CN101540945A - Microphone and method for fabricating the same - Google Patents
Microphone and method for fabricating the same Download PDFInfo
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- CN101540945A CN101540945A CNA2009101282220A CN200910128222A CN101540945A CN 101540945 A CN101540945 A CN 101540945A CN A2009101282220 A CNA2009101282220 A CN A2009101282220A CN 200910128222 A CN200910128222 A CN 200910128222A CN 101540945 A CN101540945 A CN 101540945A
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Abstract
The invention provides a microphone capable of implementing miniature. The microphone includes: a substrate including a tone hole and having a top surface on which a substrate electrode is provided; a converter provided on the top surface of the substrate and including a main body having a back space, a diaphragm provided at the bottom of the back space of the main body, and a converter electrode provided on a region of a bottom surface of the main body facing the substrate electrode; and a bump connecting the substrate electrode and the converter electrode to each other. The diaphragm vibrates in response to sound entering from the tone hole. The converter converts sound into a signal.
Description
Technical field
The present invention relates to microphone and manufacture method thereof.
Background technology
For example mobile device such as mobile phone is sought more miniaturization, lightweight, turns to target based on such its inner also miniaturization of microphone, light weight of installing that require.
Particularly, have on the substrate of sound hole, installing, utilizing bonding wire to connect the electrode of substrate of substrate and the vibrating body electrode of conversion body,, realizing miniaturization, lightweight by to the microphone board unitization from the conversion body of sound to electrical signal conversion.Here, the object goods are different with microphone, but as similar document in the past, have the documents 1 about the miniaturization of container.
Patent documentation 1: Japanese kokai publication hei 9-92670 communique
Problem in the above-mentioned example in the past is that the miniaturization of device is insufficient.Promptly, as mentioned above, in example in the past, after on the substrate conversion body being installed, utilize bonding wire to connect the electrode of substrate of substrate and the vibrating body electrode of conversion body, but, when utilizing bonding wire to connect, necessarily need the bigger space of this bonding wire of traction,, can't fully realize the miniaturization of container as its result.When microphone has used conventional art, then can't fully realize miniaturization.
Summary of the invention
The objective of the invention is to improve a kind of microphone that can realize miniaturization.
In order to realize this purpose, microphone of the present invention, it possesses: substrate, it is formed with sound hole and has electrode of substrate on upper surface; Conversion body, it is converted to the signal of telecommunication with acoustic pressure and is arranged on the upper surface of aforesaid substrate; Radome; Raised pad, wherein, above-mentioned conversion body has: the main body that is formed with backside space; Be located at aforementioned body backside space the bottom and bear the vibrating membrane of above-mentioned acoustic pressure; Be located in the lower surface of aforementioned body conversion body electrode with the zone of aforesaid substrate electrode contraposition, the upper surface of above-mentioned radome and aforementioned body and side join and cover the top of above-mentioned backside space, and above-mentioned raised pad connects aforesaid substrate electrode and above-mentioned conversion body electrode.
According to this structure, because can make the space of front of vibrating membrane thinner than in the past under the situation of the diameter that does not change sound hole, so can not reduce the size that reduce microphone under the situation of gathering acoustic energy power.Therefore, if use microphone of the present invention, then can realize miniaturization, light-weighted mobile device.
Therefore, if the main body of above-mentioned conversion body is made of silicon, then can easily utilize semiconductor technology to make microphone.
In addition, also can be, above-mentioned vibrating membrane be made of silicon, and aforementioned body and above-mentioned vibrating membrane form.
Also can be that above-mentioned backside space connects aforementioned body and enlarges upward from above-mentioned vibrating membrane.
Also can be that microphone also possesses the resinite of at least a portion of the outer surface of the part of the upper surface that covers aforesaid substrate and above-mentioned radome.By the resinite that covers radome is set, can improve microphone with respect to the intensity of impacting, therefore, use microphone of the present invention, can improve the resistance to impact of mobile device.
Also can be that above-mentioned resinite covers the side of above-mentioned radome.
Also can be also to possess the amplifier element that will amplify by the signal of above-mentioned conversion body generation.
Also can be that aforesaid substrate has the mounting terminal of the lower surface of being located at itself.
If the volume of backside space, then can keep poly-acoustic energy power greater than the volume from the lower surface of vibrating membrane to the space of sound hole, vibrating membrane is easily in the frequency band internal vibration of broad simultaneously, so it is preferred.
The manufacture method of microphone of the present invention wherein, possesses following step: operation (a), prepare conversion body, and this conversion body has: the main body that is formed with backside space; Be located at the vibrating membrane of the bottom of above-mentioned backside space; Be located at the conversion body electrode of the lower surface of aforementioned body; Operation (b) is placed in above-mentioned conversion body on the substrate, and connects above-mentioned conversion body electrode and electrode of substrate, and described substrate is formed with sound hole and has the aforesaid substrate electrode of the position of answering with above-mentioned conversion body electrode pair in the surface formed thereon; Operation (c) after above-mentioned operation (b), will be joined with the upper surface of aforementioned body and side and the radome that covers the top of above-mentioned backside space is arranged on the aforesaid substrate.
According to this method, can the little microphone of manufacturing dimension.
Also can be in above-mentioned operation (b), to utilize the ultrasonic heat pressure welding that above-mentioned conversion body electrode is connected with the aforesaid substrate electrode.
Also can be, after above-mentioned operation (c), also possess operation (d), like this, can make the microphone that resistance to impact is improved with at least a portion of the outer surface of the part of the upper surface of resin-sealed aforesaid substrate and above-mentioned radome.
Also can be that above-mentioned operation (a) comprises the operation (a1) that forms the above-mentioned backside space of chamfering taper by the central portion of wet etching silicon plate selectively.
Also can be, in above-mentioned operation (a1), before above-mentioned backside space connects aforementioned body, stop wet etching, form above-mentioned vibrating membrane with aforementioned body thus.
As mentioned above, according to microphone of the present invention, because can make the space of front of vibrating membrane thinner than in the past under the situation of the diameter that does not change sound hole, so can under the situation that not reduce poly-acoustic energy power, reduce the size of microphone.Therefore, if use microphone of the present invention, then can realize miniaturization, light-weighted mobile device.
Description of drawings
Fig. 1 is the vertical view of the upper surface side of the microphone that relates to of expression embodiments of the present invention.
Fig. 2 is the vertical view of the lower face side of the microphone that relates to of expression embodiments of the present invention.
Fig. 3 is the cutaway view of III-III line among Fig. 2 of the microphone that relates to of expression embodiments of the present invention.
Fig. 4 is the cutaway view of the manufacture method of the microphone that relates to of expression embodiments of the present invention.
Fig. 5 is the cutaway view of the manufacture method of the microphone that relates to of expression embodiments of the present invention.
Fig. 6 is the cutaway view of the manufacture method of the microphone that relates to of expression embodiments of the present invention.
Fig. 7 is the cutaway view of the microphone that relates to of embodiments of the present invention.
Fig. 8 is the cutaway view of the variation of the microphone that relates to of expression embodiments of the present invention.
The number in the figure explanation:
1 sound hole
2 substrates
3 conversion bodies
4 amplifier elements
5 main bodys
6 backside spaces
7 vibrating membranes
8 conversion body electrodes
9 mounting terminal
10 electrode of substrate
11 raised pads
12 patterns
13 radomes
14 resinites
15 leading spaces
Embodiment
Below, by the description of drawings one embodiment of the present invention.
Fig. 1 is the vertical view of the upper surface side of the microphone that relates to of expression embodiments of the present invention.Fig. 2 is the vertical view of the lower face side of the microphone that relates to of expression embodiment of the present invention.Fig. 3 is the cutaway view of III-III line among Fig. 2 of the microphone that relates to of expression embodiment of the present invention.
As Fig. 1～shown in Figure 3, the microphone of present embodiment possesses: the OBL substrate 2 with circular sound hole 1; Be configured in the conversion body 3 on the substrate 2; Utilize the amplifier element 4 of resinite 14 with substrate 2, conversion body 3 sealings.
Though do not illustrate, but on vibrating membrane 7, be pasted with piezoelectrics, these piezoelectrics make vibrating membrane 7 vibrations by the sound that imports into from sound hole 1, sound (acoustic pressure) is converted to the signal of telecommunication, after the signal of telecommunication that is converted is amplified by amplifier element 4, input to the control circuit of electronic equipment such as mobile phone from the mounting terminal 9 of substrate 2.Here, piezoelectrics also can be located at the upper surface of vibrating membrane 7 or any one of lower surface.And, also can replace piezoelectrics to use electret.In addition, also overleaf the bottom in space 6 be provided with and have the capacitor of vibrating membrane 7 as side's electrode.At this moment, capacitor is converted to the signal of telecommunication with acoustic pressure.
In addition, be formed with electrode of substrate 10 with conversion body electrode 8 opposed positions in the upper surface of substrate 2, this electrode of substrate 10 and conversion body electrode 8 are electrically connected mutually via raised pad 11.Here, electrode of substrate 10 and mounting terminal 9 and electrode of substrate 10 are with patterns 12 in amplifier element 4 utilizes substrate 2 respectively and suitably be connected.Like this, when the sound that imports into from sound hole 1 utilized vibrating membrane 7 to be converted to the signal of telecommunication, this signal of telecommunication was amplified by amplifier element 4, afterwards, inputed to the control circuit of electronic equipment such as mobile phone from the mounting terminal 9 of substrate 2.
In the microphone of present embodiment, be formed at covering conversion body 3 backside space 6 top mode and be provided with the radome 13 that connects airtight with the upper surface and the side of conversion body 3 (main body 5).That is, as shown in Figure 3, the upper surface of the main body 5 of conversion body 3 and side are covered by metal radome 13, like this, can suppress the intrusion of external noise composition from the upper surface side of main body 5.And then, as mentioned above, cover the main body upper surface side of conversion body 3 by utilizing radome 13, the size of backside space 6 is fixed, thus, can make the acoustic characteristic stabilisation.In addition, directly contact with main body 5, can make the current potential stabilisation of main body 5 via radome 13, thereby can realize the microphone that anti-interference noise is strong by radome 13.In addition, the structure with respect to cover radome on the substrate that has carried microphone in the past by being arranged to that radome 13 is directly contacted with main body 5, can reduce backside space, thereby can realize the miniaturization of assembly integral body.Here, in the present embodiment explanation, " side of main body 5 " is meant the side in the outside of main body 5, under the situation that does not have special record, is not meant towards the face of backside space 6.
Then, after forming radome 13, the upper surface of substrate 2 and the upper surface and the side of main body 5 are sealed with amplifier element 4, like this, can realize substrate 2 and the integrated and conversion body 3 of conversion body 3 and the protection of amplifier element 4 with resinite 14.
And then, as mentioned above, with under substrate 2 and the conversion body 3 incorporate states, the volume ratio of backside space 6 of main body 5 that is formed at conversion body 3 is big from the volume of vibrating membrane 7 lower surfaces formed leading space 15 till the sound hole 1 of the lower surface of substrate 2 of joining with this backside space 6.
Its reason is that backside space 6 is big more, and the frequency band of easy more vibration of vibrating membrane 7 and vibration also broadens.If with the conceptual illustration of Helmholtz resonator it, then the leading space 15 of vibrating membrane 7 is to backside space 6 openings of volume Va, when sound when leading space 15 imports into, piston effect makes air compression, the expansion of interior volume, consequently, vibrating membrane 7 vibrations.
As shown in Figure 7, Va (volume of backside space 6)＞Vb (volume of the leading space 15 of vibrating membrane 7).Leading space 15 main purposes are that sound is entered, and therefore, adopt the width of flatness and the size of above-below direction is as far as possible little, like this, can reduce spatial volume, in addition, preferred backside space 6 increases its spatial volume so that make vibrating membrane 7 easy frequency band internal vibrations at broad as much as possible.Here, in microphone in the past, there is the relation of Va (volume of backside space)＜Vb (volume of the leading space 15 of vibrating membrane).
In the microphone of present embodiment, as mentioned above, the conversion body 3 that has substrate 2, the main body 5 of sound hole 1 and have a vibrating membrane 7 connects via raised pad 11, therefore, compare with the situation of using line, can reduce vibrating membrane 7 leading space 15 volume and the size of sound hole 1 is narrowed down.Therefore, can reduce the size of microphone, and can not reduce poly-sound function.
And, because the side of radome 13 and upper surface are covered by resinite 14, so not only with respect to the impact from the side direction of conversion body 3, and, also be difficult to breakage with respect to the impact that the top from conversion body 3 applies.Like this, therefore the remarkable miniaturization of the microphone of present embodiment, slimming, but have good resistance to impact, especially preferably be applicable in the easy mobile communication equipments such as mobile phone that drop etc.
Here, resinite 14 also can cover the side integral body of radome 13, even cover the upper surface of radome 13 and the some of side, compares with the situation that resinite 14 is not set, and still can improve the resistance to impact of microphone.
Fig. 4, Fig. 5 and Fig. 6 are the cutaway views of manufacture method of the microphone of expression present embodiment.As shown in Figure 4, at first, carry out wet etching (wet etching), and form the sound hole 1 that connects main body 5 at central portion from the top to the main body 5 of silicon system.Then, vibrating membrane 7 is bonded in the bottom of sound hole 1.Secondly, as shown in Figure 5, with main body 5 mountings of conversion body 3 under the state on the upper surface of substrate 2, utilize the ultrasonic heat pressure welding that the electrode of substrate 10 of these substrate 2 upper surfaces and the conversion body electrode 8 of main body 5 are linked together.Then, as shown in Figure 6 that electrode of substrate 10 is with after conversion body electrode 8 is connected, main body covered 5 with radome 13, with resinite 14 sealings.In this operation, amplifier element is also sealed by resinite.And radome 13 is arranged to connect airtight with the upper surface of conversion body 3 (main body 5) and side and is covered the top of backside space 6.Like this, according to the method for present embodiment, can utilize semiconductor technology to make microphone.
Here, in the present embodiment, show the example with conversion body 3 splits formation vibrating membrane 7, still, also can form vibrating membrane 7 and conversion body 3 by silicon.That is, in said method, the backside space 6 of conversion body 3 forms by the main body 5 of utilizing wet etching to connect silicon system from the top, but, by stopping this wet etching halfway, also can be formed on the conversion body 3 that main body 5 is provided with vibrating membrane 7.
Here, can suitably change the constituent material, component locations etc. of the microphone of present embodiment.For example, the flat shape of main body 5 can also can be a circle etc. for the polygons such as rectangle beyond the square also.
Here, also can utilize ultrasonic heat pressure welding method in addition to connect electrode of substrate 10 and conversion body electrode 8.
The variation of microphone
Fig. 8 is the cutaway view of the variation of the microphone that relates to of expression embodiments of the present invention.
As shown in Figure 8, in microphone shown in Figure 3, resinite 14 does not cover the upper surface of radome 13 and only covers the side.In this case, also can improve the intensity of the impact that applies with respect to side, therefore, can preferably be applicable in the communication equipments such as mobile phone by resinite 14 from conversion body 3.In addition, the microphone that this variation relates to is not provided with resinite 14 on the upper surface of radome 13, and is corresponding with the part that is not provided with, and compares more correspondingly slimming with the microphone that Fig. 3 represents.
Here, resinite 14 also can cover the side integral body of radome 13, even cover the part of the side of radome 13, also can improve the resistance to impact of microphone.
In addition, resinite 14 can not be arranged on the side of radome 13 yet, and only is arranged on the upper surface, so long as resinite 14 covers at least a portion of the outer surface (side and upper surface) of radome 13, all can improve with respect to the intensity of impacting.
Utilizability on the industry
Microphone of the present invention described above is in the transmission of the sound such as mobile phone and the movement of reception The miniaturization of equipment, lightweight aspect are more useful.
Claims (14)
1. microphone, it possesses:
Substrate, it is formed with sound hole, and has electrode of substrate on upper surface;
Conversion body, it is converted to the signal of telecommunication with acoustic pressure, and is arranged on the upper surface of described substrate;
Radome;
Raised pad,
Wherein, described conversion body has: the main body that is formed with backside space; Be located at described main body backside space the bottom and bear the vibrating membrane of described acoustic pressure; Be located in the lower surface of described main body the conversion body electrode with the opposed zone of described electrode of substrate,
The upper surface of described radome and described main body and side join and cover the top of described backside space,
Described raised pad connects described electrode of substrate and described conversion body electrode.
2. microphone according to claim 1, wherein,
The main body of described conversion body is made of silicon.
3. microphone according to claim 2, wherein,
Described vibrating membrane is made of silicon, and described main body and described vibrating membrane form.
4. microphone according to claim 1, wherein,
Described backside space connects described main body and enlarges upward from described vibrating membrane.
5. microphone according to claim 1, wherein,
Also possess resinite, this resinite covers at least a portion of the outer surface of the part of upper surface of described substrate and described radome.
6. microphone according to claim 1, wherein,
Described resinite covers the side of described radome.
7. microphone according to claim 1, wherein,
Also possesses the amplifier element that will amplify by the signal of described conversion body generation.
8. microphone according to claim 1, wherein,
Described substrate has the mounting terminal of the lower surface of being located at itself.
9. according to each described microphone in the claim 1～8, wherein,
The volume of described backside space is greater than the lower surface of the described vibrating membrane volume to the space of described sound hole.
10. the manufacture method of a microphone wherein, comprising:
Operation (a) is prepared conversion body, and this conversion body has: the main body that is formed with backside space; Be located at the vibrating membrane of the bottom of described backside space; Be located at the conversion body electrode of the lower surface of described main body,
Operation (b) is placed in described conversion body on the substrate, and connects described conversion body electrode and electrode of substrate, and described substrate is formed with sound hole and has the described electrode of substrate of the position of answering with described conversion body electrode pair in the surface formed thereon,
Operation (c) after described operation (b), will be joined with the upper surface of described main body and side and the radome that covers the top of described backside space is arranged on the described substrate.
11. the manufacture method of microphone according to claim 10, wherein,
In described operation (b), utilize the ultrasonic heat pressure welding that described conversion body electrode is connected with described electrode of substrate.
12. the manufacture method of microphone according to claim 10, wherein,
After described operation (c), also possesses operation (d), with at least a portion of the outer surface of the part of the upper surface of resin-sealed described substrate and described radome.
13. according to the manufacture method of each described microphone in the claim 10～12, wherein,
Described operation (a) comprises the operation (a1) that forms the described backside space of chamfering taper by the central portion of wet etching silicon plate selectively.
14. the manufacture method of microphone according to claim 13, wherein,
In described operation (a1), before connecting described main body, described backside space stops wet etching, form described vibrating membrane with described main body thus.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008070018 | 2008-03-18 | ||
| JP2008070018 | 2008-03-18 | ||
| JP2008329192 | 2008-12-25 |
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| Publication Number | Publication Date |
|---|---|
| CN101540945A true CN101540945A (en) | 2009-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009101282220A Pending CN101540945A (en) | 2008-03-18 | 2009-03-18 | Microphone and method for fabricating the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105191350A (en) * | 2013-03-13 | 2015-12-23 | 欧姆龙株式会社 | Capacitance type sensor, acoustic sensor, and microphone |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992670A (en) * | 1995-09-27 | 1997-04-04 | Omron Corp | Constitution of sensor device and mounting method for realizing its constitution |
| US20060210106A1 (en) * | 2001-11-27 | 2006-09-21 | Corporation For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
| CN1933681A (en) * | 2005-09-13 | 2007-03-21 | 星精密株式会社 | Condenser microphone |
| CN1988736A (en) * | 2005-12-22 | 2007-06-27 | 株式会社电装 | Ultrasonic sensor |
-
2009
- 2009-03-18 CN CNA2009101282220A patent/CN101540945A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992670A (en) * | 1995-09-27 | 1997-04-04 | Omron Corp | Constitution of sensor device and mounting method for realizing its constitution |
| US20060210106A1 (en) * | 2001-11-27 | 2006-09-21 | Corporation For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
| CN1933681A (en) * | 2005-09-13 | 2007-03-21 | 星精密株式会社 | Condenser microphone |
| CN1988736A (en) * | 2005-12-22 | 2007-06-27 | 株式会社电装 | Ultrasonic sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105191350A (en) * | 2013-03-13 | 2015-12-23 | 欧姆龙株式会社 | Capacitance type sensor, acoustic sensor, and microphone |
| CN105191350B (en) * | 2013-03-13 | 2018-04-03 | 欧姆龙株式会社 | Electrostatic capacity sensor, sound transducer and microphone |
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Application publication date: 20090923 |