separate package is not required and the device is small (thin). Since this pressure chamber simultaneously forms a fluid supply path from the semiconductor pressure sensor to the semiconductor valve, the piping work using a separately prepared tube becomes unnecessary as in the conventional case, and the assembly process is simplified. Further, with the decrease in the number of connecting portions, the possibility of leakage occurring in the connecting portions is suppressed as much as possible.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 shows a first embodiment of a pressure sensor module with a valve according to the present invention. As shown in the figure, a semiconductor pressure sensor 11 and a semiconductor valve 12 are mounted on the upper surface of the substrate 10, and a case 13 is mounted on the upper surface of the substrate 10 so as to cover both.

The respective parts will be described in detail. The board 10 can be constructed by using a ceramic or an epoxy board used for a usual printed board, and through holes are respectively provided at the mounting positions of the semiconductor pressure sensor 11 and the semiconductor valve 12. 10a and 10b are provided. The through hole 10a on the semiconductor pressure sensor 11 side is for introducing atmospheric pressure, which is a reference pressure, into the sensor. Further, the through hole 10b on the semiconductor valve 12 side functions as an escape hole (exhaust hole) for discharging the fluid (gas to be pressure-measured) introduced into the case 13 to the outside.

As the semiconductor pressure sensor 11, a piezoresistive pressure sensor is used in this example, and a thin diaphragm 11a is used.
Is the pressure sensitive portion, and the upper surface side thereof is the pressure receiving surface. That is,
The space 11b formed between the diaphragm 11a and the upper surface of the substrate 10 is opened to the atmospheric pressure through the through hole 10a, and therefore, detection is performed according to the difference between the atmospheric pressure and the pressure applied to the upper surface of the diaphragm 11a. The signal is output. This output can be taken out to the outside through the bonding wire 14.

As shown in the enlarged view of FIG. 1B, the semiconductor valve 12 has a first fixed substrate 16 bonded to the upper side of a silicon substrate 15 with a diaphragm 15a and a second fixed substrate 16 below the silicon substrate 15. The fixed substrate 17 is joined and integrated. The first and second fixed substrates 16 and 17 may be formed of glass substrates like the pressure sensor, but are not limited thereto and may be formed of a semiconductor such as silicon.

Further, a convex portion is formed at the center of the lower surface of the diaphragm 15a to form a valve body 15b. In addition, pressure is applied to the diaphragm 15a in the space formed by the upper portion of the diaphragm 15a of the silicon substrate 15 and the first fixed substrate 16 so that the diaphragm 15a can be curved downward. The pressurized liquid 18 is filled. The pressurized liquid 18 is a liquid having a large coefficient of thermal expansion (may be a gel), and when it is heated, it thermally expands and applies a predetermined pressure to the surrounding inner wall surface. Then, the flexible diaphragm 15a is deformed by the pressure.
The heating of the pressurized liquid 18 is performed by energizing a heater (not shown) (which can be formed of a thin film having good thermal conductivity) through a lead wire 19 to heat the heater, for example. The heat can be used.

A predetermined space S is also formed between the lower surface of the diaphragm 15a and the second fixed substrate 17. Then, a concave groove 15c is formed in a part of the joint surface of the lower surface of the silicon substrate 15 with the second fixed substrate 17, and when the joint is made, the space S is communicated with the outside through the concave groove 15c. I have to.

Further, the second fixed substrate 17 is formed with a through hole 17a which vertically penetrates through the central portion thereof. When the semiconductor valve 12 is mounted on the substrate 10,
The through hole 17a is the through hole 10b formed in the substrate 10.
It has come to communicate with.

As a result, during normal times (when not heated), the valve body 15b is separated from the second fixed base plate 17 as shown in FIG. 2B, so that it is supplied into the case 13. The fluid can flow out to the outside through the groove 15c, the space S, and the through hole 17a, as shown by the arrow in FIG. When the pressurized liquid 18 thermally expands, the diaphragm 15a swells downward, and the valve body 15b accordingly.
Also descends, the valve body 15b contacts the upper surface of the second fixed substrate 17, and closes the through hole 17a. As a result, the passage of the fluid is blocked, and the inside of the case 13 becomes a closed space,
The fluid supplied into the case 13 does not flow out. Furthermore, by stopping the position of the valve body 15b on the way, the second
By adjusting the distance from the fixed substrate 17 to the opening degree of the valve, the outflow amount per unit time can be adjusted.

The case 13 is airtightly joined to the joining surface with the substrate 10, and a pressure guiding tube 13a for introducing pressure is formed at a predetermined position on the top surface thereof. A fluid to be measured is supplied into the case 13 through the pressure guiding tube 13a, and the pressure of the fluid is detected by the semiconductor pressure sensor 12.
That is, the internal space of the case 13 is the semiconductor pressure sensor 1
2 will constitute the pressure chamber 20. And
The semiconductor valve 12 is mounted in the pressure chamber 20 together with the semiconductor pressure sensor 11. The case 13 can be integrally formed by metal processing, injection molding of plastic, or the like.

Next, the operation of the above-mentioned device will be described. A pressure measurement target fluid (gas or the like) is introduced into the case 13 through the pressure guiding tube 13a. At this time, semiconductor valve 1
When 2 is closed (the pressurized liquid 18 is thermally expanded), the inside of the case 13 becomes a closed space, so that the pressure inside the case 13 becomes equivalent to the pressure of the fluid to be measured.

Therefore, the semiconductor pressure sensor 11 outputs a detection signal corresponding to the pressure to the outside. And
As in the conventional case, the open / close control of the semiconductor valve 12 is performed according to the detected current pressure by an external control device (not shown).

At this time, since the semiconductor pressure sensor 11 and the semiconductor valve 12 are housed in the same case, a separate package is not required, and the size is small (thin). In this example, the case 13 constitutes the pressure chamber 20 for the semiconductor pressure sensor 11, and has a function of supplying the fluid between the pressure sensor and the semiconductor valve and the fluid to be measured to the semiconductor valve (the conventional silicon tube shown in FIG. 1). And a pipe for connecting the semiconductor pressure sensor 11 and the semiconductor valve 12 and the like is unnecessary, and the assembly process is simplified. Further, as long as the airtightness of the joint between the case 13 and the substrate 10 is ensured, leakage does not occur in the conventional connecting portion. Then, as compared with the conventional process of maintaining the airtightness at the connecting portion with the tube, it is easier to hermetically bond the case 13 and the substrate 10, and the reliability is also improved.

In the above-described embodiment, an example in which a piezo type pressure sensor is used as the semiconductor pressure sensor has been described, but the present invention is not limited to this. For example, a capacitance type pressure sensor is used. But of course it's good. In such a case, the pressure sensor 11 'may be of a type in which the capacitance gap widens (the diaphragm 11a separates from the glass substrate 21) when the pressure becomes high as shown in FIG. As shown in FIG. 4, when the pressure becomes higher, the capacitance gap becomes narrower (diaphragm 11a
Is closer to the glass substrate 21 side) type pressure sensor 1
It may be 1 ', and any configuration can be adopted. In addition,
Since the configuration other than the semiconductor pressure sensor 11 'is the same as that of the embodiment shown in FIG. 2, the detailed description thereof will be omitted.

Further, the semiconductor valve used is not limited to the one described above. As an example, for example, a member (metal) having a different coefficient of thermal expansion is formed on a part (preferably a peripheral part) of the diaphragm to form a pressure film, and a current is passed through the pressure film to generate heat. Then, due to the difference in thermal expansion coefficient between the pressure film and the diaphragm, the diaphragm functions like a bimetal, and the diaphragm bends in a predetermined direction. This may be utilized to control the opening / closing of the valve. Further, in the case of this structure, since the bending direction can be arbitrarily set, the valve may be closed in a steady state in which no current is applied, contrary to the above-described embodiment.

FIG. 5 shows a second embodiment of the sensor module according to the present invention, which constitutes a pressure chamber 20 for accommodating the sensor 11 and the like as compared with the above-mentioned embodiment and modification. The case structure is changing. That is, in the first embodiment, one end of a silicon tube (flexible tube) is connected to the pressure guiding tube 13a, and the other end of the tube is connected to a pressure pump or the like. Therefore,
In the present embodiment, the tube and the case are integrated. This eliminates the need for connecting the tube and the pressure guiding tube, further simplifying the assembly process.

Then, specifically, the silicon tube 2
An integral case 22 is formed by 2a and a case portion 22b whose tip is expanded and formed into an appropriate shape. The shape of the opening surface of the case portion 22b is made slightly smaller than the outer shape of the substrate 10, and a concave groove 22c is formed on the inner peripheral surface of the case portion 22a on the opening side, and the substrate 10 is formed in the concave groove 22c. It is integrated by fitting. At this time, the wall thickness of the case portion 22b is increased to exert strength so that the case portion 22b is not easily crushed.

The other end of the tube 22a (the case portion 2
The opposite side of 2b) may be left as it is as shown in the figure, but may be branched into two or more branches such as a T (Y) shape, and various modifications can be made. Further, in the illustrated example, the capacitance type pressure sensor 1 of the type in which the capacitance gap widens on the substrate 10 as the pressure rises.
Although an example in which 1'is mounted is shown, although not shown, the capacitance type pressure sensor of the type shown in FIG. 4 in which the capacitance gap is narrowed or the piezo type pressure sensor shown in FIG. 2 is applied. Of course, it is also possible (same in the following embodiments).
Note that other configurations and operational effects are the same as those of the above-described embodiments and modifications, and thus detailed description thereof will be omitted.

FIG. 6 shows a sensor module according to a third embodiment of the present invention. In the present embodiment, the container main body 28 having an upper opening and the container main body 28 is covered,
The semiconductor pressure sensor 11 ′ and the semiconductor valve 12 are provided in a housing having a lid 29 that closes the opening of the container body 28.
Implement That is, the members forming the pressure chamber 20 are different.

Specifically, an exhaust pipe 28a is formed at a predetermined position on the bottom surface of the container body 28, and the inside and outside of the container body 28 can be communicated with each other through the exhaust pipe 28a. Further, a pressure guiding tube 29a is formed at a predetermined position on the top surface of the lid body 29, and the inside and the outside of the lid body 29 can be communicated with each other via the pressure guiding tube 29a. Then, in an actual use state, a predetermined tube is attached to the pressure guiding tube 28a, and the fluid to be measured is introduced into the housing via the tube and the pressure guiding tube 29a. Further, the lid 29 is attached to the container body 2
The joint surface of the pressure chamber 20 is sealed by mounting it on the container 8, and the space formed by the lid 29 and the container body 28 constitutes the pressure chamber 20.

In order to manufacture the present sensor module using the casing having such a structure, first, the semiconductor pressure sensor 11 'and the semiconductor valve 12 are provided at predetermined positions on the bottom surface of the container body 28.
Is fixed. At this time, the mounting position of the semiconductor valve 12 is such that the exhaust hole of the valve 12 faces the exhaust pipe 29a and communicates therewith. In this state, the container body 28 is covered with a lid 29 and hermetically sealed.

With such a structure, for example, a fluid having a predetermined pressure is introduced into the housing via the pressure guiding tube 29a, the pressure in the pressure chamber 20 in the housing is detected by the semiconductor pressure sensor 11 ', and the detected pressure is When the opening degree of the semiconductor valve 12 is adjusted so as to match the target, a fluid having a pressure matching the target pressure is output from the exhaust pipe 28a (this principle and configuration itself is the same in each of the above-described embodiments. is there). Then, in this example, by connecting a predetermined tube to the exhaust pipe 28a, it becomes possible to discharge a fluid having a desired pressure from the other end of the tube installed at an arbitrary position.

In this example, the through hole is not formed in the bottom surface of the container body 28 at a position facing the semiconductor pressure sensor 11 ', and the diaphragm 1 of the semiconductor pressure sensor 11' is not formed.
The atmospheric pressure is not applied to the lower surface side of 1'a, and the absolute pressure applied to the upper surface of the diaphragm 11'a is measured. However, it is of course possible to provide a through hole as in each of the above-described embodiments to apply atmospheric pressure to the lower surface of the diaphragm 11'a.

The container main body 28 in this example is equivalent to an integrally formed one in which a predetermined connecting pipe is connected to the through hole 10b of the substrate 10 of each of the above-described embodiments. Therefore, even if the pipe is fixed to the lower surface (the position where the through hole 10b is formed) of the substrate 10 of each embodiment, the same function can be exhibited.

FIG. 7 shows an example of an embodiment of the pressure control device according to the present invention. As shown in the figure, in this example, the shape of the substrate 10 'is made larger than that in each of the above-described embodiments. That is, the shape is larger than the mounting space of the semiconductor pressure sensor 11 'and the semiconductor valve 12 mounted on the substrate 10'.

On the substrate 10 ', in addition to the semiconductor pressure sensor 11' and the semiconductor valve 12, a sensor circuit for obtaining the pressure based on the sensor output signal, and the opening and closing of the semiconductor valve 12 based on the obtained pressure. An electronic component 25 for forming a control circuit for controlling is mounted. These electronic components 25 for forming a predetermined circuit and the sensor 11 'and the valve 12 are connected to each other by printed wiring formed on the substrate 10'.
Further, the case 13 is joined to the upper surface of the substrate 10 'so as to cover the semiconductor pressure sensor 11' and the semiconductor valve 12 as in the above-described respective embodiments. This allows
Electrical connection can be made easily, and useless space for connection can be saved, resulting in further miniaturization. Further, since it is installed on one board (substrate 10 '), subsequent handling becomes easy. Note that other configurations and operational effects are the same as those of the above-described embodiments and modifications, and thus detailed description thereof will be omitted.

The pressure control device of the present invention is based on the above-described embodiment, and as shown in FIG.
In addition to the semiconductor pressure sensor 11 'and the semiconductor valve 12, the electronic component 25 constituting various circuits may be simultaneously covered as the case 13' attached to 0 '. As a result, the electronic components 25 and the wiring connecting them are also in the case 13 '.
Since it is protected by, there is no danger of touching the electronic component 25 or the like during use, and the reliability is improved.

Further, the case 13 'and the substrate 10' can be connected to each other by, for example, an adhesive agent, and as shown in FIG. 9, the flange portion 1 is provided at the lower end of the case 13 '.
3'b may be provided, and the flange portion 13'b may be joined by using a screw 26. At this time, in order to ensure airtightness, the flange portion 1
A predetermined packing 27 is interposed between 3'b and the substrate 10 '.

Further, the integrated case, which is the feature of the second embodiment shown in FIG. 5, can be applied to the type in which the electronic component 25 is also covered with the case as described above. That is, as shown in FIG. 10, the integrated case 22 'in which the tube 22'a and the case portion 22'b are integrated is fitted into the substrate 10'.

8 to 10, the fluid to be measured is introduced into the case through the pressure guiding tube 13'a or the tube 22'a, and the pressure is applied by the semiconductor pressure sensor 11 'there. Is measured, and the semiconductor valve 12 is opened and closed according to the measurement result. The other configurations and effects are the same as those of the above-described embodiments and modified examples, and thus detailed description thereof will be omitted. Further, although not shown, it is of course possible to store electronic components and the like in the case of the type of the case (those having an exhaust pipe provided on the lower side) as in the third embodiment.

FIG. 11 shows an example of an embodiment of the standard pressure generator according to the present invention. In this example, the pressurizing pump 30 and the semiconductor valve pressure sensor module 31 are connected by a T-shaped flexible tube 32. The pressurizing pump 30 is controlled by the pressurizing pump control circuit 33 so as to output a gas having a constant pressure. As a result, the gas having a predetermined pressure is supplied to the tip ends 32a of the sensor module 31 and the flexible tube 32.

In this example, the sensor module 31 is of a type in which the control circuits of the above-described first and third embodiments and their modifications are not mounted on the substrate.
Therefore, the control device 35 is connected to the outside of the sensor module 31.

This control device 35 is based on the semiconductor pressure sensor 1
The sensor circuit 35a for obtaining the pressure based on the detection signals from 1, 11 ', the setting comparison circuit 35b for comparing the pressure obtained by the circuit 35a with the set target pressure, and the comparison result of the setting comparison circuit 35b Accordingly, a semiconductor valve control circuit 35c for controlling the opening / closing of the semiconductor valve 12 so that the pressure in the pressure chamber becomes the target pressure is provided.

With such a structure, the gas having a predetermined pressure is output from the pressurizing pump 30, and the gas can be output to the outside through the nozzle 37. At this time, the sensor module 31 exhausts a part of the gas supplied from the pressurizing pump 30 to the outside of the sensor module so that the gas pressure in the pressure chamber reaches the target pressure. Then, since the pressures inside the pressure chamber and the flexible tube 32 become equal, as a result, the gas of the standard pressure equal to the desired target pressure is output from the nozzle 37. The target pressure can be changed by operating the setting / comparing circuit 35b.
It becomes possible to output a gas at an arbitrary pressure (below the pressure output from the pressurizing pump).

Then, the above components 30 to 33, 35 are mounted in the housing 36, and the tip 32a of the flexible tube 32 is connected to the nozzle 37 attached to the side surface of the housing 36. The pressurizing pump 30 and the pressurizing pump control circuit 33 constitute a standard pressure generator 38.
Further, the pressure control device is configured by combining the pressure sensor module 31 with a semiconductor valve and the control device 35. Therefore, in place of the sensor module 31 and the control device 35 which are configured as separate parts, the pressure of the present invention formed by mounting a sensor, a valve and various electronic parts on the same substrate shown in FIGS. Of course, a control device may be applied.

FIG. 12 shows another embodiment of the standard pressure measuring device according to the present invention. In this example, as the pressure sensor module 31 'with a semiconductor valve to be used, the one of the third embodiment described above is used. Further, the standard pressure generator 38 'and the pressure control device 42 (sensor module 31' + control device 35) are constituted by different members. That is, the output of the standard pressure generator 38 ',
The pressure guiding tube 29a of the sensor module 31 'is connected by one connecting tube 41. Furthermore, the sensor module 3
It is configured by connecting another tube 44 to the 1'exhaust pipe 28a.

The respective parts will be described in detail. The standard pressure generator 38 'is the same as the one including the pressurizing pump 30 and the pressurizing pump control circuit 33 shown in FIG. A gas having a predetermined pressure is output. Further, the pressure control device 42 is connected to the control device 35 to the sensor module 31 ', and is controlled so that the pressure in the pressure chamber becomes the target pressure set by the setting comparison circuit 35b.

In this example, the standard pressure generator 38 '
The gas output from the sensor module 31 'is directly supplied to the pressure chamber in the sensor module 31', and the supplied gas is directly discharged via the tube 44. Therefore, since the gas pressure in the pressure chamber and the pressure discharged through the tube 44 become equal, the control device 35 is operated as described above, and the pressure in the pressure chamber is controlled to reach the target pressure. From 44,
The gas depressurized to the target pressure is output. Also in this example, it is of course possible to adopt a configuration in which the control device, the sensor and the valve are mounted on the same substrate.

FIG. 13 shows an example of a preferred embodiment of the pressure gauge according to the present invention. As shown in the figure, a pressure pump 50, a pressure sensor module 51 with a semiconductor valve, a cuff 52 and a T-shaped flexible tube 53.
Connect with. The pressurizing pump 50 and the sensor module 51 are connected to the control circuit / blood pressure measuring circuit 54,
Its operation is controlled. In the control circuit / blood pressure measurement circuit 54, the operation control of the pressurizing pump and the control circuit for the sensor module 51 (see FIG.
1 (corresponding to the control circuit 35 shown in FIG. 12) is mounted, and circuits necessary for blood pressure measurement are further incorporated. Then, the data regarding the measured blood pressure and the like are displayed on the display panel 54a.

That is, since the pressure supplied to the cuff 52 can be accurately controlled by the sensor module 51, highly accurate measurement can be performed. That is, in general, this type of electronic blood pressure monitor sends the air to the cuff 52 wrapped around the upper arm or the forefinger, and tightens the upper arm or the forefinger to press the blood vessel, thereby determining the maximum pressure and the minimum pressure at which the heartbeat pulse wave is generated. Obtain and measure. At that time, it is necessary to accurately control the pressure value, and for example, in the case of a method of detecting the heartbeat pulse wave while reducing the pressure after pressurizing once, it is possible to perform pressure reduction control by minute leak, It becomes unavoidable to accurately detect the pressure that becomes the boundary of the presence or absence of the heartbeat pulse wave, and in this example, since the accuracy suppression control can be performed,
As a result, it has become possible to measure pressure more accurately than ever before.

Further, as described in each of the above-mentioned embodiments, the sensor module 51 can be made extremely small, so that the entire sphygmomanometer can be downsized (about 1/5 of the conventional one).
You can As a result, for example, as shown in FIG. 14, the control circuit / blood pressure measuring circuit 54, the pressurizing pump 51, and the sensor module 51 can be mounted on the cuff 52 and integrated. That is, blood pressure can be measured (in the example shown, blood pressure is obtained from a signal from the wrist artery) while the cuff 52 is wrapped around like a wristwatch, and portability is improved. Therefore, not only blood pressure measurement in a normal static state but also blood pressure measurement in a dynamic state (during exercise, etc.) can be easily performed.

It is needless to say that the present invention can be applied to a sphygmomanometer in which the conventional cuff and measuring system are composed of separate members.

[0055]

As described above, in the semiconductor pressure sensor module with a valve, the pressure control device using the same according to the present invention, the standard pressure generating device using the pressure control device, and the sphygmomanometer, the same pressure chamber is provided. Since the semiconductor pressure sensor and the semiconductor valve are housed, the size is further reduced as compared with the case where they are individually packaged. Since this separate package is not required and the pressure chamber constitutes the path connecting the sensor and the valve, the connection work in the subsequent process is unnecessary, the assembly is easy, and the reliability is high. Further, the number of parts is reduced and the assembling work is facilitated, and the cost is reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a conventional example.

FIG. 2 is a diagram showing a first embodiment of a sensor module according to the present invention.

FIG. 3 is a diagram showing a modification thereof.

FIG. 4 is a diagram showing a modification thereof.

FIG. 5 is a diagram showing a second embodiment of the sensor module according to the present invention.

FIG. 6 is a diagram showing a sensor module according to a third embodiment of the invention.

FIG. 7 is a diagram showing a preferred embodiment of a pressure control device according to the present invention.

FIG. 8 is a diagram showing another preferred embodiment of the pressure control device according to the present invention.

FIG. 9 is a diagram showing another preferred embodiment of the pressure control device according to the present invention.

FIG. 10 is a diagram showing another preferred embodiment of the pressure control device according to the present invention.

FIG. 11 is a diagram showing a preferred embodiment of a standard pressure generator according to the present invention.

FIG. 12 is a diagram showing another preferred embodiment of the standard pressure generating device according to the present invention.

FIG. 13 is a diagram showing a preferred embodiment of a sphygmomanometer according to the present invention.

FIG. 14 is a diagram showing another preferred embodiment of the sphygmomanometer according to the present invention.

[Explanation of symbols]

 10, 10 'Substrate 11, 11' Semiconductor pressure sensor 12 Semiconductor valve 13, 13 'Case 13a, 13'a, 29a Pressure guiding tube 20 Pressure chamber 22 Integrated case 22a Tube (pressure guiding tube) 29 Lid 29a Pressure guiding tube 31, 31 'Pressure sensor module with valve 35 Control device 38, 38' Standard pressure generator 42 Pressure control device 50 Pressurizing pump 51 Pressure sensor module with valve 52 Cuff 54 Control circuit Blood pressure measurement circuit

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location F16K 37/00 G01L 7/08 G01L 7/08 9/08 9/08 H01L 23/00 H01L 23 / 00 A61B 5/02

Claims (7)

[Claims] 1. A semiconductor pressure sensor with a valve, characterized in that a semiconductor valve is also accommodated in a pressure chamber accommodating a semiconductor pressure sensor, and a fluid in the pressure chamber can be discharged to the outside via the semiconductor valve. module. 2. The semiconductor pressure sensor and the semiconductor valve are mounted on the same substrate.
A semiconductor pressure sensor module with a valve according to [1]. 3. The valve according to claim 2, wherein a pressure guiding tube capable of supplying a fluid to be measured into the pressure chamber is integrally formed on a wall surface of the pressure chamber excluding the substrate. With semiconductor pressure sensor module. 4. The valve-equipped semiconductor pressure sensor module according to claim 2, wherein a control circuit for controlling the semiconductor valve based on an output of the semiconductor pressure sensor is mounted on the substrate. Pressure control device. 5. The fluid generating means for outputting a fluid having a predetermined pressure, and all or a part of the fluid output from the fluid generating means can be acquired. A standard pressure generating device comprising: a semiconductor pressure sensor module with a valve; and a control circuit for controlling the semiconductor valve based on an output of the semiconductor pressure sensor. 6. The cuff, means for supplying a gas having a predetermined pressure to the cuff, and all or part of the gas supplied to the cuff can be acquired. A valve-equipped semiconductor pressure sensor module, a control circuit that controls the semiconductor valve based on the output of the semiconductor pressure sensor, and a blood pressure measurement unit that measures at least blood pressure based on the pressure of the gas supplied to the cuff. A sphygmomanometer characterized in that the pressure of the gas supplied to the cuff can be controlled by a semiconductor pressure sensor module with a valve. 7. A sphygmomanometer characterized in that components other than the cuff according to claim 6 are integrally attached to the cuff.