JPH0992670A - Constitution of sensor device and mounting method for realizing its constitution - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive to thin a sensor device having a sensor element to be connected by a bonding wire. SOLUTION: A capacitance type semiconductor pressure sensor element 20 is mounted to a bottom face of housings 10, 12. A wire bonding hole 15 is opened in this bottom face. A bonding pad 25 of the sensor element 20 and a bonding face of a lead frame 14 which is insert-molded to the housing are both faced downwardly and connected via a bonding wire 22. A bonding wire 26 is hung down and is not projected up, therefore the housings 10, 12 can be thinned.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a structure in which a sensor element (for example, a semiconductor pressure-sensitive element), more generally an electric element, is mounted on a substrate, a stem, a housing, or another supporting member,
In particular, it relates to a structure for connecting an electric element and a supporting member with a bonding wire, and a mounting method for realizing this structure.

[0002]

2. Description of the Related Art A conventional example in which a semiconductor pressure sensor (capacitive pressure sensitive element) is mounted on a resin stem will be described with reference to FIG.

A capacitive semiconductor pressure sensor 60 is provided in a resin stem 51 in which a lead frame 54 is insert-molded.
Has been implemented.

The semiconductor pressure sensor 60 comprises a glass substrate 61 and a semiconductor substrate 62, which are bonded to each other. The semiconductor substrate 62 is composed of a peripheral frame portion 62a and a thin diaphragm portion 62b supported by the frame portion 62a. Since the semiconductor substrate 62 has conductivity, the diaphragm portion 62b serves as a movable electrode.
The frame portion 62a is anodically bonded to the glass substrate 61.

A diaphragm 62b is provided on the glass substrate 61.
The fixed electrode 63 is formed on the surface facing the. Further, a pressure guiding hole 64 for the pressure to be measured is formed in the glass substrate 61. The fixed electrode 63 is not provided at the position of the opening of the hole 64. The glass substrate 61 is fixed to the bottom surface of the stem 51 with a resin paste 69.

A pressure guiding pipe 56 is formed integrally with the stem 51. The pressure guiding hole 56 a of the pressure guiding pipe 56 communicates with the pressure guiding hole 64 of the glass substrate 61. Stem 5
The upper opening of 1 is covered by a cover 53.

The pressure to be measured is introduced into the semiconductor pressure sensor 60 through the pressure guiding hole 56a of the pressure guiding pipe 56. As a result, the diaphragm portion 62b of the semiconductor substrate 62 is deformed, and the diaphragm portion (movable electrode) 62b and the fixed electrode 63 are
The capacitance between and changes. The pressure to be measured is detected based on the capacitance.

The glass substrate 61 is formed to be slightly larger than the semiconductor substrate 62 so that a part of the glass substrate 61 protrudes, and a bonding pad 65 for the movable electrode 62b and the fixed electrode 63 (only one is shown in the figure). ) Has been formed. These bonding pads 65 are electrically connected to the movable electrode 62b and the fixed electrode 63 by a wiring pattern (not shown) or the like.

The lead frame 54 is on the left of the stem 51,
Two on the right. The two lead frames 54 (only one is shown) on the right side of the figure and the bonding pads 65 are electrically connected by bonding wires 66, respectively. In this way, the movable electrode 62b and the fixed electrode 63 of the semiconductor pressure sensor 60 are
Is connected to an external pressure measuring circuit through the lead frame 54. The two lead frames 54 on the left side are dummy.

The surface of the stem 51 on which the glass substrate 61 is fixed is the mounting surface (die bonding surface) of the semiconductor pressure sensor 60. In the conventional structure, the bonding pad 65 of the semiconductor pressure sensor 60 and the surface of the lead frame 54 to be wire-bonded are the stems 51.
It was facing the same direction (upper in the figure) as the mounting surface of. For this reason, the bonding wire 66 protruded upward in the resin stem 51. In order to prevent the bonding wire 66 that transmits an electric signal and the cover 53 of the resin stem 51 from contacting each other, it is necessary to increase the thickness (height) of the stem 51. In the conventional structure, there is a problem in that there is a large space above the semiconductor pressure sensor 60 mounted in the stem 51, and the stem 51 becomes thick and large.

FIG. 12 shows another conventional example. The difference from the structure shown in FIG. 11 is that in FIG. 12, the semiconductor substrate 72 is made larger than the glass substrate 71 so that a part of the semiconductor substrate 72 protrudes. That the wire bonding pad 65 is formed on the bottom of the stem 51 and that the semiconductor substrate 72 and the glass substrate 71 are reversed in the vertical direction and the semiconductor substrate 72 is fixed to the bottom surface of the stem 51. That is, the pressure is introduced into the diaphragm portion 72b.

In such a structure as well, the thickness of the stem 51 must be increased in the same manner.

FIG. 13 shows a conventional example in which a semiconductor pressure sensor is directly mounted on a circuit board. Wiring patterns 73 and 74 are formed on the circuit board 70. Electrical and electronic element parts 75 such as ICs, resistors and capacitors are connected by a wiring pattern 74 to realize a predetermined electric circuit.

A semiconductor pressure sensor 60 (having the same structure as that shown in FIG. 11) is also fixed on the circuit board 70. A pressure to be measured is introduced into the semiconductor pressure sensor 60 through a pressure guiding pipe 71 attached to the circuit board 70 and a pressure guiding hole 70a formed in the circuit board 70. Wire bonding pad 65 of semiconductor pressure sensor 60
Are electrically connected to the wiring pattern 73 on the fixed substrate 70 by bonding wires 66.

Also in this structure, the semiconductor pressure sensor 6
0 wire bonding pad surface and circuit board 70
The wiring pattern 73 is oriented in the same direction as the mounting surface of the circuit board 70, and the bonding wire 66 projects upward.

The wiring pattern 74 for connecting the other electric and electronic element parts 75 and the wiring pattern 73 for connecting the semiconductor pressure sensor 60 are both printed on one surface of the circuit board 70. There is also a problem that the wiring pattern is dense on the surface or a circuit board having a large area is required.

[0017]

DISCLOSURE OF THE INVENTION The present invention reduces the thickness of a stem or other supporting member for mounting an electric element including a sensor element, or the overall height of an electric device including the electric element and the supporting member. Is to lower.

The present invention also seeks to effectively utilize the area of the circuit board.

The structure of the sensor device according to the present invention comprises a sensor element and its supporting member, the supporting member has a mounting surface, and the sensor element is fixed on the mounting surface. Pad is provided,
In a sensor device in which the support member is provided with terminals connected to the wire bonding pad by wire bonding, the wire bonding pad of the sensor element is located at a position distant from the mounting surface of the support member. The sensor element is fixed on the mounting surface of the support member so as to face the mounting surface,
The support member has a hole for wire bonding work at a position corresponding to the wire bonding pad.

The present invention can be applied to a general electric device having an electric element.

That is, the structure of the electric device according to the present invention comprises an electric element and a supporting member for the electric element, the supporting member has a mounting surface, and the electric element is fixed on the mounting surface. Is provided with a wire bonding pad, and the support member is provided with the wire bonding pad.
In an electric device provided with a terminal connected to a pad by wire bonding, the wire bonding pad of the electric element is located at a position apart from the mounting surface of the supporting member and faces the mounting surface. Thus, the electrical element is fixed on the mounting surface of the support member, and a hole for wire bonding work is formed in the support member at a position corresponding to the wire bonding pad. It is a thing.

The present invention provides an implementation method for implementing the structure of the electrical device described above.

A method of mounting an electric element according to the present invention is
A supporting member having a mounting surface for fixing an electric element is provided with a hole for wire bonding work and a terminal for wire bonding is provided, and the electric element is fixed to the mounting surface when fixed to the supporting member. A wire bonding pad is provided in a position away from the facing fixing surface in the same direction as the fixing surface, and the electrical connection is made such that the wire bonding pad is located at a position facing the hole for wire bonding work. The element is fixed to the supporting member such that the fixing surface faces the mounting surface, and the wire bonding pad of the electric element and the terminal of the supporting member are connected by a bonding wire.

The sensor element is not limited to the above semiconductor pressure sensor, but may be an acceleration sensor, an optical sensor, a temperature sensor, or the like.
Includes all elements and devices that convert physical quantities into electrical signals. The electric element is a broader concept, and includes an IC circuit and other electric and electronic elements, parts and devices.

The supporting members on which these sensor elements and electric elements are mounted include stems, housings, boards, circuit boards, and various other names.

The connection terminal does not necessarily have to be directly provided on the supporting member, but may be provided on another member attached to the supporting member (may be indirectly provided on the supporting member).

Generally, the surface of the terminal to be wire-bonded will be provided so as to face the mounting surface of the support member. In this case, the wire bonding pad of the electric element (sensor element) and the terminal are both oriented toward the mounting surface and apart from the mounting surface. The bonding wire connecting between these projects in the direction of the mounting surface. The bonding wire does not protrude toward the side opposite to the mounting surface beyond the electric element (sensor element). Therefore, it is sufficient for the supporting member such as the stem to secure a space slightly higher than the electric element (sensor element), and the thickness of the supporting member can be reduced. Alternatively, the overall height of the electric device including the electric element and the supporting member can be reduced.

In another aspect, the terminal is provided on a surface of the support member opposite to the mounting surface. In this case, the bonding wire connecting the wire bonding pad and the terminal passes through the hole.

In this case as well, the mounting surface side of the supporting member is not required to have a height higher than that of the electric element for wire bonding. This aspect is particularly effective when the support member is a circuit board, and both surfaces of the circuit board can be effectively used for mounting electric and electronic components.

[0030]

【Example】

First Embodiment FIG. 1 is an assembled perspective view of a sensor device. In this sensor device, a capacitive semiconductor pressure sensor element (capacitive pressure sensitive element) is mounted on a resin stem. FIG. 2 is a sectional view taken along the line II-II in FIG. 1 (showing an assembled state).

With reference to these drawings, a resin stem 10 and a bottom plate 1 in which a lead frame 14 is insert-molded are formed.
A housing (or a case) of the sensor device is constituted by 2 and. A pressure guiding pipe 16 protruding outward is formed on the bottom plate 12. The capacitive semiconductor pressure sensor element 20 is fixed (mounted) on the bottom plate 12 with a resin paste 29. After mounting the sensor element 20 on the bottom plate 12, the stem 10 is covered so as to cover the sensor element 20 and the stem 10 and the bottom plate 12 are joined (welded, fused, or bonded) to form a housing. .

The semiconductor pressure sensor element 20 is the glass substrate 2
1 and a semiconductor substrate 22, which are bonded to each other. The semiconductor substrate 22 has a peripheral frame portion 22.
a and a thin diaphragm portion 22b supported by the frame portion 22a. Since the semiconductor substrate 22 has conductivity, the diaphragm portion 22b becomes a movable electrode. The frame portion 22a is anodically bonded to the glass substrate 21.

The semiconductor pressure sensor element 20 is fixed to the bottom surface of the bottom plate 12 by the resin paste 29 on the frame portion 22a of the semiconductor substrate 22 so that the central portion thereof coincides with the position of the pressure guiding pipe 16. Therefore, the measured pressure is applied to one surface of the diaphragm portion 22b through the pressure guiding pipe 16.

The diaphragm portion 2 is provided on the glass substrate 21.
The fixed electrode 23 is formed on the surface facing 2b. Further, a pressure guide hole 24 is formed in the glass substrate 21. The fixed electrode 2 is provided at a portion corresponding to the opening position of the pressure guiding hole 24.
3 is not formed. A reference pressure (atmospheric pressure introduced through a work hole 15 described later) is introduced into the space surrounded by the diaphragm portion 22b and the glass substrate 21 through the pressure guiding hole 24.

The diaphragm portion 22b of the semiconductor substrate 22 is elastically deformed according to the difference between the measured pressure and the reference pressure introduced into the semiconductor pressure sensor element 20 through the pressure guiding hole 16a of the pressure guiding pipe 16. As a result, the diaphragm portion 2
The capacitance between 2b (movable electrode) and the fixed electrode 23 changes. The measured pressure is detected based on the change in the electrostatic capacitance.

The glass substrate 21 is formed to be slightly larger than the semiconductor substrate 22 so that a part thereof protrudes. Wire-bonding pads 25 for movable electrodes and fixed electrodes are formed on the protruding portions. The bonding pad 25 faces the mounting surface of the semiconductor pressure sensor element 20 (downward in the figure). These bonding pads 25 are electrically connected to the movable electrode 22b and the fixed electrode 23 by a wiring pattern (not shown) or the like.

The lead frame 14 is on the left of the stem 10,
Two on the right. The surface of the lead frame 14 to be wire-bonded is formed by thinning the side wall of the stem 10 to form the bottom plate 1 of the semiconductor pressure sensor element 20.
It is exposed in the direction of the mounting surface on 2 (downward in the figure) and faces this direction.

Two corresponding lead frames 14 and two wire bonding pads 25 provided on one side (right side in FIG. 2) of the stem 10 are bonding wires (gold wire, aluminum wire, etc.). ) 26 electrically connect to each other. In this way, the movable electrode 22 of the semiconductor pressure sensor element 20 is
b and the fixed electrode 23 are connected to a pressure measuring circuit (not shown) provided outside through the lead frame 14.

The other side of the stem 10 (left side in FIG. 2)
The two lead frames are dummy. A dummy lead frame is effectively used when the sensor device is stably fixed or held on a printed wiring board or other member.

Bonding is performed on the bottom plate 12 of the housing.
A hole 1 for wire bonding work is provided in a portion facing the bonding surface of the pad 25 and the lead frame 14.
5 are formed.

A wire 26 is provided between the bonding pad 25 of the semiconductor pressure sensor element 20 mounted in the housing of the sensor device and the bonding surface of the lead frame 14.
This hole 15 is used when bonding the. A part of the bonded wire 26 may hang down into the hole 15.

In this way, the bonding wire projects (hangs) toward the mounting surface. Since the bonding wire does not project in the direction opposite to the mounting surface, a space for the bonding wire is provided between the upper surface of the stem 10 (upper surface in FIG. 2) and the upper surface of the semiconductor pressure sensor element 20. It is not necessary to secure the space, and this space can be made sufficiently small, so that the height of the stem 10 can be made small. That is, a sensor element having a small height (or thickness) is realized.

In this embodiment, the lead frame 1
Although 4 is bent downward outside the sensor device, it may be bent upward. The pressure sensitive element built in the housing is not limited to the capacitive type, but may be a piezo type semiconductor pressure sensor element. In the piezo type semiconductor pressure sensor element, instead of providing the fixed electrode 23, one or a plurality of piezoresistive elements are formed in a part of the diaphragm portion 22b. The resistance value of the piezoresistive element changes due to the deformation of the diaphragm portion 22b. A bridge circuit including this piezoresistive element can be used to obtain a signal representing the measured pressure.

Second Embodiment FIG. 3 shows another example in which a capacitive semiconductor pressure sensor element is mounted.

The difference from the structure shown in FIG. 2 is that the pressure guiding pipe 16 is formed on the resin stem 11 integrally formed with the lead frame 14. This pressure guiding pipe 16
The semiconductor pressure sensor element 20 has the frame portion 22a of the semiconductor substrate 22 so that the central portion thereof coincides with the pressure guiding hole 16a.
It is fixed to the bottom surface of the resin stem 11 with the resin paste 29. The lower part of the side wall of the stem 11 is thin, and the lower surface of the lead frame 14 is exposed. The bonding work hole 15 is formed in the bottom surface of the resin stem 11. The upper opening of the resin stem 11 is
Covered by a cover 13. The same members as those shown in FIG. 2 are designated by the same reference numerals to avoid redundant description.

Also in this structure, since the bonding wire 26 projects in the direction of the mounting surface of the stem 11, the gap between the semiconductor pressure sensor element 20 and the cover 13 can be made small, and the thickness of the stem 11 can be reduced. (Height) can be made thin.

Third Embodiment FIG. 4 shows still another example in which a capacitive semiconductor pressure sensor element is mounted on a resin stem.

The difference from the structure shown in FIG. 3 is the arrangement and structure of the semiconductor pressure sensor element 20A. The semiconductor pressure sensor element 20A is arranged inside the resin stem 11 upside down from that shown in FIG. 3, and the glass substrate 21 is fixed to the bottom surface of the stem 11 with a resin paste 29. Further, the pressure to be measured is introduced from the pressure guiding pipe 16 through the pressure guiding hole 24 of the glass substrate 21 into the diaphragm portion 22b.

A part of the semiconductor substrate 22 is made larger than the glass substrate 21 so that a part thereof is projected.

A wire bonding pad 25 is formed on the protruding portion of the semiconductor substrate 22 so as to face the bottom surface (mounting surface) of the resin stem 11.

Also in this structure, both the bonding pad 25 and the surface of the lead frame 14 to be wire-bonded face the direction of the mounting surface of the stem 11 and are apart from the mounting surface. The bonding wire 26 connecting these projects in the direction of the mounting surface, and a part of the bonding wire 26 is formed in the resin stem 11 for bonding work.
Located inside.

The bonding wire 22 cannot project above the semiconductor pressure sensor element 20A,
Since it is sufficient for the stem 11 to have a height that secures a space slightly higher than the sensor element 20A, it is possible to reduce the thickness of the stem 11.

Fourth Embodiment FIGS. 5 and 6 show still another example in which a semiconductor pressure sensor element is mounted on a resin stem. 5 is a sectional view corresponding to FIG. 2, and FIG. 6 is a sectional view taken along the line VI-VI of FIG.

The structure of the resin stem 11A is different from that of the second embodiment shown in FIG.

A pressure guiding pipe 16A is formed on the bottom surface of the resin stem 11A so as to extend along the bottom surface.
The tip portion thereof projects outward from the side wall of the stem 11A. The pressure guiding hole 16a of the pressure guiding pipe 16A is bent at a right angle below the semiconductor pressure sensor element 20. In this way, the pressure guiding pipe of the resin stem can be formed in a desired direction.

Fifth Embodiment FIG. 7 shows another structure of the resin stem. Stem 1
The side wall on the right side (the right side in FIG. 7) of 1B is thinly formed below the mounting position of the lead frame 14.
As a result, the surface of the right lead frame 14 to be wire-bonded is exposed and faces the hole 15 for wire-bonding work (same as the structure of the above-described embodiment). Since the left side wall of the stem 11B has a thin upper part, a lead frame 14A (separate reference numeral is used to distinguish it from the right side lead frame 14)
The surface to be wire-bonded is facing upward.

FIG. 8 shows a structure of a sensor device having a structure similar to that of the resin stem shown in FIG. 7 and using a resin stem large enough to mount two semiconductor pressure sensor elements. .

On the resin stem 11C, semiconductor pressure sensors 20 and 20B having exactly the same structure (separate reference numerals for distinction) are mounted.

The semiconductor pressure sensor element 20 has the same arrangement as that shown in FIG. 3 or 5. The sensor element 20 is arranged such that the glass substrate 21 is above the semiconductor substrate 22. Since the wire bonding pad 25 is provided downward on the protruding portion of the glass substrate 21 and the wire bonding surface of the lead frame 14 is exposed downward, the bonding wire 2 connected between them is formed.
6 projects downward. A working hole 15 is formed at the position of the bonding wire 26 on the bottom surface of the stem 11C.

The semiconductor pressure sensor element 20B is arranged upside down with respect to the sensor element 20. bonding·
Since the glass substrate 21 on which the pad 25 is formed is on the lower side, the bonding pad 25 faces upward. The bonding surface of the lead frame 14A also faces upward. Therefore, with respect to the sensor element 20B, the bonding wire 26 projects upward.

Two pressure guiding pipes 16B and 16C are formed on the resin stem 11C so as to project downward. In the sensor element 20, the measured pressure is directly introduced from the pressure guiding pipe 16B to the diaphragm portion 22b. In the sensor element 20B, the measured pressure is the glass substrate 2
It is guided to the diaphragm portion 22b through the first pressure guiding hole 24.

As described above, in the sensor device of this embodiment, by using two sensor elements having the same structure, the same (or different) measured pressure is applied in different directions (locations) of the diaphragm portion 22b of the sensor element. It has the feature of being able to lead.

Sixth Embodiment FIG. 9 shows an example in which a semiconductor pressure sensor is directly mounted on a circuit board.

Wiring patterns 44 are formed on the front and back surfaces of the circuit board 40. Electrical and electronic element parts 46 such as ICs, resistors and capacitors are soldered to the circuit board 40.
It is mounted on the front and back sides of the and realizes a predetermined electric circuit.

A pressure guiding pipe 41 is further fixed to the circuit board 40. The pressure guiding hole 40a communicating with the pressure guiding hole of the pressure guiding pipe 41 is formed penetrating the circuit board 40. The semiconductor pressure sensor element 20 is fixed on the circuit board 40 by a resin paste 29 so that the central portion thereof coincides with the pressure guiding hole 40a. The pressure to be measured is introduced into the diaphragm portion of the sensor element 20 through the pressure guiding pipe 41 and the pressure guiding hole 40a.

The semiconductor pressure sensor element 20 has the same structure as that shown in FIG. 2, and a part of the upper glass substrate 21 is formed to be slightly larger than the lower semiconductor substrate 22. A wire bonding pad 25 is formed on the protruding portion of the glass substrate 21. The circuit board 40 is provided with a bonding work hole 45 at a position facing the wire bonding pad 25. Circuit board 4
A wiring pattern 43 for wire bonding is formed on the back surface (lower surface) of 0.

The bonding pad 25 of the semiconductor pressure sensor element 20 and the wiring pattern 43 of the circuit board 40 are
It is electrically connected by the bonding wire 26 passing through the working hole 45.

Wiring pattern 4 for wire bonding
3 may be provided on the surface (upper surface) of the circuit board 40 (the surface just opposite to the illustrated wiring pattern 43). In this case, the bonding wire 26 projects in the direction of the circuit board 40 (in the direction of the working hole 45 or inside thereof).

In this way, even in the structure in which the semiconductor pressure sensor element is provided on the circuit board, the bonding wire protrudes toward the circuit board (as shown in FIG. Since it passes through the hole), it is not necessary to secure a space for arranging the bonding wire up above the circuit board.

If necessary, as shown in FIG.
A wiring pattern for wire bonding can be provided on the surface opposite to the surface of the circuit board on which the semiconductor pressure sensor is mounted, so that both front and back surfaces of the circuit board can be utilized. This can reduce the area of the circuit board.

Application Example FIG. 10 shows an outline of the configuration of a pressure measuring device using a pressure sensor device.

This blood pressure measuring device comprises a sensor device 8, a cuff 1, a pump 2, a control unit 3 including a CPU, and the like. The sensor device 8 has the structure shown in FIG. 9, that is, a pressure sensor element is mounted on a circuit board on which a part of the control circuit of the blood pressure measuring device is mounted.
Of course, as the sensor device, a housing or a stem having a pressure sensor element built therein as shown in FIGS. 1 to 9 can be used. The housing or stem of such a sensor device can be fixed to the circuit board.

The cuff 1 and the pressure sensor element of the sensor device 8 are connected by a rubber tube 4. A pump 2 is also connected to the rubber tube 4, and the pump 2 pressurizes the inside of the cuff 1. An exhaust valve 6 is provided in the middle of the rubber tube 4. An input unit 5 and an output unit 7 are connected to the control unit 3.

When measuring blood pressure, first, the cuff 1 is wrapped around the upper arm of the subject. If necessary, the age and sex of the person to be measured are input from the input unit 5 including a keyboard, and the start of blood pressure measurement is instructed.

When the control section 3 receives the start signal from the input section 5, it closes the exhaust valve 6 and starts the pump 2. As a result, the inside of the cuff 1 is pressurized. The pressure applied to the cuff 1 is constantly detected by the sensor device 8.

When the pressure detected by the sensor device 8 reaches a predetermined pressure, the control section 3 stops the pump 2.
Next, the control unit 3 opens the exhaust valve 6 to remove the air in the cuff 1 and gradually reduce the pressure.

There are various blood pressure measuring methods such as an oscillometric method and a Korotkoff sound method. In the oscillometric method, the blood pressure value (maximum blood pressure and minimum blood pressure) is determined based on the change in the amplitude of the pulse wave that is superimposed on the cuff pressure during the decompression process of the cuff pressure. The pulse wave amplitude is detected based on the pressure detection signal from the pressure sensor device 8. The pulse rate is calculated based on the sensor pressure detection signal as needed.

The obtained systolic blood pressure and diastolic blood pressure are displayed on the display device of the output unit 7. If necessary, it is also possible to judge whether the blood pressure is abnormal in consideration of the entered age and display the result.

The small pressure sensor device 8 contributes to downsizing of the entire blood pressure measuring device.

Although the pressure sensor device has been exemplified in the above-mentioned embodiments, the present invention can be applied to other sensor devices, such as an acceleration sensor device, and moreover, it is widely applicable to all sensors requiring electrical connection by wire bonding. It is applied to an electric device having an electric element.

[Brief description of drawings]

FIG. 1 is an assembled perspective view of a sensor device according to a first embodiment.

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 shows a second embodiment and is a sectional view corresponding to FIG.

FIG. 4 is a sectional view showing a third embodiment and corresponding to FIG.

5 shows a fourth embodiment and is a sectional view corresponding to FIG.

6 is a sectional view taken along line VI-VI of FIG.

FIG. 7 is a cross-sectional view showing an example of a resin stem.

8 shows a fifth embodiment and is a sectional view corresponding to FIG.

FIG. 9 is a sectional view of a sensor device of a sixth embodiment in which a semiconductor pressure sensor is directly mounted on a circuit board.

FIG. 10 is a configuration diagram of a blood pressure measurement device.

FIG. 11 is a sectional view showing a conventional example in which a capacitive pressure sensor is mounted on a resin stem.

FIG. 12 is a cross-sectional view showing another conventional example in which a capacitive pressure sensor is mounted on a resin stem.

FIG. 13 is a cross-sectional view showing a conventional example of a sensor device in which a semiconductor pressure sensor is directly mounted on a circuit board.

[Explanation of symbols]

 10, 11, 11A, 11B, 11C ... Resin stem 14 ... Lead frame 15 ... Bonding work hole 16, 16A, 16B, 16C, 41 ... Pressure guiding pipe 16a, 24, 40a ... Pressure guiding hole 20, 20A, 20B ... Capacitive semiconductor pressure sensor 21 ... Glass substrate 22 ... Semiconductor substrate 22a ... Frame part 22b ... Diaphragm part (movable electrode) 23 ... Fixed electrode 25 ... Wire bonding pad 26 ... Bonding wire 29 ... Resin paste

Claims (7)

[Claims] 1. A sensor element and a supporting member therefor, wherein the supporting member has a mounting surface, and the sensor element is fixed on the mounting surface.
In a sensor device in which a pad is provided and the supporting member is provided with a terminal connected to the wire bonding pad by wire bonding, the wire bonding pad of the sensor element is provided from the mounting surface of the supporting member. The sensor element is fixed on the mounting surface of the supporting member so as to face the mounting surface at a distant position, and the supporting member is used for wire bonding work at a position corresponding to the wire bonding pad. The structure of the sensor device in which the holes are drilled. 2. The structure of the sensor device according to claim 1, wherein the terminal is provided so as to face the mounting surface of the support member. 3. The terminal is provided on a surface of the support member opposite to the mounting surface, and a bonding wire connecting the wire bonding pad and the terminal passes through the hole. The structure of the sensor device according to claim 1. 4. The sensor having the structure according to claim 1, wherein the sensor element is a pressure sensitive element, and the support member is provided with a pressure guiding pipe for guiding a pressure to be measured to the pressure sensitive element. 5. A pressure measuring device comprising a sensor device having a structure according to claim 1, wherein the sensor element is a pressure sensitive element. 6. An electric element and a supporting member for the electric element are provided, the supporting member has a mounting surface, and the electric element is fixed on the mounting surface.
In an electric device in which a pad is provided and the supporting member is provided with a terminal connected to the wire bonding pad by wire bonding, the wire bonding pad of the electrical element is the mounting surface of the supporting member. The electrical element is fixed on the mounting surface of the support member so as to be away from the mounting surface and face the mounting surface, and wire bonding is performed on the support member at a position corresponding to the wire bonding pad. A structure of electrical equipment with holes for work. 7. A support member having a mounting surface for fixing an electric element is provided with a hole for wire bonding work and a terminal for wire bonding, and the electric element is fixed to the support member. A wire bonding pad facing away from the fixing surface facing the mounting surface in the same direction as the fixing surface, and the wire bonding pad is positioned to face the hole for wire bonding work. Then, the electric element is fixed to the supporting member such that the fixing surface faces the mounting surface, and the wire bonding pad of the electric element and the terminal of the supporting member are connected by a bonding wire. A method of mounting electrical elements.